A linear array detector assembly module and a linear array detector
By using middleware and high-precision stitching technology in the linear array detector, the problems of pixel misalignment and height difference during stitching of the linear array detector were solved, and high-resolution and high-stability imaging effects were achieved.
Patent Information
- Application Number
- CN202522395974.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-12
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-11-12
AI Technical Summary
Existing linear array detectors suffer from pixel misalignment, gaps, and height differences during stitching, resulting in decreased image quality and poor system stability, making it difficult to achieve high-resolution imaging.
Multiple detector modules are fixed using intermediate components to ensure that the splicing gap is less than 150μm and the height difference is less than 30μm. High-precision splicing is achieved through bolt connection and fine-tuning technology. Combined with a heat-conducting layer and multi-layer functional structure design, the system stability is enhanced.
It achieves continuity and uniformity in high-resolution imaging, improves system stability and environmental adaptability, reduces image stitching seams and grayscale unevenness, and ensures high-precision and high-stability imaging results.
Smart Images
Figure CN224945941U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of detectors, specifically to a linear array detector assembly module and a linear array detector. Background Technology
[0002] Linear array detectors (LDA) are core imaging components in X-ray scanning cameras, industrial non-destructive testing, and quality control systems. Their basic imaging principle is: the object being inspected moves at a constant speed relative to the X-ray source and the detector; the detector acquires signals line by line and synthesizes them into a two-dimensional X-ray image. The performance of the linear array detector, especially its spatial resolution and image uniformity, directly determines the quality of the entire imaging system.
[0003] To meet the detection width requirements of different application scenarios, conventional linear array detectors typically require splicing multiple independent PD modules (detector plate modules) to achieve an effective detection length ranging from 102 mm to 1600 mm or even longer. However, this splicing structure faces significant challenges in actual manufacturing processes. Currently, common splicing techniques often involve directly mounting PD modules onto a unified structural component or housing. Due to unavoidable tolerances in the manufacturing of the PD modules themselves and the mounting positions on the structural components, direct splicing of multiple modules will accumulate pixel misalignment and gaps, as well as differences in detection surface height. These deviations can lead to visible seams, image misalignment, or uneven grayscale in the final image, severely degrading image quality and failing to meet the requirements of high-resolution imaging. Furthermore, the direct splicing structure lacks a highly rigid intermediate reference platform. After being subjected to vibration, temperature changes, or long-term use, the relative positions between the PD modules are prone to slight drift, causing the initial calibration accuracy to fail, resulting in poor system stability and requiring frequent recalibration. Existing processes often rely heavily on operator skill, requiring tedious shims, repeated trial assembly, and manual adjustments to compensate for tolerances. This process is inefficient, inconsistent, and difficult to standardize and scale up production. Utility Model Content
[0004] In view of the problems existing in the linear array detectors in the prior art described above, this application provides a linear array detector assembly module and a linear array detector to solve the problems of large positioning error and low accuracy in the prior art.
[0005] To achieve the above and other related objectives, this utility model provides a linear array detector assembly module, which includes:
[0006] Multiple detector board modules, each detector board module including a first surface and a second surface arranged opposite to each other, the first surface being a detection surface, and a connector being disposed on the second surface;
[0007] The middleware, wherein the first surface of the plurality of detector board modules is fixed on the middleware;
[0008] The splicing gap between two adjacent detection plate modules is less than 150 μm, and the height difference between two adjacent detection plate modules is less than 30 μm.
[0009] Optionally, the connector protrudes from the surface of the probe module.
[0010] Optionally, the middleware is made of aluminum alloy.
[0011] Optionally, a heat dissipation layer is provided between the middleware and the detector board module.
[0012] This application also provides a linear array detector, including:
[0013] The outer casing includes a top plate and a bottom plate that are positioned opposite each other;
[0014] The intermediate component includes a top surface and a bottom surface that are disposed opposite to each other, wherein the top surface is fixedly disposed on the top plate;
[0015] Multiple detector plate modules, each detector plate module including a first surface and a second surface arranged opposite to each other, the first surface being a detection surface, the second surface being provided with a connector, the first surface being fixedly connected to the intermediate component, and the second surface being fixedly connected to the base plate;
[0016] The splicing gap between two adjacent detection plate modules is less than 150 μm, and the height difference between two adjacent detection plate modules is less than 30 μm.
