A surface relief grating waveguide manufacturing equipment

Abstract

This invention provides a surface-embossed grating waveguide manufacturing equipment, comprising a first bonding mechanism, a second bonding mechanism, and a laser cutting mechanism. The first bonding mechanism is used to bond optically transparent adhesive to the entire unstructured surface of a waveguide wafer with multiple grating structures. The second bonding mechanism is used to bond a cover plate to the side of the waveguide wafer where the optically transparent adhesive is bonded. The laser cutting mechanism is used to cut the waveguide bonding structure composed of the waveguide wafer, optically transparent adhesive, and cover plate to obtain multiple waveguide wafer units, each waveguide wafer unit having one set of grating structures. Using this surface-embossed grating waveguide manufacturing equipment, the entire surface of a waveguide wafer with multiple grating structures is first bonded with optically transparent adhesive and a cover plate to obtain a waveguide bonding structure. Then, the waveguide bonding structure is laser-cut to obtain waveguide wafer units with one set of grating structures, greatly improving the bonding operation efficiency, reducing the risk of contamination of the waveguide wafer units, and improving bonding accuracy.

Description

Technical Field

[0001] This utility model relates to the field of AR diffraction waveguide manufacturing technology, specifically to a surface relief grating waveguide manufacturing equipment. Background Technology

[0002] The existing scheme for producing surface-embossed grating waveguides using splicing molds is as follows:

[0003] 1. Multiple surface-embossed grating waveguides are spliced ​​together as mold units on a large mold base to obtain a spliced ​​mold.

[0004] 2. Using a splicing mold as an imprinting template, waveguide wafers with multiple grating structures are obtained through nanoimprinting:

[0005] A soft film adhesive is spin-coated onto a splicing mold, and the grating structure of the splicing mold is transferred to a soft film substrate using a nanoimprinting process to obtain a splicing soft film. The transfer area of ​​the splicing soft film has a transfer structure with multiple sets of grating structures (i.e., the inverse structure of the grating structure).

[0006] By spin-coating an imprinting adhesive onto a waveguide wafer, the transfer structure of multiple grating structures in the transfer area of ​​the spliced ​​soft film is transferred onto the waveguide wafer using an imprinting adhesive and a nanoimprinting process, resulting in a waveguide wafer with multiple grating structures.

[0007] 3. The waveguide wafer with multiple grating structures is cut according to the finished waveguide shape to obtain multiple waveguide wafer units, each waveguide wafer unit having a set of grating structures.

[0008] 4. Based on the layered structure of the finished waveguide (consisting of at least one cover plate and at least one waveguide wafer unit), bonding operation is performed at the edge area between the cover plate and the waveguide wafer unit, or bonding operation is performed at the edge area between the waveguide wafer units, to obtain the waveguide bonding structure.

[0009] 5. The end face of the waveguide bonding structure is sealed with light-shielding adhesive to obtain the finished waveguide with embossed grating.

[0010] The above-mentioned method of cutting waveguide wafers with multiple grating structures and then bonding the cut waveguide wafer units has the following problems:

[0011] 1) Waveguide wafers with multiple grating structures are cut and then bonded together with multiple waveguide wafer units, resulting in low bonding efficiency.

[0012] 2) After the waveguide wafer with multiple grating structures is cut, multiple waveguide wafer units are bonded separately. The independent bonding operation of each waveguide wafer unit increases the risk of contamination by dust, impurities and other substances in the surrounding environment.

[0013] 3) After the waveguide wafer with multiple grating structures is cut, multiple waveguide wafer units are bonded together. Due to the small size of the waveguide wafer units, the alignment and bonding accuracy between the cover plate and the waveguide wafer units or between the waveguide wafer units is easily reduced. Utility Model Content

[0014] In order to overcome the shortcomings of the prior art, this utility model provides a surface relief grating waveguide manufacturing equipment.

[0015] This utility model is achieved through the following technical solution:

[0016] This utility model provides a surface relief grating waveguide manufacturing equipment, including a first bonding mechanism, a second bonding mechanism and a laser cutting mechanism;

[0017] The first bonding mechanism is used to bond optically transparent adhesive to the entire unstructured surface of the waveguide wafer;

[0018] The second bonding mechanism is used to bond a cover plate to the side of the waveguide wafer where optically transparent adhesive is bonded;

[0019] The laser cutting mechanism is used to cut the waveguide bonding structure composed of waveguide wafer, optical transparent adhesive and cover plate to obtain waveguide wafer unit.

