A high-temperature testing device for memory chips

Abstract

This utility model relates to the field of chip testing technology, and more particularly to a high-temperature testing device for memory chips. This utility model provides a high-temperature testing device for memory chips, including a test incubator and a sealed door, with the sealed door rotatably connected to the left side of the test incubator. A clamping mechanism that drives the limiting plate via a lead screw and guide rod converts the rotation of the connecting rod into a precise and controllable linear clamping force, avoiding uneven force and batch variations caused by traditional manual tightening. Even under high temperature and vibration conditions, it can effectively compensate for displacement caused by material thermal expansion and mismatch, ensuring that the carrier board and the test socket always maintain low impedance and highly reliable electrical contact. By employing a sliding plate, mounting holes, mounting plate, and T-slot color scheme, a highly modular and flexible adaptability of the carrier is achieved, allowing for quick switching of test configurations for different package types without the need for a complete replacement.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a high-temperature testing device for memory chips. Background Technology

[0002] The high-temperature testing device for memory chips is a specialized equipment used to perform functional verification, aging tests, or reliability assessments on memory integrated circuits in high-temperature environments.

[0003] Existing high-temperature testing devices for memory chips typically involve first mounting the memory chip onto a carrier board, and then placing the carrier board inside a test chamber for high-temperature testing. However, after the carrier board is installed, existing structures generally lack a reliable and controllable clamping mechanism, making it difficult to ensure that the carrier board and the test interface maintain stable, low-impedance electrical contact under high-temperature and vibration environments. Poor contact can easily occur due to thermal expansion or mechanical loosening, which in turn affects the accuracy and repeatability of the test results.

[0004] To address the aforementioned issues, a high-temperature testing device for memory chips with a modular design is needed. Utility Model Content

[0005] To overcome the shortcomings of lacking a clamping structure, this utility model provides a high-temperature testing device for memory chips.

[0006] The technical implementation scheme of this utility model is as follows: a high-temperature testing device for memory chips, including a test constant temperature chamber, a sealed door, sliding plates, mounting plates, connecting plates, lead screws, guide rods, and limiting plates. The sealed door is rotatably connected to the left side of the test constant temperature chamber. Multiple sliding plates are slidably connected inside the test constant temperature chamber. Each sliding plate has multiple mounting holes symmetrically opened front and back. Multiple mounting plates are provided on each sliding plate. A T-shaped groove is opened on the top of each mounting plate. Multiple connecting plates are connected inside the test constant temperature chamber. A lead screw is rotatably connected between every two adjacent connecting plates on the left side. A guide rod is provided between every two adjacent connecting plates on the right side. A limiting plate is threadedly connected to each lead screw. Each limiting plate is slidably engaged with the corresponding guide rod.

[0007] In a preferred embodiment of the present invention, a slider and a fixing plate are also included. Multiple sliders are slidably connected inside the test constant temperature chamber, and a fixing plate is fixed between each pair of adjacent left and right sliders.

[0008] In a preferred embodiment of this utility model, a connecting rod is also included, with a connecting rod connected to each lead screw.

[0009] In a preferred embodiment of this utility model, each mounting hole is elongated.

[0010] In a preferred embodiment of this utility model, each mounting plate has multiple fixing holes.

[0011] In a preferred embodiment of this utility model, each sliding plate is provided with grooves that are symmetrically arranged on the left and right sides to match the fixed plate.

[0012] The beneficial effects of this utility model are as follows: By adopting a combined structure of sliding plate + detachable mounting plate + T-slot + elongated mounting hole, a high degree of modularity and flexible adaptability of the carrier system is achieved. Different test configurations for different packaging types can be quickly switched without replacing the entire system, significantly shortening debugging time and reducing maintenance costs. The elongated mounting hole supports horizontal fine adjustment to ensure precise alignment between the carrier plate and the electrical interface. The clamping mechanism of the limiting plate is driven by a screw-guide rod linkage, which converts the rotation operation into a precise and controllable linear clamping force, avoiding the problem of uneven force caused by manual tightening. Even under high temperature and vibration conditions, it can effectively offset the micro-displacement caused by the thermal expansion of materials, ensuring that the carrier plate and the test socket always maintain reliable electrical contact. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a cross-sectional view of the constant temperature test chamber of this utility model.

[0015] Figure 3 This is an exploded view of the sliding plate and the fixing plate of this utility model.

[0016] Figure 4 This is an exploded view of the sliding plate and mounting plate of this utility model.

[0017] Figure 5 The drawings show the connecting plate, lead screw, and guide rod of this utility model.

[0018] The components in the attached diagram are labeled as follows: 1. Test constant temperature chamber, 2. Sealing door, 3. Sliding plate, 4. Mounting hole, 5. Mounting plate, 6. T-slot, 7. Connecting plate, 8. Lead screw, 9. Guide rod, 10. Limiting plate, 11. Slider, 12. Fixing plate, 13. Connecting rod. Detailed Implementation

