Chip temperature testing device

Abstract

This utility model discloses a chip temperature testing device, belonging to the field of chip testing. It includes a test chamber shell, with a mounting platform fixedly connected inside the shell. A mounting mechanism is mounted on the mounting platform, comprising several support blocks. A platform is fixedly connected to the top of each support block. The mounting mechanism also includes an air extraction component. The advantages are: by incorporating a driving mechanism and a temperature control mechanism, before temperature testing of the chip, the air below the piston plate inside the hollow tube is extracted using an air extraction fan and pipe, allowing the temperature control head to slowly press against the chip surface. This avoids excessive impact on the chip and creates a sealed space around the chip, reducing airflow and making heat transfer from the temperature control head to the chip more efficient. It also reduces heat dissipation from the chip, making temperature control easier, providing a precise temperature testing environment, and improving testing accuracy.

Description

Technical Field

[0001] This utility model relates to the field of chip testing, and in particular to a chip temperature testing device. Background Technology

[0002] With the continuous development of electronic technology, chips have become one of the indispensable core components in modern electronic products. However, the quality of chips directly affects the performance and stability of the entire product; therefore, rigorous testing and inspection are required during chip production and quality control. The temperature characteristics of chips are also crucial for their normal operation, necessitating accurate temperature testing.

[0003] A search revealed a chip temperature testing device disclosed in Chinese Patent Publication No. CN222393690U. This patent includes a test chamber shell and a temperature testing mechanism. The test chamber shell has a partition inside, which divides it into a front chamber and a rear chamber. The front chamber contains a platform and a moving device. The moving device is equipped with a lifting device for mounting the temperature testing mechanism. The platform and the temperature testing mechanism are correspondingly arranged. A temperature control head is located at the bottom of the lifting rod. This device uses a spring to buffer the chip when excessive pressure is applied, preventing chip damage. Current chip temperature testing devices waste a lot of heat during chip testing by using gas flow, resulting in inaccurate temperature control and difficulty in obtaining accurate temperature test curves, thus affecting testing efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a chip temperature testing device to solve the above-mentioned problems.

[0005] This utility model achieves the above objectives through the following technical solutions: A chip temperature testing device includes a test chamber shell, an installation platform fixedly connected inside the test chamber shell, several blind holes on the installation platform, an installation mechanism on the installation platform, and several support blocks disposed within the blind holes. A platform is fixedly connected to the top of each support block. The installation mechanism also includes an air extraction assembly, which includes an air extraction fan. An air extraction pipe is fixedly connected to the air inlet of the air extraction fan, and the air inlet of the air extraction pipe is located on the top of the support blocks. A drive mechanism, including a hydraulic cylinder, is fixedly connected to the top of the test chamber shell. A connecting seat is fixedly connected to the output end of the hydraulic cylinder, and a connecting plate is fixedly connected to the connecting seat. Several hollow tubes are fixedly connected to the connecting plate, and a temperature control mechanism is installed inside each hollow tube. The temperature control mechanism includes an installation tube, a piston plate fixedly connected to the bottom of the installation tube, and a temperature control head installed on the piston plate.

[0006] Preferably, the number of support blocks and hollow tubes are the same and they are arranged linearly and evenly, with the hollow tubes located directly above the support blocks.

[0007] Preferably, a number of guide strips are fixedly connected inside the hollow tube, and a guide block is fixedly connected to the side of the mounting tube, with the guide block slidably mounted on the guide strips.

[0008] Preferably, a spring is installed between the hollow tube and the piston plate.

[0009] Preferably, a heat insulation plate is fixedly connected to the piston plate.

[0010] Preferably, several anti-slip pads are fixedly connected to the bottom of the test chamber shell.

[0011] The beneficial effects are as follows: By setting up a drive mechanism and a temperature control mechanism, the air under the piston plate inside the hollow tube is extracted by the air pump and the air extraction pipe before the chip is tested for temperature. This allows the temperature control head to slowly press against the chip surface, avoiding excessive impact on the chip. In addition, a sealed space is formed around the chip, reducing air flow and making the heat conduction from the temperature control head to the chip more efficient. It also reduces the heat dissipation of the chip, makes the temperature easier to control, provides a precise temperature testing environment, and improves the accuracy of the test.

