Coaxial structure detector

Abstract

This application relates to the field of optical fiber communication and provides a coaxial structure detector, including a housing with a receiving cavity, both ends of which are open; a first connector connected to the opening at one end of the housing, at least a portion of the first connector extending out of the housing; a photoelectric conversion component housed within the receiving cavity and connected to the first connector, the photoelectric conversion component being used to convert optical signals into electrical signals; an amplification and filtering component electrically connected to the photoelectric conversion component, the amplification and filtering component being used to amplify and filter the electrical signals transmitted by the photoelectric conversion component; and a second connector connected to the opening at the other end of the housing, at least a portion of the second connector extending out of the housing, the second connector being electrically connected to the amplification and filtering component. In this application, the coaxial structure detector can compensate for amplitude attenuation during optical fiber transmission conversion, effectively reducing signal distortion and helping to improve the accuracy of information reconstruction carried in radio frequency signals.

Description

Technical Field

[0001] This application belongs to the field of optical fiber communication technology, and in particular relates to coaxial structure detectors. Background Technology

[0002] Optical fiber communication is a communication technology that uses optical fiber as the transmission medium and optical signals as the carrier. It typically involves first converting the radio frequency electrical signal to be transmitted into an optical signal through electro-optical conversion, then transmitting the optical signal to the destination through an analog optical fiber link, and finally converting the optical signal back into an electrical signal through photoelectric conversion at the destination.

[0003] In related technologies, optical signals suffer from optical loss during transmission and conversion, resulting in a smaller output signal than the input signal. This means that the radio frequency signal in the analog fiber optic link experiences amplitude attenuation, which may cause signal distortion and reduce the accuracy of information reconstruction from the radio frequency signal. Utility Model Content

[0004] This application provides a coaxial structure detector that can solve the technical problem in related technologies where the amplitude attenuation of radio frequency signals in analog fiber optic links may lead to signal distortion and reduce the accuracy of information restoration from radio frequency signals.

[0005] This application provides a coaxial structure detector, including: The shell has a receiving cavity, and both ends of the shell are open. A first connector is connected to an opening at one end of the housing, and at least a portion of the first connector extends out of the housing; A photoelectric conversion component is housed within a receiving cavity and connected to a first connector. The photoelectric conversion component is used to convert optical signals into electrical signals. The amplification and filtering component is electrically connected to the photoelectric conversion component. The amplification and filtering component is used to amplify and filter the electrical signal transmitted by the photoelectric conversion component. The second connector is connected to the opening at the other end of the housing, at least a portion of the second connector extends out of the housing, and the second connector is electrically connected to the amplification and filtering assembly.

[0006] The coaxial detector provided in this embodiment has a first connector that can be connected to an optical fiber connector, enabling the connection between the coaxial detector and optical fiber equipment. The photoelectric conversion component can convert optical signals into electrical signals, and the amplification and filtering component can adjust and filter the amplitude of the electrical signals. The second connector can transmit the electrical signals to the client's radio frequency equipment, facilitating interconnection with subsequent radio frequency circuits. The coaxial detector can compensate for the amplitude attenuation during optical fiber transmission conversion, effectively reducing signal distortion and helping to improve the accuracy of information restoration carried in the radio frequency signal.

[0007] Optionally, the photoelectric conversion component includes a lens, a photodiode chip, a thin-film circuit chip connected to the photodiode chip, and pins connected to the thin-film circuit chip, the pins being connected to the amplification and filtering component; The lens is used to focus the optical signal transmitted by the first connector onto the photodiode chip; Photodiode chips are used to convert optical signals into electrical signals and to transmit electrical signals to thin-film circuit chips. Thin-film circuit chips are used to convert current signals into voltage signals and to transmit voltage signals to amplification and filtering components via pins.

[0008] By adopting the above technical solution, the lens can focus the light signal onto the photosensitive surface of the photodiode chip, which can improve the efficiency of light signal coupling. The photodiode chip directly converts the light signal into a current signal, and the thin film circuit chip can efficiently convert the weak photocurrent into a voltage signal, providing a suitable input form for subsequent amplification.

[0009] Optionally, the photoelectric conversion assembly also includes a socket, a lens connected to one end of the socket, a photodiode chip and a thin-film circuit chip housed inside the socket, and pins extending out from the other end of the socket.

