Magnetic devices and power conversion systems

CN224946625UActive Publication Date: 2026-11-06MUZHIHE TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522591683.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2025-11-20
Filing Date
2025-12-05
Publication Date
2026-11-06
Estimated Expiration
2035-12-05

AI Technical Summary

Technical Problem

Traditional common-mode chokes in high-power applications involve a trade-off between common-mode inductance and differential-mode inductance. The size of the magnetic components limits the improvement of power density, and it is difficult to effectively integrate heat dissipation and insulation features.

Method used

A compact three-phase differential common-mode integrated choke is designed, which adopts an upper and lower package structure, combined with multiple auxiliary magnetic cores and heat sinks. The package is formed by injection molding, and the air gap between the main magnetic core and the auxiliary magnetic core is used to achieve high differential mode inductance and effective noise suppression under large load current.

Benefits of technology

While maintaining a compact size, it achieves larger common-mode and differential-mode inductance, improves power density, and effectively manages heat through heat sinks, ensuring electrical insulation and reliable assembly.

✦ Generated by Eureka AI based on patent content.

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Abstract

A magnetic device and power conversion system are disclosed, wherein the magnetic device includes an upper package, a lower package, and a main magnetic core. The upper package includes a plurality of upper winding segments. The lower package includes a plurality of lower winding segments, an opening formed between a central portion and a sidewall of the lower package, a plurality of auxiliary magnetic cores, and a plurality of heat sinks. The plurality of auxiliary magnetic cores are disposed within the central portion of the lower package. Each of the plurality of heat sinks has a first surface and an opposite second surface, wherein the first surface is exposed on the back side of the lower package, and the second surface is in thermal contact with at least one of the plurality of lower winding segments. The main magnetic core is disposed within the opening of the lower package.
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Description

Technical Field

[0001] This invention relates to a common-mode choke, and more particularly, to a compact three-phase differential common-mode integrated choke. Background Technology

[0002] The rapid electrification of transportation and the continued expansion of artificial intelligence (AI) applications have driven an explosive growth in high-power energy conversion systems. Electric vehicles, battery storage systems, and AI computing servers all require large amounts of electrical energy, which must be efficiently converted between alternating current (AC) and direct current (DC). As the voltage and current levels of these power conversion systems continue to increase, the switching speeds of the power semiconductor devices used are also increasing, resulting in large rates of voltage change (dv / dt) and current change (di / dt). These rapid transitions make it extremely difficult to meet electromagnetic compatibility (EMC) standards such as CISPR 22 / EN 55022 Class B.

[0003] To suppress common-mode and differential-mode noise generated by high-frequency power converters, EMC filters incorporating common-mode chokes are typically employed. However, conventional common-mode choke designs involve a trade-off between achieving a large common-mode inductance and maintaining sufficient differential-mode inductance under high load currents. In high-power applications, the magnetic core of conventional chokes often saturates under high currents, causing a sharp drop in differential-mode inductance and thus weakening noise suppression performance. Simultaneously, the physical size of the magnetic components also limits further increases in power density.

[0004] Therefore, a common-mode choke is needed that combines a large common-mode inductance, a high differential-mode inductance at high currents, and a compact overall size, while also being suitable for automated and scalable manufacturing processes. The structure should also effectively integrate thermal management features for heat dissipation from the windings, maintain reliable insulation spacing, and facilitate efficient assembly. This disclosure proposes a solution to this need. Utility Model Content

[0005] Preferred embodiments of this disclosure typically solve or circumvent the aforementioned and other problems by providing a compact three-phase differential common-mode integrated choke, and typically achieve technical advantages.

[0006] According to one embodiment of this disclosure, a magnetic device is provided, comprising: an upper package including a plurality of upper winding segments; a lower package including a plurality of lower winding segments, an opening formed between a central portion and a sidewall of the lower package, a plurality of auxiliary magnetic cores, and a plurality of heat sinks, wherein: the plurality of auxiliary magnetic cores are disposed within the central portion; and each of the plurality of heat sinks has a first surface exposed to the back surface of the lower package and a second surface in thermal contact with at least one of the plurality of lower winding segments; and a main magnetic core disposed within the opening of the lower package.