[0012] The additional technical features and advantages of this utility model will become more apparent from the following description, or may be learned through specific practice of this utility model. Attached Figure Description

[0013] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the following detailed description to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the chip temperature testing device described in this utility model; Figure 2 This is a side sectional view of the chip temperature testing device described in this utility model; Figure 3 This is a schematic diagram showing the connection between the mounting platform and the carrier of the chip temperature testing device described in this utility model; Figure 4 This is a schematic diagram of the drive mechanism structure of the chip temperature testing device described in this utility model; Figure 5 This is a cross-sectional view of the hollow tube of the chip temperature testing device described in this utility model; Figure 6 This is a schematic diagram of the temperature control mechanism of the chip temperature testing device described in this utility model.

[0014] The reference numerals in the attached drawings are explained as follows: 101, outer shell of the test chamber; 102, mounting platform; 103, anti-slip mat; 201, bearing block; 202, platform; 203, vacuum pump; 204, vacuum pipe; 205, discharge pipe; 301, hydraulic cylinder; 302, connecting seat; 303, connecting plate; 304, hollow tube; 305, guide strip; 401, mounting tube; 402, guide block; 403, piston plate; 404, temperature control head; 405, heat insulation plate; 406, spring. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] The present invention will be further described below with reference to the accompanying drawings: like Figure 1 — Figure 6As shown, the chip temperature testing device includes a test chamber housing 101. A mounting platform 102 is bolted inside the test chamber housing 101. The mounting platform 102 has several blind holes and a mounting mechanism. The mounting mechanism includes several support blocks 201, which are disposed within the blind holes. The top of each support block 201 is bolted to the platform 202. During temperature testing, the chip needs to be mounted on the interface of the platform 202. The mounting platform 102 contains a power supply component and a monitoring component, which provide power, data monitoring, and recording during chip temperature testing. The mounting mechanism also includes a vacuum component, which includes a vacuum pump 203. A vacuum pipe 204 is inserted into the inlet end of the vacuum pump 203, and a discharge pipe 205 is inserted into the outlet end of the vacuum pump 203. 05 connects to the outside of the mounting platform 102. The air inlet end of the exhaust pipe 204 is located on the top of the support block 201. A drive mechanism is provided on the top of the test chamber shell 101. The drive mechanism includes a hydraulic cylinder 301. The hydraulic cylinder 301 is bolted to the top of the test chamber shell 101. The output end of the hydraulic cylinder 301 is bolted to a connecting seat 302. A connecting plate 303 is bolted to the connecting seat 302. Several hollow tubes 304 are bolted to the connecting plate 303. A temperature control mechanism is installed inside the hollow tubes 304. The temperature control mechanism includes a mounting tube 401. A piston plate 403 is bolted to the bottom of the mounting tube 401. A temperature control head 404 is installed on the piston plate 403. The temperature control head 404 is electrically connected to an external controller through a wire. The wire passes through the mounting tube 401 and is led out from the top (not shown in the figure).

[0018] In this embodiment, the number of carrier blocks 201 and hollow tubes 304 are the same and they are arranged linearly and evenly. The hollow tubes 304 are located directly above the carrier blocks 201. Setting multiple carrier blocks 201 and stage 202 facilitates simultaneous temperature testing of multiple chips, improving testing efficiency. Furthermore, the hollow tubes 304 can cover the carrier blocks 201 when the device is not in use, preventing dust from falling onto the stage 202 and avoiding affecting the connection between the chip and the stage 202.

[0019] In this embodiment, a plurality of guide strips 305 are welded inside the hollow tube 304, and a guide block 402 is bolted to the side of the mounting tube 401. The guide block 402 is slidably disposed on the guide strips 305. The arrangement of the guide block 402 and the guide strips 305 guides the movement of the mounting tube 401 and the piston plate 403, prevents the piston plate 403 from deviating, improves the airtightness of the piston plate 403 and the mounting tube 401 during relative movement, and improves the testing efficiency.

[0020] In this embodiment, a spring 406 is installed between the hollow tube 304 and the piston plate 403. The spring 406 is configured to provide a reverse force for the piston plate 403 to move towards the top of the chip, preventing the air pressure below the piston plate 403 from decreasing too quickly and the impact force when the temperature control head 404 contacts the chip from being too large, which could damage the device or the chip. Furthermore, after the test is completed, raising the connecting plate 303 can reset the piston plate 403.