[0010] By adopting the above technical solution, the tube socket can provide physical protection and a sealed environment for other components of the photoelectric conversion module, which can prevent dust, moisture and other contaminants from polluting the core photoelectric device, improve the long-term stability and service life of the photoelectric conversion module, and also facilitate assembly and replacement as a standard part.

[0011] Optionally, the first connector includes a first flange, a core connected to the first flange, and a ceramic insert, a ceramic sleeve, and a guide ring sequentially disposed between the core and the first flange; The first flange is connected to the opening at one end of the housing, and the tube core is connected to the tube seat.

[0012] By adopting the above technical solution, the space between the core and the first flange can provide a stable installation position for the ceramic ferrule, ceramic sleeve and guide ring. The ceramic ferrule can be engaged with the ceramic part in the fiber optic connector, the ceramic sleeve can position and fix the ceramic ferrule, and the guide ring can guide the ceramic ferrule and the ceramic part in the fiber optic connector to achieve the correct combination of the two, which can ensure high-precision and low-loss docking between the optical fiber and the internal optical path of the detector.

[0013] Optionally, the thin-film circuit chip includes a switching resistor for converting a current signal into a voltage signal.

[0014] By adopting the above technical solution, the conversion resistor can match the output impedance of the photodiode chip with the input impedance of the subsequent amplifier circuit, reduce signal reflection and standing waves, ensure efficient transmission and fidelity of radio frequency signals, further reduce signal distortion, and improve the accuracy of information restoration carried in radio frequency signals.

[0015] Optionally, the amplification and filtering component includes a circuit board, and a noise amplifier, an attenuator, and a bandpass filter connected in sequence to the circuit board. One end of the circuit board is connected to the pins of the thin-film circuit chip, and the other end of the circuit board is connected to the second connector.

[0016] By adopting the above technical solutions, the noise amplifier can amplify the electrical signal, effectively compensate for the loss in optical transmission and photoelectric conversion, and improve the signal amplitude and signal-to-noise ratio; the attenuator is used to precisely adjust the signal amplitude to suit subsequent circuit processing or meet output requirements; the bandpass filter can filter out harmonics, noise and spurious waves in the signal, significantly improve the purity and quality of the output signal, further reduce signal distortion, and improve the accuracy of information restoration carried in the radio frequency signal.

[0017] Optionally, two noise amplifiers and two attenuators are provided, with the two noise amplifiers and two attenuators arranged alternately, and a bandpass filter adjacent to one of the attenuators.

[0018] By adopting the above technical solution, the alternating setting of two-stage amplifiers and two-stage attenuators can avoid signal saturation or self-oscillation caused by excessive gain of a single-stage amplifier. At the same time, the intermediate amplitude can be adjusted by the attenuator to achieve a wider dynamic range and more stable gain control. By reasonably allocating the gain and attenuation of each stage, the linearity of the entire amplification link can be optimized, nonlinear distortion can be reduced, and the information carried in the radio frequency signal can be restored more accurately.

[0019] Optionally, the second connector includes a ground electrode and a signal electrode, and the circuit board includes a ground pad and a signal pad, with the ground electrode soldered to the ground pad and the signal electrode soldered to the signal pad.

[0020] By adopting the above technical solutions, the grounding electrode design helps to achieve good grounding, enhances the circuit's anti-interference capability, and provides a stable reference potential for the signal, which helps to maintain the integrity of the radio frequency signal. The grounding electrode and signal electrode of the second connector are interconnected with the corresponding pads on the circuit board by soldering, which can ensure low-loss and low-reflection transmission of radio frequency signals between the detector's internal circuitry and external devices.

[0021] Optionally, the housing is tubular, comprising an upper shell and a lower shell, which together form a receiving cavity and an opening. A first connector and a second connector are respectively connected to the two ends of the upper shell and the lower shell, and a photoelectric conversion component and an amplification and filtering component are disposed between the upper shell and the lower shell.

[0022] By adopting the above technical solution, the split design of the upper and lower shells facilitates the installation, debugging, and maintenance of the photoelectric conversion components and amplification and filtering components inside the shell.

[0023] Optionally, the second connector includes a second flange, and the housing has a first slot adapted to the first flange and a second slot adapted to the second flange.