[0007] According to one embodiment of this disclosure, a power conversion system is provided, comprising: a three-phase common-mode choke having an input configured to be coupled to a three-phase AC power supply and configured to suppress common-mode noise; and a power conversion circuit coupled to the output of the three-phase common-mode choke, wherein the three-phase common-mode choke comprises: an upper package including a plurality of upper winding segments; a lower package including a plurality of lower winding segments, an opening formed between a central portion and a sidewall of the lower package, a plurality of auxiliary magnetic cores, and a plurality of heat sinks, wherein: the plurality of auxiliary magnetic cores are disposed within the central portion; and each of the plurality of heat sinks has a first surface exposed to a back surface of the lower package and a second surface in thermal contact with at least one of the plurality of lower winding segments; and a main magnetic core disposed within the opening of the lower package.

[0008] The foregoing has provided a general overview of the features and technical advantages of this disclosure, intended to facilitate a more comprehensive understanding of the subsequent detailed description. Other features and advantages of this disclosure, which form the subject matter of the claims, will be described below. Those skilled in the art will understand that the concepts and specific embodiments disclosed herein can serve as the basis for modifications or designs to other structures or processes to achieve the same objectives as this disclosure. Furthermore, those skilled in the art will appreciate that such equivalent constructions do not depart from the spirit and scope of this disclosure as defined by the appended claims. Attached Figure Description

[0009] To gain a more complete understanding of this disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, wherein:

[0010] Figure 1 A simplified structural schematic diagram of a three-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0011] Figure 2 A schematic diagram of the magnetic and electrical characteristics of a three-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0012] Figure 3 A schematic diagram showing the appearance of a three-phase common-mode choke according to various embodiments of the present disclosure is provided.

[0013] Figure 4 Various embodiments according to this disclosure are shown. Figure 3 The diagram shows an exploded view of a three-phase common-mode choke.

[0014] Figure 5 Top and bottom view schematic diagrams of a three-phase common-mode choke according to various embodiments of the present disclosure are shown.

[0015] Figure 6 An exploded view of the upper package of a three-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0016] Figure 7 A perspective view of the upper package of a three-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0017] Figure 8 An exploded view of the lower package of a three-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0018] Figure 9 Top and bottom view schematic diagrams of the lower package according to various embodiments of the present disclosure are shown.

[0019] Figure 10 A schematic diagram of the thermal contact between the lower winding section and the heat sink according to various embodiments of the present disclosure is shown.

[0020] Figure 11 A cross-sectional schematic diagram of the lower package body according to various embodiments of the present disclosure is shown.

[0021] Figure 12 A perspective view of a three-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0022] Figure 13 A perspective schematic diagram of a single-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0023] Figure 14 A perspective schematic diagram of a three-phase four-wire common-mode choke according to various embodiments of the present disclosure is shown.

[0024] Figure 15 A perspective schematic diagram of two different main magnetic cores according to various embodiments of the present disclosure is shown.

[0025] Figure 16 A schematic diagram of a power conversion system including the three-phase common-mode choke according to various embodiments of the present disclosure is shown.

[0026] Figure 17 The following illustrations show methods for manufacturing according to various embodiments of the present disclosure. Figure 3 The diagram shows a flow chart of the three-phase common-mode choke method.

[0027] Unless otherwise stated, the same reference numerals and symbols in different figures generally denote corresponding parts. The figures are not necessarily drawn to scale for clarity of relevant aspects of the various embodiments of this disclosure. Detailed Implementation

[0028] The making and use of various embodiments of this disclosure will be discussed in detail below. However, it should be understood that the concepts disclosed herein can be embodied in various specific contexts, and the specific embodiments discussed below are for illustrative purposes only and are not intended to limit the scope of protection of the appended claims. Furthermore, it should be understood that various changes, substitutions, and modifications can be made herein without departing from the spirit and scope of this disclosure as defined by the appended claims.

[0029] Furthermore, one or more features of one or more embodiments described below may be combined to create other alternative embodiments not explicitly described, and features suitable for such combinations should also be considered within the scope of this disclosure. Therefore, the appended claims are intended to cover any such modifications or embodiments.

