LiDAR and detector chips

Abstract

This disclosure provides a lidar and a detector chip. The detector chip includes: a detector array having a photosensitive surface, the photosensitive surface including a photosensitive area and a non-photosensitive area; and a black adhesive layer located on the non-photosensitive area. The detector includes a single-photon avalanche diode configured to receive near-infrared light, and the black adhesive layer has a transmittance of less than 1% for near-infrared light.

Description

Technical Field

[0001] This disclosure relates to the field of laser detection, and in particular to a lidar and detector chip. Background Technology

[0002] As an active detection sensor, lidar measures information about objects, such as distance and speed, by emitting detection light and receiving the echo.

[0003] In lidar detection, a laser emits a probe beam. The detector receives the echo formed by the reflection of this probe beam from an object. Besides the echo, the detector may also receive ambient light, which can interfere with lidar detection. Matching the size of the detector's photosensitive surface to the size of the echo spot can effectively improve the signal-to-noise ratio. However, existing methods for adjusting the size of the detector's photosensitive surface are complex, costly, and have long processing cycles. Utility Model Content

[0004] The problem addressed by this disclosure is how to adjust the size of the photosensitive area of ​​the photosensitive surface of a detector chip used in lidar in a low-cost and short-cycle manner.

[0005] To address the aforementioned problems, this disclosure provides a detector chip for lidar, comprising:

[0006] A detector array having a photosensitive surface including a photosensitive area and a non-photosensitive area; and a black adhesive layer located on the non-photosensitive area, wherein the detector includes a single-photon avalanche diode configured to receive near-infrared light, and the black adhesive layer has a transmittance of less than 1% for the near-infrared light.

[0007] Optionally, the detector chip further includes: a metal mesh disposed between adjacent detectors, the metal mesh protruding from the photosensitive surface; the thickness of the black adhesive layer is greater than the height of the metal mesh protruding from the photosensitive surface.

[0008] Optionally, the thickness of the black adhesive layer is greater than 1.5 μm.

[0009] Optionally, the transmittance of the black adhesive layer to the near-infrared light is less than 0.1%.

[0010] Optionally, the detector chip further includes a planarization layer located on the photosensitive area and the black adhesive layer, the surface of the planarization layer being parallel to the photosensitive surface.

[0011] Optionally, the black adhesive layer includes a matrix and a dopant, wherein the dopant is dispersed within the matrix.

[0012] Optionally, the detector chip further includes an adhesion layer located between the photosensitive surface of the detector array and the black adhesive layer.

[0013] Accordingly, this disclosure also provides a lidar, including:

[0014] A laser chip configured to generate probe light; and a detector chip adapted to receive echo light formed by reflection of the probe light, the detector chip comprising: a detector array having a photosensitive surface including a photosensitive area and a non-photosensitive area; and a black adhesive layer located on the non-photosensitive area, wherein the detector includes a single-photon avalanche diode configured to receive the echo light, and the black adhesive layer has a transmittance of less than 1% for the echo light.

[0015] Optionally, the size of the photosensitive area is consistent with the size of the echo light corresponding to the probe light.

[0016] Optionally, the lidar further includes a lens configured to shape the probe light and the echo light, wherein the photosensitive area corresponds to the spot size of the echo light after being shaped by the lens.

[0017] Compared with the prior art, the technical solution disclosed herein has the following advantages:

[0018] In this disclosed technical solution, a black adhesive layer is disposed on the non-photosensitive area of ​​the photosensitive surface of the detector array. The black adhesive layer can block light. The photosensitive area of ​​the photosensitive surface of the detector array can receive light signals. Adjusting the size of the black adhesive layer can adjust the size of the photosensitive area of ​​the photosensitive surface. The size of the photosensitive area of ​​the photosensitive surface can be adapted to the size of the near-infrared light spot. This disclosed technical solution can adjust the size of the photosensitive area of ​​the photosensitive surface of the detector chip. The adjustment cost is low and the cycle is short. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort. The drawings are used to provide a further understanding of this disclosure and constitute a part of the specification. They are used together with the embodiments of this disclosure to explain this disclosure and do not constitute a limitation of this disclosure. In the drawings:

[0020] Figure 1 This is a top view schematic diagram of the detector chip used for lidar in some embodiments of this disclosure.

