Tooling for AI server heat sink

Abstract

This utility model discloses a heat sink fixture for an AI server, relating to the field of heat sink technology. It includes a base plate with a mounting plate fixedly connected to its top. A baffle plate is fixedly connected to the side wall of the base plate away from the mounting plate. This utility model constructs a highly efficient dual-path heat dissipation system through the coordinated operation of a first heat dissipation component and a second heat dissipation component. During assembly, solid or hollow heat-conducting elements can be selected according to specific heat dissipation requirements. Solid heat-conducting elements directly transfer heat from the chip to the distal fins through heat conduction; while hollow heat-conducting elements can be connected to an external air pump or liquid cooling pump, forcing the cooling medium to circulate within the tube, greatly improving heat exchange efficiency. Combined with an external cooling fan, this design not only ensures stable chip operation under high load, but its modular design also significantly improves the adaptability, maintainability, and upper limit of heat dissipation performance of the heat sink fixture.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, specifically to tooling for heat sinks of AI servers. Background Technology

[0002] AI server heatsinks are devices specifically designed to efficiently dissipate the high heat generated inside AI servers. These heatsinks are typically optimized for the high power consumption and intensive computing requirements of AI servers to ensure stable operation and optimal performance. With the continuous development of AI technology and the increasing demands of its applications, AI server chips need to bear high computational loads during operation, which can easily lead to high chip temperatures and malfunctions. Therefore, efficient heat dissipation for the chips is essential.

[0003] For example, a server cooling device using a high-speed fan is described in patent CN223260146U. This device includes a chassis, a motor bracket, a high-speed fan, and server components. The motor bracket has at least one mounting hole, in which the high-speed fan is installed. The motor bracket divides the chassis into an air inlet area and a heat dissipation area. The server components are located in the heat dissipation area. The high-speed fan has an air inlet and an air outlet. The high-speed fan uses an internal rotor structure high-speed motor, resulting in high air pressure and velocity, which is effective for cooling server components with narrow channels. It also has lower maintenance and operating costs than traditional liquid cooling and water cooling, and provides better cooling performance. However, during the cooling process, it relies solely on the high-speed fan for heat dissipation without corresponding heat sinks or heat-conducting elements. This means that during cooling, it can only effectively dissipate heat from server components located at the fan outlet, while some chips located in leeward areas cannot be effectively cooled, reducing the device's practicality.

[0004] Based on this, the tooling for providing heat sinks for AI servers can eliminate the drawbacks of existing devices. Utility Model Content

[0005] The purpose of this invention is to provide a tooling for a heat sink for an AI server, in order to solve the problems in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: The fixture for the heat sink of the AI ​​server includes a base plate, a mounting plate fixedly connected to the top of the base plate, a baffle fixedly connected to the side wall of the base plate away from the mounting plate, a top plate fixedly connected to the top of the mounting plate and the baffle, a chip disposed on the side wall of the mounting plate, and a first heat dissipation component and a second heat dissipation component disposed on the side wall of the mounting plate for dissipating heat from the chip.

[0007] Based on the above technical solutions, this utility model also provides the following optional technical solutions: Preferably, the first heat dissipation component includes a mounting block and a heat-conducting plate. The mounting block is fixedly connected to the mounting plate by bolts. A vertical groove is provided on the right side wall of the mounting block. A protrusion on the left side wall of the heat-conducting plate fits into the vertical groove. The heat-conducting plate is fixedly connected to the side wall of the mounting plate by bolts.

[0008] Preferably, the right side wall of the heat-conducting plate has a rectangular groove for placing the chip.

[0009] Preferably, a connecting plate is symmetrically fixedly connected to the left side wall of the heat-conducting plate, a partition is fixedly connected to the left side wall of the connecting plate, a first heat-conducting element is uniformly fixedly connected to the left side wall of the heat-conducting plate, a support plate is fixedly connected to the left side wall of the heat-conducting plate, a first heat dissipation fin group is sleeved on the outer wall of the support plate, the first heat dissipation fin group is in contact with the outer wall of the bottom plate and the top plate, and the first heat dissipation fin group is composed of multiple heat dissipation fins.

[0010] Preferably, the first heat dissipation fin group has through holes at the positions corresponding to the first heat-conducting element for accommodating the first heat-conducting element.