[0019] The present invention will be further described below with reference to specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0020] Example: A high-temperature testing device for memory chips, such as... Figures 1-5As shown, the system includes a test chamber 1, a sealing door 2, sliding plates 3, a mounting plate 5, a connecting plate 7, a lead screw 8, a guide rod 9, a limiting plate 10, a slider 11, a fixing plate 12, and a connecting rod 13. The test chamber 1 serves as the main structure and working environment cavity of the entire system, providing and maintaining a set high-temperature testing environment. It possesses excellent heat insulation, temperature uniformity, and sealing properties to ensure the testing process is conducted under stable thermal conditions. An opening is located on its front side, and a sealing door 2 is rotatably connected to the left side of the test chamber 1 to close the opening. Multiple sliding plates 3 are slidably connected inside the test chamber 1. These sliding plates 3 can slide out from the opening on the front side of the test chamber 1. Each sliding plate 3 has symmetrically arranged grooves on its left and right sides that fit the fixing plate 12. Each sliding plate 3 also has multiple symmetrically arranged mounting holes 4, each of which is elongated and used to install the mounting plate 5. The elongated mounting holes 4 allow the mounting plate 5 to be finely adjusted horizontally to accommodate different sizes or layouts of carrier plates, improving ventilation. For practical use, each sliding plate 3 is equipped with multiple mounting plates 5, each mounting plate 5 has multiple fixing holes, and each mounting plate 5 has a T-shaped groove 6 on its top. The test constant temperature chamber 1 is internally connected to multiple connecting plates 7. A lead screw 8 is rotatably connected between every two adjacent connecting plates 7 on the left side, used to precisely control the lifting stroke of the limit plate 10 and achieve pressure adjustment. A guide rod 9 is provided between every two adjacent connecting plates 7 on the right side, and each lead screw 8 is threadedly connected to a limit plate 10. The limiting plates 10 are all slidably engaged with the corresponding guide rods 9. When pressed down, they abut against the top of the test plate, achieving reliable clamping and limiting of the plate, preventing loosening of contact caused by high temperature or vibration. Multiple sliders 11 are slidably connected inside the test constant temperature chamber 1. A fixing plate 12 is fixed between each pair of adjacent sliders 11 on the left and right. When the sliding plate 3 is pushed into place, the fixing plate 12 is embedded in the groove to form a mechanical stop, providing lateral limiting and high repeatability positioning accuracy. Each lead screw 8 is connected to a connecting rod 13.

[0021] When this device is in operation, first open the sealed door 2 on the left side of the test chamber 1. Then, move the internal slider 11 and the fixing plate 12 upwards as a whole, so that the fixing plate 12 disengages from the limiting groove on the sliding plate 3, releasing the constraint on the sliding plate 3. At this time, the sliding plate 3 can be pulled forward to the operating position. Install multiple mounting plates 5 of suitable size on the sliding plate 3, and use the set elongated mounting holes 4 to make horizontal fine adjustments to the installation position to meet the needs of different carrier layouts. After the adjustment is completed, insert the carrier plate loaded with the chip to be stored into the T-shaped groove 6 on the top of each mounting plate 5 to complete the installation of the carrier plate. Then, push the sliding plate 3 back to the original working position inside the test chamber 1. During this process, the fixing plate 12 re-embeds into the corresponding groove on the sliding plate 3 under the action of gravity, realizing the lateral limitation and positioning of the sliding plate 3, ensuring Its structural stability during high-temperature testing was then assessed. The sealing door 2 was then closed, and the test chamber 1 was started. The heating components inside the test chamber 1 heated the interior of the chamber to the set temperature and maintained it stably. To ensure reliable contact between the carrier plate and the electrical interface under high temperature and vibration conditions, a clamping limit was applied: the connecting rod 13 connected to the end of the lead screw 8 was rotated to drive the lead screw 8 to rotate. Since each limiting plate 10 simultaneously engages with the lead screw 8 via a thread and slides with the guide rod 9 between adjacent connecting plates 7, the rotational motion of the lead screw 8 is converted into the linear lifting and lowering motion of the limiting plate 10 along the axial direction of the guide rod 9. Thus, the limiting plate 10 can be precisely pressed down onto the carrier plate, achieving reliable clamping and limiting of the carrier plate, effectively preventing displacement or poor contact caused by thermal expansion or mechanical vibration, and ensuring the accuracy and repeatability of the test data.

[0022] Although this disclosure has been described with respect to only a limited number of embodiments, those skilled in the art who benefit from this disclosure will understand that various other embodiments can be devised without departing from the scope of this invention. Therefore, the scope of this invention should be limited only by the appended claims.

Claims

1. A memory chip high temperature testing device, comprising The test chamber (1) includes a sealing door (2), a sliding plate (3), a mounting plate (5), a connecting plate (7), a lead screw (8), a guide rod (9), and a limiting plate (10). The sealing door (2) is rotatably connected to the left side of the test chamber (1). Three sliding plates (3) are slidably connected inside the test chamber (1). Each sliding plate (3) has multiple mounting holes (4) symmetrically opened at the top front and back. Three mounting plates (5) are installed on the top of each sliding plate (3). Each mounting plate (5) has a T-shaped groove (6) opened on the top. Multiple connecting plates (7) are fixedly connected to the rear side inside the test chamber (1). A lead screw (8) is rotatably connected between each pair of adjacent connecting plates (7) on the left side. A guide rod (9) is fixedly connected between each pair of adjacent connecting plates (7) on the right side. A limiting plate (10) is threadedly connected to each lead screw (8). Each limiting plate (10) is slidably engaged with the corresponding guide rod (9).

2. The storage chip high temperature testing device according to claim 1, characterized in that, It also includes sliders (11) and fixing plates (12). Multiple sliders (11) are slidably connected inside the test constant temperature chamber (1), and a fixing plate (12) is fixed between each pair of adjacent sliders (11).

3. The storage chip high temperature testing device according to claim 2, characterized in that, It also includes a connecting rod (13), and each lead screw (8) is fixedly connected to the bottom end of the connecting rod (13).

4. The storage chip high temperature testing device according to claim 3, characterized in that, Each mounting hole (4) is elongated.

5. A high-temperature testing device for memory chips according to claim 4, characterized in that, Each mounting plate (5) has multiple fixing holes.

6. A high-temperature testing device for memory chips according to claim 5, characterized in that, Each sliding plate (3) has symmetrical grooves on the left and right sides that are adapted to the fixed plate (12).

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