A heat sink pressing device capable of compensating for die eccentricity and realizing CPU pressure balance and a heat sink

Abstract

This utility model relates to a heatsink clamping device and a heatsink that can compensate for die eccentricity and achieve balanced CPU pressure. The four screw holes on the PCB circuit board for mounting the heatsink clamping device are fixed in position. By adjusting the lengths of the left and right arms of the spring clips in the heatsink clamping device, the cold plate applies uniform pressure to the CPU chip with die core bias. The adjusted lengths of the left and right arms of the spring clips need to satisfy torque balance in the Z-axis direction and force balance in the Y-axis direction. The stiffness is adjusted by changing the effective length of the cantilever arm of the spring clip, thereby generating different forces under the same downward displacement to balance the torque caused by die eccentricity.

Description

Technical Field

[0001] This utility model relates to the field of centrifugal fan technology, specifically to a heat sink clamping device and heat sink that can compensate for die eccentricity and achieve CPU pressure balance. Background Technology

[0002] With the rapid development of electronic technology, the computing performance of the central processing unit (CPU) is constantly improving, and its power consumption and heat generation are also increasing. In order to ensure the stable operation of the CPU, an efficient heat sink must be used to dissipate heat in a timely manner. The current mainstream heat dissipation method is to make contact between the heat sink's cold plate and the CPU heat spreader (IHS) or directly with the CPU core (DIE), so that the heat is conducted to the heat sink fins and then blown away by the fan.

[0003] The contact pressure between the heatsink plate and the CPU is a key factor affecting heat conduction efficiency. Insufficient pressure will lead to poor contact, increased contact thermal resistance, and severely affect heat dissipation performance; while excessive or uneven pressure may crush the fragile die or cause the CPU substrate to bend, resulting in permanent hardware damage.

[0004] The current technology has the following main pain points and shortcomings: 1. Uneven pressure due to DIE misalignment: Because the CPU chip (DIE) is usually not at the geometric center of the package, but rather has a certain coordinate offset, the symmetrical pressure applied by the heatsink plate through the surrounding screw holes cannot be evenly transmitted to the DIE. This results in a gradient in the pressure distribution on the DIE surface, with excessive pressure at one end and insufficient pressure at the other, forming a heat dissipation bottleneck and posing a risk of crushing.

[0005] 2. Fixed mounting point locations and strong design constraints: In compact devices such as mini-PCs, the mounting holes for the heatsink screws on the motherboard are usually fixed, and due to the limited space around the CPU surface mount area, mounting points cannot be placed directly above the die. This greatly limits the traditional approach of improving pressure distribution by optimizing mounting point locations.

[0006] 3. Existing pressure equalization solutions are complex and have drawbacks: To address the problem of uneven pressure, existing technologies employ various solutions, such as using height-adjustable screw studs, using springs with varying stiffness, or adding complex pressure equalization plate structures between the cold plate and the DIE. These solutions either increase assembly complexity and production costs or introduce additional parts and potential points of failure, reducing reliability and making them difficult to widely apply in cost-sensitive consumer products. Utility Model Content

[0007] In view of this, it is necessary to provide a heatsink clamping device and heatsink that can compensate for die eccentricity and achieve uniform pressure distribution, which is easy to assemble and can effectively adapt to die eccentricity and achieve uniform pressure distribution, thus achieving balanced CPU pressure.

[0008] A heatsink clamping device that can compensate for die eccentricity and achieve CPU pressure balance is fixedly installed on the PCB circuit board through four screw holes. The heatsink clamping device includes a cold plate and a pair of spring clips. The pair of spring clips are disposed on the upper and lower edges of the cold plate. The cold plate is in close contact with the die core of the CPU chip to conduct heat to the heat sink fins. Each of the spring pieces has a first connecting part and elastic arms located at both ends of the first connecting part. The two elastic arms have a predetermined length, and the length of the elastic arms is set according to the offset position of the DIE core, so that the cold plate applies pressure evenly to the DIE core, thereby applying uniform pressure to the CPU chip in the mini PC that has a DIE core bias.