[0021] Figure 2 This is a top view of the detector array in some embodiments of this disclosure.

[0022] Figure 3 This is a schematic cross-sectional view of the detector array in some embodiments of this disclosure.

[0023] Figure 4 This is a cross-sectional structural schematic diagram of a detector chip used for lidar in some embodiments of this disclosure.

[0024] Figures 5 to 9 This is a schematic diagram of the various steps in the manufacturing method of a detector chip for lidar in some embodiments of this disclosure. Detailed Implementation

[0025] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure. Therefore, the drawings and description are to be considered exemplary in nature and not restrictive.

[0026] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or connections that allow for communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0028] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] The following disclosure provides numerous different embodiments or examples for implementing various structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this disclosure, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0030] In existing technologies, adjusting the size of the detector's photosensitive surface requires redesigning and manufacturing the chip to achieve a customized photosensitive surface. Redesigning and manufacturing the chip involves steps such as layout design, wafer fabrication, dicing, chip packaging, and testing. The cumulative cost can reach millions of dollars, and the processing cycle typically exceeds eight months.

[0031] This disclosure provides a detector chip for lidar, which allows adjustment of the size of the photosensitive area on the detector's photosensitive surface. This reduces adjustment costs and shortens the adjustment cycle. The detector chip provided in this disclosure includes a detector array and a black adhesive layer. The detector array has a photosensitive surface. The photosensitive surface includes a photosensitive area and a non-photosensitive area. The black adhesive layer is located on the non-photosensitive area. The detector includes a single-photon avalanche diode. The single-photon avalanche diode can receive near-infrared light. The black adhesive layer has a near-infrared light transmittance of less than 1%.

[0032] In some embodiments, a black adhesive layer on the non-photosensitive area of ​​the photosensitive surface of the detector array can block light. The photosensitive area of ​​the photosensitive surface of the detector array can receive light signals. The size of the photosensitive area of ​​the photosensitive surface can be adjusted by adjusting the size of the black adhesive layer. The photosensitive area of ​​the photosensitive surface can be adapted to the spot size of near-infrared light. Exemplarily, the black adhesive layer can be formed in the back-end packaging process. Embodiments of this disclosure can adjust the size of the photosensitive area of ​​the photosensitive surface of the detector chip. The adjustment cost is low and the cycle is short.

[0033] refer to Figure 1The diagram shows a top view of a detector chip for lidar in some embodiments of this disclosure.

[0034] The detector chip includes a detector array 110.

[0035] The detector array 110 has a photosensitive surface. The photosensitive surface includes a photosensitive area (ps) and a non-photosensitive area (nps). The detector chip also includes a black adhesive layer 130. The black adhesive layer 130 is located on the non-photosensitive area (nps).

[0036] In some embodiments, the detector chip includes a plurality of pixels 111. The plurality of pixels 111 may be arranged in an array along a preset direction. For example, Figure 1 In some embodiments shown, the detector array 110 contains a plurality of pixels 111 arranged in a one-dimensional array along the x-direction. In some embodiments, the plurality of pixels 111 may also be arranged in a two-dimensional array along both the x-direction and the y-direction (not shown in the figure). The y-direction may be perpendicular to the x-direction.

[0037] like Figure 1 As shown, the photosensitive surface of pixel 111 includes a photosensitive area ps and a non-photosensitive area nps. A black adhesive layer 130 is disposed on the non-photosensitive area nps. The black adhesive layer 130 can block light incident on the non-photosensitive area, preventing the detector in the non-photosensitive area from receiving light. In this way, the black adhesive layer 130 can limit the photosensitive area of ​​pixel 111, such as limiting the position, shape, or size of the photosensitive area.

