Chip pick-up assembly and test indenter device

Abstract

This application relates to a chip pickup assembly and a test head device. The chip pickup assembly includes a pickup head and a plurality of jaws. The pickup head has a pickup surface for picking up chips, and the plurality of jaws are disposed around the pickup surface to form a receiving space for accommodating chips. The jaws are configured to confine the chip within the receiving space, wherein at least one of the plurality of jaws is a detachable jaw that is detachably mounted on the chip pickup assembly. The chip pickup assembly provided by this application adopts a detachable jaw design, which enables the chip pickup assembly to adapt to the testing needs of semiconductor chips of different sizes, improving compatibility. The individual replacement function of the detachable jaws ensures timely repair when the jaws are worn or deformed, reducing maintenance costs. The detachable jaws have better strength and temperature resistance, are less affected by temperature, and ensure the pickup accuracy and testing reliability of the chip pickup assembly.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a chip pickup component and a test head device. Background Technology

[0002] A semiconductor testing and sorting machine is a device used to test and sort semiconductor chips. During operation, the machine's loading device moves the semiconductor chips to the infeed position. The testing arm picks up the chips at the infeed position and presses them onto a testing socket for testing. After testing, the testing arm removes the chips and places them in the discharge position. The end of the testing arm is equipped with a testing head, which typically has grippers for positioning and picking up the semiconductor chips.

[0003] Currently, the jaws of test heads are typically integrated with the test head, meaning that a single test head can only handle semiconductor chips of a specific size. When testing semiconductor chips of different sizes is required, or when the jaws wear out or deform due to prolonged use, the entire test head must be replaced, leading to extended equipment downtime and soaring spare parts costs. Furthermore, because the integrated jaws protrude from the main body of the test head, they are susceptible to temperature fluctuations, resulting in insufficient accuracy and reliability in picking up semiconductor chips, thus affecting the testing efficiency and the reliability of the results.

[0004] Therefore, it is necessary to propose a new technical solution to overcome the shortcomings of existing technologies. Utility Model Content

[0005] Based on this, this application provides a chip pickup component and a test head device, which can improve compatibility and reliability, and reduce maintenance costs.

[0006] Therefore, this application adopts the following technical solution: a chip pickup assembly, which includes a pickup head and a plurality of claws, the pickup head having a pickup surface for picking up chips, the plurality of claws being disposed around the pickup surface to form a receiving space for accommodating chips together with the pickup surface, the claws being configured to confine the chip within the receiving space, wherein at least one of the plurality of claws is a detachable claw that is detachably mounted on the chip pickup assembly.

[0007] In some embodiments, the chip pickup assembly includes a body, and a pickup head extends protruding from the body, the end face size of the pickup head being smaller than the end face size of the body.

[0008] In some embodiments, the pickup head includes a protrusion extending from the body and an end portion located at the free end of the protrusion, the detachable claw including a mounting portion and a contact portion, the mounting portion being connected to the protrusion and the contact portion being located on the side of the end portion.

[0009] In some embodiments, the sidewall of the protruding post is provided with a mounting groove, and the mounting part is located in the mounting groove.

[0010] In some embodiments, the mounting part has a countersunk hole, and the mounting part is mounted on the protruding post by a countersunk bolt.

[0011] In some embodiments, the detachable claws are a pair, positioned on opposite sides of the pickup head in a first direction.

[0012] In some embodiments, the plurality of jaws includes a pair of fixed jaws, which are integrally formed with the pickup head and disposed on opposite sides of the pickup head in a second direction.

[0013] In some embodiments, the pickup surface includes a body placement surface for placing the body portion of the chip and a pin placement surface for placing the pin portion of the chip, wherein the pin placement surfaces are located on opposite sides of the body placement surface in the first direction, such that the pin portion is limited by the pair of removable claws.

[0014] In some embodiments, the width of the detachable claw is greater than the width of the fixed claw.

