A capacitive sensor, a capacitive sensing device, and an equipment

Abstract

This application provides a capacitive sensor, a capacitive sensing device, and an apparatus. The capacitive sensor includes a connecting substrate, a detection component, and a sensing signal amplification layer. The detection component is disposed on the connecting substrate and forms a capacitive sensing electrode. The sensing signal amplification layer covers the detection component and is in contact with it, amplifying the sensing signal and causing a capacitance change in the detection component when the detected object touches the amplification layer to generate a detection signal. The capacitive sensor provided by this application, by sensitively detecting the presence of conductive objects such as human bodies and amplifying the sensing signal, improves the sensitivity and signal strength of the detection signal, accelerates signal response, and facilitates rapid processing by the detection circuit. For example, by quickly, sensitively, and accurately detecting whether someone touches the door frame during the automatic closing phase of a car door, the closing process can be quickly adjusted, thereby avoiding injury problems.

Description

Technical Field

[0001] This application relates to the field of safety detection technology, specifically to a capacitive sensor, and an apparatus and device including the capacitive sensor. Background Technology

[0002] In daily life, many devices are used in scenarios involving the detection of human body parts to provide early warnings or prevent injuries. For example, the gates of processing equipment, automatically closing windows, and doorways all pose a risk of hand injuries from being pinched. A more detailed example is the increasing use of electrically operated, automatically closing doors in car models. These doors are driven by motors, resulting in faster and more concentrated closing force. During the closing process, as the door approaches the frame, it accelerates the closure with greater force. If a person's fingers or wrists are in the doorway area during this phase, they could be caught in the door, easily causing injury. Utility Model Content

[0003] In view of this, this application aims to provide a capacitive sensor that sensitively detects the presence of conductive objects such as human bodies through a sensing signal amplification layer, and enhances the capacitance increment generated by the capacitive sensing electrode to improve the sensitivity and signal strength of the detection signal, thereby accelerating the signal response and facilitating rapid processing by the detection circuit. This capacitive sensor is suitable for applications requiring anti-pinch detection, such as door frames. For example, by quickly, sensitively, and accurately detecting whether someone touches the door frame during the automatic closing phase of a car door, the closing process can be rapidly adjusted to avoid pinching injuries; and the detection method is accurate and effective, reducing false alarms.

[0004] This application mainly provides a capacitive sensor, including a connecting substrate, a detection component, and a sensing signal amplification layer;

[0005] At least a portion of the connecting substrate is laid in the detection area of ​​the capacitive sensor;

[0006] The detection component is disposed on the connecting substrate and is used to form a capacitive sensing electrode;

[0007] The sensing signal amplification layer covers the detection component and is in contact with the detection component to amplify the sensing signal and cause a capacitance change in the detection component when the object being detected comes into contact with the sensing signal amplification layer, thereby generating a detection signal.

[0008] In one possible implementation, the connecting substrate, the detection component, and the sensing signal amplification layer are stacked sequentially, and the connecting substrate and the sensing signal amplification layer together wrap and seal the detection component.

[0009] In one possible implementation, the sensing signal amplification layer is formed of a high dielectric constant material, and the connection substrate is formed of a low dielectric constant material.

[0010] In one possible implementation, the dielectric constant of the sensing signal amplification layer is not less than 6 farads / meter, and / or the dielectric constant of the connecting substrate is not greater than 4 farads / meter.

[0011] In one possible implementation, the detection component includes any one or any combination of conductive wires, conductive sheets, conductive meshes, conductive films, conductive particles, conductive fabrics, conductive inks, conductive pastes, and circuit boards.

[0012] In one possible implementation, the connecting substrate is a plastic part, and the sensing signal amplification layer is injection molded onto the connecting substrate using conductive adhesive.

[0013] In one possible implementation, the conductive adhesive is made of thermoplastic elastomer; and / or, the resistivity of the conductive adhesive is 9-16 ohms / cm.

[0014] In one possible implementation, the detection component is provided with at least two sensing units, each of which is not connected to the others to avoid signal crosstalk.

[0015] In one possible implementation, the detection component is provided with at least three sensing units, each of which is not connected to the others to avoid signal crosstalk.

[0016] In one possible implementation, the detection component is a flexible circuit board, which is provided with a plurality of sensing units formed of conductors.

[0017] In one possible implementation, at least a portion of the sensing unit is provided with a shielding layer that covers a portion of the sensing unit to separate the portion of the sensing unit from the sensing signal amplification layer, thereby avoiding signal crosstalk between the sensing units.

[0018] In one possible implementation, the detection component is a flexible circuit board, which includes a shielding layer and a conductive layer. The conductive layer is provided with a plurality of sensing units formed by conductors, and at least a portion of the sensing units are provided with the shielding layer.

[0019] In one possible implementation, the shielding layer is a mesh structure.

[0020] In one possible implementation, the sensing signal amplification layer includes a plurality of outer covering portions, each of which covers one sensing unit in a one-to-one manner.

[0021] In one possible implementation, the outer covering portions are separated by an insulator; or, the sensing signal amplification layer further includes a thinning portion located between each two adjacent outer covering portions, the thickness of the thinning portion being less than the thickness of the outer covering portion.

[0022] In one possible implementation, the outer covering portion is arranged along the length of the detection area of ​​the capacitive sensor.

[0023] In one possible implementation, the connecting base is provided with a fixing part for fixing the capacitive sensor.

[0024] In one possible implementation, the fixing part is one or any combination of a snap-fit ​​structure, a plug-in structure, a bolt structure, an adhesive structure, and a welded structure.

[0025] This application also provides a capacitive sensing device, including a device body, a controller disposed on the device body, and a capacitive sensor as described in any of the above claims, wherein the capacitive sensor is electrically connected to the controller.

[0026] This application also provides a device, including a device body, on which a control system and a capacitive sensor as described in any of the preceding claims are disposed, the capacitive sensor being electrically connected to the control system.

[0027] In one possible implementation, the device body has a first component and a second component that are brought together by a drive mechanism to form a closed loop. The connecting base is connected to the first component or the second component. The sensing signal amplification layer is exposed on the closed surface of the first component and the second component, so that when a detected object comes into contact with the sensing signal amplification layer, the control system controls the state of at least one of the first component and the second component based on the detection signal.

[0028] The capacitive sensor provided in this application not only includes a detection component to form a capacitive sensing electrode, but also a sensing signal amplification layer that amplifies the intensity of the sensed signal and improves detection sensitivity. This amplification layer covers the detection component, with at least a portion directly exposed, enabling sensitive detection of the presence of a conductive object. For example, when a part of the human body touches the amplification layer, the conductivity of the human body affects the electric field of both the amplification layer and the detection component, increasing the charge on both surfaces and generating a capacitance change. This capacitance change in the detection component (capacitive sensing electrode) forms a detection signal. After acquiring the detection signal from the capacitive sensing electrode, the detection circuit can quickly respond accordingly.

