A wire bonding teaching model

Abstract

This utility model discloses a wire bonding teaching model, comprising a substrate, a bare die mounted on the upper center of the substrate, a plurality of first contacts evenly spaced on the upper end of the bare die, and a plurality of wire frames evenly embedded in the upper end of the substrate, the wire frames equidistantly surrounding the bare die, each wire frame corresponding to one of the first contacts. A second contact is connected to one end of each wire frame facing the bare die, and the second contact is embedded in the substrate. A connector is soldered to the upper end of the second contact, and a bonding wire is inserted into the connector, with the other end of the bonding wire contacting the bottom of the first contact. Through the cooperation of the bare die, the wire frames embedded in the upper end of the substrate, and the bonding wire, a model for wire bonding teaching is provided, reducing the cost of wire bonding teaching and allowing for repeated practice.

Description

Technical Field

[0001] This utility model relates to the field of teaching and training technology of microelectronic packaging and assembly, and in particular to a wire bonding teaching model. Background Technology

[0002] Wire bonding uses metal leads (such as gold, aluminum, or copper wires) as a bridge to achieve metal-to-metal connection between chip pads and substrate pads through thermo-pressing, ultrasonic waves, or thermo-ultrasonic energy, thus transmitting electrical signals. In university teaching and corporate training, to enable trainees to intuitively understand and master the principles and operational skills of wire bonding, it is usually necessary to use teaching models for demonstration and repeated practice.

[0003] However, existing wire bonding teaching equipment is mostly expensive actual bonding machines or operates on discarded chips. The former is costly and difficult to popularize; the latter lacks a structure specifically designed for teaching, cannot be reused, and has unsatisfactory teaching effect.

[0004] Searching revealed that some existing teaching models (such as the utility model with publication number CN210505559U, entitled "A Utility Model of a MEMS Flexible Wire Bonding Device") are suitable for the research and development of wire bonding structures, but they have problems such as non-replaceable bonding wires and unintuitive operation, and cannot meet the teaching needs of low cost and high repeatability. Utility Model Content

[0005] The purpose of this invention is to provide a wire bonding teaching model that can reduce teaching costs, be reused, and facilitate intuitive understanding by students.

[0006] To achieve the above objectives, a wire bonding teaching model is provided, comprising a substrate. A bare die is mounted on the upper center of the substrate. Multiple first contacts are equidistantly arranged on the upper end of the bare die. A plurality of wire frames are equidistantly embedded on the upper end of the substrate, and the wire frames equidistantly surround the bare die. Each wire frame corresponds to one of the first contacts. A second contact is connected to one end of each wire frame facing the bare die, and the second contact is embedded in the substrate. A connector is soldered to the upper end of the second contact, and a flexible bonding wire is inserted into the connector, with the other end of the bonding wire contacting the bottom of the first contact. This model reduces teaching costs, is reusable, and facilitates intuitive understanding for students.

[0007] According to the aforementioned wire bonding teaching model, a storage rack is fixedly connected to the upper end of the substrate, and the upper surface of the storage rack has several slots at equal intervals to accommodate bonding wires. When the model is not in use or the wire rack needs to be replaced, the wire rack can be removed from the substrate and stored in the slots in an orderly manner to avoid loss.

[0008] According to the aforementioned wire bonding teaching model, one end of the bonding wire has a rectangular contact pin (1), which is inserted into the connector. The end of the bonding wire away from the second contact point has a contact pin (2) that abuts against the first contact point. Contact pins one and two are used for connecting the bonding wire to the first and second contacts.

[0009] According to the aforementioned wire bonding teaching model, the lead frame is made of copper-plated aluminum. This reduces the cost of the lead frame while making it more realistic.

[0010] According to the aforementioned wire bonding teaching model, the substrate is provided with numbered markings for identifying the bonding sequence. This facilitates the installation of bonding wires by trainees and helps them with practice.

[0011] According to the aforementioned wire bonding teaching model, the contact pin one of the bonding wire is interference-fitted with the connector. This prevents the contact pin one from being easily pulled out after being inserted into the connector, thus aiding in the shaping of the bonding wire.

[0012] The above-mentioned solution has the following beneficial effects: 1. This utility model enlarges and simplifies the actual wire bonding process structure, allowing students to clearly see the spatial position and electrical connection relationship between the chip, pins, and bonding wires, greatly improving the intuitiveness of teaching. Through the design of plug-in components and replaceable bonding wires, students can easily remove the bonding wires after completing one "bonding" and repeat the practice multiple times.

[0013] 2. The bonding wire needs to be bent into a specific shape (such as an arc) to connect the first and second contacts. This process simulates the wire feeding, arc initiation, and welding steps of a real bonding machine, which effectively trains the students' operating skills.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments; Figure 1 This is an overall structural diagram of a wire bonding teaching model according to the present invention; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 for Figure 1 Enlarged view of point B in the middle; Figure 4 This is a structural diagram showing the connection between the bonding wire and the storage rack in a wire bonding teaching model according to this utility model. Figure 5 This is a structural diagram of the bonding wire in a wire bonding teaching model according to this utility model.