[0015] This application also adopts the following technical solution: a test pressure head device, including a substrate and at least one chip pickup component disposed on the substrate, wherein the chip pickup component is the chip pickup component described in any of the above embodiments, wherein the substrate and the chip pickup component are provided with airflow channels communicating with each other, and the airflow channels form an adsorption port for adsorbing chips on the pickup surface.

[0016] The chip pickup assembly provided in this application, with its detachable jaws, can adapt to the testing needs of semiconductor chips of different sizes, eliminating the need to replace the entire test head due to changes in chip size, thus improving compatibility. Simultaneously, the individual replacement function of the detachable jaws ensures timely repair when the jaws are worn or deformed, reducing maintenance costs. Furthermore, the detachable jaws have better strength and temperature resistance, are less affected by temperature, ensuring the pickup accuracy and testing reliability of the chip pickup assembly, and improving the detection efficiency and reliability of the semiconductor chips. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of an embodiment of the test pressure head device of this application.

[0019] Figure 2 This is a perspective view of an embodiment of the chip pickup component of this application.

[0020] Figure 3 This is a partial enlarged view of an embodiment of the chip pickup component of this application.

[0021] Figure 4 This is a perspective view of another embodiment of the chip pickup component of this application.

[0022] Figure 5 This is an exploded perspective view of an embodiment of the chip pickup component of this application.

[0023] Figure 6 This is a cross-sectional view of an embodiment of the test pressure head device of this application.

[0024] The component reference numerals are as follows: 100, Test head device; 10, Substrate; 20, Chip pickup assembly; 30, Airflow channel; 1, Body; 2, Pickup head; 21, End; 210, Pickup surface; 211, Main body placement surface; 212, Pin placement surface; 213, Adsorption port; 22, Protrusion; 221, Mounting groove; 31, Removable claw; 311, Mounting part; 3110, Countersunk hole; 312, Contact part; 32, Fixing claw; 4, Countersunk bolt; 5, Pin. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0030] This application provides a chip pickup component and a test head device including the chip pickup component, aiming to solve the problems of poor adaptability, high replacement cost, and insufficient pickup accuracy and reliability caused by the integrated structure of the test head and jaws in the prior art. The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0031] Please see Figures 1 to 6As shown, the chip pickup assembly 20 provided in this application includes a pickup head 2 and a plurality of claws. The pickup head 2 has a pickup surface 210 for picking up chips. The plurality of claws are disposed around the pickup surface 210 to form a receiving space for accommodating chips together with the pickup surface 210. The claws are configured to confine the chips within the receiving space. At least one of the plurality of claws is a detachable claw 31 that is detachably mounted on the chip pickup assembly 20.

[0032] The chip pickup assembly 20 provided in this application, due to its detachable jaws 31 design, can adapt to the testing needs of semiconductor chips of different sizes, eliminating the need to replace the entire test head due to changes in chip size, thus improving compatibility. Simultaneously, the individual replacement function of the detachable jaws 31 ensures timely repair when the jaws are worn or deformed, reducing maintenance costs. Furthermore, when subjected to thermal deformation under temperature influences, the detachable jaws 31 can expand along with the chip pickup assembly 20. Since the chip pickup assembly 20 is relatively small, its thermal expansion is also relatively small, and the assembly gap between the two further reduces the amount of thermal deformation. Therefore, the detachable jaws 31 have better strength and temperature resistance, are less affected by temperature, ensure the pickup accuracy and testing reliability of the chip pickup assembly 20, and improve the detection efficiency and reliability of the semiconductor chips.

[0033] Please see Figure 1 As shown, the chip pickup assembly 20 provided in this application is applied in the field of semiconductor testing technology, and is used to locate and pick up chips during the testing and sorting process of semiconductor chips. In this embodiment, the chip pickup assembly 20 includes a body 1, a pickup head 2 disposed on the body 1, and several claws. The body 1 serves as the main body of the chip pickup assembly 20 and is used for mounting the chip pickup assembly 20 to other components, such as mounting the chip pickup assembly 20 to the substrate 10 included in the test head device 100. In this embodiment, the body 1 is generally a rectangular block, and has several screw holes for screws to pass through to connect the chip pickup assembly 20 to other components.