[0029] The amplification layer for the sensing signal serves several purposes. First, it protects the detection components and extends their lifespan. Second, it enlarges the sensing contact area, increasing the detection zone. Third, by amplifying and enhancing the sensing signal, it not only sensitively detects the presence of conductive objects such as humans but also increases the capacitance increment generated by the capacitive sensing electrode. This improves the sensitivity and signal strength of the detection signal, enhancing its accuracy and rapid response, allowing the detection circuit to quickly process the signal.

[0030] For example, this capacitive sensor is suitable for use in door frames and other similar applications. By quickly, sensitively, and accurately detecting whether someone is touching the door frame during the automatic closing phase of the car door, it can rapidly adjust the door closing process to avoid pinching injuries. Moreover, the detection method is accurate and effective, reducing the possibility of false alarms. Attached Figure Description

[0031] Figure 1 The image shown is a front view of the capacitive sensor in an embodiment of this application.

[0032] Figure 2 The image shown is a schematic diagram of the back of the capacitive sensor in an embodiment of this application.

[0033] Figure 3 The diagram shown is a schematic diagram of the mating connector in an embodiment of this application.

[0034] Figure 4 The diagram shown is a structural schematic of the connecting substrate in an embodiment of this application.

[0035] Figure 5 The diagram shown is a schematic of the detection component being disposed on the connecting substrate in an embodiment of this application.

[0036] Figure 6 The diagram shown is an overall schematic diagram of the detection component in an embodiment of this application.

[0037] Figure 7 The diagram shown is a schematic of the detection component, electrical connection module, and insulating layer in an embodiment of this application.

[0038] Figure 8 The image shown is an overall schematic diagram of the inductive signal amplification layer in an embodiment of this application.

[0039] Figure 9 The diagram shown is a schematic diagram of the structure of the soft adhesive coating in an embodiment of this application.

[0040] Figure 10 The diagram shown is a schematic representation of the arrangement of multiple sensing units in an embodiment of this application.

[0041] Figure 11The diagram shown is a schematic diagram of the shielding layer configuration in an embodiment of this application.

[0042] Figure 12 The diagram shown is a schematic diagram of the structure of the inductive signal amplification layer in an embodiment of this application.

[0043] Figures 1-12 middle:

[0044] 1. Connecting base; 11. Electrical connection module; 111. Pin; 112. Pin module; 101. Groove; 12. Fixing part; 13. Sealing element;

[0045] 2. Detection component; 20. Sensing unit; 20a. First sensing unit; 20b. Second sensing unit; 20c. Third sensing unit; 201a. First sensing segment; 201b. Second sensing segment; 201c. Third sensing segment; 21. Flexible substrate; 22. Shielding layer; 3. Sensing signal amplification layer; 30. Outer covering section; 30a. First outer covering section; 30b. Second outer covering section; 30c. Third outer covering section; 31. Thinning section; 4. Coating soft adhesive; 41. Main adhesive section; 42. Sealing adhesive section; 5. Insulating layer. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] In daily life, many devices are used in scenarios where they detect human or other biological organisms to provide early warnings or prevent harm. For example, in vehicles equipped with power-closing doors, the problem of fingers being pinched is quite common. When a power-closing door approaches the door frame, it has a closing stroke. During this stroke, the door drive motor must overcome the resistance of the door lock to close the door, resulting in a large closing force. If an elderly person or child is pinched, the pain is high and the injury is significant.

[0048] In related technologies, Hall effect sensors are used to detect changes in the current of the door drive motor to achieve anti-pinch detection. The Hall effect sensor is installed near the door drive motor or transmission mechanism and indirectly calculates the motor speed or rotation angle by detecting changes in the magnetic field strength of the motor rotor. Under normal conditions, when the door closes at a constant speed, the motor speed is stable, and the Hall effect sensor output signal frequency is constant. When an object is caught in the door, the motor load increases, causing the speed to decrease, and the Hall effect sensor detects a decrease in the frequency of magnetic field changes. The control unit judges the resistance as abnormal and triggers the motor to stop or reverse, thereby preventing pinching injuries. However, there are limitations, such as difficulty in detecting minute resistance: if the obstacle only causes a slight decrease in motor speed (e.g., a finger pinched only reduces the speed by 5%), it may not break the threshold, leading to missed detection. Experiments show that if the obstacle is an object with a diameter less than 15mm (e.g., a child's finger), the missed detection rate exceeds 30%.

[0049] Response lag: There is a 50-100ms delay from the change in rotational speed to the processing of the magnetic field signal. During this time, the closing force of the door has already acted on the human body. Mechanical interference can lead to misjudgment: Nonlinear load interference: Changes in mechanical resistance such as aging of the door sealing strip and dust accumulation on the track can be mistaken for a pinching signal, causing false triggering. Locking stage failure: During the final engagement stage of the door latch (about 3-6mm of travel), the resistance of the door lock causes the motor speed to drop sharply, which overlaps with the characteristics of the pinching signal. The control unit cannot distinguish between them, which will lead to the door lock not closing properly or failing to close.

[0050] In view of this, please refer to the appendix. Figures 1-12 This application provides a capacitive sensor comprising a connecting substrate 1, a detection component 2, and a sensing signal amplification layer 3. The connecting substrate 1 supports and fixes the detection component 2 and the sensing signal amplification layer 3, and can be connected to a device or equipment, such as a door frame of a vehicle, a window frame of other equipment, or a gate. The detection component 2, after being connected to a detection circuit, can be energized to form a capacitive sensing electrode. The sensing signal amplification layer 3 covers the detection component 2 and is in contact with it; therefore, the sensing signal amplification layer 3 corresponds to the signal amplification area of ​​the capacitive sensing electrode.

[0051] When a conductive object (such as a human or animal, or a conductive component) comes into contact with the signal amplification layer 3, it affects the electric field of the signal amplification layer 3 and the detection component 2, increasing the charge on both surfaces and generating a capacitance increment, thus forming a capacitance change. This capacitance change generates a detection signal. Furthermore, due to the amplification effect of the signal amplification layer 3, compared to direct contact between the object and the detection component 2, the signal amplification layer 3 can generate a capacitance increment more sensitively and rapidly, and it can enhance the overall capacitance increment generated on the capacitive sensing electrode, thereby increasing the capacitance change, amplifying the sensing signal, strengthening the signal, and improving detection sensitivity.

