A fully automated chip component testing equipment

Abstract

This utility model discloses a fully automatic chip component testing device, including a base plate, a vertical box, a testing camera, a horizontal adjustment component, a vertical adjustment component, and a clamping and flipping component. The vertical box is fixedly connected to the base plate, and a strip-shaped opening is provided on the front side of the vertical box. The clamping and flipping component includes a flipping motor, two fixed posts, two rotating rods, a rectangular frame, multiple pneumatic rods, clamping blocks, and sponge strips. One end of each of the two rotating rods is rotatably connected to a corresponding fixed post via bearings, and the other end of each of the two rotating rods is fixedly connected to the rectangular frame. The multiple pneumatic rods are respectively fixedly connected to the four inner walls of the rectangular frame. This utility model can not only flip chip components for double-sided testing, but also adjust the height and position of the testing camera to achieve clearer local testing of chip components. Furthermore, the protrusions facilitate the removal of the chip from the placement table after testing.

Description

Technical Field

[0001] This utility model relates to the field of chip component testing technology, and in particular to a fully automated chip component testing device. Background Technology

[0002] In today's rapidly developing electronics and information industry, chip components, as core components of various electronic devices, directly determine the performance and reliability of end products. With the continuous improvement of chip integration, miniaturization, and the expansion of application scenarios to high-precision fields such as aerospace and medical electronics, the market has placed more stringent demands on the accuracy, efficiency, and comprehensiveness of chip component testing. Currently, chip component inspection mainly relies on manual inspection and semi-automated inspection equipment. Under manual inspection, operators need to use magnifying glasses or microscopes to check for defects on the chip surface and the quality of pin soldering one by one. This is not only labor-intensive and inefficient, but also easily affected by factors such as human visual fatigue and subjective judgment differences, resulting in a high rate of missed and false detections, which is difficult to meet the inspection needs of large-scale mass-produced chips. While semi-automated inspection equipment has improved inspection efficiency to some extent, it still faces several technical bottlenecks. On the one hand, most existing equipment can only inspect one side of the chip. If the other side of the chip needs to be inspected, it must be manually flipped. This process not only increases the number of steps and prolongs the inspection cycle, but may also cause electrostatic damage or physical contamination to the chip due to manual contact, further affecting chip quality. On the other hand, for the inspection of localized minor defects on the chip (such as tiny scratches, pin oxidation spots, etc.), the existing equipment lacks the flexibility to adjust the position and height of the camera, making it difficult to accurately focus on the inspection area. This results in poor clarity in the detection of localized defects, making it impossible to accurately identify minor problems and affecting the accuracy of the inspection results.

[0003] Therefore, a fully automated chip component testing device needs to be designed to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a fully automatic chip component inspection device. This invention can not only flip chip components for double-sided inspection, but also adjust the height and position of the inspection camera to perform clearer inspection of local parts of the chip components. At the same time, the protrusions facilitate the removal of the chip from the placement table after the chip inspection is completed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A fully automatic chip component testing device includes a base plate, a vertical box, a detection camera, a horizontal adjustment component, a vertical adjustment component, and a clamping and flipping component. The vertical box is fixedly connected to the base plate, and a strip-shaped opening is provided on the front side of the vertical box. The clamping and flipping component includes a flipping motor, two fixed posts, two rotating rods, a rectangular frame, multiple pneumatic rods, clamping blocks, and sponge strips. One end of each of the two rotating rods is rotatably connected to the corresponding fixed post via bearings, and the other end of each of the two rotating rods is fixedly connected to the rectangular frame. The multiple pneumatic rods are respectively fixedly connected to the four inner walls of the rectangular frame. The multiple clamping blocks are fixedly connected to the telescopic ends of the corresponding pneumatic rods. The multiple sponge strips are fixedly connected to the corresponding clamping blocks. The flipping motor is mounted on the fixed post on the right side, and the output shaft of the flipping motor is fixedly connected to the rotating rod located on the right side.

[0006] Preferably, a rectangular box is fixedly connected to the base plate, a placement platform is slidably connected to the rectangular box, a hydraulic rod is fixedly connected to the inner bottom of the rectangular box, and the telescopic end of the hydraulic rod is fixedly connected to the placement platform.

[0007] Preferably, a protrusion is fixedly connected to the upper end of the placement platform.

[0008] Preferably, the lateral adjustment assembly includes a lead screw, a lateral motor, a moving block, and a moving rod. The lead screw is rotatably connected to the inner walls of the left and right sides of the vertical box. The lateral motor is installed on the left side of the vertical box, and its output shaft is fixedly connected to the lead screw. The moving block is threaded onto the lead screw, and the moving rod is fixedly connected to the moving block with a strip-shaped opening penetrating its front side.