[0020] The waveguide wafer has multiple grating structures, and each waveguide wafer unit has a set of grating structures.

[0021] Furthermore, the first bonding mechanism includes a first bonding cavity, and a first bonding platform, a second bonding platform, a rotating component, a first lifting component, and a first moving component are disposed within the first bonding cavity;

[0022] One end of the first fitting platform is connected to the rotating component, the rotating component is connected to the first lifting component, and the first lifting component is connected to the top inner wall of the first fitting cavity;

[0023] One end of the second bonding platform is connected to the first moving component, and the first moving component is connected to the bottom inner wall of the first bonding cavity;

[0024] The first bonding platform is used for vacuum adsorption of one side of the structural surface of the waveguide wafer;

[0025] The second bonding platform is used for vacuum adsorption of optically transparent adhesive.

[0026] Furthermore, the first bonding mechanism also includes an alignment component, which includes a first alignment camera, a second alignment camera, and a control unit;

[0027] The first alignment camera and the second alignment camera are respectively connected to the control unit, and the control unit is connected to the first moving component;

[0028] The first alignment camera is connected to the inner wall of the first bonding cavity. The first alignment camera acquires the first position information of the waveguide wafer adsorbed by the first bonding platform and sends it to the control unit.

[0029] The second alignment camera is connected to the inner wall of the first bonding cavity. The second alignment camera acquires the second position information of the optical transparent adhesive adsorbed on the second bonding platform and sends it to the control unit.

[0030] The control unit controls the movement of the first moving component based on the first location information and the second location information.

[0031] Furthermore, the second bonding platform includes a receiving groove;

[0032] The receiving groove is equipped with a second lifting component, a second moving component, and a roller component;

[0033] The bottom of the receiving groove is connected to the bottom end of the second moving component, the top of the second moving component is connected to the bottom end of the second lifting component, and a roller component is provided at the top of the second lifting component.

[0034] A stretchable steel plate is provided at the top of the receiving groove.

[0035] Furthermore, the sidewall of the receiving groove is provided with a first vacuum adsorption through hole;

[0036] The first vacuum adsorption through hole is connected to the vacuum ventilation pipe.

[0037] Furthermore, the second bonding platform also includes a third lifting component and a support plate;

[0038] The bottom of the receiving groove is connected to the bottom end of the third lifting component, and the support plate is provided at the top of the third lifting component;

[0039] The support plate is located below the stretchable steel plate.

[0040] Furthermore, the second bonding mechanism includes a second bonding cavity;

[0041] The second fitting cavity is provided with a third fitting platform, a fourth fitting platform, a fourth lifting component, and a third moving component;

[0042] One end of the third fitting platform is connected to the fourth lifting component, and the fourth lifting component is connected to the inner wall of the top of the second fitting cavity;

[0043] One end of the fourth bonding platform is connected to the third moving component, and the third moving component is connected to the bottom inner wall of the second bonding cavity;

[0044] The third bonding platform is used for vacuum adsorption of the opposite side of the optical transparent adhesive used to bond the waveguide wafer.

[0045] The fourth bonding platform is used for vacuum adsorption of the cover plate.

[0046] Furthermore, a second vacuum adsorption through hole is formed on the side wall of the second fitting cavity;

[0047] The second vacuum adsorption through hole is connected to the vacuum ventilation pipe.

[0048] Furthermore, the laser cutting mechanism employs a Bessel laser beam.

[0049] Compared with the prior art, the technical solution of this utility model has the following beneficial effects:

[0050] This invention provides a surface-embossed grating waveguide manufacturing equipment, comprising a first bonding mechanism, a second bonding mechanism, and a laser cutting mechanism. The first bonding mechanism is used to bond optically transparent adhesive to the entire unstructured surface of a waveguide wafer with multiple grating structures. The second bonding mechanism is used to bond a cover plate to the side of the waveguide wafer with the optically transparent adhesive. The laser cutting mechanism is used to cut the waveguide bonding structure composed of the waveguide wafer, optically transparent adhesive, and cover plate to obtain multiple waveguide wafer units, each waveguide wafer unit having one set of grating structures. Using this surface-embossed grating waveguide manufacturing equipment, the entire surface of a waveguide wafer with multiple grating structures is first bonded with optically transparent adhesive and a cover plate to obtain a waveguide bonding structure. Then, the waveguide bonding structure is laser-cut to obtain multiple waveguide wafer units with one set of grating structures, greatly improving the bonding operation efficiency, reducing the risk of contamination of the waveguide wafer units, and improving the bonding operation accuracy. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0052] Figure 1 A schematic diagram of the overall structure of the surface relief grating waveguide manufacturing equipment provided by this utility model;