[0034] Please see Figure 2 and Figure 3As shown, the pickup head 2 protrudes from the body 1, and the end face size of the pickup head 2 is smaller than that of the body 1. This design allows the pickup head 2 to approach the chip more flexibly, extending into narrow spaces for easier pickup operations. The pickup head 2 has a pickup surface 210 for picking up the chip, which is the key part that directly contacts the chip and performs the pickup function. In this embodiment, the pickup head 2 includes a protruding post 22 extending from the body 1 and an end face 21 located at the free end of the protruding post 22. The protruding post 22 serves to connect the body 1 and the end face 21, and also provides an installation position for the detachable claw 31; the end face 21 directly carries the chip, and the end face of the end face 21 constitutes the pickup surface 210.

[0035] Please see Figure 3 As shown, in this embodiment, the pickup surface 210 includes a main body placement surface 211 for placing the main body of the chip, and a pin placement surface 212 for placing the pins of the chip. The pin placement surface 212 is located on opposite sides of the main body placement surface 211 in the first direction. A pair of detachable claws 31 are disposed on opposite sides of the pickup head 2 in the first direction, thus limiting the pins by the pair of detachable claws 31. The detachable claws 31 are configured to match the structure of the chip and its pins, thereby enabling compatibility with chips of various structures, providing accurate positioning, protecting the pins, and providing a stable foundation for subsequent pickup and testing. In this embodiment, the pin placement surface 212 is lower than the main body placement surface 211. When the main body of the chip rests against the main body placement surface 211, the pins on both sides of the main body rest against the pin placement surface 212 to achieve stable support. An adsorption port 213 is provided on the main body placement surface 211. The adsorption port 213 is connected to a negative pressure adsorption device through a channel to form a negative pressure adsorption force to adsorb the chip onto the pickup surface 210. In some embodiments, the chip can be a SOP type chip, or a TSSOP, MSOP, or other types of chip.

[0036] Please see Figures 3 to 5 As shown, several claws are disposed around the pickup surface 210 to form a receiving space for accommodating the chip together with the pickup surface 210. The claws are configured to confine the chip within the receiving space. The claws are the structure of the chip pickup assembly 20 for chip positioning. In this application, the claws include a pair of detachable claws 31 and a pair of fixed claws 32.

[0037] The detachable claws 31 are detachably mounted on the chip pickup assembly 20. In this embodiment, the detachable claws 31 are disposed on opposite sides of the pickup head 2 in a first direction. The detachable claws 31 include a mounting portion 311 and a contact portion 312. The mounting portion 311 is connected to the protrusion 22, and the contact portion 312 is located on the side of the end 21 for contacting the chip and confining it within the receiving space. In this embodiment, the mounting portion 311 is relatively thick to have sufficient structural strength to ensure reliable installation; the contact portion 312 is relatively thin and has a guide slope on its back side to facilitate insertion into the slot for chip placement to pick up and place the chip.

[0038] Furthermore, to achieve detachable installation, the side wall of the protrusion 22 is provided with a mounting groove 221, and the mounting part 311 is located in the mounting groove 221. This design ensures the stability and accuracy of the installation of the detachable claw 31. Specifically, the mounting part 311 is connected to the mounting groove 221 of the protrusion 22 via a pin 5 and a countersunk bolt 4. The pin 5 is inserted into the pin holes on the mounting part 311 and the protrusion 22 to achieve the pre-positioning of the detachable claw 31. Then, the countersunk bolt 4 passes through the countersunk hole 3110 opened on the mounting part 311 and is locked onto the protrusion 22 to securely install the detachable claw 31 onto the protrusion 22. In this embodiment, the design of using the countersunk bolt 4 ensures that the bolt head does not protrude from the surface of the mounting part 311, reducing possible interference between the bolt and the chip receiving structure during chip pickup and ensuring smooth pickup operation.

[0039] In other embodiments, the detachable claw 31 can also achieve detachable installation connection through one or more structures such as a snap-fit ​​structure, a plug-in structure, or a threaded structure.