[0009] Preferably, each of the elastic arms has a mounting hole at its end, and the mounting hole and the screw hole are fixedly connected by bolts.

[0010] Preferably, the two elastic arms include a left arm and a right arm, and the sum of the lengths of the left arm and the right arm is the same as the length of the first connecting portion; The sum of the length L_l of the left arm and the length L_r of the right arm is half the distance D between the screw holes P1 and P2. At the same time, the ratio between the length L_l of the left arm and the length L_r of the right arm is inversely proportional to the ratio between the force F_l of the left arm and the force F_r of the right arm.

[0011] Preferably, the cold plate includes a plate body and side wings disposed on the upper and lower sides of the plate body. The side wings extend from the side of the plate body and spread outward, and the side wings are integrally formed with the plate body.

[0012] Preferably, the side wing and the plate have an arc-shaped second connecting portion, such that the upper surface of the side wing is higher than the upper surface of the plate; the second connecting portion is arranged perpendicularly to the plate and the side wing, and is used to connect the plate and the side wing.

[0013] Preferably, the side wing is located at the center of the side wall edge on both the upper and lower sides of the plate, and the connection between the side wing and the edge of the plate has a concave arc groove, which is used to increase the structural strength of the side wing.

[0014] Preferably, the length and width of the side wing are the same as the length and width of the first connecting part, and the length of the side wing is fixedly connected to the first connecting part by a connector, so that the spring piece is fixedly installed on the side wing.

[0015] And, a heat sink, including the heat sink clamping device described above that can compensate for die eccentricity to achieve balanced pressure on the CPU, wherein the heat sink clamping device is uniformly attached to the CPU chip with die bias to achieve air cooling of the CPU chip.

[0016] Preferably, it also includes a radiator heat pipe and a cooling blower. The radiator heat pipe is attached above the radiator clamping device, and the cooling blower is located above the radiator heat pipe. The radiator heat pipe and the cooling blower are used to transfer the heat from the radiator clamping device and achieve air cooling.

[0017] Preferably, the air outlet of the cooling blower is provided with cooling fins, which abut against the heat pipes of the radiator to improve heat dissipation efficiency.

[0018] In the aforementioned heatsink clamping device and heatsink that compensate for die eccentricity and achieve CPU pressure equalization, the positions of the four screw holes on the PCB circuit board used to mount the heatsink clamping device remain fixed. By adjusting the lengths of the left and right arms of the spring in the heatsink clamping device, the cold plate applies uniform pressure to the CPU chip with die core bias. The adjusted lengths of the left and right arms of the spring need to satisfy torque balance in the Z-axis direction and force balance in the Y-axis direction. By changing the effective length of the cantilever arm of the spring, its stiffness is adjusted, thereby generating different forces under the same downward displacement, thus balancing the torque caused by die eccentricity. This technical solution combines the die's position coordinates on the CPU, and the constraints of the fixed screw hole center distance and the fixed side wing length of the cold plate, to calculate the effective lengths of the left and right arms of the spring, i.e., the distance from the screw hole center to the side wing edge. By adjusting the force difference between the left and right arms of the spring, the torque caused by die eccentricity is balanced. This utility model has a simple structure, is easy to implement, has low cost, and is easy to promote. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a heatsink clamping device that can compensate for die eccentricity and achieve balanced CPU pressure according to an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the cold plate structure of the heat sink clamping device that can compensate for die eccentricity and achieve balanced CPU pressure according to an embodiment of the present invention.

[0021] Figure 3This is a schematic diagram of the structure of a heatsink with a heatsink clamping device that can compensate for die eccentricity and achieve CPU pressure balance (excluding the heatsink blower and heatsink fins).

[0022] Figure 4 This is a schematic diagram of the structure of a heat sink with a heat sink clamping device that can compensate for die eccentricity and achieve balanced CPU pressure, according to an embodiment of the present invention. Detailed Implementation

[0023] The present invention will now be described in detail with reference to specific embodiments and accompanying drawings.