[0053] Figure 2 This is a schematic diagram of the first bonding mechanism;

[0054] Figure 3 This is a schematic diagram of the structure of the second bonding platform;

[0055] Figure 4 This is a schematic diagram of the second bonding mechanism.

[0056] Among them, 1-first bonding mechanism, 1-1-first bonding cavity, 1-2-first bonding platform, 1-3-second bonding platform, 1-3-1-accommodating groove, 1-3-2-second moving component, 1-3-3-second lifting component, 1-3-4-roller component, 1-3-5-stretchable steel plate, 1-3-6-third lifting component, 1-3-7-support plate, 1-4-rotating component, 1-5-first lifting component, 1-6-first moving component, 2-second bonding mechanism, 2-1-second bonding cavity, 2-2-third bonding platform, 2-3-fourth bonding platform, 2-4-fourth lifting component, 2-5-third moving component, 3-laser cutting mechanism. Detailed Implementation

[0057] The technical solution of this utility model will be clearly and completely described below with reference to its embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0058] In this document, the terms "first," "second," and other similar words are not intended to imply any order, quantity, or importance, but are merely used to distinguish different elements. The terms "one," "a," and other similar words are not intended to indicate the existence of only one of the stated things, but rather that the description refers only to one of the stated things, which may have one or more. The terms "comprising," "including," and other similar words are intended to indicate a logical relationship, not a spatial relationship. For example, "A includes B" means that logically B belongs to A, not that spatially B is located inside A. Furthermore, the meanings of the terms "comprising," "including," and other similar words should be considered open-ended, not closed. For example, "A includes B" means that B belongs to A, but B does not necessarily constitute all of A; A may also include other elements such as C, D, and E.

[0059] In this document, the terms "embodiment," "this embodiment," "preferred embodiment," and "one embodiment" do not imply that the description applies only to one specific embodiment, but rather that such description may also be applicable to one or more other embodiments. Those skilled in the art will understand that any description made herein relating to one embodiment can be substituted, combined, or otherwise incorporated with the descriptions in one or more other embodiments. Such substitutions, combinations, or other incorporations resulting in new embodiments are readily conceived by those skilled in the art and fall within the protection scope of this utility model.

[0060] In this description, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0061] like Figure 1 As shown, this utility model provides a surface relief grating waveguide manufacturing equipment, including a first bonding mechanism 1, a second bonding mechanism 2 and a laser cutting mechanism 3.

[0062] The first bonding mechanism 1 is used to bond optically transparent adhesive to the entire unstructured surface of the waveguide wafer.

[0063] The second bonding mechanism 2 is used to bond a cover plate to the side of the waveguide wafer where optically transparent adhesive is bonded.

[0064] The laser cutting mechanism 3 is used to cut the waveguide bonding structure composed of waveguide wafer, optical transparent adhesive and cover plate to obtain waveguide wafer unit.

[0065] The waveguide wafer has multiple sets of grating structures. Based on the waveguide product's cutting shape, the waveguide wafer can be cut into multiple waveguide wafer units. Each waveguide wafer unit has a set of grating structures. The unstructured surface of the waveguide wafer refers to the surface opposite to the side where the grating structure is located. This set of grating structures can include an input grating and an output grating, or it can include an input grating, a transition grating, and an output grating.

[0066] For example, such as Figure 2 As shown, the first bonding mechanism includes a first bonding cavity 1-1, and a first bonding platform 1-2, a second bonding platform 1-3, a rotating component 1-4, a first lifting component 1-5, and a first moving component 1-6 are arranged inside the first bonding cavity 1-1.

[0067] One end of the first bonding platform 1-2 is connected to the rotating component 1-4, the rotating component 1-4 is connected to the first lifting component 1-5, and the first lifting component 1-5 is connected to the top inner wall of the first bonding cavity 1-1.