[0011] Preferably, the second heat dissipation component includes a plurality of second heat-conducting elements and two symmetrically arranged second heat dissipation fin groups. The right side of the second heat-conducting element is attached to the left side wall of the chip, and the outer wall of the second heat-conducting element is fixedly connected to the right side wall of the mounting block. The second heat dissipation fin group has through holes for accommodating the second heat-conducting elements at positions corresponding to the second heat-conducting elements. The cross-section of the second heat dissipation fin group is T-shaped, and the second heat dissipation fin group is composed of a plurality of heat dissipation fins.

[0012] Preferably, the base plate and the mounting plate are evenly provided with grooves for holding the second heat dissipation fin group, the top plate is provided with a fitting groove adapted to the second heat dissipation fin group, and the baffle is provided with a circular through hole on the side wall corresponding to all the through holes.

[0013] Preferably, the first and second heat-conducting elements can be either solid tubes or hollow tubes.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention constructs a highly efficient dual-path heat dissipation system through the coordinated operation of a first heat dissipation component and a second heat dissipation component. During assembly, solid or hollow heat-conducting elements can be selected according to specific heat dissipation requirements. Solid heat-conducting elements directly transfer heat from the chip to the distal fins through heat conduction; while hollow heat-conducting elements can be connected to an external air pump or liquid cooling pump, forcing the cooling medium to circulate within the tube, greatly improving heat exchange efficiency. Combined with an external cooling fan, this design not only ensures stable operation of the chip under high load, but its modular design also significantly improves the adaptability, maintainability, and upper limit of heat dissipation performance of the heat dissipation fixture. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the exploded view of this utility model.

[0017] Figure 3 This is a schematic diagram of the structure of the first heat dissipation component of this utility model.

[0018] Figure 4 This is a schematic diagram of the structure of the second heat dissipation component of this utility model.

[0019] Figure reference numerals: 1. Base plate; 11. Mounting plate; 12. Top plate; 13. Baffle; 14. Chip; 2. First heat dissipation assembly; 21. Mounting block; 22. Heat-conducting plate; 23. Connecting plate; 24. Partition; 25. First heat-conducting element; 26. Support plate; 27. First heat dissipation fin group; 3. Second heat dissipation assembly; 31. Second heat-conducting element; 32. Second heat dissipation fin group. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0021] In one embodiment, such as Figures 1-4 As shown, the fixture for the heat sink of the AI ​​server includes a base plate 1, a mounting plate 11 fixedly connected to the top of the base plate 1, a baffle 13 fixedly connected to the side wall of the base plate 1 away from the mounting plate 11, a top plate 12 fixedly connected to the top of the mounting plate 11 and the baffle 13, a chip 14 disposed on the side wall of the mounting plate 11, and a first heat dissipation component 2 and a second heat dissipation component 3 for dissipating heat from the chip 14 disposed on the side wall of the mounting plate 11.

[0022] In this embodiment, the chip 14 can be quickly cooled by the cooperation of the first heat dissipation component 2 and the second heat dissipation component 3. The components in the first heat dissipation component 2 and the second heat dissipation component 3 can be selected and matched as needed, thereby improving the heat dissipation rate of the device.

[0023] In an optional embodiment, such as Figure 3 As shown, the first heat dissipation assembly 2 includes a mounting block 21 and a heat-conducting plate 22. The mounting block 21 is fixedly connected to the mounting plate 11 by bolts. A vertical groove is provided on the right side wall of the mounting block 21. The protrusion on the left side wall of the heat-conducting plate 22 fits into the vertical groove. The heat-conducting plate 22 is fixedly connected to the side wall of the mounting plate 11 by bolts. By assembling in this way, the position between the two mounting blocks 21 can just be placed to support the first heat dissipation fin group 27.

[0024] In an optional embodiment, such as Figure 3 As shown, the right side wall of the heat-conducting plate 22 has a rectangular groove for placing the chip 14, so that the chip 14 can be in close contact with the heat-conducting plate 22, thereby facilitating the rapid transfer of heat to the heat-conducting plate 22.