[0030] This disclosure will be described in conjunction with preferred embodiments in a specific context, namely a compact three-phase differential common-mode integrated choke. However, this disclosure can also be applied to various common-mode chokes. The embodiments will now be described in detail with reference to the accompanying drawings.

[0031] Figure 1 A simplified structure of a three-phase common-mode choke according to various embodiments of the present disclosure is shown. The three-phase common-mode choke includes three sets of winding coils: a first-phase winding coil 111, a second-phase winding coil 112, and a third-phase winding coil 113. In the following description, the first phase may also be referred to as phase A. The second phase may also be referred to as phase B. The third phase may also be referred to as phase C.

[0032] The three-phase common-mode choke also includes a main magnetic core 102, a first auxiliary magnetic core 104, and a second auxiliary magnetic core 106. In some embodiments, the main magnetic core 102 is a toroidal nanocrystalline amorphous magnetic core. The first auxiliary magnetic core 104 and the second auxiliary magnetic core 106 are high-saturation magnetic cores formed from suitable magnetic materials such as laminated silicon steel sheets or iron-silicon powder.

[0033] The first phase winding coil 111 includes a first portion wound on the first longitudinal side of the main magnetic core 102, a second portion wound on the second longitudinal side of the main magnetic core 102, and a connecting portion connecting the first portion and the second portion. For example... Figure 1As shown, the connection portion of the first phase winding coil 111 is located between the first longitudinal side and the second longitudinal side of the main magnetic core 102.

[0034] The second-phase winding coil 112 includes a first portion wound on the first longitudinal side of the main magnetic core 102, a second portion wound on the second longitudinal side of the main magnetic core 102, and a connecting portion connecting the first portion and the second portion. For example... Figure 1 As shown, the connection portion of the second phase winding coil 112 is located between the first longitudinal side and the second longitudinal side of the main magnetic core 102.

[0035] The third-phase winding coil 113 includes a first portion wound on the first longitudinal side of the main magnetic core 102, a second portion wound on the second longitudinal side of the main magnetic core 102, and a connecting portion connecting the first portion and the second portion. For example... Figure 1 As shown, the connection portion of the third phase winding coil 113 is located between the first longitudinal side and the second longitudinal side of the main magnetic core 102.

[0036] like Figure 1 As shown, the first auxiliary magnetic core 104 is located inside the opening of the main magnetic core 102 and between the first phase winding coil 111 and the second phase winding coil 112. The second auxiliary magnetic core 106 is located inside the opening of the main magnetic core 102 and between the second phase winding coil 112 and the third phase winding coil 113.

[0037] like Figure 1 As shown, air gaps are provided between the auxiliary magnetic cores 104 and 106 and the main magnetic core 102. Specifically, a first predetermined air gap 1011 is provided between the first longitudinal side of the main magnetic core 102 and the first auxiliary magnetic core 104. A second predetermined air gap 1012 is provided between the second longitudinal side of the main magnetic core 102 and the first auxiliary magnetic core 104. A third predetermined air gap 1021 is provided between the first longitudinal side of the main magnetic core 102 and the second auxiliary magnetic core 106. A fourth predetermined air gap 1022 is provided between the second longitudinal side of the main magnetic core 102 and the second auxiliary magnetic core 106.

[0038] Figure 2 The magnetic and electrical characteristics of a three-phase common-mode choke according to various embodiments of the present disclosure are illustrated. Three input terminals receive currents Ia(in), Ib(in), and Ic(in) corresponding to phases A, B, and C, respectively. Three output terminals output corresponding currents Ia(out), Ib(out), and Ic(out). During normal differential-mode operation, the magnetic flux generated by the currents through their respective magnetic paths, due to the characteristics of the three-phase alternating current waveforms, is shown by the dashed lines in the figure. Each dashed line represents a differential-mode flux path associated with a corresponding phase winding.

[0039] Dashed line 121 represents the differential-mode flux path associated with the first phase (phase A). The differential-mode flux path associated with the first phase includes the main magnetic core 102, the first auxiliary magnetic core 104, and the air gap between the main magnetic core 102 and the first auxiliary magnetic core 104. Dashed line 122 represents the differential-mode flux path associated with the second phase (phase B). The differential-mode flux path associated with the second phase includes the main magnetic core 102, the first auxiliary magnetic core 104, the second auxiliary magnetic core 106, and the air gap between the main magnetic core 102 and the auxiliary magnetic cores 104 and 106. Dashed line 123 represents the differential-mode flux path associated with the third phase (phase C). The differential-mode flux path associated with the third phase includes the main magnetic core 102, the second auxiliary magnetic core 106, and the air gap between the main magnetic core 102 and the second auxiliary magnetic core 106.