[0068] One end of the second bonding platform 1-3 is connected to the first moving part 1-6, and the first moving part 1-6 is connected to the bottom inner wall of the first bonding cavity 1-1.

[0069] The first bonding platform 1-2 is used for vacuum adsorption of one side of the structural surface of the waveguide wafer, and the second bonding platform 1-3 is used for vacuum adsorption of optical transparent adhesive.

[0070] For example, the rotating component may include a drive motor and a transmission shaft, and the first lifting component may employ an existing cylinder mechanism. One end of the transmission shaft is connected to one end of the first contacting platform, the other end of the transmission shaft is connected to the output shaft of the drive motor, and the bottom end of the drive motor is connected to the pushing end of the cylinder mechanism.

[0071] The aforementioned first moving component can be an existing slide rail slider assembly.

[0072] In a preferred embodiment, in order to improve the alignment accuracy between the waveguide wafer of the first bonding platform and the optically transparent adhesive of the second bonding platform, thereby ensuring that the optically transparent adhesive is bonded to the entire unstructured surface of the waveguide wafer, the first bonding mechanism may further include an alignment component (not shown in the figure), which includes a first alignment camera, a second alignment camera and a control unit.

[0073] The first and second alignment cameras are connected to the control unit, which in turn is connected to the first moving component.

[0074] The first alignment camera is connected to the inner wall of the first bonding cavity. The first alignment camera acquires the first position information of the waveguide wafer adsorbed by the first bonding platform and sends it to the control unit.

[0075] The second alignment camera is connected to the inner wall of the first bonding cavity. The second alignment camera acquires the second position information of the optically transparent adhesive adsorbed on the second bonding platform and sends it to the control unit.

[0076] The control unit controls the movement of the first moving component based on the first position information and the second position information to achieve precise alignment between the optical transparent adhesive of the second bonding platform and the waveguide wafer of the first bonding platform, thereby ensuring that the optical transparent adhesive is bonded to the entire unstructured surface of the waveguide wafer.

[0077] The aforementioned control unit can be an existing controller, and the aforementioned first and second alignment cameras can be existing CCD cameras.

[0078] As a preferred embodiment, such as Figure 3 As shown, the second bonding platform includes a receiving groove 1-3-1, and a second lifting component 1-3-3, a second moving component 1-3-2, and a roller component 1-3-4 are arranged in the receiving groove 1-3-1.

[0079] The bottom of the receiving groove 1-3-1 is connected to the bottom end of the second moving part 1-3-2, the top of the second moving part 1-3-2 is connected to the bottom end of the second lifting part 1-3-3, the top of the second lifting part 1-3-3 is provided with a roller part 1-3-4, and the top of the receiving groove 1-3-1 is provided with a stretchable steel plate 1-3-5.

[0080] The side wall of the receiving tank is provided with a first vacuum adsorption through hole, which is connected to a vacuum ventilation pipe.

[0081] When bonding the waveguide wafer on the first bonding platform to the optically transparent adhesive on the second bonding platform, the second lifting component drives the roller component to lift the stretchable steel plate upward through the second moving component, and the second moving component drives the roller component to pass laterally through the stretchable steel plate, thereby achieving a tight bond between the optically transparent adhesive on the second bonding platform and the waveguide wafer on the first bonding platform, avoiding air bubble problems during the bonding operation between the waveguide wafer on the first bonding platform and the optically transparent adhesive on the second bonding platform.

[0082] The aforementioned second lifting component can adopt an existing cylinder mechanism, the second moving component can adopt an existing slide rail slider assembly, the stretchable steel plate can adopt existing components, and the roller component can adopt existing components.

[0083] During the initial vacuuming operation inside the receiving tank, to prevent the stretchable steel plate at the top of the receiving tank from collapsing downwards, such as... Figure 3 As shown, the second bonding platform also includes a third lifting component 1-3-6 and a support plate 1-3-7. The bottom of the receiving groove 1-3-1 is connected to the bottom end of the third lifting component 1-3-6. The support plate 1-3-7 is set at the top of the third lifting component 1-3-6. The support plate is located below the stretchable steel plate. During the initial vacuuming operation in the receiving groove, the third lifting component moves the support plate close to the bottom surface of the stretchable steel plate to prevent the stretchable steel plate from sinking downward. When the roller component needs to be started, the third lifting component moves the support plate down.