[0024] By adopting the above technical solution, the first and second slots on the housing are adapted to the flange of the connector, which can ensure that the first and second connectors can be quickly and accurately installed into the predetermined position of the housing, ensuring the alignment accuracy of the optical axis and electrical connection; at the same time, it can firmly fix the connector to the housing, which can enhance the vibration resistance and reliability of the overall structure. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a coaxial detector provided in one embodiment of this application; Figure 2 This is an exploded structural diagram of a coaxial structure detector provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of a photoelectric conversion component provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the first connector provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of an amplification and filtering component provided in an embodiment of this application. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0028] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] Please see Figures 1 to 5 This application provides a coaxial structure detector 100, including a housing 10, a first connector 20, a photoelectric conversion component 30, an amplification and filtering component 40, and a second connector 50.

[0032] The housing 10 is a cavity structure, and its internal structure is a receiving cavity 11 for accommodating other components. Preferably, the housing 10 is constructed as a tubular structure with openings at both ends, and the openings at both ends are connected through the middle receiving cavity 11.

[0033] The first connector 20 is a structure in the coaxial detector 100 that connects to an external fiber optic connector. The first connector 20 is connected to an opening at one end of the housing 10 and has a connecting portion protruding from the housing 10; that is, at least a portion of the first connector 20 extends out of the housing 10. The structure of the first connector 20 extending out of the housing 10 is coupled to the structure of the fiber optic connector. The optical signal transmitted by the fiber optic connector can be transmitted to the coaxial detector 100 through the first connector 20, and the coaxial detector 100 receives the optical signal transmitted by the fiber optic connector through the first connector 20. Preferably, the fiber optic connector is a tab-twist (ST) fiber optic connector, and the first connector 20 can be connected to the ST fiber optic connector.

[0034] The photoelectric conversion component 30 is housed within the receiving cavity 11 and connected to the first connector 20. The photoelectric conversion component 30 is used to convert the optical signal transmitted by the first connector 20 into an electrical signal. Optionally, the photoelectric conversion component 30 may include structures such as photovoltaic devices (photocells), photomultiplier tubes, CCD / CMOS image sensors, and photodiode arrays.

[0035] The amplification and filtering component 40 is electrically connected to the photoelectric conversion component 30. The amplification and filtering component 40 is used to amplify and filter the electrical signal transmitted by the photoelectric conversion component 30. The amplification and filtering component 40 includes an amplification circuit and a filter. The amplification circuit can adjust the amplitude of the electrical signal, and the filter can filter the electrical signal to remove noise in the electrical signal.

[0036] The second connector 50 is connected to the opening at the other end of the housing 10. The first connector 20 and the second connector 50 are respectively connected to opposite ends of the housing 10. At least a portion of the second connector 50 extends out of the housing 10. The second connector 50 is electrically connected to the amplification and filtering assembly 40. The second connector 50 can be connected to radio frequency (RF) equipment. The interface of the second connector 50 is adapted to the interface of the RF equipment. The second connector 50 is used to transmit electrical signals to the RF equipment, and the RF equipment performs operations such as reading the electrical signals. Preferably, the second connector 50 is constructed as a Sub-Miniature Version A (SMA-J) connector, which has internal threads and external pin-shaped connectors.

[0037] The optical signal is transmitted from the optical fiber to the ST optical fiber connector at the end. The optical signal is then transmitted to the coaxial structure detector 100 through the connection between the ST optical fiber connector and the first connector 20. The first connector 20 transmits the optical signal to the photoelectric conversion component 30, which converts the optical signal into an electrical signal and transmits the electrical signal to the amplification and filtering component 40. The amplification and filtering component 40 adjusts the amplitude and filters the electrical signal, and then transmits the processed electrical signal to the external radio frequency equipment through the second connector 50.

[0038] The coaxial structure detector 100 provided in this embodiment has a first connector 20 that can be connected to an optical fiber connector, enabling the coaxial structure detector 100 to connect to an optical fiber device. The photoelectric conversion component 30 can convert optical signals into electrical signals, and the amplification and filtering component 40 can adjust the amplitude and filter the electrical signals. The second connector 50 can transmit the electrical signals to the client's radio frequency device, facilitating interconnection with subsequent radio frequency circuits. The coaxial structure detector 100 can compensate for the amplitude attenuation during optical fiber transmission conversion, effectively reducing signal distortion and helping to improve the accuracy of information restoration carried in the radio frequency signal.