[0052] The detection component 2 can transmit the detection signal to the detection circuit via wired or wireless transmission. For example, the detection component 2 can transmit the detection signal to the detection circuit through the electrical connection module 11. The electrical connection module 11 can be a module integrating a battery and wireless transmission components, or it can be a wired circuit connection module, such as a connection pin or circuit connector. After receiving the detection signal, the detection circuit can make timely adjustments based on the detection signal, such as issuing an early warning or stopping a process to prevent harm to the organism, thus improving the speed of signal response.

[0053] Meanwhile, the sensing signal amplification layer 3 covers the detection component 2, and at least a portion of the sensing signal amplification layer 3 is exposed on the surface of the connecting substrate 1. Therefore, the sensing signal amplification layer 3 is the part that directly contacts the object being detected, while the detection component 2 is covered and protected, preventing direct exposure to the external environment and avoiding erosion from rain, sand, etc., which could affect its service life. Furthermore, the area of ​​the sensing signal amplification layer 3 can be larger than that of the detection component 2, thus increasing the sensing touch area and detection area, thereby improving the detection success rate.

[0054] For example, when this capacitive sensor is applied to an automatically closing electric soft-close door, the sensing signal amplification layer 3 is directly exposed at the doorway, enabling sensitive and accurate detection of the presence of living beings such as humans. During the automatic door closing phase, the capacitive sensor can quickly, sensitively, and accurately detect whether a living being has touched the door frame, allowing the control system to quickly adjust the door closing process based on the detection signal, thereby avoiding problems such as pinching injuries. Moreover, the detection method is accurate and effective, which helps to reduce misjudgments.

[0055] As can be seen, the capacitive sensor provided in this application not only has a detection component 2 to form a capacitive sensing electrode, but also a sensing signal amplification layer 3 that can amplify the intensity of the sensing signal and improve detection sensitivity. The setting of the sensing signal amplification layer 3 has three advantages: first, it can protect the detection component 2 and extend its service life; second, it can enlarge the sensing contact area and increase the detection area; third, through the amplification and enhancement of the sensing signal, it can not only sensitively detect the presence of conductive objects such as human bodies, but also increase the capacitance increment generated by the capacitive sensing electrode, thereby improving the sensitivity and signal strength of the detection signal, improving detection sensitivity and accuracy, and improving the rapid response of the detection, so that the detection circuit can quickly process the detection signal without lag.

[0056] Meanwhile, capacitive sensing is a contact-based detection method, capable of timely and accurate detection even of small parts like fingers, eliminating the problem of missed detections. Furthermore, the sensor is triggered by contact with conductive biological objects, but shows no capacitance change when touched by non-conductive objects, and is unaffected by resistance, thus avoiding false triggering due to mechanical interference. This makes it ideal for detecting living organisms in automatically closing doors and windows to prevent harm.

[0057] The detection component 2 and the sensing signal amplification layer 3 can be distributed in a raised shape on the connecting substrate 1, or they can be embedded in the connecting substrate 1.

[0058] In some embodiments, the connecting substrate 1, the detection component 2, and the sensing signal amplification layer 3 are stacked sequentially, and the connecting substrate 1 and the sensing signal amplification layer 3 together enclose and seal the detection component 2. For example, the connecting substrate 1 is provided with a groove 101, the detection component 2 is embedded in the groove 101, and the sensing signal amplification layer 3 can also be embedded in the groove 101.

[0059] This configuration completely isolates the detection component 2 from the external environment, eliminating the need for additional insulation treatment. It also effectively protects the detection component 2 from adverse effects caused by water film, dust, sweat, chemicals, etc., thus preventing any impact on the sensing performance.

[0060] The connecting substrate 1 can be formed of a low-dielectric material. This increases the overall structural strength of the capacitive sensor, facilitating its assembly. It also provides insulation, preventing the detection component 2 and the sensing signal amplification layer 3 from contacting the external conductive medium, thus avoiding excessive parasitic capacitance on the capacitive sensing electrode that could affect the sensor's detection triggering. For example, the dielectric constant of the connecting substrate 1 is no greater than 4 farads / meter.

[0061] The detection component 2 is a conductive object, such as any one or any combination of wires, conductive sheets, conductive meshes, conductive films, conductive particles, conductive fabrics, conductive inks, conductive pastes, and circuit boards.

[0062] The detection component 2 can have a flexible structure and can be a flexible material with conductive properties, such as carbon film, conductive coating, nanowire, flexible circuit board, etc.

[0063] The dielectric constant of the sensing signal amplification layer 3 is greater than that of the detection component 2. Thus, even without increasing the area ratio of the sensing signal amplification layer 3 to the detection component 2, it can still amplify the signal, increase the sensing signal, and improve the detection sensitivity.

[0064] The inductive signal amplification layer 3 can be formed of a high-dielectric material. A high-dielectric material refers to a material with a high dielectric constant, which can generate stronger polarization under an electric field, thereby providing a larger capacitance value within the same geometric dimensions. Examples include ceramic materials (barium titanate, titanium oxide, etc.), polymer-based composite materials (epoxy resin, PVDF and its copolymers, etc.), adhesives, and nanostructures. For example, the dielectric constant of the inductive signal amplification layer 3 is not less than 6 farads / meter.

[0065] Based on the structure of this application, the capacitance C generated by the sensor satisfies the following formula:

[0066] C = ε0·εr·A / d.

[0067] Where A is the area of ​​the two plates facing each other (in this scheme, it is the area of ​​the contact part of the object being detected and the area of ​​the detection component 2 facing each other or overlapping); ε0 is the vacuum permittivity; εr is the relative permittivity (in this scheme, it is the permittivity of the induction signal amplification layer 3); and d is the plate spacing (in this scheme, it is the distance from the contact part of the object being detected to the detection component 2).

[0068] It is evident that the higher the dielectric constant of the sensing signal amplification layer 3, the greater the incremental capacitance and the stronger the signal strength when the detected object triggers the signal.

[0069] The sensing signal amplification layer 3 can be formed of a flexible material, have a flexible structure, or be a flexible component. For example, conductive adhesive, carbon film, conductive coating, etc.

[0070] Thus, the sensing signal amplification layer 3 is very easy to bend to fit curved surfaces, and it is also easy to make thin, making it very easy to install in places such as doors and windows that need to be closed; at the same time, as the part that directly contacts the object being detected, the flexible feel is even better.

[0071] In some embodiments, the sensing signal amplification layer 3 is formed of conductive adhesive, or in other words, the material of the sensing signal amplification layer 3 is conductive adhesive. The conductive adhesive has a high dielectric constant, which amplifies the sensing signal. Specifically, the conductive adhesive can be a thermoplastic elastomer or conductive silicone. Preferably, the resistivity of the sensing signal amplification layer 3 is 9-16 ohms / cm. This ensures detection sensitivity while preventing significant discomfort to living organisms such as humans.