[0040] Figure 2 The equivalent circuit of the three-phase common-mode choke is also shown. Each phase winding includes two physical parts connected in series. These two physical parts correspond to two parts wound on the main magnetic core 102. The equivalent circuit of each phase has two components: common-mode inductance and differential-mode inductance. The portion in each phase indicated by dashed lines represents the differential-mode inductance loop associated with the corresponding phase winding. The differential-mode inductance of these three phases is mainly provided by the auxiliary magnetic cores 104 and 106. The three phase windings together constitute a three-phase integrated choke, which effectively suppresses common-mode noise while maintaining a large differential-mode inductance under large load currents.

[0041] Figure 3 The appearance of a three-phase common-mode choke according to various embodiments of the present disclosure is shown. The three-phase common-mode choke 100 includes an upper package 200 and a lower package 300. (As shown...) Figure 3 As shown, the upper package 200 is stacked on top of the lower package 300. The upper package 200 includes a plurality of upper winding segments. In some embodiments, the upper winding segments are formed of a suitable conductive material such as copper.

[0042] like Figure 3 As shown, the upper winding segments are partially embedded in the molding material of the upper encapsulation 200. The upper encapsulation 200 is formed by partially encapsulating the multiple upper winding segments through an injection molding process. After the upper encapsulation 200 is formed, certain areas of the multiple upper winding segments remain exposed, such as... Figure 3 As shown.

[0043] The lower package 300 includes multiple lower winding segments and multiple auxiliary magnetic cores (not in...). Figure 3 As shown in the text, but Figure 4 (shown in) and multiple heat sinks (not shown in) Figure 3 As shown in the text, but Figure 5 (As shown in the figure). In some embodiments, the lower winding segment is formed of a suitable conductive material such as copper.

[0044] like Figure 3 As shown, the lower winding segments are partially embedded in the molding material of the lower package 300. In some embodiments, the lower package 300 is formed by placing a plurality of lower winding segments on a plurality of heat sinks, placing a plurality of auxiliary magnetic cores on the plurality of heat sinks, and performing an injection molding process to partially encapsulate at least a portion of the plurality of lower winding segments, the plurality of auxiliary magnetic cores, and the plurality of heat sinks. After the lower package 300 is formed, as shown... Figure 3 As shown, portions of the multiple lower winding segments remain exposed. In an alternative embodiment, the lower package is formed by placing the multiple lower winding segments on multiple heat sinks and performing an injection molding process to partially encapsulate at least a portion of the multiple lower winding segments and the multiple heat sinks, while reserving space for multiple auxiliary magnetic cores. After forming the lower package 300, the multiple auxiliary magnetic cores are inserted into the reserved spaces. An advantageous feature of this approach is that the air gap between the auxiliary magnetic cores and the main magnetic cores can be adjusted without modifying the mold, thereby reducing manufacturing costs.

[0045] During the assembly of the three-phase common-mode choke 100, after the upper package 200 is stacked on top of the lower package 300, a portion of each lower winding segment contacts a corresponding portion of an upper winding segment. The contact portions are welded together to form an electrical and mechanical connection. More specifically, the welding process connects the upper and lower winding segments together to form a connection for the first phase (…). Figure 3 The first phase winding coil 111 of phase A shown is used for the second phase ( Figure 3 The second phase winding coil 112 of phase B shown, and the coil for the third phase (shown in Figure B) Figure 3 The third phase winding coil 113 of phase C shown.

[0046] In some embodiments, the first phase winding coil has eight turns, the second phase winding coil has eight turns, and the third phase winding coil has eight turns. A first terminal 1111 of the first phase winding coil 111 is disposed on the lower package 300. Similarly, a first terminal 1121 of the second phase winding coil 112 is disposed on the lower package 300, and a first terminal 1131 of the third phase winding coil 113 is disposed on the lower package 300. Terminals 1111, 1121, and 1131 are configured to provide electrical connections for input or output power transmission.