[0038] In some embodiments, pixel 111 includes a plurality of detector pds. Exemplarily, the detector pd includes a single-photon avalanche diode (SPAD). The SPAD can receive near-infrared light. Exemplarily, pixel 111 or the SPAD can receive the echo formed by the reflection of the detection light emitted by the lidar by an object. The transmittance of the black adhesive layer 130 to the near-infrared light is less than 1%.

[0039] Figure 2 A top view of the detector array is shown in some embodiments of this disclosure. Figure 3 A cross-sectional schematic diagram of the detector array in some embodiments of this disclosure is shown.

[0040] For example, such as Figures 1 to 3 In some embodiments shown, a pixel 111 includes a plurality of detectors pd. The plurality of detectors pd are arranged in an array along a predetermined direction. For example, the plurality of detectors pd are arranged in a two-dimensional array along a first direction and a second direction. The first direction is, for example, the x-direction. The second direction may be perpendicular to the x-direction. The detectors pd include SPADs.

[0041] In some embodiments of this disclosure, the detector chip may include a metal mesh. The metal mesh may be disposed between adjacent detectors. The metal mesh may protrude from the photosensitive surface. Distributing a metal mesh between adjacent detectors can effectively suppress optical crosstalk between them and improve the signal-to-noise ratio of the detector array. The metal mesh may protrude from the photosensitive surface of the detector array along a direction perpendicular to the photosensitive surface of the detector array.

[0042] For example, such as Figures 1 to 3 In some embodiments shown, the detector chip includes a metal grid mg. The metal grid mg includes metal isolation structures between adjacent detectors pd. For example, there is a metal isolation structure between every two adjacent detectors in a plurality of detectors pd. The metal isolation structures between the plurality of detectors pd are integrally formed to constitute the metal grid mg. The metal grid mg extends along the z-direction. The z-direction is perpendicular to the photosensitive surface of the detector array. Figure 3 As shown, the metal mesh mg protrudes from the photosensitive surface of the detector array.

[0043] Continue to refer to Figure 1 The detector chip also includes a black adhesive layer located on the non-photosensitive area of ​​the detector array.

[0044] The black adhesive layer defines the photosensitive and non-photosensitive areas of the photosensitive surface in a detector array. It blocks the non-photosensitive areas, preventing light from incident on them. By setting the black adhesive layer, the position, shape, or size of the photosensitive area on the photosensitive surface in the detector array can be redefined or flexibly adjusted.

[0045] A black adhesive layer is placed on the non-photosensitive area. Adjusting the position, shape, or size of the black adhesive layer can adjust the position, shape, or size of the photosensitive area of ​​the photosensitive surface. For example, a lidar can emit probe light. The probe light can be near-infrared light. A detector array can receive the echo formed by the probe light being reflected by an object. The photosensitive area of ​​the photosensitive surface can be adapted to the light spot of the echo.

[0046] By adjusting the photosensitive area of ​​the photosensitive surface through the black adhesive layer, the development cycle of detector chips used in LiDAR can be shortened to less than two months, saving over 90% of development costs and reducing the development cycle by over 75%. The technical solution disclosed herein is highly versatile. The photosensitive area of ​​the photosensitive surface can be customized for different needs or different end products. It can meet the needs of different customers or product iterations with lower development costs and shorter development cycles.

[0047] In some embodiments, the detector array may include multiple pixels. A black adhesive layer may cover a portion of the photosensitive surface of a pixel. The portion of the photosensitive surface covered by the black adhesive layer is a non-photosensitive area. The portion of the photosensitive surface not covered by the black adhesive layer is a photosensitive area.

[0048] For example, such as Figures 1 to 3 In some embodiments shown, the black adhesive layer 130 is located on a portion of the detector pds in the pixels 111. The photosensitive surface of the covered detector pds is the non-photosensitive area nps. The photosensitive surface of the portion of the detector pds not covered by the black adhesive layer 130 is the photosensitive area. Figure 1 As shown, the non-photosensitive area nps of a pixel is located around the photosensitive area ps.