[0021] In this embodiment, a heat insulation plate 405 is bolted to the piston plate 403. The heat insulation plate 405 prevents the heat from the temperature control head 404 from being conducted to other locations through the piston plate 403, thereby further improving the temperature control accuracy of the chip.

[0022] In this embodiment, several anti-slip pads 103 are adhered to the bottom of the test chamber shell 101.

[0023] Working Principle: During operation, the output end of hydraulic cylinder 301 retracts, and connecting seat 302 is in a high position. The operator installs the chips to be tested one by one onto the stage 202. Hydraulic cylinder 301 is then activated, pushing connecting seat 302 and connecting plate 303 downwards. Connecting plate 303 causes each hollow tube 304 to descend synchronously. The hollow tubes 304 are inserted into blind holes on the mounting platform 102. At this point, the hollow tubes 304 cover the support block 201, forming a sealed space below the piston plate 403 inside the hollow tubes 304. The vacuum pump 203 is then activated, drawing air out of the sealed space below the piston plate 403 through the vacuum pipe 204. During the vacuuming process, the piston plate 403 gradually descends until the temperature control head 404 presses against the top of the chip, and the vacuum pipe 204 continues to draw air. A negative pressure space is created below the piston plate 403, suppressing heat exchange caused by convection and reducing airflow and heat conduction speed within the space. This allows the heat from the temperature control head 404 to be more concentrated on the chip. The temperature control head 404 is activated, and the tester controls its temperature to transfer it to the chip via heat conduction, minimizing heat loss from the chip via convection. This allows for precise control of chip heat and monitoring of chip status through control components, enabling more efficient and accurate chip temperature testing. After the test, the output end of the hydraulic cylinder 301 retracts, and the connecting seat 302 and connecting plate 303 pull the hollow tube 304 off the support block 201, allowing the chip to return to room temperature or be removed using tools for the next batch of chip temperature testing.

[0024] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A chip temperature testing device, comprising a test chamber housing (101), wherein a mounting platform (102) is fixedly connected inside the test chamber housing (101), characterized in that: The mounting platform (102) has several blind holes, and the mounting platform (102) has an installation mechanism. The installation mechanism includes several support blocks (201), and the support blocks (201) are disposed in the blind holes. The top of the support blocks (201) is fixedly connected to the platform (202). The installation mechanism also includes an air extraction assembly, which includes an air extraction machine (203). The air extraction machine (203) has an air extraction pipe (204) fixedly connected to its air inlet end. The air inlet end of the air extraction pipe (204) is disposed on the top of the support blocks (201). The top of the test chamber shell (101) is provided with a driving mechanism. The driving mechanism includes a hydraulic cylinder (301), which is fixedly connected to the top of the test chamber shell (101). A connecting seat (302) is fixedly connected to the output end of the hydraulic cylinder (301). A connecting plate (303) is fixedly connected to the connecting seat (302). Several hollow tubes (304) are fixedly connected to the connecting plate (303). A temperature control mechanism is installed inside the hollow tubes (304). The temperature control mechanism includes an installation tube (401). A piston plate (403) is fixedly connected to the bottom of the installation tube (401). A temperature control head (404) is installed on the piston plate (403).

2. The chip temperature testing device according to claim 1, characterized in that: The number of the support blocks (201) is the same as that of the hollow tubes (304) and they are arranged linearly and evenly. The hollow tubes (304) are located directly above the support blocks (201).

3. The chip temperature testing device according to claim 1, characterized in that: A plurality of guide strips (305) are fixedly connected inside the hollow tube (304), and a guide block (402) is fixedly connected to the side of the mounting tube (401). The guide block (402) is slidably disposed on the guide strips (305).

4. The chip temperature testing device according to claim 1, characterized in that: A spring (406) is installed between the hollow tube (304) and the piston plate (403).

5. The chip temperature testing device according to claim 1, characterized in that: A heat insulation plate (405) is fixedly connected to the piston plate (403).

6. The chip temperature testing device according to claim 1, characterized in that: The bottom of the test chamber shell (101) is fixedly connected with several anti-slip pads (103).

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