[0047] like Figure 3 As shown, multiple upper winding segments and multiple lower winding segments are partially embedded in plastic encapsulation material using injection molding. The plastic encapsulation material can be polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), or similar materials.

[0048] Figure 4 Various embodiments according to this disclosure are shown. Figure 3 The diagram shows an exploded view of a three-phase common-mode choke. The choke includes an upper package 200, a lower package 300, and a main magnetic core 102. The main magnetic core 102 is disposed within an opening in the lower package 300. The upper package 200 is stacked on top of the lower package 300.

[0049] The lower package 300 includes multiple lower winding segments, an opening formed between the central portion 309 and the sidewall 305 of the lower package 300, a first auxiliary magnetic core 104, a second auxiliary magnetic core 106, and three heat sinks (in Figure 4 Not shown in the image, but... Figure 5 (As shown in the figure). The first auxiliary magnetic core 104 and the second auxiliary magnetic core 106 become part of the lower package 300 by being placed during the molding process or inserted into a reserved space after molding.

[0050] The multiple lower winding segments include multiple first-phase lower winding segments (phase A), multiple second-phase lower winding segments (phase B), and multiple third-phase lower winding segments (phase C).

[0051] The plurality of first-phase lower winding sections include a first-phase input lower winding section, a plurality of first-phase intermediate lower winding sections, and a first-phase output lower winding section. The plurality of first-phase intermediate lower winding sections include a first group of first-phase intermediate lower winding sections and a second group of first-phase intermediate lower winding sections. The first leg of the first group of first-phase intermediate lower winding sections is arranged near the side wall 305 of the lower package 300, and the second leg of the first group of first-phase intermediate lower winding sections is arranged in the central portion 309 of the lower package 300. The first leg of the second group of first-phase intermediate lower winding sections is arranged in the central portion 309 of the lower package 300, and the second leg of the second group of first-phase intermediate lower winding sections is arranged near the side wall 305 of the lower package 300.

[0052] The plurality of second-phase lower winding sections include a second-phase input lower winding section, a plurality of second-phase intermediate lower winding sections, and a second-phase output lower winding section. The plurality of second-phase intermediate lower winding sections include a first group of second-phase intermediate lower winding sections and a second group of second-phase intermediate lower winding sections. The first leg of the first group of second-phase intermediate lower winding sections is arranged near the side wall 305 of the lower package 300, and the second leg of the first group of second-phase intermediate lower winding sections is arranged in the central portion 309 of the lower package 300. The first leg of the second group of second-phase intermediate lower winding sections is arranged in the central portion 309 of the lower package 300, and the second leg of the second group of second-phase intermediate lower winding sections is arranged near the side wall 305 of the lower package 300.

[0053] The plurality of third-phase lower winding sections include a third-phase input lower winding section, a plurality of third-phase intermediate lower winding sections, and a third-phase output lower winding section. The plurality of third-phase intermediate lower winding sections include a first group of third-phase intermediate lower winding sections and a second group of third-phase intermediate lower winding sections. The first leg of the first group of third-phase intermediate lower winding sections is arranged near the side wall 305 of the lower package 300, and the second leg of the first group of third-phase intermediate lower winding sections is arranged in the central portion 309 of the lower package 300. The first leg of the second group of third-phase intermediate lower winding sections is arranged in the central portion 309 of the lower package 300, and the second leg of the second group of third-phase intermediate lower winding sections is arranged near the side wall 305 of the lower package 300.

[0054] The first auxiliary magnetic core 104 is arranged between the intermediate lower winding section of the first phase located in the central portion 309 of the lower package 300 and the intermediate lower winding section of the second phase located in the central portion 309 of the lower package 300. The second auxiliary magnetic core 106 is arranged between the intermediate lower winding section of the second phase located in the central portion 309 of the lower package 300 and the intermediate lower winding section of the third phase located in the central portion 309 of the lower package 300.