[0049] In some embodiments, the black adhesive layer 130 may cover a portion of the photosensitive surface of the detector pd. For example, the photosensitive surface of a detector pd may be partly a photosensitive area and partly a non-photosensitive area.

[0050] In some embodiments, a metal mesh is disposed on the photosensitive surface of the detector array. The thickness of the black adhesive layer can be greater than the height of the metal mesh protruding from the photosensitive surface. This improves the flatness of the top surface of the black adhesive layer.

[0051] For example, such as Figures 1 to 3 In some embodiments shown, along the z-direction, the black adhesive layer 130 protrudes from the photosensitive surface between the metal mesh mg. The black adhesive layer 130 also protrudes from the top of the metal mesh mg. The dimension of the black adhesive layer 130 along the z-direction is larger than the dimension of the metal mesh mg. The black adhesive layer 130 has a flat surface perpendicular to the z-direction.

[0052] In some embodiments, the thickness of the black adhesive layer can be greater than 1.5 μm. This effectively ensures the flatness of its top surface and the light-blocking ability of the black adhesive layer.

[0053] In some embodiments, the transmittance of the black adhesive layer to near-infrared light is less than 0.1%. The detector chip can be a detector chip used for lidar. The detection light and echo of lidar are near-infrared light. The low transmittance of the black adhesive layer to near-infrared light can suppress the reception of near-infrared light in non-photosensitive areas. For example, a 1.5 μm thick black adhesive layer 130 has a transmittance of less than 0.1% to near-infrared light at a wavelength of 905 nm.

[0054] For example, the black adhesive layer has a transmittance of less than 0.1% for visible light. This can suppress the reception of visible light and ambient light by the photosensitive surface of the detector in non-photosensitive areas, thereby improving the signal-to-noise ratio of the lidar.

[0055] In some embodiments, the black adhesive layer may include a matrix and a dopant. The dopant is dispersed within the matrix. The matrix in the black adhesive layer may be an organic material. The dopant may be an inorganic material. The black adhesive layer can be fabricated in the back-end packaging process without adjusting the epitaxial process of the detector array, effectively reducing process costs and shortening the development cycle. For example, the matrix in the black adhesive layer may be a resin. The dopant may be carbon black.

[0056] Continue to refer to Figure 3In some embodiments of this disclosure, the detector chip further includes an adhesion layer.

[0057] The adhesion layer is located between the photosensitive surface of the detector array and the black adhesive layer. The adhesion layer can improve the surface adhesion of the photosensitive surface of the detector array, improve the adhesion reliability between the black adhesive layer and the photosensitive surface of the detector array, and improve the reliability and stability of the detector chip.

[0058] For example, the adhesion layer can be located on the photosensitive surface of the detector array. The surface of the adhesion layer can be in direct contact with the photosensitive surface of the detector array. Figure 3 In some embodiments shown, the adhesion layer 120 ( Figure 3 (As shown in red in the middle) The surface of the detector pd of pixel 111 in the detector array 110 is covered. The adhesion layer 120 also covers the surface of the metal mesh mg.

[0059] In some embodiments of this disclosure, the thickness of the adhesion layer can be in the range of 0.04 μm to 0.08 μm.

[0060] refer to Figure 4 The diagram shows a cross-sectional view of a detector chip for lidar in some embodiments of this disclosure.

[0061] In some embodiments of this disclosure, the detector chip may further include a planarization layer. The planarization layer is located on the photosensitive area and the black adhesive layer. The surface of the planarization layer is parallel to the photosensitive surface.

[0062] The planarization layer can fill the height difference between the photosensitive surface of the photosensitive area in the detector array and the top surface of the black adhesive layer, providing a good surface for subsequent processes.

[0063] The planarization layer can improve the flatness of the detector array surface after the black glue layer is formed, providing a good process surface for subsequent processes and improving the yield and accuracy of subsequent processes.