[0084] The aforementioned third lifting component can employ an existing cylinder mechanism.

[0085] For example, such as Figure 4 As shown, the second bonding mechanism includes a second bonding cavity 2-1, and a third bonding platform 2-2, a fourth bonding platform 2-3, a fourth lifting component 2-4, and a third moving component 2-5 are disposed inside the second bonding cavity 2-1.

[0086] One end of the third fitting platform 2-2 is connected to the fourth lifting component 2-4, and the fourth lifting component 2-4 is connected to the inner wall of the top of the second fitting cavity 2-1.

[0087] One end of the fourth bonding platform 2-3 is connected to the third moving part 2-5, and the third moving part 2-5 is connected to the bottom inner wall of the second bonding cavity 2-1.

[0088] The third bonding platform 2-2 is used for vacuum adsorption of the opposite side of the optical transparent adhesive for bonding the waveguide wafer, and the fourth bonding platform 2-3 is used for vacuum adsorption of the cover plate.

[0089] A second vacuum adsorption through hole is opened on the side wall of the second fitting cavity, and the second vacuum adsorption through hole is connected to the vacuum ventilation pipe.

[0090] For example, the fourth lifting component can be an existing cylinder mechanism, and the third moving component can be an existing slide rail slider assembly.

[0091] For example, the laser cutting mechanism described above uses a Bessel laser beam. The Bessel laser beam has non-diffraction characteristics and a long focusing depth, enabling it to form a long, narrow cutting area during the cutting of the waveguide bonding structure composed of waveguide wafers, optically transparent adhesive, and a cover plate. This reduces the thermal impact on surrounding materials and lowers the risk of damage to the waveguide bonding structure.

[0092] The following example illustrates the working principle of the surface relief grating waveguide manufacturing equipment of this utility model:

[0093] 1. The first bonding platform vacuum adsorbs one side of the structural surface of the waveguide wafer, with the waveguide wafer located above the first bonding platform. The second bonding platform vacuum adsorbs optically transparent adhesive, with the optically transparent adhesive located above the second bonding platform.

[0094] 2. The rotating component drives the first bonding platform to rotate, so that the waveguide wafer is located below the first bonding platform.

[0095] 3. The first alignment camera acquires the first position information of the waveguide wafer adsorbed by the first bonding platform and sends it to the control unit. The second alignment camera acquires the second position information of the optically transparent adhesive adsorbed by the second bonding platform and sends it to the control unit. Based on the first and second position information, the control unit controls the first moving component to move, thereby driving the optically transparent adhesive of the second bonding platform to move, so as to realize the bonding and alignment operation between the optically transparent adhesive of the second bonding platform and the waveguide wafer of the first bonding platform.

[0096] 4. The first lifting component lowers the waveguide wafer to the optical transparent adhesive near the second bonding platform via the first bonding platform.

[0097] 5. The second lifting component drives the roller component to lift the stretchable steel plate upward through the second moving component, and the second moving component drives the roller component to pass laterally across the stretchable steel plate, thereby achieving a tight bond between the optical transparent adhesive of the second bonding platform and the waveguide wafer of the first bonding platform, and the optical transparent adhesive is bonded to the entire non-structural surface of the waveguide wafer.

[0098] 6. The third bonding platform vacuum adsorbs the opposite side of the waveguide wafer to be bonded with the optical transparent adhesive, with the waveguide wafer located below the third bonding platform; the fourth bonding platform vacuum adsorbs the cover plate, with the cover plate located above the fourth bonding platform.

[0099] 7. The third moving component drives the cover plate to move through the fourth bonding platform, thereby realizing the bonding and alignment operation between the cover plate of the fourth bonding platform and the waveguide wafer of the bonding optical transparent adhesive of the third bonding platform.

[0100] 8. The fourth lifting component lowers the waveguide wafer bonded with optical transparent adhesive via the third bonding platform and applies pressure to the cover plate on the fourth bonding platform to obtain a waveguide bonding structure composed of the waveguide wafer, optical transparent adhesive and cover plate.

[0101] 9. Waveguide wafer units are obtained by cutting the waveguide bonding structure composed of waveguide wafer, optical transparent adhesive and cover plate using a laser cutting mechanism.