[0024] Please see Figure 1 and Figure 2 This paper presents a heatsink clamping device 100 that can compensate for die eccentricity and achieve CPU pressure balance. It is fixedly installed on the PCB circuit board 200 through four screw holes 201. The heatsink clamping device 100 includes a cold plate 10 and a pair of springs 20. The pair of springs 20 are disposed on the upper and lower edges of the cold plate 10. The cold plate 10 is in close contact with the die core of the CPU chip to conduct heat to the heat pipes and heat sink fins of the heat sink. Each of the spring plates 20 has a first connecting part 23 and elastic arms at both ends of the first connecting part. The two elastic arms have a predetermined length, and the length of the elastic arms is set according to the offset position of the DIE core, so that the cold plate applies pressure evenly to the DIE core, thereby applying uniform pressure to the CPU chip in the mini PC that has a DIE core bias.

[0025] Preferably, each of the elastic arms has a mounting hole at its end, and the mounting hole and the screw hole are fixedly connected by bolts.

[0026] Specifically, since the CPU chips are all the same size, the positions of the four screw holes on the PCB board remain fixed. Therefore, the overall size of the heat sink clamping device remains unchanged, so as to facilitate its fixed installation on the PCB board.

[0027] Preferably, the two elastic arms include a left arm 21 and a right arm 22, and the sum of the lengths of the left arm 21 and the right arm 22 is the same as the length of the first connecting portion 23; The sum of the length L_l of the left arm 21 and the length L_r of the right arm 22 is half the distance D between the screw holes P1 and P2. At the same time, the ratio between the length L_l of the left arm 21 and the length L_r of the right arm 22 is inversely proportional to the ratio between the force F_l of the left arm 21 and the force F_r of the right arm 22.

[0028] Specifically, in this embodiment, the two spring pieces are the first spring piece and the second spring piece, and there are a total of four elastic arms. The four elastic arms are the first left arm, the first right arm, the second left arm, and the second right arm, respectively. The four elastic arms correspond to the four screw holes on the PCB circuit board. The coordinate points of the four screw holes are P1, P2, P3, and P4, respectively. P1 and P2 are located above the cold plate, and P3 and P4 are located below the cold plate. The distance between P1 and P2 is D, and the distance between P3 and P4 is equal to the distance between P1 and P2. The forces exerted by the four elastic arms on the corresponding coordinate points are F1, F2, F3, and F4, respectively.

[0029] In the Z direction, the resultant force on the left is F-left = F1 + F3, which acts at D / 2 to the left of the origin; the torque generated by the resultant force on the left is M_left = F_left × D / 2, which is counterclockwise and takes a positive value.

[0030] The resultant force on the right side, F-right = F2 + F4, acts at point D / 2 to the right of the origin. The torque generated by the resultant force on the right side is M_right = F_right × D / 2, and the direction is clockwise, taking a negative value.

[0031] The reaction force R of the CPU chip's DIE core on the cold plate is concentrated at the center of the DIE, G(x, 0) mm. The torque generated by the reaction force R is M_r = R × G, and its direction is clockwise, taking a negative value. Because the reaction force is to the right, it produces a clockwise torque about the origin.

[0032] According to the principle of torque balance, the resultant torque of the system about the Z-axis is zero: M_left - M_right - M_r = 0, thus obtaining equation (1): F_left × D / 2 - F_right × D / 2 - R × G = 0 (1); According to the principle of force balance, the net force in the Y direction is zero, thus yielding equation (2): R = F_left + F_right (2); The ratio of the resultant force on the left to the resultant force on the right can be calculated using equations (1) and (2): F_left / F_right. Since the first and second springs are symmetrically arranged, and the left and right arms of the springs have identical properties, the ratio of the force F_l on the left arm to the force F_r on the right arm is equal to the ratio of the resultant force F_left on the left to the resultant force F_right on the right, resulting in equation (3): F_l / F_r = F_left / F_right(3).