[0009] Preferably, the longitudinal adjustment assembly includes a micro motor, a threaded rod, a threaded sleeve, and two telescopic rods. The two telescopic rods are fixedly connected to the lower part of the moving rod. The detection camera is fixedly connected to the telescopic ends of the two telescopic rods. The threaded sleeve is threadedly connected to the threaded rod. The threaded rod is rotatably connected to the moving rod. The micro motor is mounted on the moving rod, and its output shaft is fixedly connected to the threaded rod. The detection camera is fixedly connected to the threaded sleeve.

[0010] Preferably, the flipping motor, the traversing motor, and the micro motor are all servo motors.

[0011] Compared with existing technologies, the advantages of this device are: 1. Compared with the existing technology, this device realizes fully automatic flipping of chip components through clamping and flipping components. Double-sided inspection can be completed without manual flipping of chips. This not only saves manual operation steps and shortens the inspection cycle, but also avoids electrostatic damage or physical contamination of chips caused by manual contact, ensuring chip quality while improving inspection efficiency. 2. Compared with existing technologies, this device is equipped with a horizontal adjustment component and a vertical adjustment component, which can flexibly adjust the horizontal position and vertical height of the detection camera, accurately focus on the local detection area of ​​the chip, greatly improve the detection clarity of local minor defects of the chip, and ensure accurate detection results; Compared with existing technologies, this device has a protrusion on the upper part of the placement stage. After the test is completed, the operator can easily remove the chip from the placement stage with the help of tools, avoiding the situation where the lower end of the chip is close to the placement stage and is difficult to pick up, thus shortening the time for picking up the chip and further optimizing the efficiency of the overall testing process. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a fully automated chip component testing device proposed in this utility model; Figure 2 for Figure 1 Front sectional view; Figure 3 for Figure 1 Enlarged structural diagram at point A in the middle.

[0013] In the diagram: 1. Base plate, 2. Rectangular box, 3. Fixed column, 4. Flip motor, 5. Rotating rod, 6. Rectangular frame, 7. Pneumatic rod, 8. Clamping block, 9. Sponge strip, 10. Protrusion, 11. Horizontal movement motor, 12. Lead screw, 13. Moving block, 14. Moving rod, 15. Micro motor, 16. Threaded rod, 17. Threaded sleeve, 18. Detection camera, 19. Telescopic rod, 20. Hydraulic rod, 21. Placement platform, 22. Vertical box. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0015] Reference Figures 1-3A fully automatic chip component testing device includes a base plate 1, a vertical box 22, a detection camera 18, a horizontal adjustment assembly, a vertical adjustment assembly, and a clamping and flipping assembly. The vertical box 22 is fixedly connected to the base plate 1, and a strip-shaped opening is provided on the front side of the vertical box 22. The clamping and flipping assembly includes a flipping motor 4, two fixed posts 3, two rotating rods 5, a rectangular frame 6, multiple pneumatic rods 7, a clamping block 8, and a sponge strip 9. One end of each of the two rotating rods 5 is rotatably connected to the corresponding fixed post 3 via bearings, and the other end of each of the two rotating rods 5 is fixed to the rectangular frame 6. The connection consists of multiple pneumatic rods 7 fixedly connected to the four inner walls of the rectangular frame 6, multiple clamping blocks 8 fixedly connected to the telescopic ends of the corresponding pneumatic rods 7, and multiple sponge strips 9 fixedly connected to the corresponding clamping blocks 8. The flip motor 4 is mounted on the fixed column 3 on the right side, and the output shaft of the flip motor 4 is fixedly connected to the rotating rod 5 located on the right side. After the chip element is placed, the multiple pneumatic rods 7 are stretched, causing the multiple sponge strips 9 to press and deform against the chip element, clamping the chip element while avoiding damage to the chip element.

[0016] A rectangular box 2 is fixedly connected to the base plate 1, and a placement platform 21 is slidably connected to the rectangular box 2. A hydraulic rod 20 is fixedly connected to the bottom inner part of the rectangular box 2. The telescopic end of the hydraulic rod 20 is fixedly connected to the placement platform 21. After the chip component is clamped, the placement platform 21 is moved down by the retraction of the hydraulic rod 20 to avoid affecting the subsequent flipping of the chip.

[0017] The upper end of the placement stage 21 is fixedly connected to a protrusion 10, which creates a certain gap between the chip and the placement stage 21, making it easier to remove the chip later.