[0039] Optionally, such as Figure 3 As shown, the photoelectric conversion component 30 includes a lens 31, a photodiode chip 32, a thin-film circuit chip 33 connected to the photodiode chip 32, and pins 34 connected to the thin-film circuit chip 33. Pins 34 are connected to the amplification and filtering component 40. The lens 31 focuses the optical signal transmitted from the first connector 20 onto the photodiode chip 32. The photodiode chip 32 converts the optical signal into a current signal and transmits the current signal to the thin-film circuit chip 33. The thin-film circuit chip 33 converts the current signal into a voltage signal and transmits the voltage signal to the amplification and filtering component 40 via pins 34.

[0040] By adopting the above technical solution, the lens 31 can focus the light signal onto the photosensitive surface of the photodiode chip 32, which can improve the efficiency of light signal coupling. The photodiode chip 32 directly converts the light signal into a current signal, and the thin film circuit chip 33 can efficiently convert the weak photocurrent into a voltage signal, providing a suitable input form for subsequent amplification.

[0041] Optionally, the thin-film circuit chip 33 includes a conversion resistor for converting a current signal into a voltage signal. Preferably, the conversion resistor has a resistance of 50Ω.

[0042] By adopting the above technical solution, the conversion resistor can match the output impedance of the photodiode chip 32 with the input impedance of the subsequent amplifier circuit, reduce signal reflection and standing waves, ensure efficient transmission and fidelity of radio frequency signals, further reduce signal distortion, and improve the accuracy of information restoration carried in radio frequency signals.

[0043] Optionally, such as Figure 2 As shown, the photoelectric conversion assembly 30 also includes a socket 35, a lens 31 connected to one end of the socket 35, a photodiode chip 32 and a thin film circuit chip 33 housed in the socket 35, and a pin 34 extending out from the other end of the socket 35.

[0044] The tube socket 35 is a tubular seat structure with an internal cavity. The photodiode chip 32 and the thin film circuit chip 33 are housed in the cavity of the tube socket 35. The lens 31 is located at one end of the tube socket 35 near the first connector 20. The pin 34 is located at one end of the tube socket 35 near the amplification and filtering component 40. The pin 34 is connected to the thin film circuit chip 33 and is used to transmit the electrical signal of the thin film circuit chip 33 to the amplification and filtering component 40.

[0045] By adopting the above technical solution, the tube socket 35 can provide physical protection and a sealed environment for other components of the photoelectric conversion component 30, which can prevent dust, moisture and other contaminants from polluting the core photoelectric device, improve the long-term stability and service life of the photoelectric conversion component 30, and also facilitate assembly and replacement as a standard part.

[0046] Optionally, such as Figure 2 and Figure 4 As shown, the first connector 20 includes a first flange 21, a core 22 connected to the first flange 21, and a ceramic insert 23, a ceramic sleeve 24, and a guide ring 25 sequentially disposed between the core 22 and the first flange 21.

[0047] The first flange 21 is connected to the opening at one end of the housing 10, and the core tube 22 is connected to the tube seat 35. The first flange 21 has two openings and is hollow inside. The ceramic insert 23, ceramic sleeve 24 and guide ring 25 are sequentially arranged in the cavity of the first flange 21, and the core tube 22 is arranged at the end of the first flange 21 near the tube seat 35.

[0048] The guide ring 25 and the ceramic sleeve 24 are hollow tubular structures. The ceramic sleeve 24 is inserted into the guide ring 25, and the ceramic ferrule 23 is inserted into the ceramic sleeve 24. When the first connector 20 connects to the fiber optic connector, the ceramic tube of the fiber optic connector moves to the position coupled with the ceramic ferrule 23 by the guidance of the guide ring 25. The optical signal is transmitted through the ceramic tube to the ceramic ferrule 23, and the ceramic ferrule 23 transmits the optical signal to the lens 31 of the photoelectric conversion component 30.

[0049] By adopting the above technical solution, the space between the core 22 and the first flange 21 can provide a stable installation position for the ceramic ferrule 23, the ceramic sleeve 24 and the guide ring 25. The ceramic ferrule 23 can be engaged with the ceramic part in the fiber optic connector, the ceramic sleeve 24 can position and fix the ceramic ferrule 23, and the guide ring 25 can guide the ceramic ferrule 23 and the ceramic part in the fiber optic connector to achieve the correct combination of the two, which can ensure high-precision and low-loss docking between the optical fiber and the internal optical path of the detector.