[0064] For example, such as Figure 4 In some embodiments shown, planarization layer 240 is located on detector pd and black adhesive layer 230. The surface of planarization layer 240 is parallel to the photosensitive surface. The surface of planarization layer 240 is perpendicular to the z-direction.

[0065] In some embodiments, the thickness of the planarization layer (the dimension of the planarization layer along the z-direction) can range from 1.5 μm to 2.5 μm. The thickness of the planarization layer can be greater than the thickness of the black adhesive layer, allowing the planarization layer to fill the height difference between the top of the black adhesive layer and the photosensitive surface. A planarization layer thickness not exceeding 2.5 μm can reduce light absorption and decrease the impact of the planarization layer on the photon detection efficiency of the detector.

[0066] In some embodiments of this disclosure, the detector chip may further include a microlens. The microlens is located on a planarization layer.

[0067] Microlenses can focus light signals onto the detectors in the detector array, thereby improving the photon detection efficiency of the detectors.

[0068] like Figure 4 In some embodiments shown, the detector chip includes a microlens array 250. The microlens array 250 includes a plurality of microlenses 251. The plurality of microlenses 251 are distributed on the surface of a planarization layer 240 on the photosensitive area ps and the non-photosensitive area. Each microlens 251 corresponds one-to-one with a detector pd.

[0069] On the other hand, this disclosure also provides a lidar.

[0070] A lidar system comprises a laser chip and a detector chip. The laser chip generates probe light. The detector chip receives the echo formed by the reflection of the probe light. The detector chip includes a detector array and a black layer. The detector array has a photosensitive surface, which includes a photosensitive area and a non-photosensitive area. The black layer is located on the non-photosensitive area. The detector includes a single-photon avalanche diode (SPDB). The SPDB receives the echo. The black layer has a transmittance of less than 1% for the echo.

[0071] Laser chips may include lasers. For example, lasers may include vertical-cavity surface-emitting lasers (VCSELs), edge-emitting lasers (EELs), distributed feedback lasers (DFBs), fiber lasers, or similar devices.

[0072] In some embodiments of this disclosure, the detector chip can be the detector chip used in lidar as disclosed herein. The technical solution for the detector chip can be found in the foregoing embodiments of the detector chip.

[0073] In some embodiments of this disclosure, the photosensitive area may correspond to the echo of the probe light. Exemplarily, the size of the photosensitive area may be comparable to the size of the echo formed by the object reflecting the probe light. For example, the spot of the echo formed by the object reflecting the probe light may be slightly smaller than the photosensitive area of ​​the photosensitive surface. Alternatively, the spot of the echo formed by the object reflecting the probe light may be slightly larger than the photosensitive area of ​​the photosensitive surface. Exemplarily, the position of the photosensitive area may correspond to the position of the echo. For example, the position of the photosensitive area may correspond to the position of the echo of the probe light at its farthest detection distance. This ensures that the detector of the photosensitive area receives the corresponding echo, suppresses the reception of interfering light, and improves the signal-to-noise ratio of the lidar. Interfering light may include echoes that do not correspond to the photosensitive area, such as echoes from detection angles corresponding to other photosensitive areas, or probe light or echoes from other lidars. Interfering light may also include ambient light.

[0074] In some embodiments of this disclosure, the lidar may further include a lens. The lens can shape the probe light and the echo. The photosensitive area may correspond to the size of the light spot after the echo has been shaped by the lens.

[0075] For example, the lens can receive and shape the echo formed by the probe light reflected from an object. The shaped echo can then be incident on the photosensitive surface of the detector array. The echo spot on the photosensitive surface of the detector array can be slightly larger than the photosensitive area of ​​the photosensitive surface. Alternatively, the echo spot on the photosensitive surface of the detector array can be slightly smaller than the photosensitive area of ​​the photosensitive surface.

[0076] A lens may include one or more lenses. A lidar may include separate transmitting and receiving lenses. For example, a receiving lens may include one or more lenses. The receiving lens may perform echo shaping. For example, a lidar may include a shared lens for shaping the coaxial beam in the transmitting and receiving optical paths.