[0033] According to the principles of mechanics, the force exerted by the spring can be simplified to a cantilever model, and the formula for calculating its end stiffness k is shown in equation (4): k = F / δ = (3EI) / L³ (4); Where E is the elastic modulus of the material; I is the moment of inertia of the section; L is the effective length of the spring piece, the distance from the center of the screw to the contact point of the cantilever edge of the cold plate; and δ is the preload displacement.

[0034] Therefore, the stiffness k is inversely proportional to the cube of the effective length L of the spring: k ∝ 1 / L³.

[0035] The force F in the Z-axis direction is k * δ. When the preload displacement δ is set to be constant, the force F is proportional to the stiffness k, as shown in equation (5). F ∝ k ∝ 1 / L³(5).

[0036] Combining equations (3) and (5), we can obtain: F_l / F_r = (k_l) / (k_r) = (1 / L_l³) / (1 / L_r³) = (L_r / L_l)³ (6); L_r / L_l = ∛ (F_l / F_r) = ∛ (F_left / F_right) (7); Specifically, in this embodiment, it is assumed that the sum of the length L_l of the left arm and the length L_r of the right arm is half the distance D between the screw holes P1 and P2, as shown in equation (8): L_l + L_r = D / 2 (8); Based on equations (7) and (8), the specific length values ​​of the left arm L_l and the right arm L_r can be obtained through calculation.

[0037] Preferably, the cold plate 10 includes a plate body 11 and side wings 12 disposed on the upper and lower sides of the plate body. The side wings 12 extend from the side of the plate body 11 and spread outward. The side wings 12 are integrally formed with the plate body 11.

[0038] Preferably, the side wing 12 and the plate 11 have an arc-shaped second connecting portion, such that the upper surface of the side wing 12 is higher than the upper surface of the plate 11; the second connecting portion is arranged perpendicularly to the plate 11 and the side wing 12, and is used to connect the plate 11 and the side wing 12.

[0039] Specifically, the second connecting part is integrally formed with the plate 11 and the side wing 12, so that the side wing 12 is in the shape of outstretched wings.

[0040] Preferably, the side wing 12 is located at the center of the side wall edge on the upper and lower sides of the plate 11, and the connection between the side wing 12 and the edge of the plate 11 has a concave arc groove, which is used to increase the structural strength of the side wing 12.

[0041] Specifically, the arc-shaped connecting groove at the connection between the side wing 12 and the plate 11 can prevent cracks or breaks at the connection between the side wing 12 and the plate 11.

[0042] Preferably, the length and width of the side wing 12 are the same as the length and width of the first connecting part 23, and the length of the side wing 12 is fixedly connected to the first connecting part 23 by a connector, so that the spring piece 20 is fixedly installed on the side wing 12.

[0043] Specifically, the side wing 12 is the same size as the first connecting part 23. The side wing 12 and the first connecting part 23 are provided with a plurality of mounting holes at corresponding positions. The plurality of connecting parts are respectively inserted into the connecting holes. The spring piece 20 is fixedly installed on the side wing 12 of the cold plate 10, thereby realizing the fixed connection between the spring piece 20 and the cold plate 10.

[0044] Specifically, in this embodiment, the derivation process of the lengths of the left arm 21 and right arm 22 of the spring piece 20 is as follows: I. Problem Modeling and Torque Balance Analysis 1. Given conditions: CPU substrate size: 50 mm × 25 mm.

[0045] Coordinate system: with the center of the CPU substrate as the origin O(0, 0).

[0046] DIE dimensions and position: 23 mm × 11.5 mm. Its four corner coordinates are as follows: A(-10, 6) B(13, 6) C(-10, -5.5) D(13, -5.5) DIE center coordinates G: X_g = (B_x + A_x) / 2 = (13 + (-10)) / 2 = 1.5 mm Z_g = (A_z + C_z) / 2 = (6 + (-5.5)) / 2 = 0.25 mm Therefore, the center coordinates of DIE are G(1.5, 0.25) mm. Its X-direction offset is the main influencing factor.