[0040] In this embodiment, by providing a detachable jaw 31, when testing semiconductor chips of different sizes, only the detachable jaw 31 of the appropriate size and shape needs to be replaced, without replacing the entire test head. This greatly improves the adaptability of the device, reduces equipment downtime, and lowers spare parts costs. Furthermore, since the detachable jaw 31 can be replaced individually, when the jaw wears or deforms due to long-term use, only the damaged detachable jaw 31 needs to be replaced to restore the device's pickup accuracy and reliability, extending the overall lifespan of the device. Moreover, as a relatively independent component, the detachable jaw 31 has ample structural design space, allowing for better strength and temperature resistance. The assembly gap formed by the detachable jaw 31 on the chip pickup assembly 20 also reduces thermal deformation, thus minimizing its susceptibility to temperature fluctuations. This ensures the pickup accuracy and testing reliability of the chip pickup assembly 20, improving the detection efficiency and reliability of the semiconductor chips.

[0041] Please continue reading. Figures 3 to 5As shown, the plurality of grippers also includes a pair of fixed grippers 32, which are integrally formed with the pickup head 2 and disposed on opposite sides of the pickup head 2 in the second direction. The fixed grippers 32 and the detachable grippers 31 cooperate with each other to form a receiving space for accommodating the chip, stably confining the chip therein. In this embodiment, the width of the detachable gripper 31 is greater than the width of the fixed grippers 32. Figure 3 As shown, the width of the detachable claw 31 is its dimension along the second direction, and the width of the fixed claw 32 is its dimension along the first direction. This width design better matches the structural characteristics of the chip. The wider detachable claw 31 can better adapt to the size of the pins on both sides of the chip, providing a more stable limiting effect; while the relatively narrower fixed claw 32 acts on both sides of the chip body in the second direction, playing an auxiliary limiting role, without causing too much obstruction to the placement and pickup of the chip. Furthermore, compared with the end of the detachable claw 31, the end of the fixed claw 32 is closer to the pickup surface 210, so that the detachable claw 31 guides the chip first. This arrangement is beneficial to the lifespan management of the fixed claw 32 and the overall device.

[0042] Please refer to it again. Figure 1 and Figure 6 As shown, this application also provides a test pressure head device 100, which includes a substrate 10 and at least one chip pickup component 20 disposed on the substrate 10. The chip pickup component 20 is the chip pickup component 20 of any of the above embodiments. The substrate 10 and the chip pickup component 20 are provided with an airflow channel 30 that communicates with each other. The airflow channel 30 forms an adsorption port 213 for adsorbing chips on the pickup surface 210. The substrate 10 provides a stable mounting platform for the chip pickup component 20. By controlling the airflow direction and air pressure within the airflow channel 30, the adsorption and release operations of the chips by the adsorption port 213 can be achieved. Specifically, when it is necessary to adsorb the chip, a negative pressure airflow is introduced into the airflow channel 30 through an external air source, so that a negative pressure is generated at the adsorption port 213, thereby firmly adsorbing the chip onto the pickup surface 210; when it is necessary to place the chip in a designated position, the negative pressure airflow is stopped or a positive pressure airflow is introduced, so that the adsorption port 213 loses its adsorption force or generates a thrust, separating the chip from the pickup surface 210.

[0043] In this embodiment, a test head device 100 includes four chip pickup components 20 arranged in an array. This configuration allows the test head device 100 to simultaneously pick up multiple chips, improving testing efficiency.

[0044] The working process of the chip pickup assembly 20 provided in this application is described below. During the semiconductor chip testing and sorting process, the loading device transfers the semiconductor chip to the infeed position. At this time, the test arm drives the test pressure head device 100, on which the chip pickup assembly 20 of this application is installed, to move above the infeed position. By controlling the airflow channel 30 to generate negative pressure at the suction port 213 formed on the pickup surface 210, the chip is adsorbed onto the pickup surface 210. During this process, the detachable claw 31 and the fixed claw 32 work together to confine the chip within the receiving space, preventing the chip from shifting or falling off during adsorption and movement. After the chip is accurately adsorbed and confined, the test pressure head device 100 presses the chip onto the test holder for testing. After the test is completed, the test arm again drives the test pressure head device 100 to pick up the chip and move it to the discharge position. By changing the air pressure in the airflow channel 30, the suction port 213 loses its adsorption force, and the chip is placed at the discharge position, completing the entire testing and sorting process.