[0025] In an optional embodiment, such as Figure 3 As shown, a connecting plate 23 is symmetrically fixedly connected to the left side wall of the heat-conducting plate 22, and a partition plate 24 is fixedly connected to the left side wall of the connecting plate 23. First heat-conducting elements 25 are uniformly fixedly connected to the left side wall of the heat-conducting plate 22, and a support plate 26 is fixedly connected to the left side wall of the heat-conducting plate 22. A first heat-dissipating fin assembly 27 is sleeved on the outer wall of the support plate 26. The first heat-dissipating fin assembly 27 is attached to the outer walls of the bottom plate 1 and the top plate 12. The first heat-dissipating fin assembly 27 consists of multiple heat-dissipating fins, and the partition plate 24 holds the first heat-dissipating fin assembly... The first heat sink 27 and the second heat sink fin group 32 are separated, so that during installation, a single first heat sink fin group 27 or two second heat sink fin groups 32 can be selectively installed. In the split installation state, the structure remains stable and there is no risk of displacement or detachment. It also facilitates the independent inspection or replacement of individual fin groups in the future. When installing the first heat sink fin group 27, the support plate 26 and two mounting blocks 21 support the first heat sink fin group 27. When disassembling, the first heat sink fin group 27 can be removed from the support plate 26 by simply pulling it.

[0026] In an optional embodiment, such as Figure 3As shown, the first heat dissipation fin group 27 has through holes for accommodating the first heat conduction element 25 at the positions corresponding to the first heat conduction element 25. During heat dissipation, the heat dissipation plate 22 directly absorbs the heat emitted by the chip 14, and the heat dissipation plate 22 transfers the heat to the first heat conduction element 25, and then the first heat conduction element 25 transfers the heat to the first heat dissipation fin group 27. Subsequently, the heat on the first heat dissipation fin group 27 is carried away by an external cooling fan.

[0027] In an optional embodiment, such as Figure 4 As shown, the second heat dissipation assembly 3 includes multiple second heat-conducting elements 31 and two symmetrically arranged second heat dissipation fin groups 32. The right side of the second heat-conducting element 31 is attached to the left side wall of the chip 14, and the outer wall of the second heat-conducting element 31 is fixedly connected to the right side wall of the mounting block 21. The second heat dissipation fin group 32 has through holes for accommodating the second heat-conducting element 31 at the corresponding positions. The cross-section of the second heat dissipation fin group 32 is T-shaped. The second heat dissipation fin group 32 is composed of multiple heat dissipation fins. During heat dissipation, the second heat-conducting elements 31 directly absorb the heat from the chip 14 and transfer the heat to the second heat dissipation fin group 32.

[0028] In an optional embodiment, such as Figure 4 As shown, the base plate 1 and mounting plate 11 are evenly provided with grooves for holding the second heat dissipation fin assembly 32. The top plate 12 is provided with fitting grooves adapted to the second heat dissipation fin assembly 32. The baffle 13 is provided with circular through holes on the sidewalls corresponding to all the through holes. Through the through holes on the sidewalls of the baffle 13, the connection between the second heat dissipation fin assembly 32 and the base plate 1, mounting plate 11 and top plate 12 can be quickly disassembled, rather than a traditional fixed connection. When disassembly is required, it is only necessary to remove the restriction of two of the base plate 1, mounting plate 11 and top plate 12 to quickly remove it for repair or replacement.

[0029] In an optional embodiment, such as Figure 2 As shown, the first heat-conducting element 25 and the second heat-conducting element 31 can be equipped with solid tubes or hollow tubes. Solid tubes or hollow tubes can be selected as needed. Hollow tubes can be connected to external air pumps or liquid cooling pumps, so that gas or liquid can continuously circulate in the first heat-conducting element 25 or the second heat-conducting element 31, thereby improving the heat exchange speed. In conjunction with a cooling fan, the heat dissipation speed can be accelerated, thereby enabling the chip 14 to withstand higher loads.