[0018] The horizontal adjustment assembly includes a lead screw 12, a horizontal movement motor 11, a moving block 13, and a moving rod 14. The lead screw 12 is rotatably connected to the inner walls of the left and right sides of the vertical box 22. The horizontal movement motor 11 is installed on the left side of the vertical box 22, and its output shaft is fixedly connected to the lead screw 12. The moving block 13 is threadedly connected to the lead screw 12. The moving rod 14 is fixedly connected to the moving block 13, and its front side has a through-hole. Through the operation of the horizontal movement motor 11, the moving block 13 drives the detection camera 18 to move left and right, adjusting the detection position.

[0019] The longitudinal adjustment assembly includes a micro motor 15, a threaded rod 16, a threaded sleeve 17, and two telescopic rods 19. The two telescopic rods 19 are fixedly connected to the lower part of the moving rod 14. The detection camera 18 is fixedly connected to the telescopic ends of the two telescopic rods 19. The threaded sleeve 17 is threadedly connected to the threaded rod 16. The threaded rod 16 is rotatably connected to the moving rod 14. The micro motor 15 is mounted on the moving rod 14, and its output shaft is fixedly connected to the threaded rod 16. The detection camera 18 is fixedly connected to the threaded sleeve 17. The operation of the micro motor 15 causes the threaded sleeve 17 to drive the detection camera 18 to move up and down, thereby enabling clear detection of a local part of the detection chip. The flip motor 4, the transverse motor 11, and the micro motor 15 are all servo motors.

[0020] It is worth mentioning that, in order to avoid blind spots in detection, the moving rod 14 can be replaced with an electric cylinder, so that the position of the detection camera 18 can be adjusted in the front and back directions.

[0021] The functional principle of this utility model can be explained through the following operation: First, chip loading and preliminary positioning are performed. The chip component to be tested is placed on the placement stage 21. At this time, the placement stage 21 is at the initial support height, providing stable support for chip clamping operation. Next, the chip clamping and fixing stage begins. Multiple pneumatic rods 7 in the clamping and flipping assembly are activated. The telescopic ends of the pneumatic rods 7 push the corresponding clamping blocks 8 towards the chip until the four clamping blocks 8 simultaneously clamp the chip from all four sides. At this time, the sponge strips 9 fixed on the clamping blocks 8 contact the chip surface, which not only enhances the stability of the clamping but also avoids physical damage to the chip surface caused by excessive clamping force, thus achieving safe and firm fixing of the chip. After the chip is clamped, the hydraulic rod 20 at the bottom of the rectangular box 2 is activated. The telescopic end of the hydraulic rod 20 drives the placement stage 21 to retract and move downward along the inner wall of the rectangular box 2 until the placement stage 21 is completely separated from the chip. This avoids interference from the placement stage 21 to the chip or the clamping and flipping assembly when the rectangular frame 6 flips the chip later, and provides sufficient space for the chip flipping operation. The next step involves adjusting the position and height of the inspection camera 18 and performing single-sided inspection. If different lateral areas of the chip need to be inspected, the horizontal adjustment component's lateral movement motor 11 is activated. The output shaft of the lateral movement motor 11 drives the lead screw 12 to rotate between the left and right inner walls of the vertical box 22. Since the moving block 13 is threadedly connected to the lead screw 12, and the moving rod 14 is fixedly connected to the moving block 13 and passes through the strip-shaped opening on the front side of the vertical box 22, the rotation of the lead screw 12 will drive the moving block 13, the moving rod 14, and the inspection camera 18 below to move along the axial direction of the lead screw 12 until the inspection camera 18 is aligned with the lateral area of ​​the chip to be inspected. For the inspection of minor local defects in the chip, when the height of the inspection camera 18 needs to be adjusted for precise focusing, the vertical adjustment component is activated. The micro motor 15 in the adjustment assembly drives the threaded rod 16 to rotate on the moving rod 14 via its output shaft. The threaded sleeve 17 is threadedly connected to the threaded rod 16 and fixed to the detection camera 18. Simultaneously, the detection camera 18 is connected to the moving rod 14 via two telescopic rods 19. The telescopic rods 19 restrict the detection camera 18 from rotating with the threaded rod 16, allowing it to move only longitudinally. When the threaded rod 16 rotates, it drives the threaded sleeve 17 to move the detection camera 18 vertically up and down until the camera focuses on the local area of ​​the chip to be inspected, ensuring clear inspection. After the position and height of the detection camera 18 are adjusted, the detection camera 18 is activated to inspect the chip's upward-facing side for defects and records the inspection data. After the single-sided chip inspection is completed, the chip flipping and double-sided inspection stage begins. The flipping motor 4 in the clamping and flipping assembly is activated. The output shaft of the flipping motor 4 drives the right-side rotating rod 5 to rotate around the bearing on the fixed post 3. Since both rotating rods 5 are fixedly connected to the rectangular frame 6, the rotation of the right-side rotating rod 5 will simultaneously drive the rectangular frame 6, the pneumatic rod 7, the clamping block 8, and the clamped chip to flip as a whole. The flipping angle can be set according to requirements, usually 180°, until the chip's downward side faces upward. After flipping to the correct position, the position and height of the inspection camera 18 are adjusted again by the horizontal adjustment assembly and the vertical adjustment assembly to perform defect inspection on the other side of the chip, realizing fully automatic double-sided chip inspection without manual intervention. Finally, in the chip removal process after testing, after the chip is tested on both sides, the hydraulic rod 20 is activated first, so that its telescopic end moves the placement stage 21 upward to a support position that fits against the bottom of the chip. Then, the pneumatic rod 7 is controlled to retract, which moves the clamping block 8 away from the chip, releasing the chip from the clamp. At this time, the operator can use the protrusion 10 on the placement stage 21 and the height difference between the protrusion 10 and the edge of the chip to easily remove the chip from the placement stage 21 without the need for tweezers or other tools, thus avoiding the chip being difficult to remove due to electrostatic adsorption or damage during removal, and completing the entire testing process.