[0072] The induction signal amplification layer 3 can be bonded to the connecting base 1, or fastened to the connecting base 1 by bolts, or other connection methods, or it can be an integral structure with the connecting base 1.

[0073] In some embodiments, the connecting substrate 1 is a plastic part, and the sensing signal amplification layer 3 is injection molded onto the connecting substrate 1 using conductive adhesive. In this way, the conductive adhesive can be directly laid on the connecting substrate 1 and exposed on the surface of the connecting substrate 1 while covering the detection component 2.

[0074] The use of conductive adhesive to form the sensing signal amplification layer 3 allows the sensing signal amplification layer 3 to be easily manufactured into various shapes, and can also increase the detection area to improve detection accuracy. Furthermore, because it can be made thin, it can be easily installed on the closing surface of the door frame in a suitable detection position to form a good detection area. Moreover, due to the high flexibility of the conductive adhesive, only a surface needs to be exposed on the door frame panel for detection, ensuring detection accuracy and sensitivity without affecting the closing and locking of the car door.

[0075] The detection component 2 has a sensing unit 20, which is used for detection by capacitive sensing. There may be one sensing unit 20 or multiple sensing units 20, such as two, three, four or more. The specific number is determined according to actual needs and design requirements. In this embodiment, there is no specific limit on the upper limit of the number of sensing units 20.

[0076] Each sensing unit 20 is separated and not interconnected to avoid signal interference. The arrangement of multiple sensing units 20 expands the detection coverage area and enhances the detection success rate. Furthermore, the independent detection by multiple sensing units 20 makes the detection more accurate and avoids false positives.

[0077] Specifically, the sensing unit 20 may include a first sensing unit 20a, a second sensing unit 20b, a third sensing unit 20c, ... the Nth sensing unit.

[0078] Corresponding to multiple sensing units 20, the sensing signal amplification layer 3 can be a single unit that simultaneously contacts multiple sensing units 20. However, there is a phenomenon where the charge generated by a certain sensing unit 20 due to triggering can couple to other sensing units 20 through the sensing signal amplification layer 3. Therefore, preferably, the sensing signal amplification layer 3 includes multiple outer covering portions 30, each covering a sensing unit 20 one-to-one. For example, the first outer covering portion 30a covers the first sensing unit 20a, the second outer covering portion 30b covers the second sensing unit 20b, the third outer covering portion 30c covers the third sensing unit 20c, and so on, with the Nth outer covering portion covering the Nth sensing unit.

[0079] Each outer cover portion 30 is arranged along a target direction (the target direction is set according to the detection requirements, such as the length direction of the sensor detection area) to form an independent detection zone. Preferably, the outer cover portion 30 is strip-shaped or block-shaped, and the size of the outer cover portion 30 in the target direction is preferably not smaller than the size of the object being detected in that direction, so as to avoid the object being detected from touching multiple outer cover portions 30 at the same time. Preferably, each sensing unit 20 is also arranged along the target direction, or in other words, at least the section of each sensing unit 20 used for capacitive sensing (denoted as the sensing section) is arranged along the target direction so that each outer cover portion 30 and each sensing unit 20 can make one-to-one corresponding contact.

[0080] When the object being detected comes into contact with the sensing signal amplification layer 3, it will usually only come into contact with one of the outer covering portions 30, which will generate a capacitance increment.

[0081] To prevent excessive charge coupling to other outer covering sections 30, which could affect signal strength, and to prevent signal fluctuations from other sensing units 20, each outer covering section 30 can be isolated from each other by an insulator (which can be formed of any insulating material, such as insulating adhesive, or it can be formed locally from the connecting substrate 1). Alternatively, the sensing signal amplification layer 3 also includes a thinning section 31 located between each pair of adjacent outer covering sections 30, the thickness of the thinning section 31 being less than the thickness of the outer covering section 30. By isolating the outer covering sections 30 or separating them by the thinning section 31, a signal propagation barrier can be formed between each outer covering section 30, such as... Figure 12 As shown.

[0082] Thus, when the detected object touches a certain outer covering portion 30, either none of the other outer covering portions 30 will generate charge fluctuations or capacitance changes, or due to the thinning portion 31, one or two outer covering portions 30 adjacent to the touched outer covering portion 30 will generate minute capacitance fluctuations. The capacitance value generated by these fluctuations is significantly smaller than the capacitance value generated by the touched outer covering portion 30. The majority of the capacitance increment generated by the touched outer covering portion 30 will be conducted to the corresponding sensing unit 20, resulting in only one sensing unit 20 being triggered.

[0083] For example, the detection circuit can collect the capacitance change of each sensing unit. If the capacitance change of a certain sensing unit 20 is greater than the minimum trigger threshold (the minimum trigger threshold can be set according to factors such as experiment and application scenario), then the signal is considered valid and it is a normal trigger.

[0084] As can be seen, in the detection scenario, the target object (such as a biological object or a conductive component) typically triggers only one sensing unit 20. For example, when the target object touches the first outer covering portion 30a, the capacitance of the first sensing unit 20a changes, generating a detection signal. The other sensing units 20 do not generate detection signals, and the detection circuit only acquires one detection signal. If the target object touches the second outer covering portion 30b, only the second sensing unit 20b generates a detection signal due to a capacitance change. The other sensing units 20 do not generate detection signals, and the detection circuit still only acquires one detection signal.

[0085] In certain special cases, such as when the detected object simultaneously touches the end regions of two adjacent outer covering portions 30 (e.g., the center of the actual touch location is between two adjacent outer covering portions 30), both corresponding sensing units 20 will generate capacitance changes and thus generate signals. In this case, the detection circuit will collect two detection signals and determine whether the sum of the capacitance changes generated by the two sensing units 20 is greater than the minimum trigger threshold. If so, it is considered a normal trigger; otherwise, it is considered a false trigger.

[0086] When non-biological conductive objects, such as rainwater or car doors, come into contact with the capacitive sensor, they will simultaneously touch all the outer covering portions 30 over a large area, triggering all the sensing units 20. With a large number of triggers and a wide coverage area, each sensing unit 20 will generate a capacitance change and produce a detection signal. The detection circuit will receive multiple detection signals at the same time, and the amount of capacitance change collected will increase significantly. The capacitance change value will be significantly greater than the capacitance value generated when only one or two sensing units 20 are triggered.