[0030] The above embodiments disclose the tooling for a heat sink of an AI server. During the operation of the chip 14, the heat generated is directly absorbed by the heat-conducting plate 22 and the second heat-conducting element 31. The second heat-conducting element 31 transfers the heat to the second heat dissipation fin group 32, the heat-conducting plate 22 transfers the heat to the first heat-conducting element 25, and then the first heat-conducting element 25 transfers the heat to the first heat dissipation fin group 27. Thus, the first heat dissipation fin group 27 and the second heat dissipation fin group 32 absorb the heat. In conjunction with an external cooling fan, the heat on the second heat dissipation fin group 32 is carried away, accelerating air circulation. This ensures that the first heat dissipation fin group 27 and the second heat dissipation fin group 32 do not accumulate excessive heat, thereby keeping the chip 14 at a suitable operating temperature. When selecting the first heat-conducting element 25 and the second heat-conducting element 31, solid tubes or hollow tubes can be selected as needed. Hollow tubes can be connected to external air pumps or liquid cooling pumps, so that gas or liquid can continuously circulate in the first heat-conducting element 25 or the second heat-conducting element 31, thereby improving the heat exchange rate. In addition, with the help of a cooling fan, the heat dissipation rate can be accelerated, so that the chip 14 can bear a higher load. In summary, by using the first heat dissipation component 2 and the second heat dissipation component 3 together, the chip 14 can be quickly cooled. Furthermore, the accessories in the first heat dissipation component 2 and the second heat dissipation component 3 can be selected and matched as needed, thereby improving the heat dissipation rate of the device.

[0031] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fixture for a heat sink of an AI server, comprising a base plate (1), wherein a mounting plate (11) is fixedly connected to the top of the base plate (1), characterized in that, A baffle (13) is fixedly connected to the side wall of the base plate (1) away from the mounting plate (11). A top plate (12) is fixedly connected to the top of the mounting plate (11) and the baffle (13). A chip (14) is provided on the side wall of the mounting plate (11). A first heat dissipation component (2) and a second heat dissipation component (3) for dissipating heat from the chip (14) are provided on the side wall of the mounting plate (11). The first heat dissipation component (2) includes a mounting block (21) and a heat-conducting plate (22). The mounting block (21) is fixedly connected to the mounting plate (11) by bolts. A vertical groove is provided on the right side wall of the mounting block (21). The protrusion on the left side wall of the heat-conducting plate (22) is fitted into the vertical groove. The heat-conducting plate (22) is fixedly connected to the side wall of the mounting plate (11) by bolts. A connecting plate (23) is symmetrically fixedly connected to the left side wall of the heat-conducting plate (22), a partition plate (24) is fixedly connected to the left side wall of the connecting plate (23), a first heat-conducting element (25) is uniformly fixedly connected to the left side wall of the heat-conducting plate (22), a support plate (26) is fixedly connected to the left side wall of the heat-conducting plate (22), and a first heat dissipation fin group (27) is sleeved on the outer wall of the support plate (26). The first heat dissipation fin group (27) is attached to the outer wall of the bottom plate (1) and the top plate (12). The first heat dissipation fin group (27) is composed of multiple heat dissipation fins. The second heat dissipation component (3) includes multiple second heat-conducting elements (31) and two symmetrically arranged second heat dissipation fin groups (32). The right side of the second heat-conducting element (31) is attached to the left side wall of the chip (14). The outer wall of the second heat-conducting element (31) is fixedly connected to the right side wall of the mounting block (21). The second heat dissipation fin group (32) has a through hole for accommodating the second heat-conducting element (31) at the position corresponding to the second heat-conducting element (31). The cross-section of the second heat dissipation fin group (32) is T-shaped. The second heat dissipation fin group (32) is composed of multiple heat dissipation fins. The first heat-conducting element (25) and the second heat-conducting element (31) can be either solid tubes or hollow tubes.

2. The tooling for the heat sink of the AI ​​server according to claim 1, characterized in that, The right side wall of the heat-conducting plate (22) has a rectangular groove for placing the chip (14).

3. The tooling for the heat sink of the AI ​​server according to claim 1, characterized in that, The first heat dissipation fin group (27) has through holes at the positions corresponding to the first heat conduction element (25) for accommodating the first heat conduction element (25).

4. The tooling for the heat sink of the AI ​​server according to claim 1, characterized in that, The bottom plate (1) and the mounting plate (11) are evenly provided with grooves for holding the second heat dissipation fin group (32), the top plate (12) is provided with fitting grooves that are compatible with the second heat dissipation fin group (32), and the baffle (13) is provided with circular through holes on the sidewalls corresponding to all the through holes.

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