[0017] Optionally, the detection board module and the intermediate component are provided with corresponding bolt holes, and the detection board module and the intermediate component are connected by bolts.
[0018] Optionally, the bolt hole is an oblong hole.
[0019] Optionally, it also includes:
[0020] A cover plate is disposed on the side of the top plate away from the intermediate member;
[0021] An electromagnetic shielding layer is disposed on the top plate near the intermediate component;
[0022] A radiation shielding layer is disposed on the side of the electromagnetic shielding layer near the intermediate component;
[0023] The PD board is disposed between the radiation shielding layer and the intermediate component.
[0024] Optionally, the cover plate includes a carbon plate;
[0025] The electromagnetic shielding layer includes aluminum foil;
[0026] The radiation shielding layer includes lead plates.
[0027] As described above, the linear array detector assembly module and linear array detector provided by this utility model have at least the following beneficial technical effects:
[0028] The linear array detector of this invention integrates the linear array detector assembly module onto an intermediate component, which serves as a platform for precise positional adjustment. This eliminates defects such as image seams, misalignment, and uneven grayscale caused by splicing deviations, ensuring the continuity and uniformity of two-dimensional X-ray images and laying a structural foundation for high-resolution, high-fidelity imaging. Attached Figure Description
[0029] Figure 1 The image shown is a top view of the linear array detector assembly module provided in Embodiment 1.
[0030] Figure 2 The image shown is a side view of the linear array detector assembly module provided in Embodiment 1.
[0031] Figure 3 The image shown is a side view of the linear array detector provided in Embodiment 2.
[0032] Figure 4 Shown is a top view of the linear array detector provided in Embodiment 2.
[0033] Reference numerals: 10, Detector board module; 11, First surface; 12, Second surface; 13, Connector; 14, Alignment mark; 15, First bolt hole; 20, Intermediate component; 21, Second bolt hole; 30, Outer shell; 31, Top plate; 32, Bottom plate; 40, Cover plate; 50, Electromagnetic shielding layer; 60, Radiation shielding layer; 70, PD board. Detailed Implementation
[0034] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.
[0035] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.
[0036] Example 1
[0037] This embodiment provides a linear array detector assembly module, such as... Figure 1 As shown, this is a top view of the array detector assembly module provided in this embodiment; as Figure 2 The image shows a side view of the array detector assembly module provided in this embodiment. The linear array detector assembly module of this embodiment includes: multiple detector board modules 10, each detector board module 10 including a first surface 11 and a second surface 12 disposed opposite to each other, the first surface 11 being a detection surface, and a connector 13 disposed on the second surface 12; an intermediate component 20, on which the first surfaces 11 of the multiple detector board modules 10 are fixed; the splicing gap between two adjacent detector board modules 10 is less than 150 μm, and the height difference between two adjacent detector board modules 10 is less than 30 μm.
[0038] The number of detector plate modules 10 is set according to actual needs; this embodiment uses four detector plate modules 10 as an example. Optionally, it also includes: a base plate (not shown in the figure), and the second surfaces 12 of the multiple detector plate modules 10 are fixed to the base plate via connectors 13; specifically, the first surfaces 11 of the detector plate modules 10 face the incident direction of the X-rays. Specifically, as shown... Figure 2 As shown, connector 13 protrudes from the surface of probe board module 10. Connector 13 is used to achieve board-to-board connection. Optionally, connector 13 includes a horn-shaped structure, a pin header and nut header structure (pins are disposed on probe board module 10, and nuts are disposed on the base plate), a board-to-board stack connector, or a solder ball grid array. This embodiment, for example... Figure 1 As shown, connector 13 has a bull horn structure.
[0039] Specifically, alignment marks 14 are provided on the edge of each probe module 10 for precise alignment. Optionally, the alignment marks 14 include: cross marks, circular marks, square marks, etc.