[0022] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A fully automated chip component testing device, characterized in that, include: The components include a base plate (1), a vertical box (22), a detection camera (18), a horizontal adjustment component, a vertical adjustment component, and a clamping and flipping component. The vertical box (22) is fixedly connected to the base plate (1), and the front side of the vertical box (22) has a strip-shaped opening. The clamping and flipping assembly includes a flipping motor (4), two fixed posts (3), two rotating rods (5), a rectangular frame (6), multiple pneumatic rods (7), clamping blocks (8), and sponge strips (9). One end of each of the two rotating rods (5) is rotatably connected to the corresponding fixed post (3) via a bearing, and the other end of each of the two rotating rods (5) is fixedly connected to the rectangular frame (6). The multiple pneumatic rods (7) are respectively fixedly connected to the four inner walls of the rectangular frame (6). The multiple clamping blocks (8) are fixedly connected to the telescopic ends of the corresponding pneumatic rods (7). The multiple sponge strips (9) are fixedly connected to the corresponding clamping blocks (8). The flipping motor (4) is mounted on the fixed post (3) on the right side, and the output shaft of the flipping motor (4) is fixedly connected to the rotating rod (5) located on the right side.

2. The fully automated chip component testing equipment according to claim 1, characterized in that: A rectangular box (2) is fixedly connected to the base plate (1), and a placement platform (21) is slidably connected to the rectangular box (2). A hydraulic rod (20) is fixedly connected to the inner bottom of the rectangular box (2), and the telescopic end of the hydraulic rod (20) is fixedly connected to the placement platform (21).

3. The fully automated chip component testing equipment according to claim 2, characterized in that: The upper end of the placement platform (21) is fixedly connected to a protrusion (10).

4. The fully automated chip component testing equipment according to claim 1, characterized in that: The lateral adjustment assembly includes a mounting screw (12), a lateral movement motor (11), a moving block (13), and a moving rod (14). The screw (12) is rotatably connected to the inner walls of the left and right sides of the vertical box (22). The lateral movement motor (11) is installed on the left side of the vertical box (22), and its output shaft is fixedly connected to the screw (12). The moving block (13) is threaded onto the screw (12). The moving rod (14) is fixedly connected to the moving block (13), and its front side has a through-hole.

5. The fully automated chip component testing equipment according to claim 4, characterized in that: The longitudinal adjustment assembly includes a micro motor (15), a threaded rod (16), a threaded sleeve (17), and two telescopic rods (19). The two telescopic rods (19) are fixedly connected to the lower part of the moving rod (14). The detection camera (18) is fixedly connected to the telescopic ends of the two telescopic rods (19). The threaded sleeve (17) is threadedly connected to the threaded rod (16). The threaded rod (16) is rotatably connected to the moving rod (14). The micro motor (15) is mounted on the moving rod (14), and its output shaft is fixedly connected to the threaded rod (16). The detection camera (18) is fixedly connected to the threaded sleeve (17).

6. The fully automated chip component testing equipment according to claim 5, characterized in that: The flip motor (4), the traverse motor (11), and the micro motor (15) are all servo motors.

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