[0045] As can be seen from the above description of the specific embodiments, the chip pickup assembly 20 and the test head device 100 including the chip pickup assembly 20 provided in this application have the following significant advantages. Due to the detachable jaws 31 design of the chip pickup assembly 20, the test head device 100 can adapt to the testing needs of semiconductor chips of different sizes, eliminating the need to replace the entire test head due to changes in chip size, thus reducing equipment downtime and spare parts costs. Simultaneously, the individual replacement function of the detachable jaws 31 ensures timely repair when the jaws are worn or deformed, extending the service life of the entire device. Moreover, as a relatively independent component, the detachable jaws 31 have ample structural design space, allowing for better strength and temperature resistance, and are less affected by temperature, maintaining the pickup accuracy and reliability of the test head device 100, and improving the detection efficiency and reliability of the semiconductor chips. Overall, the chip pickup assembly and test head device of this application provide an efficient, reliable, and highly adaptable solution in the field of semiconductor testing technology, with broad market application prospects.

[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A chip pickup component, characterized in that, The chip pickup assembly (20) includes a pickup head (2) and a plurality of claws. The pickup head (2) has a pickup surface (210) for picking up chips. The plurality of claws are disposed around the pickup surface (210) to form a receiving space for accommodating chips together with the pickup surface (210). The claws are configured to confine the chip within the receiving space. At least one of the plurality of claws is a detachable claw (31) that is detachably mounted on the chip pickup assembly (20).

2. The chip pickup component as described in claim 1, characterized in that, The chip pickup assembly (20) includes a body (1), and a pickup head (2) extends protruding from the body (1). The end face size of the pickup head (2) is smaller than the end face size of the body (1).

3. The chip pickup component as described in claim 2, characterized in that, The pickup head (2) includes a protruding post (22) extending from the body (1) and an end (21) located at the free end of the protruding post (22). The detachable claw (31) includes a mounting part (311) and a contact part (312). The mounting part (311) is connected to the protruding post (22), and the contact part (312) is located on the side of the end (21).

4. The chip pickup component as described in claim 3, characterized in that, The side wall of the protruding post (22) is provided with a mounting groove (221), and the mounting part (311) is located in the mounting groove (221).

5. The chip pickup component as described in claim 3, characterized in that, The mounting part (311) is provided with a countersunk hole (3110), and the mounting part (311) is installed on the protruding post (22) by a countersunk bolt (4).

6. The chip pickup component as described in claim 1, characterized in that, The detachable claws (31) are a pair, which are disposed on opposite sides of the pickup head (2) in the first direction.

7. The chip pickup component as described in claim 6, characterized in that, The plurality of jaws includes a pair of fixed jaws (32), which are integrally formed with the pickup head (2) and disposed on opposite sides of the pickup head (2) in a second direction.

8. The chip pickup component as described in claim 6, characterized in that, The pickup surface (210) includes a body placement surface (211) for placing the main body portion of the chip, and a pin placement surface (212) for placing the pin portion of the chip, wherein the pin placement surface (212) is located on opposite sides of the body placement surface (211) in the first direction, such that the pin portion is limited by a pair of the removable claws (31).

9. The chip pickup assembly as described in claim 7, characterized in that, The width of the detachable claw (31) is greater than the width of the fixed claw (32).

10. A test indenter device, comprising a substrate (10) and at least one chip pickup assembly (20) disposed on the substrate (10), characterized in that, The chip pickup assembly (20) is the chip pickup assembly (20) according to any one of claims 1 to 9, wherein the substrate (10) and the chip pickup assembly (20) are provided with airflow channels (30) that are connected to each other, and the airflow channels (30) form an adsorption port (213) on the pickup surface (210) for adsorbing the chip.

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