[0050] Optionally, such as Figure 5 As shown, the amplification and filtering component 40 includes a circuit board 41, and a noise amplifier 42, an attenuator 43 and a bandpass filter 44 connected in sequence to the circuit board 41. One end of the circuit board 41 is connected to the pin 34 of the thin film circuit chip 33, and the other end of the circuit board 41 is connected to the second connector 50.

[0051] The circuit board 41 is a printed circuit board (PCB), the noise amplifier 42 is preferably a low-addition phase noise amplifier 42, the attenuator 43 is a fixed attenuator 43, and the bandpass filter 44 is used to filter out out-of-band harmonics and noise signals.

[0052] By adopting the above technical solutions, the noise amplifier 42 can amplify the electrical signal, effectively compensate for the loss in optical transmission and photoelectric conversion, and improve the signal amplitude and signal-to-noise ratio; the attenuator 43 is used to precisely adjust the signal amplitude to make it suitable for subsequent circuit processing or to meet output requirements; the bandpass filter 44 can filter out harmonics, noise and spurious waves in the signal, significantly improve the purity and quality of the output signal, further reduce signal distortion, and improve the accuracy of information restoration carried in the radio frequency signal.

[0053] Optionally, such as Figure 2 and Figure 5 As shown, there are two noise amplifiers 42 and two attenuators 43, which are arranged alternately. The bandpass filter 44 is adjacent to one of the attenuators 43. That is, the arrangement order on the circuit board 41 is noise amplifier 42-attenuator 43-noise amplifier 42-attenuator 43-bandpass filter 44.

[0054] By adopting the above technical solution, the alternating setting of two-stage amplifiers and two-stage attenuators 43 can avoid signal saturation or self-oscillation caused by excessive gain of a single-stage amplifier. At the same time, the intermediate amplitude is adjusted by attenuators 43 to achieve a wider dynamic range and more stable gain control. By reasonably allocating the gain and attenuation of each stage, the linearity of the entire amplification link can be optimized, nonlinear distortion can be reduced, and the information carried in the radio frequency signal can be restored more accurately.

[0055] Optionally, such as Figure 2 As shown, the second connector 50 includes a ground electrode 51 and a signal electrode 52, and the circuit board 41 includes a ground pad 411 and a signal pad 412. The ground electrode 51 is soldered to the ground pad 411, and the signal electrode is soldered to the signal pad 412.

[0056] Specifically, there are two ground electrodes 51 and one signal electrode 52, with the signal electrode 52 located between the two ground electrodes 51.

[0057] By adopting the above technical solution, the ground electrode 51 design helps to achieve good grounding, enhance the anti-interference capability of the circuit, and provide a stable reference potential for the signal, which helps to maintain the integrity of the radio frequency signal; the ground electrode 51 and signal electrode 52 of the second connector 50 are interconnected with the corresponding pads on the circuit board 41 by soldering, which can ensure low loss and low reflection transmission of radio frequency signals between the internal circuit of the detector and the external device.

[0058] Optionally, such as Figure 1 and Figure 2 As shown, the housing 10 is tubular and includes an upper housing 12 and a lower housing 13. The upper housing 12 and the lower housing 13 enclose a receiving cavity 11 and an opening. The first connector 20 and the second connector 50 are respectively connected to the two ends of the upper housing 12 and the lower housing 13. The photoelectric conversion component 30 and the amplification and filtering component 40 are disposed between the upper housing 12 and the lower housing 13.

[0059] By adopting the above technical solution, the split design of the upper shell 12 and the lower shell 13 facilitates the installation, debugging and maintenance of the photoelectric conversion component 30 and the amplification and filtering component 40 inside the shell 10.

[0060] Optionally, such as Figure 2 As shown, the second connector 50 includes a second flange 53, and the housing 10 has a first slot 14 adapted to the first flange 21 and a second slot 15 adapted to the second flange 53.

[0061] By adopting the above technical solution, the first slot 14 and the second slot 15 on the housing 10 are adapted to the flange of the connector, which can ensure that the first connector 20 and the second connector 50 can be quickly and accurately installed into the predetermined position of the housing 10, ensuring the alignment accuracy of the optical axis and electrical connection; at the same time, the connector can be firmly fixed on the housing 10, which can enhance the vibration resistance and reliability of the overall structure.