[0016] Legend: 1. Substrate; 2. Bare chip; 3. First contact; 4. Lead frame; 5. Second contact; 6. Connector; 7. Bonding wire; 8. Storage rack; 9. Slot; 10. Contact pin one; 11. Contact pin two. Detailed Implementation

[0017] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0018] Reference Figure 1 - Figure 3 This utility model provides a wire bonding teaching model, which includes a substrate 1. The substrate 1 is preferably made of transparent acrylic sheet so that students can observe the internal structure from the bottom. The substrate 1 is marked with numbers to indicate the bonding sequence, making it easy for students to install the bonding wires 7 and facilitating practice. A bare chip 2 is mounted in the upper center of the substrate 1. Multiple first contacts 3 are equidistantly arranged on the upper end of the bare chip 2 to simulate the pads on the chip. Several lead frames 4 are equidistantly embedded in the upper end of the substrate 1 and are equidistantly arranged around the bare chip 2. The lead frames 4 are made of copper-plated aluminum metal, which reduces the cost of the lead frames 4 while making them more realistic. The lead frame 4 corresponds one-to-one with the first contact 3. The end of the lead frame 4 facing the bare chip 2 is connected to the second contact 5, and the second contact 5 is embedded in the substrate 1 to simulate the solder joint of the external lead frame. The upper end of the second contact 5 is welded with a plug 6, which is a flexible metal sleeve. A flexible bonding wire 7 is inserted into the plug 6, and the bottom of the other end of the bonding wire 7 is in contact with the first contact 3.

[0019] like Figure 1 and Figure 4 As shown, a storage rack 8 is fixedly connected to the upper end of the substrate 1. The upper surface of the storage rack 8 has several slots 9 at equal intervals to accommodate bonding wires 7. When the model is idle or the lead frame 4 needs to be replaced, the lead frame 4 can be removed from the substrate 1 and stored in the slots 9 in an orderly manner to avoid loss.

[0020] like Figure 5As shown, one end of the bonding wire 7 has a rectangular contact pin 10, which is inserted into the connector 6. The contact pin 10 of the bonding wire 7 and the connector 6 are press-fitted, so that the contact pin 10 cannot be easily pulled out after being inserted into the connector 6, which helps to shape the bonding wire 7. The bonding wire 7 itself is made of a metal wire (such as copper wire) with good plasticity. The end of the bonding wire 7 away from the second contact 5 has a contact pin 21 that abuts against the first contact 3. The contact pin 10 and the contact pin 211 are used to connect the bonding wire 7 to the first contact 3 and the second contact 5. When the trainee operates, he uses special training tweezers or clamps to bend the other end of the bonding wire 7 into the required arc shape so that the second contact pin 11 at the bottom makes stable contact with the first contact 3 on the bare chip 2, thereby completing the simulated connection of a "bonding" lead.

[0021] One end of the bonding wire 7 is provided with a first contact pin 10. Those skilled in the art should connect all electrical components and their compatible power supplies in this case via wires, and should select appropriate controllers according to actual conditions to meet control requirements. The specific connection and control sequence should refer to the working principle described below, where the electrical connections between the various electrical components are completed in sequence. The detailed connection methods are well-known technologies in the field. The following mainly introduces the working principle and process, and will not describe the electrical control further.

[0022] Working principle: During the teaching process, the student first takes a bonding wire 7 from the storage rack 8 and inserts its first contact pin 10 into the corresponding connector 6 of the lead frame 4. Then, the student imitates the operation of a real bonding machine, using a tool to precisely guide the other end of the bonding wire 7 to the corresponding first contact point 3 on the bare chip 2. Through slight pressing or a specific technique, the student makes a stable contact between the second contact pin 11 and the first contact point 3, while maintaining a smooth arc shape for the bonding wire 7. After completing the connection of one wire, the student can check the connection quality and the shape of the arc. After the practice is over, the bonding wire 7 can be easily pulled out of the connector 6 and replaced with a new bonding wire 7 for the next practice.

[0023] In the description of this utility model, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "front," "center," and "both ends," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. At the same time, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "fixed installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction relationship between two elements. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A wire bonding instructional model, comprising: The substrate (1) is characterized in that a bare chip (2) is mounted on the upper middle part of the substrate (1), a plurality of first contacts (3) are provided at equal intervals on the upper end of the bare chip (2), a plurality of lead frames (4) are embedded at equal intervals on the upper end of the substrate (1), and the lead frames (4) are equidistantly surrounding the bare chip (2), the lead frames (4) correspond one-to-one with the first contacts (3), a second contact (5) is connected to one end of the lead frame (4) facing the bare chip (2), and the second contact (5) is embedded in the substrate (1), a connector (6) is soldered to the upper end of the second contact (5), a flexible bonding wire (7) is inserted into the connector (6), and the bottom of the other end of the bonding wire (7) is in contact with the first contact (3).

2. The wire bonding teaching model according to claim 1, characterized in that, The upper end of the substrate (1) is fixedly connected to a storage rack (8), and the upper surface of the storage rack (8) is provided with a plurality of slots (9) for accommodating bonding wires (7) at equal intervals.

3. The wire bonding teaching model according to claim 1, characterized in that, One end of the bonding wire (7) is provided with a contact foot one (10) with a rectangular cross section, and the contact foot one (10) is inserted into the connector (6). The end of the bonding wire (7) away from the second contact (5) is provided with a contact foot two (11) that abuts against the first contact (3).

4. The wire bonding teaching model according to claim 1, characterized in that, The lead frame (4) is made of aluminum metal with copper plating on its surface.

5. A wire bonding teaching model according to claim 1, characterized in that, The substrate (1) is provided with numbering marks for identifying the bonding sequence.

6. A wire bonding teaching model according to claim 3, characterized in that, The contact pin 10 of the bonding wire (7) is interference-fitted with the connector (6).

Images