[0087] To distinguish the triggering of the target object from that of other objects, experiments can be conducted on the capacitance change generated by a single triggering of the target object, and the capacitance change when rain or other objects trigger multiple sensing units 20 over a large area. A threshold value, called the critical calibration value, is set based on this data to distinguish between these two situations. In use, the detection circuit can acquire the capacitance change of the triggered sensing units 20. If only one or two sensing units 20 generate a signal, and the capacitance change is less than the critical calibration value, it is determined to be a normal triggering.

[0088] Thus, by setting the detection component 2 as multiple segmented sensing units 20 and the sensing signal amplification layer 3 as multiple outer covering parts 30, multiple detection zones are formed. This not only expands the detection area, but also allows the detection circuit to distinguish whether the trigger belongs to the detection object based on the number of collected detection signals and the change in capacitance, eliminating interference from other non-detection objects and avoiding false triggering and misjudgment caused by external factors such as rain.

[0089] Based on the structural design of this application, the following example illustrates one method for implementing capacitance detection (the actual method is not limited to this):

[0090] 1. Based on the capacitance change generated when the object is triggered once, and the capacitance change generated when triggered over a large area by external factors such as rain, set the minimum trigger threshold and critical calibration value.

[0091] 2. The number of signals collected and the capacitance changes of different sensing units 20. For example, when the number of sensing units 20 is 2, the capacitance changes of the first sensing unit 20a and the second sensing unit 20b are collected; when the number of sensing units 20 is 3, the capacitance changes of the first sensing unit 20a, the second sensing unit 20b and the third sensing unit 20c are collected.

[0092] 3. If a capacitance change occurs in a certain sensing unit 20, and the amount of capacitance change is greater than the set minimum trigger threshold but less than the critical calibration value, it is determined to be a normal trigger.

[0093] 4. If the two sensing units 20 generate detection signals, and the sum of the capacitance changes of all sensing units 20 is greater than the minimum trigger threshold but less than the critical calibration value, then it is determined to be a normal trigger.

[0094] 5. If two or more sensing units 20 generate signals, and the sum of the capacitance changes of all sensing units 20 exceeds the critical calibration value, it is determined to be a false trigger. The principle is that interfering conductive materials such as rainwater and fog have the characteristic of large-area coverage.

[0095] Ultimately, by using the dual conditions of "number of triggers of sensing unit 20" and "total change in capacitance", the system can distinguish between "normal triggering" and "external interference such as rain", thereby reducing the occurrence of sensor false triggering and misjudgment.

[0096] Multiple sensing units 20 are formed by multiple conductors, such as multiple wires, multiple conductive sheets, multiple conductive films, etc. The multiple sensing units 20 are distributed on the connecting base 1 and are not interconnected, that is, they are arranged in parallel in the circuit.

[0097] Preferably, in some embodiments, the detection component 2 is a flexible circuit board, i.e., an FPC. The flexible circuit has a flexible substrate 21, a conductive layer disposed on the flexible substrate 21, and an outer film layer covering the conductive layer. The conductive layer includes multiple conductors, and each conductor forms a sensing unit 20. Thus, multiple sensing units 20 can be integrated, and the detection component 2 with multiple sensing units 20 can be integrated into a single independent component. This not only protects each sensing unit 20 but also allows for flexible configuration of the length and distribution structure of the multiple sensing units 20 according to requirements. It also facilitates the placement of the detection component 2 onto the connecting substrate 1 and prevents production damage to each sensing unit 20.

[0098] In some embodiments, the connecting base 1 is further provided with an electrical connection module 11, which is used to connect the detection component 2 and the external detection circuit. Specifically, it can be a pin structure such as a metal wire or pin 111, or it can be a connector structure.

[0099] The electrical connection module 11 on the connecting base 1 can be one or multiple, such as each sensing unit 20 being connected to the electrical connection module 11 one-to-one. For structural simplicity, in some embodiments, each sensing unit 20 is connected to the same electrical connection module 11. When multiple sensing units 20 are all connected to the same electrical connection module 11, or when there are at least two electrical connection modules 11, but one electrical connection module 11 is connected to at least two sensing units 20 simultaneously, in some cases, local sections of some sensing units 20 may be arranged side by side or stacked. Since each sensing unit 20 needs to be connected to the electrical connection module 11, at least some local areas of the sensing units 20 may extend along the arrangement direction of the outer covering portion 30 and may extend into other detection zones, and be located below the outer covering portion 30 of other detection zones.

[0100] For example, such as Figure 10 As shown, the length of each sensing unit 20 increases sequentially. Each sensing unit 20 is spaced apart in one direction and extends side-by-side in another direction, with the extension direction being the same as the arrangement direction of each outer covering portion 30. Alternatively, the length of each sensing unit 20 increases sequentially, and the sensing units 20 are stacked, with the extension direction of each sensing unit 20 being the same as the arrangement direction of each outer covering portion 30. In this case, there may be local sections of the sensing unit 20 located below the outer covering portions 30 of other detection zones. In these situations, even if the detected object only touches one outer covering portion 30, it may still compress other sensing units 20.

[0101] For example, such as Figure 10 , Figure 11 and Figure 12As shown, the sensing signal amplification layer 3 is divided into a first outer cover portion 30a, a second outer cover portion 30b, and a third outer cover portion 30c along the target direction. The first sensing unit 20a includes a first sensing segment 201a and a first extension segment, and the second sensing unit 20b includes a second sensing segment 201b and a second extension segment. The second sensing segment 201b is located below the second outer cover portion 30b, but the second extension segment is located on one side of the first sensing unit 20a or below the first sensing unit 20a, possibly below the first outer cover portion 30a, covered by the first outer cover portion 30a and in contact with the first outer cover portion 30a. The third sensing unit 20c includes a third sensing segment 201c and a third extension segment. The third sensing segment 201c is located below the third outer cover portion 30c, but the third extension segment is located on one side of the first sensing unit 20a and the second sensing unit 20b. It may pass under the second outer cover portion 30b and the first outer cover portion 30a and come into contact with the first outer cover portion 30a and the second outer cover portion 30b.

[0102] To avoid signal interference and misjudgment caused by such situations, in some embodiments, at least a portion of the sensing unit 20 is provided with a shielding layer 22. The shielding layer 22 covers a local section of the sensing unit 20, such as the aforementioned extended section, and separates the extended section from the sensing signal amplification layer 3. The shielding layer 22 is connected to the electrical connection module 11 and is used for grounding in the detection circuit.