[0062] The following example describes the operation of the coaxial structure detector 100: The coaxial connector connects to an external ST fiber optic connector via a first connector 20 and to an external radio frequency (RF) device via a second connector 50. The optical signal is transmitted along the fiber optic link to the ST fiber optic connector at the end, and then through the ceramic tube of the ST fiber optic connector to the ceramic ferrule 23 of the first connector 20. The ceramic ferrule 23 focuses the optical signal onto the photosensitive surface of the photodiode chip 32 via the lens 31 of the photoelectric converter. The photodiode chip 32 converts the optical signal into a current signal and transmits the current signal to the thin-film circuit chip 33. The conversion resistor on the thin-film circuit chip 33 converts the current signal into a voltage signal, and transmits the converted voltage signal to the amplification and filtering component 40 via pin 34. After the signal amplitude is amplified by the two-stage low-addition-phase-noise amplifier 42 and adjusted by the two-stage fixed attenuator 43 in the amplification and filtering component 40, the signal is transmitted to the client's RF device via the second connector 50.

[0063] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A coaxial structure detector, characterized in that, include: A housing having a receiving cavity, the two ends of the housing being open; A first connector is connected to an opening at one end of the housing, and at least a portion of the first connector extends out of the housing; A photoelectric conversion component is housed within the receiving cavity and connected to the first connector, the photoelectric conversion component being used to convert optical signals into electrical signals; An amplification and filtering component is electrically connected to the photoelectric conversion component, and the amplification and filtering component is used to amplify and filter the electrical signal transmitted by the photoelectric conversion component; A second connector is connected to an opening at the other end of the housing, at least a portion of the second connector protruding from the housing, and the second connector is electrically connected to the amplification and filtering assembly.

2. The coaxial structure detector according to claim 1, characterized in that, The photoelectric conversion component includes a lens, a photodiode chip, a thin-film circuit chip connected to the photodiode chip, and pins connected to the thin-film circuit chip. The pins are connected to the amplification and filtering component. The lens is used to focus the optical signal transmitted by the first connector onto the photodiode chip; The photodiode chip is used to convert the optical signal into a current signal and to transmit the current signal to the thin-film circuit chip. The thin-film circuit chip is used to convert the current signal into a voltage signal and to transmit the voltage signal to the amplification and filtering component through the pin.

3. The coaxial structure detector according to claim 2, characterized in that, The photoelectric conversion assembly also includes a socket, the lens is connected to one end of the socket, the photodiode chip and the thin film circuit chip are housed in the socket, and the pins extend out of the other end of the socket.

4. The coaxial structure detector according to claim 3, characterized in that, The first connector includes a first flange, a core connected to the first flange, and a ceramic insert, a ceramic sleeve, and a guide ring sequentially disposed between the core and the first flange. The first flange is connected to the opening at one end of the housing, and the tube core is connected to the tube seat.

5. The coaxial structure detector according to claim 2, characterized in that, The thin-film circuit chip includes a conversion resistor for converting the current signal into a voltage signal.

6. The coaxial structure detector according to claim 2, characterized in that, The amplification and filtering component includes a circuit board, and a noise amplifier, an attenuator, and a bandpass filter connected in sequence to the circuit board. One end of the circuit board is connected to the pin of the thin-film circuit chip, and the other end of the circuit board is connected to the second connector.

7. The coaxial structure detector according to claim 6, characterized in that, Two noise amplifiers and two attenuators are provided, and the two noise amplifiers and two attenuators are arranged alternately. The bandpass filter is adjacent to one of the attenuators.

8. The coaxial structure detector according to claim 7, characterized in that, The second connector includes a ground electrode and a signal electrode. The circuit board includes a ground pad and a signal pad. The ground electrode is soldered to the ground pad, and the signal electrode is soldered to the signal pad.

9. The coaxial structure detector according to claim 4, characterized in that, The housing is tubular and includes an upper shell and a lower shell. The upper shell and the lower shell enclose the receiving cavity and the opening. The first connector and the second connector are respectively connected to the two ends of the upper shell and the lower shell. The photoelectric conversion component and the amplification and filtering component are disposed between the upper shell and the lower shell.

10. The coaxial structure detector according to claim 9, characterized in that, The second connector includes a second flange, and the housing has a first slot adapted to the first flange and a second slot adapted to the second flange.

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