[0055] The upper package 200 includes multiple upper winding segments. These multiple upper winding segments include multiple first-phase upper winding segments, multiple second-phase upper winding segments, and multiple third-phase upper winding segments. Each of the multiple first-phase upper winding segments includes multiple intra-phase connecting upper winding segments and one inter-phase connecting upper winding segment. Each of the multiple second-phase upper winding segments includes multiple intra-phase connecting upper winding segments and one inter-phase connecting upper winding segment. Each of the multiple third-phase upper winding segments includes multiple intra-phase connecting upper winding segments and one inter-phase connecting upper winding segment.

[0056] The first phase group connection upper winding section is configured to connect the first group of first phase middle lower winding sections and the second group of first phase middle lower winding sections. The second phase group connection upper winding section is configured to connect the first group of second phase middle lower winding sections and the second group of second phase middle lower winding sections. The third phase group connection upper winding section is configured to connect the first group of third phase middle lower winding sections and the second group of third phase middle lower winding sections.

[0057] like Figure 4 As shown, the lower package 300 includes a plurality of mounting calibration posts 307 that protrude upward from the center 309 of the lower package 300. The upper package 200 includes a plurality of mounting calibration openings 308. During assembly, when the upper package 200 is stacked on top of the lower package 300, the mounting calibration posts 307 pass through their respective mounting calibration openings 308 to align the upper package 200 with the lower package 300.

[0058] Figure 5Top and bottom views of a three-phase common-mode choke according to various embodiments of the present disclosure are shown. Figure 5 As shown, after the main magnetic core 102 is installed into the lower package 300, the upper package 200 and the lower package 300 are aligned, interlocked, and fixed together. The exposed winding section (also known as the copper frame strip) located at the junction of the upper and lower packages can then be connected using appropriate soldering processes, such as applying solder paste and heating, or using laser soldering. Through this process, the upper and lower winding sections are electrically connected, thereby forming a three-phase continuous winding wound on the main magnetic core 102.

[0059] Multiple upper winding segments and multiple lower winding segments together form a first-phase winding coil 111, a second-phase winding coil 112, and a third-phase winding coil 113. In some embodiments, the first terminal 1111 of the first-phase winding coil 111 is configured to be coupled to the first phase of a three-phase power supply or the first phase of a power conversion system. The first terminal 1121 of the second-phase winding coil 112 is configured to be coupled to the second phase of a three-phase power supply or the second phase of a power conversion system. The first terminal 1131 of the third-phase winding coil 113 is configured to be coupled to the third phase of a three-phase power supply or the third phase of a power conversion system. The detailed system structure of the three-phase common-mode choke 100 will be described later. Figure 16 Describe it.

[0060] like Figure 5 As shown, the three-phase common-mode choke 100 has a first heat sink 301, a second heat sink 302, and a third heat sink 303 disposed on its bottom surface to enhance heat dissipation. In some embodiments, each of the heat sinks 301, 302, and 303 is a ceramic plate that provides thermal conductivity and electrical insulation. In this description, the first heat sink 301 may also be referred to as the first ceramic plate 301, the second heat sink 302 may also be referred to as the second ceramic plate 302, and the third heat sink 303 may also be referred to as the third ceramic plate 303.

[0061] like Figure 5 As shown, there is a gap between the first heat sink 301 and the second heat sink 302. This gap is filled with a suitable molding material. Similarly, there is also a gap between the second heat sink 302 and the third heat sink 303, which is also filled with a suitable molding material.

[0062] In some embodiments, the heat dissipation surface is partially embedded in a plastic encapsulation material, such as PPS, PET, PBT, or similar materials, via an injection molding process. To ensure the reliability and effectiveness of the embedding, a significant portion of the heat dissipation surface remains exposed, while a portion of the heat sink's edge may be embedded within the plastic encapsulation. The area formed by the molding material contributes to the structural integrity and insulation performance of the three-phase common-mold choke 100 and ensures that the heat dissipation surface is securely integrated within the encapsulation.

[0063] The first heat sink 301, the second heat sink 302, and the third heat sink 303 are made of ceramic, copper, aluminum, or other suitable high thermal conductivity materials. These heat dissipation surfaces effectively conduct heat generated by internal components, thereby improving the overall thermal management performance of the three-phase common-mode choke 100. In some embodiments, the heat sinks 301, 302, and 303 are located directly below the lower winding section, forming a low thermal resistance conduction path from the lower winding section to the outside. During operation, an external heat sink contacts the heat sinks 301, 302, and 303 to dissipate heat generated by the lower winding section while maintaining electrical insulation.