[0103] Alternatively, each sensing unit 20 includes a sensing segment and an extension segment. Each sensing segment is arranged along the target direction and is positioned one-to-one below multiple outer covering portions 30 of the sensing signal amplification layer 3. The sensing segment and its corresponding outer covering portion 30 contact each other to form a set of detection zones. Multiple sets of sensing units 20 and multiple outer covering portions 30 form multiple sets of detection zones arranged along the target direction. The section of the sensing unit 20 that extends into other detection zones and is located below the outer covering portion 30 of those zones is called an extension segment. The extension segment is covered with a shielding layer 22 to prevent contact with the outer covering portions 30 in other detection zones. This ensures that the sensing unit 20 only contacts and connects with its corresponding outer covering portion 30 and does not contact the outer covering portions 30 of other sensing units 20, thus eliminating the potential problem of signal crosstalk between different sensing units 20. As in the example above, the second extension of the second sensing unit 20b covers the shielding layer 22, the third extension of the third sensing unit 20c covers the shielding layer 22, and so on. The area of ​​each sensing unit 20 located in this detection zone is directly connected to the corresponding outer cover portion 30, and the remaining areas (such as the extensions mentioned above) can all be covered by the shielding layer 22.

[0104] With this configuration, when the object being detected touches the sensing signal amplification layer 3, it will touch an outer cover portion 30. If the outer cover portion 30 covers the extensions of other sensing units 20, it means that the object being detected has pressed multiple sensing units 20. However, due to the shielding layer 22, only the sensing segment that contacts the outer cover portion 30 will generate capacitance fluctuations. The extensions of other sensing units 20, being covered by the shielding layer 22, will not contact the sensing signal amplification layer 3. The grounded shielding layer 22 will transfer the generated charge fluctuations to the ground, preventing other sensing units 20 from experiencing capacitance changes and thus avoiding interference. This ensures that the sensing units 20 do not crosstalk with each other.

[0105] The shielding layer 22 can be a metal sheet or a metal mesh, preferably a mesh structure. The mesh structure of the shielding layer 22 creates a "Faraday cage" effect, which reduces the amount of parasitic capacitance and effectively blocks interference signals, thereby reducing the occurrence of sensor false triggering. In addition, the mesh structure design has a certain degree of tensile and abrasion resistance, and can withstand slight pulling and friction during sensor installation or use.

[0106] The shielding layer 22 is used to separate the sensing unit 20 and the sensing signal amplification layer 3, and is located between the sensing signal amplification layer 3 and the sensing unit 20. Therefore, in the stacking direction, the shielding layer 22 can be disposed below the sensing signal amplification layer 3 and above the detection component 2.

[0107] Alternatively, in some embodiments, when the detection component 2 is a flexible circuit board, the flexible circuit board includes a flexible substrate 21, a conductive layer, a shielding layer 22, and an outer film layer. The conductive layer is formed by a plurality of conductors disposed on the flexible substrate 21, each conductor forming a sensing unit 20. The shielding layer 22 covers a partial area or section of the sensing unit 20, specifically, at least the section of the sensing unit 20 located below the outer cover portion 30 in other detection zones. The outer film layer is the surface of the flexible circuit board, covering the shielding layer 22 and the conductive layer.

[0108] Both the sensing unit 20 and the shielding layer 22 are connected to the electrical connection module 11. The electrical connection module 11 can be a pin structure, such as a metal wire or pin 111, or it can be a connector structure. In some embodiments, such as... Figure 3 As shown, the electrical connection module 11 is a plug-in connector, which can also be called a circuit connector or circuit terminal. Thus, the connection structure of multiple sensing units 20 and external detection circuits is integrated, simplifying the structure, production, and circuit connection operation.

[0109] Preferably, the insulating part of the mating connector and the connecting base 1 are integrally formed, such as by injection molding. This not only simplifies production but also improves the waterproof and sealing performance of the mating connector.

[0110] In some embodiments, such as Figure 3 As shown, the connecting base 1 has a pin 111 and an integrally formed plug portion. The pin 111 is located in the slot of the plug portion and forms a mating connector with the plug portion.

[0111] Pin 111 is connected to the detection component 2, and an insulating layer 5 covers the connection point to separate the connection point from the sensing signal amplification layer 3. The insulating layer 5 can be in sheet or block form, specifically, it can be insulating adhesive.

[0112] The connecting base 1 is provided with a fixing part 12 for fixing the capacitive sensor. The fixing part 12 can be one or any combination of a snap-fit ​​structure, plug-in structure, bolt structure, adhesive structure, and welding structure. The connecting base 1 can be securely and conveniently connected to the device through the fixing part 12.

[0113] For example, if the capacitive sensor is installed at the closed part of a door or window, the sensing signal amplification layer 3 can be in the form of a strip. Preferably, the main body of the connecting substrate 1 is also in the form of a sheet, with the detection component 2 and the sensing signal amplification layer 3 provided on one side in the thickness direction of the main body, and the fixing part 12 provided on the other side.

[0114] For example, the fixing part 12 can be a connecting buckle, and multiple connecting buckles can be arranged along the length direction of the connecting base 1. In this way, the connecting base 1 can have good fit and flatness on the device.

[0115] When the main body of the connecting base 1 is plate-shaped, the mating connector can be provided as a protrusion on one side of the main body, such as... Figure 2 As shown, in this embodiment, the overall structure of the mating connector can be the same as the male socket structure in the line connector; the mating connector forms a common standard part structure, which can be directly matched and connected with the female plug of the line connector, and has good sealing and waterproof performance.

[0116] The fixing part 12 may be fitted with or wrapped with a sealing element 13.

[0117] The seal 13 can be a sealing cotton or a sealing strip such as a plastic strip. In this way, when the connecting base 1 is connected to the equipment, it can seal the connection with the equipment, ensuring both sealing and shock absorption. The sealing cotton can be foam, plastic or silicone, and can be in the form of a ring, fitted one-to-one around the outer periphery of the fixing part 12 and the mating connector.

[0118] In some embodiments, a soft adhesive 4 is provided on the connecting substrate 1, covering a portion of the connecting substrate 1. For example, the soft adhesive 4 may be located on one side of the connecting substrate 1 to meet the arrangement requirements of the connecting substrate 1 on the device.

[0119] The coated soft adhesive 4 includes a main adhesive segment 41 connected to one side of the connecting substrate 1 and a sealing adhesive segment 42 disposed around the fixing part 12. Thus, the sealing adhesive segment 42 can form the aforementioned sealing element 13.

[0120] Embodiments of this application also provide a capacitive sensing device, which has a main body, a controller, and a capacitive sensor as described in the above embodiments. The capacitive sensor is electrically connected to the controller. Therefore, this capacitive sensing device can be independently installed in the space where detection is required, and can perform detection and information alerts without being connected to other circuit systems.