[0102] The above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although the utility model has been described in detail with reference to the above embodiments, those skilled in the art can still make modifications or equivalent substitutions to the specific implementation of this utility model. Any modifications or equivalent substitutions that do not depart from the spirit and scope of this utility model are within the protection scope of the claims of this utility model pending approval.

Claims

1. A surface relief grating waveguide manufacturing equipment, characterized in that, It includes a first bonding mechanism, a second bonding mechanism, and a laser cutting mechanism; The first bonding mechanism is used to bond optically transparent adhesive to the entire unstructured surface of the waveguide wafer; The second bonding mechanism is used to bond a cover plate to the side of the waveguide wafer where optically transparent adhesive is bonded; The laser cutting mechanism is used to cut the waveguide bonding structure composed of waveguide wafer, optical transparent adhesive and cover plate to obtain waveguide wafer unit. The waveguide wafer has multiple grating structures, and each waveguide wafer unit has a set of grating structures.

2. The surface relief grating waveguide manufacturing equipment according to claim 1, characterized in that, The first bonding mechanism includes a first bonding cavity, and a first bonding platform, a second bonding platform, a rotating component, a first lifting component, and a first moving component are disposed within the first bonding cavity; One end of the first fitting platform is connected to the rotating component, the rotating component is connected to the first lifting component, and the first lifting component is connected to the top inner wall of the first fitting cavity; One end of the second bonding platform is connected to the first moving component, and the first moving component is connected to the bottom inner wall of the first bonding cavity; The first bonding platform is used for vacuum adsorption of one side of the structural surface of the waveguide wafer; The second bonding platform is used for vacuum adsorption of optically transparent adhesive.

3. The surface relief grating waveguide manufacturing equipment according to claim 2, characterized in that, The first bonding mechanism further includes an alignment component, which includes a first alignment camera, a second alignment camera, and a control unit; The first alignment camera and the second alignment camera are respectively connected to the control unit, and the control unit is connected to the first moving component; The first alignment camera is connected to the inner wall of the first bonding cavity. The first alignment camera acquires the first position information of the waveguide wafer adsorbed by the first bonding platform and sends it to the control unit. The second alignment camera is connected to the inner wall of the first bonding cavity. The second alignment camera acquires the second position information of the optical transparent adhesive adsorbed on the second bonding platform and sends it to the control unit. The control unit controls the movement of the first moving component based on the first location information and the second location information.

4. The surface relief grating waveguide manufacturing equipment according to claim 2, characterized in that, The second bonding platform includes a receiving groove; The receiving groove is equipped with a second lifting component, a second moving component, and a roller component; The bottom of the receiving groove is connected to the bottom end of the second moving component, the top of the second moving component is connected to the bottom end of the second lifting component, and a roller component is provided at the top of the second lifting component. A stretchable steel plate is provided at the top of the receiving groove.

5. The surface relief grating waveguide manufacturing equipment according to claim 4, characterized in that, The sidewall of the receiving groove is provided with a first vacuum adsorption through hole; The first vacuum adsorption through hole is connected to the vacuum ventilation pipe.

6. The surface relief grating waveguide manufacturing equipment according to claim 4, characterized in that, The second bonding platform also includes a third lifting component and a support plate; The bottom of the receiving groove is connected to the bottom end of the third lifting component, and the support plate is provided at the top of the third lifting component; The support plate is located below the stretchable steel plate.

7. The surface relief grating waveguide manufacturing equipment according to claim 1, characterized in that, The second bonding mechanism includes a second bonding cavity; The second fitting cavity is provided with a third fitting platform, a fourth fitting platform, a fourth lifting component, and a third moving component; One end of the third fitting platform is connected to the fourth lifting component, and the fourth lifting component is connected to the inner wall of the top of the second fitting cavity; One end of the fourth bonding platform is connected to the third moving component, and the third moving component is connected to the bottom inner wall of the second bonding cavity; The third bonding platform is used for vacuum adsorption of the opposite side of the optical transparent adhesive used to bond the waveguide wafer. The fourth bonding platform is used for vacuum adsorption of the cover plate.

8. The surface relief grating waveguide manufacturing equipment according to claim 7, characterized in that, A second vacuum adsorption through hole is formed on the side wall of the second fitting cavity; The second vacuum adsorption through hole is connected to the vacuum ventilation pipe.

9. The surface relief grating waveguide manufacturing equipment according to claim 1, characterized in that, The laser cutting mechanism uses a Bessel laser beam.

Images