[0047] Mounting hole coordinates: Top left: P1(-28, 17) Top right: P2(28, 17) Bottom left: P3(-28, -17) Bottom right: P4(28, -17) Assumption: Coldplate is an absolutely rigid body.

[0048] 2. Establishment of the mechanical model: Consider the coldplate, springs, and screws as a rigid system. The clamping force of the four springs on the CPU can be simplified to concentrated forces F1, F2, F3, and F4 acting at the coordinates of the four mounting holes P1, P2, P3, and P4. Since the structure is symmetrical in the Z direction, it can be simplified as follows: The resultant force on the left, F_left = F1 + F3, acts at X = -28 mm.

[0049] The resultant force on the right, F_right = F2 + F4, acts at X = 28 mm.

[0050] The reaction force R of the CPU DIE on the Coldplate is concentrated at the center of the DIE at G(1.5, 0) mm (to simplify the calculation, the small Z-direction offset of 0.25 mm is ignored).

[0051] 3. Derivation of the torque balance equation: To ensure the coldplate does not rotate and the pressure is uniform, the system must satisfy torque balance. The origin O(0,0) is taken as the moment center.

[0052] The torque generated by the force F_left on the left: M_left = F_left × 28 mm (counterclockwise, positive) The torque generated by the force F_right on the right: M_right = F_right × 28 mm (clockwise, negative) The torque generated by the reaction force R: M_r = R × 1.5 mm (clockwise, negative. Because the reaction force is to the right, it produces a clockwise torque about the origin) According to the principle of torque balance, the net torque of the system about the Z-axis is zero: M_left - M_right - M_r = 0 Right now: F_left × 28 - F_right × 28 - R × 1.5 = 0 (Equation 1) According to the principle of force balance, in the Y direction: R = F_left + F_right (Equation 2) 4. Solve for the force ratio F_left / F_right: Substitute equation two into equation one: 28F_left - 28F_right - 1.5(F_left + F_right) = 0 28F_left - 28F_right - 1.5F_left - 1.5F_right = 0 (28 - 1.5)F_left + (-28 - 1.5)F_right = 0 26.5F_left - 29.5F_right = 0 therefore: 26.5F_left = 29.5F_right The final force ratio is: F_left / F_right = 29.5 / 26.5 ≈ 1.1132 Conclusion 1: To balance the eccentricity of the DIE, the total pressure provided by the left spring needs to be approximately 1.113 times that of the right spring. Assuming the left and right springs have the same performance, the ratio of the force F_l of each left spring to the force F_r of each right spring should also be F_l / F_r ≈ 1.113.

[0053] Design calculation of fragment length based on force ratio 1. Mechanical principles: The spring can be simplified as a cantilever beam model. Its end stiffness k is calculated using the following formula: k = F / δ = (3EI) / L³ in: E: Material elastic modulus (a constant) I: Moment of inertia of the cross section (For a rectangular cross section, I = w*t³ / 12. In the design of the spring sheet, the width w = 5mm and the thickness t = 0.5mm, so I is a constant). L: Effective length of the spring clip (distance from the center of the screw to the contact point at the edge of the coldplate cantilever wing) δ: Preload displacement (downward pressure) Therefore, the stiffness k is inversely proportional to the cube of the effective length L: k ∝1 / L³ Force F = k * δ. When the preload displacement δ is set to a uniform value (e.g., all 1.65 mm), force F is proportional to stiffness k, therefore: F ∝k ∝1 / L³ 2. Derivation of length ratio: According to conclusion one, F_l / F_r = 1.113 is required.

[0054] F_l / F_r = (k_l) / (k_r) = (1 / L_l³) / (1 / L_r³) = (L_r / L_l)³ =1.113 Therefore, the required effective length ratio is: L_r / L_l = ∛1.113 ≈ 1.0353 (Equation 3) 3. Exact solution satisfying space constraints: Total lateral distance between mounting holes: | -28mm | + | 28mm | = 56 mm.