[0121] Embodiments of this application also provide a device, including a device body, on which a control system and a capacitive sensor as described in any of the above embodiments are disposed, the capacitive sensor being electrically connected to the control system. Thus, this device has the structure and corresponding beneficial effects described in the above embodiments, which will not be elaborated further here.

[0122] In some embodiments, the main body of the device has a first component and a second component that are brought together by a drive mechanism to form a closed structure. A connecting base 1 is connected to the first component or the second component. A detection component 2 is exposed on the closed surface of the first component and the second component. When a detection object comes into contact with the detection component 2, the control system controls the state of at least one of the first component and the second component based on the detection signal of the detection component 2. For example, the moving component is stopped or reversed.

[0123] Embodiments of this application also provide a method for manufacturing a capacitive sensor, applicable to manufacturing the capacitive sensor described in any of the above embodiments. The manufacturing method includes the following steps (the order of the steps is not limited):

[0124] S1, process the connecting substrate 1, form an electrical connection module 11 on the connecting substrate 1, and form a region on the connecting substrate 1 to accommodate the detection component 2;

[0125] S2, the detection component 2 is made of a conductive material and is used to form a capacitive sensing electrode;

[0126] S3, the detection component 2 is placed on the connecting base 1, and the detection component 2 and the electrical connection module 11 are connected;

[0127] S4, The sensing signal amplification layer 3 is fabricated using a conductive material;

[0128] S5, cover the sensing signal amplification layer 3 onto the detection component 2 and make the sensing signal amplification layer 3 and the detection component 2 in contact and connect.

[0129] With this configuration, the conductive detection component 2 forms a capacitive sensing electrode, and the sensing signal amplification layer 3 serves as the signal amplification area of ​​the capacitive sensing electrode. It directly contacts the object being detected and generates incremental capacitance, thereby amplifying the incremental capacitance generated by the capacitive sensing electrode, enhancing the signal strength of the capacitive sensing electrode, and amplifying the sensing signal. This enhances the detection sensitivity, signal strength, detection accuracy, and success rate of the capacitive sensor. At the same time, covering the detection component 2 with the sensing signal amplification layer 3 also protects the detection component 2, isolating it from the external environment and preventing it from being corroded by rain, wind, sand, etc., which could affect its service life.

[0130] The connecting substrate 1 serves to support and enhance the overall strength of the sensor, while the sensing signal amplification layer 3 serves to amplify the signal. Therefore, in some embodiments, the connecting substrate 1 is formed by processing a low-dielectric material, and the sensing signal amplification layer 3 is formed by processing a high-dielectric material.

[0131] In some embodiments, when the sensing signal amplification layer 3 is covered on the detection component 2, the area of ​​the sensing signal amplification layer 3 is not less than the area of ​​the detection component 2, and the detection component 2 is wrapped and sealed by the sensing signal amplification layer 3 and the connecting substrate 1.

[0132] The connecting substrate 1 can be made of plastic material through injection molding. Therefore, step S1 of processing the connecting substrate 1 includes: processing the connecting substrate 1 by injection molding.

[0133] The sensing signal amplification layer 3 can be made of a flexible material. In some embodiments, step S5, which involves covering the sensing signal amplification layer 3 onto the detection component 2 and making the sensing signal amplification layer 3 and the detection component 2 in contact, includes: injection molding the sensing signal amplification layer 3 onto the connecting substrate 1 using a two-color injection molding process.

[0134] Specifically, conductive adhesive can be used as the material for the sensing signal amplification layer 3. The conductive adhesive is applied to the detection component 2 and then injection molded onto the connecting substrate 1 through a two-color injection molding process to form the sensing signal amplification layer 3.

[0135] In step S1, an electrical connection module 11 is formed on the connection substrate 1, specifically including:

[0136] S101, one or more pins 111 are formed into a pin module 112 by injection molding;

[0137] S102, the pin module 112 is integrated with the connecting base 1 by injection molding.

[0138] The step S3 of setting the detection component 2 on the connecting base 1 and connecting the detection component 2 and the electrical connection module 11 specifically includes: laying the detection component 2 on the connecting base 1 and electrically connecting the detection component 2 and the pin module 112 by welding.

[0139] In step S5, which involves covering the sensing signal amplification layer 3 onto the detection component 2 and making the sensing signal amplification layer 3 and the detection component 2 in contact, the method further includes: setting an insulating layer 5 in the welding area of ​​the pin module 112 to isolate and insulate the welding area from the sensing signal amplification layer 3. That is, when covering or injection molding the sensing signal amplification layer 3 onto the connecting substrate 1, an insulating layer 5 is first set in the welding area of ​​the pin module 112.

[0140] Specifically, the processing steps for insulating layer 5 may involve applying insulating adhesive to the welding area of ​​pin module 112.

[0141] Step S4, which involves processing a conductive material into a detection component 2, specifically includes: forming a plurality of sensing units 20.

[0142] Correspondingly, step S5, which involves covering the sensing signal amplification layer 3 onto the detection component 2 and making the sensing signal amplification layer 3 and the detection component 2 in contact, includes: forming multiple outer covering portions 30 of the sensing signal amplification layer 3, and covering the multiple outer covering portions 30 one-to-one onto the multiple sensing units 20 respectively.

[0143] Specifically, step S1 further includes: forming a groove on the connecting substrate 1 to accommodate the detection component 2 and the sensing signal amplification layer 3, and forming multiple protrusions within the groove 101. Step S3 further includes: placing the detection component 2 within the groove of the connecting substrate 1.

[0144] Step S5 also includes: injection molding the sensing signal amplification layer 3 in the groove of the connecting substrate 1, and forming a plurality of outer covering portions 30 separated by protrusions.

[0145] The arrangement of multiple segmented sensing units 20 and multiple segmented outer covering portions 30 can form multiple independent detection zones, which not only expands the detection area, but also distinguishes between normal triggering and false triggering by the number of triggered detection zones and the amount of capacitance change after being triggered.

[0146] If the size of the detection component 2 is small, the sensing units 20 can be arranged side by side with small intervals or stacked. However, the area of ​​the sensing signal amplification layer 3 is large, so the outer covering portion 30 corresponding to a certain sensing unit 20 will also cover a part of the area of ​​other sensing units 20. To prevent the detection object from pressing on a part of other sensing units 20 when touching a certain outer covering portion 30, step S4, which involves forming multiple sensing units 20 on the detection component 2, specifically includes:

[0147] A shielding layer 22 is used to cover a portion of the sensing unit 20, and the shielding layer 22 is positioned between the sensing signal amplification layer 3 and the sensing unit 20.

[0148] Connect the shielding layer 22 and the pin module 112.