[0064] like Figure 5 As shown, the exposed heat dissipation surfaces of heat sinks 301, 302, and 303 are designed for heat conduction to the outside. Parts of the windings or input / output terminals may be left exposed as needed. The remaining outer surfaces of the three-phase common-mode choke 100 are formed from a single piece of molded plastic resin. This encapsulation provides mechanical protection, electrical insulation, and durability, making the three-phase common-mode choke 100 suitable for high-efficiency power conversion applications.

[0065] Figure 6 An exploded view of a three-phase common-mode choke upper package according to various embodiments of the present disclosure is shown. The plurality of upper winding segments include a plurality of first-phase upper winding segments, a plurality of second-phase upper winding segments, and a plurality of third-phase upper winding segments.

[0066] like Figure 6 As shown, the multiple first-phase upper winding sections include seven intra-phase connecting upper winding sections 211 and one inter-phase connecting upper winding section 218. See also Figure 1 The first phase group connection upper winding segment 218 corresponds to the connection part of the first phase winding coil 111.

[0067] Each first phase group internal winding segment 211 comprises three parts. From the top view, the first phase group internal winding segment 211 includes a first straight portion 2111, a second straight portion 2113, and a broken line connecting portion 2112 connecting the first straight portion 2111 and the second straight portion 2113.

[0068] The first phase group inter-winding section 218 comprises five parts. From a top view, the first phase group inter-winding section 218 includes a first straight section 2181, a second straight section 2183, a third straight section 2185, a first broken-line connecting section 2182, and a second broken-line connecting section 2184. The first broken-line connecting section 2182 connects the first straight section 2181 and the second straight section 2183. The second broken-line connecting section 2184 connects the second straight section 2183 and the third straight section 2185.

[0069] The multiple second-phase upper winding sections include seven intra-phase upper winding sections 221 and one inter-phase upper winding section 228. See also Figure 1 The second phase group connection upper winding segment 228 corresponds to the connection part of the second phase winding coil 112.

[0070] like Figure 6 As shown, the upper winding section 221 connecting the second phase group and the upper winding section 228 connecting the second phase group correspond geometrically to the upper winding section 211 connecting the first phase group and the upper winding section 218 connecting the first phase group, respectively. They are only spatially offset relative to the position of the first phase to accommodate the arrangement of the second phase.

[0071] The multiple third-phase upper winding sections include seven intra-phase upper winding sections 231 and one inter-phase upper winding section 238. See also Figure 1 The third phase group connection upper winding segment 238 corresponds to the connection part of the third phase winding coil 113.

[0072] like Figure 6 As shown, the upper winding section 231 connecting the third phase group and the upper winding section 238 connecting the third phase group are basically the same in shape and structure as the upper winding section corresponding to the first phase, but their positions and orientations have been adjusted according to the wiring arrangement of the third phase.

[0073] See Figure 4 An opening in the lower package 300 defines a channel surrounding the central portion 309. A first set of first-phase intermediate lower winding segments is embedded on one side of the channel, while a second set of first-phase intermediate lower winding segments is embedded on the other side. An intra-phase connecting upper winding segment 211 is configured to connect two adjacent first-phase lower winding segments. An inter-phase connecting upper winding segment 218 is configured to connect the first set of first-phase intermediate lower winding segments to the second set of first-phase intermediate lower winding segments.

[0074] Similarly, the upper winding segment 221 within each second phase group is configured to connect two adjacent lower winding segments of the second phase. The upper winding segment 228 between second phase groups is configured to connect the middle lower winding segments of the first and second phases. The upper winding segment 231 within each third phase group is configured to connect two adjacent lower winding segments of the third phase. The upper winding segment 238 between third phase groups is configured to connect the middle lower winding segments of the first and second phases.

[0075] Figure 7 A perspective view of the upper package of a three-phase common-mode choke according to various embodiments of the present disclosure is shown. Figure 7 As shown, for Figure 6After the multiple upper winding segments shown are injection molded, the multiple upper winding segments are partially encapsulated by appropriate molding material and fixed into the shape of upper package 200 by high temperature and high pressure injection molding process.