[0055] This space consists of three parts: the effective length of the left spring L_l + the length of the Coldplate cantilever wing W + the effective length of the right spring L_r.

[0056] Given that the length of the cantilever wing is W = 28 mm.

[0057] Therefore, we have the following spatial constraint equations: L_l + W + L_r = 56 L_l + 28 + L_r = 56 L_l + L_r = 28 mm (Equation 4) We now have: Equation 3: L_r = 1.0353 * L_l Equation 4: L_l + L_r = 28 Substitute equation three into equation four: L_l + 1.0353L_l = 28 2.0353L_l = 28 L_l = 28 / 2.0353 ≈ 13.76 mm but: L_r = 1.0353 * 13.76 ≈ 14.24 mm 4. Engineering rounding and verification: 13.76mm and 14.24mm are inconvenient for manufacturing and drawing annotation. Engineering rounding is required. Therefore, L_l = 13.8mm and L_r = 14.2mm are selected.

[0058] Verify the rounded force ratio: L_r / L_l = 14.2 / 13.8 ≈ 1.0290 (L_r / L_l)³ = (1.0290)³ ≈ 1.0897 ≈ 1.09 Conclusion 2: Theoretical precision values: L_l=13.76mm, L_r=14.24mm, generating force ratio 1.113.

[0059] Recommended engineering values: L_l=13.8mm, L_r=14.2mm, generating force ratio 1.09.

[0060] The deviation between the two is approximately 2% (1.113 - 1.09) / 1.113, which is within the tolerance range of engineering design and material properties, and is far superior to the initial symmetrical design (force ratio = 1.0). This scheme can effectively improve more than 90% of the pressure unevenness problem and is the optimal solution to achieve uniform stress distribution in the DIE.

[0061] This derivation process rigorously proves that the asymmetric design of this utility model is the most direct, effective, and easily industrialized technical solution to the technical problem of "uneven pressure caused by DIE eccentricity at a fixed installation point".

[0062] And, please see Figure 3 and Figure 4 The image shows a heat sink 1000, which includes a heat sink clamping device 100 as described above that can compensate for die eccentricity and achieve balanced pressure on the CPU. The heat sink clamping device 100 is uniformly attached to the CPU chip with die bias to achieve air cooling of the CPU chip.

[0063] Preferably, the device further includes a radiator heat pipe 300 and a cooling blower 400. The radiator heat pipe 300 is attached to the top of the radiator pressing device 100, and the cooling blower 400 is located above the radiator heat pipe 300. The radiator heat pipe 300 and the cooling blower 400 are used to transfer the heat from the radiator pressing device 100 and achieve air cooling.

[0064] Preferably, the air outlet of the cooling blower 400 is provided with cooling fins 500, which abut against the heat pipe 300 of the radiator to improve heat dissipation efficiency.

[0065] In the aforementioned heatsink clamping device 100 and heatsink 1000, which compensate for die eccentricity and achieve CPU pressure equalization, the positions of the four screw holes on the PCB circuit board used to mount the heatsink clamping device remain fixed. By adjusting the lengths of the left and right arms of the spring in the heatsink clamping device, the cold plate applies uniform pressure to the CPU chip with die core bias. The adjusted lengths of the left and right arms of the spring need to satisfy torque balance in the Z-axis direction and force balance in the Y-axis direction. By changing the effective length of the cantilever arm of the spring, its stiffness is adjusted, thereby generating different forces under the same downward displacement, thus balancing the torque caused by die eccentricity. This technical solution combines the die's position coordinates on the CPU, and the constraints that the screw hole center distance is immutable and the side wing length of the cold plate is immutable, to calculate the effective lengths of the left and right arms of the spring, i.e., the distance from the screw hole center to the side wing edge. By adjusting the force difference between the left and right arms of the spring, the torque caused by die eccentricity is balanced. This utility model has a simple structure, is easy to implement, has low cost, and is easy to promote.