[0040] Optionally, the intermediate component 20 is made of aluminum alloy. Optionally, the intermediate component 20 includes a top surface and a bottom surface that are arranged opposite each other. In this embodiment, the top surface and the bottom surface are not distinguished, and the detection plate module 10 is installed on the same side of the intermediate component 20. Specifically, the intermediate component 20 is provided with a plurality of first bolt holes 15. Optionally, the first bolt holes 15 are oblong holes. The first bolt holes 15 are located at opposite positions of the detection plate module 10 and are used to fix the detection plate module 10. The oblong hole design allows the detection plate module 10 to be finely adjusted within a certain range (approximately ±0.07mm) before locking to compensate for manufacturing tolerances.
[0041] Optionally, a heat dissipation layer is further provided between the intermediate component 20 and the probe module 10. This heat dissipation layer comprises a thermally conductive interface material, which fills the microscopic gaps at the contact surface, establishing an efficient thermal path to conduct the heat generated by the probe module 10 during operation to the intermediate component 20 for dissipation, thereby effectively controlling the core temperature and extending the device lifespan. The thermally conductive interface material can be selected from one of the following: thermally conductive silicone pads, thermally conductive phase change materials, thermally conductive gels, or thermally conductive insulating sheets. Preferably, a thermally conductive silicone pad with a certain thickness and compressibility is used, which ensures optimal thermal conductivity while compensating for assembly tolerances and providing shock absorption.
[0042] Specifically, such as Figure 1 As shown, the arrangement direction of the detection plate module 10 is defined as the X direction; the height direction of the detection plate module 10 is defined as the Y direction. The distance between two adjacent detection plate modules 10 in the width direction (X direction) is less than or equal to 150 μm; the height difference between two adjacent detection plate modules in the height direction (Y direction) is less than or equal to 30 μm. Further, the distance between two adjacent detection plate modules 10 in the width direction (X direction) is less than or equal to 50 μm; the height difference between two adjacent detection plate modules in the height direction (Y direction) is less than or equal to 15 μm.
[0043] Specifically, the steps for installing the detector module 10 onto the intermediate component 20 include: first, placing the detector module 10 onto the intermediate component 20 and pre-locking it; observing the alignment marks 14 on the edges of two adjacent detector modules 10 using a high-powered microscope; and adjusting the position of the detector module 10 relative to the intermediate component 20 in the X and Y directions to ensure that the seam width and the height difference of the detection surface meet the stringent requirements of less than 150 μm and 30 μm, respectively. After confirming the accuracy, all screws are thoroughly tightened to complete the high-precision splicing.
[0044] Specifically, the position of the entire detector module 10 relative to the intermediate component 20 in the X and Y directions includes: initial positioning and pre-fixing: a preferred assembly sequence is to prioritize positioning a reference module, and subsequent modules are assembled sequentially towards both sides of the reference module. During pre-fixing, the subsequent modules are positioned slightly to the lower side (lower left or lower right) of the fixed module to reserve operating space for subsequent precise adjustments in the X and Y directions; precise positioning in the X direction (horizontal splicing direction): when calibrating in the X direction, the sides of two adjacent detector modules 10 that are close to each other are used as alignment references. By observing and adjusting with precision measuring instruments (including microscopes), the distance between the two sides in the X direction meets the set threshold (the distance between the sides of the two detector modules 10 that are close to each other is less than or equal to 150μm). Specifically, this is achieved by adjusting the adjustment margin provided by the waist-shaped hole provided on the intermediate part 20. Precise positioning in the Y direction (height direction of the detector module): When calibrating in the Y direction, the alignment marks 14 (including cross marks) made on the edges of the two adjacent detector modules 10 are used as the reference, or the uppermost or lowermost edge of the two adjacent detector modules 10 is used as the reference. By observing with precision measuring instruments (including microscopes), the distance between two marker points or edge lines in the Y direction is adjusted so that the spacing in the Y direction meets the set threshold (the distance between two marker points or edge lines in the Y direction is less than or equal to 30μm); final fixation: after the X and Y directions of all detector plate modules 10 have been adjusted and confirmed to meet the accuracy, all fasteners (such as screws) passing through the oblong holes can be fully tightened, thereby finally and firmly fixing the detector plate module 10 to the intermediate part 20 to form a high-precision splicing module.