[0077] On the other hand, this disclosure provides a method for manufacturing a detector chip for lidar.

[0078] refer to Figures 5 to 9 The diagram shows a schematic representation of the various steps in a method for manufacturing a detector chip for lidar in some embodiments of this disclosure.

[0079] like Figure 5 and Figure 6 As shown, the manufacturing method includes: forming a detector array.

[0080] Figure 5 A top view of the detector array is shown. Figure 6 A schematic diagram of the cross-sectional structure of the pixels in the detector array is shown.

[0081] The technical solution for the detector array can refer to the aforementioned embodiment of the detector chip used in lidar.

[0082] For example, such as Figure 5 and Figure 6 In some embodiments shown, the step of forming the detector array 310 includes forming the detector array 310 using an image sensor fabrication (CMOS Image Sensor, CIS) process. The detector array 310 includes a plurality of pixels 311.

[0083] like Figure 7 As shown, the manufacturing method further includes forming an adhesion layer on the photosensitive surface of the detector array.

[0084] For example, such as Figure 7 In some of the embodiments shown, an adhesion layer 320 is coated on the photosensitive surface of the detector array. The formed adhesion layer 320 is baked to cure it.

[0085] In some embodiments, the manufacturing method further includes forming black glue marks on the detector array.

[0086] For example, a black adhesive marking material is coated onto the photosensitive surface of a detector array. The black adhesive marking material is exposed and developed to form a black adhesive mark. The black adhesive mark is then baked to cure it.

[0087] like Figures 8 to 9 As shown, the manufacturing method further includes forming a black adhesive layer on the non-photosensitive area of ​​the photosensitive surface in the detector array.

[0088] In some embodiments, an adhesion layer is also formed on the photosensitive surface of the detector array. A black adhesive layer is formed on the adhesion layer in the non-photosensitive area.

[0089] The technical solution for the black adhesive layer can be found in the aforementioned embodiment of the detector chip used in lidar.

[0090] In some embodiments of this disclosure, a black adhesive material is coated onto the photosensitive surface of the detector array. The black adhesive material is then exposed and developed to remove the black adhesive material from the photosensitive surface of the photosensitive area, leaving the black adhesive material on the photosensitive surface of the non-photosensitive area, thus forming a black adhesive layer. The formed black adhesive layer is then baked to cure it.

[0091] In some of the example embodiments, such as Figure 8 As shown, a black adhesive material 331 is coated on the photosensitive surface of pixel 311 in detector array 310. (As shown...) Figure 9 As shown, for black adhesive material 331 (such as...) Figure 8(As shown) Exposure and development are performed to remove the black adhesive material 331 on the photosensitive surface of the photosensitive area ps, while retaining the black adhesive material 331 on the photosensitive surface of the non-photosensitive area nps, forming a black adhesive layer 330. The formed black adhesive layer 330 is then baked to cure it. Exemplarily, during the exposure of the black adhesive material, the exposure position is determined based on the black adhesive markings.

[0092] In some embodiments of this disclosure, the manufacturing method further includes: Figure 9 As shown, after forming a black resin layer on the non-photosensitive area of ​​the photosensitive surface in the detector array, a planarization layer is formed on the photosensitive area and the black resin layer. Microlenses are then formed on the planarization layer.

[0093] For example, such as Figure 9 In some of the embodiments shown, a planarization layer 340 is coated on the photosensitive surface of the detector array. The formed planarization layer 340 is baked to cure it.

[0094] For example, such as Figure 9 In some embodiments shown, a lens material is formed on a planarization layer 340. The lens material is then shaped to form a microlens array 350. The microlens array 350 includes a plurality of microlenses 351.

[0095] In some embodiments, the lens material can be shaped by etching or thermal reflow to form a microlens array. For example, the lens material can be inorganic. The lens material can be shaped by etching to form a microlens array. The lens material can also be organic. The lens material can be shaped by thermal reflow to form a microlens array.