[0066] It should be noted that this utility model is not limited to the above-described embodiments. Based on the inventive spirit of this utility model, those skilled in the art can make other changes, and these changes made based on the inventive spirit of this utility model should be included within the scope of protection claimed by this utility model.

Claims

1. A heat sink pressing device capable of compensating for die eccentricity and achieving CPU pressure balance, which is installed on a PCB circuit board, wherein the PCB circuit board is provided with four screw holes for fixing the heat sink pressing device, characterized in that, The heat sink clamping device includes a cold plate and a pair of spring clips. The pair of spring clips are disposed on the upper and lower edges of the cold plate. The cold plate is in close contact with the DIE core of the CPU chip to conduct heat to the heat sink fins. Each of the spring plates has a first connecting part and elastic arms located at both ends of the first connecting part. The two elastic arms have a predetermined length, and the length of the elastic arms is set according to the offset position of the DIE core, so that the cold plate applies pressure evenly to the DIE core, thereby applying uniform pressure to the CPU chip in the mini PC that has a DIE core offset.

2. The heat spreader hold-down apparatus that compensates for die eccentricity to achieve CPU pressure-equalized cooling according to claim 1, wherein Each of the elastic arms has a mounting hole at its end, and the mounting hole and the screw hole are fixedly connected by bolts.

3. The heat spreader hold-down apparatus that compensates for die eccentricity to achieve CPU pressure-equalized cooling according to claim 1, wherein The two elastic arms include a left arm and a right arm, and the sum of the lengths of the left arm and the right arm is the same as the length of the first connecting portion; The sum of the length L_l of the left arm and the length L_r of the right arm is half the distance D between the screw holes P1 and P2. At the same time, the ratio between the length L_l of the left arm and the length L_r of the right arm is inversely proportional to the ratio between the force F_l of the left arm and the force F_r of the right arm.

4. The heat spreader hold-down apparatus that compensates for die eccentricity to achieve CPU pressure equalization, as recited in claim 1, wherein, The cold plate includes a plate body and side wings disposed on the upper and lower sides of the plate body. The side wings extend from the side of the plate body and spread outward, and the side wings are integrally formed with the plate body.

5. The heat spreader hold-down apparatus that compensates for die eccentricity to achieve CPU pressure equalization, as recited in claim 4, wherein, The side wing and the plate have an arc-shaped second connecting portion, so that the upper surface of the side wing is higher than the upper surface of the plate; the second connecting portion is arranged perpendicularly to the plate and the side wing, and is used to connect the plate and the side wing.

6. The heat spreader hold-down apparatus that compensates for die eccentricity to achieve CPU pressure equalization, as recited in claim 4, wherein, The side wing is located at the center of the side wall edge on both the upper and lower sides of the plate. The connection between the side wing and the edge of the plate has a concave arc-shaped groove, which is used to increase the structural strength of the side wing.

7. The heat spreader hold-down apparatus that compensates for die eccentricity to achieve CPU pressure equalization, as recited in claim 5, wherein, The length and width of the side wing are the same as the length and width of the first connecting part. The length of the side wing is fixedly connected to the first connecting part by a connector, so that the spring piece is fixedly installed on the side wing.

8. A heat sink, characterized by The invention includes a heatsink clamping device as described in any one of claims 1-7, which can compensate for die eccentricity and achieve balanced pressure on the CPU. The heatsink clamping device is uniformly attached to the CPU chip with die eccentricity to achieve air cooling of the CPU chip.

9. The heat spreader of claim 8, wherein, It also includes a radiator heat pipe and a cooling blower. The radiator heat pipe is attached to the top of the radiator clamping device, and the cooling blower is located above the radiator heat pipe. The radiator heat pipe and the cooling blower are used to transfer the heat of the radiator clamping device and achieve air cooling.

10. The heat spreader of claim 9, wherein, The air outlet of the cooling blower is equipped with cooling fins, which abut against the heat pipes of the radiator to improve heat dissipation efficiency.

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