[0045] Example 2
[0046] This embodiment also provides a linear array detector, such as Figure 3 The diagram shows a side view of the linear array detector; for illustration purposes, two detector modules 10 are used as examples. The linear array detector in this embodiment includes: a housing 30, comprising a top plate 31 and a bottom plate 32 disposed opposite to each other; an intermediate component 20, comprising a top surface and a bottom surface disposed opposite to each other, the top surface being fixedly mounted on the top plate 31; and multiple detector modules 10, each detector module 10 comprising a first surface 11 and a second surface 12 disposed opposite to each other, the first surface 11 being a detection surface, and a connector being disposed on the second surface 12. The first surface 11 is fixedly connected to the intermediate component 20, and the second surface 12 is fixedly connected to the bottom plate 32. The splicing gap between two adjacent detector modules 10 is less than 150 μm, and the height difference between two adjacent detector modules is less than 30 μm.
[0047] Specifically, the outer shell 30 constitutes the main frame of the detector, and the top plate 31 faces the radiation source. Specifically, the outer shell 30 is preferably made of carbon fiber material and is a radiation-permeable cover plate to ensure structural strength and allow efficient X-ray penetration. Specifically, the intermediate component 20 includes the intermediate component 20 described in Embodiment 1, which is precision-machined from aluminum alloy. Specifically, the first surface 11 of the plurality of detector plate modules 10 is disposed on the bottom surface of the intermediate component 20, and the top surface of the intermediate component 20 is fixedly connected to the top plate 31.
[0048] like Figure 4 The diagram shows a top view of the linear array detector provided in this embodiment. Optionally, the intermediate component 20 and the base plate 32 of the housing 30 are provided with corresponding second bolt holes 21, and the intermediate component 20 and the housing 30 are connected by bolts. Optionally, the second bolt holes 21 are oblong holes. Specifically, in this embodiment, the oblong holes are located around the intermediate component 20. The intermediate component 20 is fixed to the top plate 31 plane of the housing 30 by screws passing through these oblong holes. The oblong hole design allows the intermediate component 20 to be finely adjusted within a certain range (approximately ±0.07 mm) before locking to compensate for manufacturing tolerances.
[0049] Optionally, it also includes a cover plate 40, disposed on the side of the top plate 31 away from the intermediate member 20, with the cover plate 40 facing the X-ray incident end. As the first physical barrier for direct X-ray incidence, the cover plate 40 provides robust physical protection for the internal precision detector module 10, shielding layer, etc., preventing impacts and damage. The cover plate 40 is made of a material with extremely low X-ray attenuation rate, ensuring efficient X-ray photon penetration and reducing signal loss. Optionally, the cover plate 40 is made of carbon fiber composite material or high-strength engineering plastic, which, while meeting high rigidity and strength requirements, also possesses excellent X-ray transmittance. In this embodiment, the cover plate 40 is a carbon plate.
[0050] Optionally, an electromagnetic shielding layer 50 is also included, disposed on the side of the top plate 31 near the intermediate member 20; the electromagnetic shielding layer 50 is used to isolate external electromagnetic interference, ensure the signal-to-noise ratio of the readout signal, thereby improving the clarity and accuracy of the final image. Optionally, the electromagnetic shielding layer 50 includes aluminum foil or copper foil. In this embodiment, the electromagnetic shielding layer 50 uses aluminum foil.
[0051] Optionally, a radiation shielding layer 60 is also included, disposed on the side of the electromagnetic shielding layer 50 near the intermediate component 20. The radiation shielding layer 60 is used to absorb X-ray photons generated inside the detector (such as the cover plate 40, the detector plate module 10 itself). These scattered photons are important noise sources that cause image fogging and reduce contrast. Absorbing them can significantly improve image quality. It is also used to block residual X-rays that penetrate the detector plate module 10, preventing them from leaking behind the detector and protecting the safety of surrounding equipment and personnel. Preferably, the radiation shielding layer 60 is made of a high atomic number, high density material, such as lead plate, lead rubber, or tungsten alloy sheet, to achieve efficient absorption of X-rays. In this embodiment, the radiation shielding layer 60 is made of lead plate.