[0096] It should be understood that the division of modules and units in the above system is only a logical functional division. In actual implementation, there may be other division methods. In actual implementation, they may be fully or partially integrated into a single physical entity, or they may be physically separated. Furthermore, the modules and units in the device can be implemented by a processor calling software; for example, the device includes a processor connected to memory, which stores instructions. The processor calls the instructions stored in memory to implement any of the above methods or to implement the functions of each module and unit of the device. The processor may be a general-purpose processor, such as a central processing unit (CPU) or a microprocessor, and the memory may be internal or external to the system. Alternatively, the modules and units in the device can be implemented in the form of hardware circuits. The functionality of some or all modules can be achieved through the design of these hardware circuits, which can be understood as one or more processors. For example, in one implementation, the hardware circuit is an application-specific integrated circuit (ASIC), and the functionality of some or all of the above modules is achieved through the design of the logical relationships between the components within the circuit. In another implementation, the hardware circuit can be implemented using a programmable logic device (PLD), which can include a large number of logic gates. The logical relationships between these logic gates are configured through configuration files, thereby achieving the functionality of some or all of the above modules. All modules of the above system can be implemented entirely through processor-invoked programs, entirely through hardware circuits, or partially through processor-invoked programs with the remaining parts implemented through hardware circuits.

[0097] In summary, a black adhesive layer is placed on the non-photosensitive area of ​​the photosensitive surface of the detector array. This black adhesive layer blocks light from entering the photosensitive surface of the non-photosensitive area, ensuring that only the photosensitive area of ​​the detector array can receive light signals. By reducing the size of the photosensitive surface capable of receiving light signals through the black adhesive layer, the photosensitive area of ​​the photosensitive surface is made compatible with the spot of the emitted probe light, thereby achieving low-cost, short-cycle adjustment of the area of ​​the photosensitive surface receiving light signals in the detector chip.

[0098] While the above disclosure is provided, it is not limited thereto. Any person skilled in the art may make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure shall be determined by the scope defined in the claims.

Claims

1. A detector chip for lidar, comprising: A detector array having a photosensitive surface, the photosensitive surface including a photosensitive area and a non-photosensitive area; and A black adhesive layer, located on the non-photosensitive area. The detector includes a single-photon avalanche diode configured to receive near-infrared light, and the black gel layer has a transmittance of less than 1% for the near-infrared light.

2. The probe chip of claim 1, wherein, Also includes: A metal mesh is disposed between adjacent detectors and protrudes from the photosensitive surface; The thickness of the black adhesive layer is greater than the height of the metal mesh protruding from the photosensitive surface.

3. The probe chip according to claim 1 or 2, characterized in that The thickness of the black adhesive layer is greater than 1.5 μm.

4. The probe chip of claim 3, wherein, The black adhesive layer has a transmittance of less than 0.1% for near-infrared light.

5. The probe chip of claim 1, wherein, Also includes: A planarization layer is located on the photosensitive area and the black adhesive layer, and the surface of the planarization layer is parallel to the photosensitive surface.

6. The probe chip of claim 1, wherein, The black adhesive layer comprises a matrix and a dopant, wherein the dopant is dispersed within the matrix.

7. The probe chip of claim 1, wherein, Also includes: An adhesion layer is located between the photosensitive surface of the detector array and the black adhesive layer.

8. A lidar, characterized in that, include: A laser chip configured to generate probe light; and A detector chip, adapted to receive the echo light formed by the reflection of the probe light, the detector chip comprising: A detector array having a photosensitive surface, the photosensitive surface including a photosensitive area and a non-photosensitive area; and A black adhesive layer, located on the non-photosensitive area. The detector includes a single-photon avalanche diode configured to receive the echo light, and the black gel layer has a transmittance of less than 1% to the echo light.

9. The lidar as described in claim 8, characterized in that, The size of the photosensitive area is consistent with the size of the echo light corresponding to the probe light.

10. The lidar as described in claim 9, characterized in that, Also includes: A lens configured to shape the probe light and the echo light, wherein the photosensitive area is the same size as the spot size of the echo light after being shaped by the lens.

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