[0149] With this configuration, the shielding layer 22 covers the sections of each sensing unit 20 that may extend to or pass through other detection zones' outer and inner cover portions 30, ensuring that the sensing unit 20 only contacts and connects with its corresponding outer cover portion 30, and does not contact the outer cover portions 30 corresponding to other sensing units 20, thus avoiding signal interference.

[0150] In some embodiments, the detection component 2 having multiple sensing units 20 can be integrated into a single component, such as a flexible circuit board. Therefore, step S2, which involves fabricating the detection component 2 using a conductive material, may further include:

[0151] A conductive layer is disposed on a flexible substrate 21, and a plurality of sensing units 20 are formed on the conductive layer, such that the sensing units 20 are not interconnected and are arranged along the target direction.

[0152] An outer film layer is covered on the flexible substrate 21 and the conductive layer to form a flexible circuit board, which forms the detection component 2.

[0153] For ease of processing, the shielding layer 22 can also be integrated onto the flexible circuit board. For example, the step of covering the flexible substrate 21 and the conductive layer with an outer film layer to form a flexible circuit board specifically includes:

[0154] First, a shielding layer 22 is covered on a local area of ​​a portion of the sensing unit 20, and then an outer film layer is covered.

[0155] Alternatively, the shielding layer 22 can be first connected or composited to the outer membrane layer, and then the outer membrane layer can be covered onto the connecting substrate 1, so that the shielding layer 22 covers the sensing unit 20.

[0156] Thus, the shielding layer 22 can be integrated into the processing of the detection component 2. The shielding layer 22 and each sensing unit 20 are connected to the electrical connection module 11, such as the pin module 112, and are integrated together, which facilitates simplified processing, streamlines electrical connection operations, and eliminates the need for careful insulation treatment.

[0157] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A capacitive sensor, characterized in that, It includes a connecting substrate (1), a detection component (2), and a sensing signal amplification layer (3); At least a portion of the connecting substrate (1) is laid in the detection area of ​​the capacitive sensor; The detection component (2) is disposed on the connecting substrate (1) and is used to form a capacitive sensing electrode; The sensing signal amplification layer (3) covers the detection component (2) and is in contact with the detection component (2) to amplify the sensing signal and cause the detection component (2) to generate a detection signal when the detection object contacts the sensing signal amplification layer (3).

2. The capacitive sensor as described in claim 1, characterized in that, The connecting substrate (1), the detection component (2), and the sensing signal amplification layer (3) are stacked in sequence, and the connecting substrate (1) and the sensing signal amplification layer (3) together wrap and seal the detection component (2).

3. The capacitive sensor as described in claim 1, characterized in that, The inductive signal amplification layer (3) is formed of a high dielectric constant material, and the connecting substrate (1) is formed of a low dielectric constant material.

4. The capacitive sensor as described in claim 3, characterized in that, The dielectric constant of the induction signal amplification layer (3) is not less than 6 farads / meter, and / or the dielectric constant of the connecting substrate (1) is not greater than 4 farads / meter.

5. The capacitive sensor as described in claim 1, characterized in that, The detection component (2) includes any one of the following: conductive wire, conductive sheet, conductive mesh, conductive film, conductive particles, conductive fabric, conductive ink, conductive paste, and circuit board.

6. The capacitive sensor as described in claim 1, characterized in that, The connecting substrate (1) is a plastic part, and the sensing signal amplification layer (3) is injection molded onto the connecting substrate (1) by conductive adhesive.

7. The capacitive sensor as described in claim 6, characterized in that, The conductive adhesive is made of thermoplastic elastomer; and / or the resistivity of the conductive adhesive is 9-16 ohms / cm.

8. The capacitive sensor as described in claim 1, characterized in that, The detection component (2) is provided with at least two sensing units (20), and each sensing unit (20) is not connected to each other to avoid signal crosstalk.

9. The capacitive sensor as described in claim 1, characterized in that, The detection component (2) is provided with at least three sensing units (20), and each sensing unit (20) is not connected to each other to avoid signal crosstalk.

10. The capacitive sensor as described in claim 8 or 9, characterized in that, The detection component (2) is a flexible circuit board, and the flexible circuit board is provided with a plurality of sensing units (20) formed by conductors.

11. The capacitive sensor as described in claim 8 or 9, characterized in that, At least a portion of the sensing units (20) are provided with a shielding layer (22) that covers a portion of the sensing unit (20) to separate the portion of the sensing unit (20) from the sensing signal amplification layer (3) in order to avoid signal crosstalk between the sensing units (20).

12. The capacitive sensor as described in claim 11, characterized in that, The detection component (2) is a flexible circuit board, which includes a shielding layer (22) and a conductive layer. The conductive layer is provided with a plurality of sensing units (20) formed by conductors, and at least a portion of the sensing units (20) are provided with the shielding layer (22).

13. The capacitive sensor as described in claim 12, characterized in that, The shielding layer (22) has a mesh structure.

14. The capacitive sensor as described in claim 11, characterized in that, The sensing signal amplification layer (3) includes multiple outer covering portions (30), each of the multiple outer covering portions (30) covering each of the sensing units (20) one-to-one.

15. The capacitive sensor as described in claim 14, characterized in that, The outer covering portion (30) is separated by an insulator; or, the sensing signal amplification layer (3) further includes a thinning portion (31) located between each two adjacent outer covering portions (30), the thickness of the thinning portion (31) being less than the thickness of the outer covering portion (30).

16. The capacitive sensor as described in claim 15, characterized in that, The outer covering portion (30) is arranged along the length of the detection area of ​​the capacitance sensor.

17. The capacitive sensor as described in claim 1, characterized in that, The connecting base (1) is provided with a fixing part (12) for fixing the capacitive sensor.

18. The capacitive sensor as described in claim 17, characterized in that, The fixing part (12) is one or any combination of a snap-fit ​​structure, a plug-in structure, a bolt structure, an adhesive structure, and a welded structure.

19. A capacitive sensing device, characterized in that, It includes a device body, a controller disposed on the device body, and a capacitive sensor as described in any one of claims 1-18, wherein the capacitive sensor is electrically connected to the controller.

20. A device, characterized in that, The device includes a main body, on which a control system and a capacitive sensor as described in any one of claims 1-19 are provided, wherein the capacitive sensor is electrically connected to the control system.

21. The device as claimed in claim 20, characterized in that, The main body of the device has a first component and a second component that are brought together by a drive mechanism to form a closed structure. The connecting base (1) is connected to the first component or the second component. The sensing signal amplification layer (3) is exposed on the closed surface of the first component and the second component. When a detection object comes into contact with the sensing signal amplification layer (3), the control system controls the state of at least one of the first component and the second component according to the detection signal.

Images