[0052] Optionally, a PD board 70 is also included, disposed between the radiation shielding layer 60 and the intermediate component 20. The PD board 70 is a photoelectric conversion element used to convert X-rays into electrical signals.
[0053] The installation, alignment, and fixing methods of the multiple detector plate modules 10 are exactly the same as in Embodiment 1. Specifically, the first surface 11 (detection surface) of each detector plate module 10 is fixed to the intermediate component 20 by fasteners engaging with the oblong holes on the intermediate component 20. Electrical connectors 13 (such as horn connectors) are provided on the second surface 12 of each detector plate module 10, and these connectors 13 face the base plate 32. Alignment marks 14 (such as cross marks) for precise alignment are also provided on the edges of the detector plate modules 10. Through the precision adjustment process detailed in Embodiment 1, it is ensured that the width of the splicing gap between two adjacent detector plate modules 10 in the X direction is less than 150 μm, and the height difference of their detection surfaces in the Y direction is less than 30 μm. Finally, the intermediate component 20 is fixed to the top plate 31 of the housing 30 by fasteners (such as screws) through multiple second bolt holes 21 provided around its perimeter.
[0054] In this embodiment, the linear array detector, through the intermediate component 20 structure, first achieves ultra-high precision splicing of the detector board module 10 on the intermediate component, and then installs the entire spliced assembly into the housing through a finely adjustable oblong hole. Simultaneously, through the integrated design of a multi-layered functional structure (cover plate, electromagnetic shielding layer, radiation shielding layer), a unified approach to physical protection, signal fidelity, and radiation safety is achieved. By decoupling the high-precision splicing at the module level from the overall performance at the system level, the final product achieves micron-level imaging accuracy while possessing excellent environmental adaptability, stability, and safety, solving the problem in existing technologies where it is difficult to simultaneously achieve high precision, high stability, and comprehensive protection.
[0055] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A linear array detector assembly module, characterized in that, include: Multiple detector board modules, each detector board module including a first surface and a second surface arranged opposite to each other, the first surface being a detection surface, and a connector being disposed on the second surface; The middleware, wherein the first surface of the plurality of detector board modules is fixed on the middleware; The splicing gap between two adjacent detection plate modules is less than or equal to 150 μm, and the height difference between two adjacent detection plate modules is less than or equal to 30 μm.
2. The linear array detector assembly module according to claim 1, characterized in that, The connector protrudes from the surface of the probe module.
3. The linear array detector assembly module according to claim 1, characterized in that, The middleware is made of aluminum alloy.
4. The linear array detector assembly module according to claim 1, characterized in that, A heat dissipation layer is provided between the middleware and the detection board module.
5. A linear array detector, characterized in that, include: The outer casing includes a top plate and a bottom plate that are positioned opposite each other; The intermediate component includes a top surface and a bottom surface that are disposed opposite to each other, wherein the top surface is fixedly disposed on the top plate; Multiple detector plate modules, each detector plate module including a first surface and a second surface arranged opposite to each other, the first surface being a detection surface, the second surface being provided with a connector, the first surface being fixedly connected to the intermediate component, and the second surface being fixedly connected to the base plate; The splicing gap between two adjacent detection plate modules is less than 150 μm, and the height difference between two adjacent detection plate modules is less than 30 μm.
6. The linear array detector according to claim 5, characterized in that, The detection board module and the intermediate component are provided with corresponding bolt holes, and the detection board module and the intermediate component are connected by bolts.
7. The linear array detector according to claim 6, characterized in that, The bolt hole is a waist-shaped hole.
8. The linear array detector according to claim 5, characterized in that, Also includes: A cover plate is disposed on the side of the top plate away from the intermediate member; An electromagnetic shielding layer is disposed on the top plate near the intermediate component; A radiation shielding layer is disposed on the side of the electromagnetic shielding layer near the intermediate component; The PD board is disposed between the radiation shielding layer and the intermediate component.
9. The linear array detector according to claim 8, characterized in that, The cover plate includes a carbon plate; The electromagnetic shielding layer includes aluminum foil; The radiation shielding layer includes lead plates.