[0076] In some embodiments, the injection molding process is a high-temperature, high-pressure injection molding process, using suitable plastic resins such as PPS and PBT. It should be noted that during injection molding, the distribution and amount of molding material within the upper encapsulation 200 can be precisely controlled through mold structure design. By selectively applying pressure and designing the internal geometry of the mold, certain areas can be tightly compacted, thereby eliminating space for molding material entry. Conversely, by intentionally creating cavities or voids in specific areas of the mold, molding material is allowed to flow into and remain in these areas. In this way, targeted encapsulation, optimized material utilization, and improved thermal or mechanical properties can be achieved according to the structural and functional requirements of the upper encapsulation 200.

[0077] During the injection molding process, an opening (e.g., opening 242) is provided along the side edge of each upper winding segment. The size of these openings matches the size of the corresponding lower winding segment in the lower package 300, so that after assembly, the upper and lower packages can fit tightly together, ensuring a firm contact between adjacent winding segments at their interlocking positions.

[0078] The dashed areas (e.g., dashed area 240) represent predetermined solder paste application areas on the upper winding segment. The adjacent portions of the corresponding lower winding segment are also coated with solder paste. A soldering process is then performed to electrically and mechanically connect each upper winding segment to its corresponding lower winding segment, thereby forming a continuous winding.

[0079] Figure 8 An exploded view of the under-package of a three-phase common-mode choke according to various embodiments of the present disclosure is shown. Figure 9 Top and bottom views of the three-phase common-mode choke under package according to various embodiments of the present disclosure are shown.

[0080] like Figure 8As shown, in one embodiment, the lower package 300 is formed by injection molding an assembly comprising two auxiliary magnetic cores 104 and 106, three sets of lower winding segments (copper frame strips), and three heat sinks 301, 302, and 303. During molding, the lower winding segments are positioned so that their flat bottom surfaces contact their respective heat sinks. The two auxiliary magnetic cores 104 and 106 are placed between the three sets of lower winding segments. The assembly is then encapsulated by injection molding to form the lower package 300. In an alternative embodiment, the lower package 300 is formed by injection molding an assembly comprising three sets of lower winding segments and three heat sinks, while reserving space for the two auxiliary magnetic cores 104 and 106. After the lower package 300 is formed, the auxiliary magnetic cores 104 and 106 are inserted into the reserved space. This method allows adjustment of the air gap between the main magnetic core and the auxiliary magnetic cores without modifying the mold.

[0081] The multiple lower winding segments include multiple first-phase lower winding segments (phase A), multiple second-phase lower winding segments (phase B), and multiple third-phase lower winding segments (phase C).

[0082] The multiple first-phase lower winding segments include a first-phase input lower winding segment 311, seven first-phase intermediate lower winding segments 312, and a first-phase output lower winding segment 319. The multiple second-phase lower winding segments include a second-phase input lower winding segment 321, seven second-phase intermediate lower winding segments 322, and a second-phase output lower winding segment 329. The multiple third-phase lower winding segments include a third-phase input lower winding segment 331, seven third-phase intermediate lower winding segments 332, and a third-phase output lower winding segment 339.

[0083] The first phase input lower winding section 311 includes a first phase input terminal, a first phase input support leg, and a first phase input horizontal bottom. For example... Figure 8-9 As shown, the lower winding section 311 of the first phase input is placed near the side wall 305 of the lower package 300. The bottom horizontal section of the first phase input is in thermal contact with the first heat sink 301.

[0084] The first phase intermediate lower winding segment 312 is divided into two groups. The first group includes four first phase intermediate lower winding segments 312, and the second group includes three first phase intermediate lower winding segments 312. Each of the seven first phase intermediate lower winding segments 312 is a U-shaped winding segment, having a first leg and a second leg extending from the connecting portion. Figure 8-9As shown, the first leg of the first group of first-phase intermediate lower winding sections 312 is placed near the side wall 305 of the lower package 300. The second leg of the first group of first-phase intermediate lower winding sections 312 is arranged in the central portion 309 of the lower package 300. The first leg of the second group of first-phase intermediate lower winding sections 312 is arranged in the central portion 309 of the lower package 300. The second leg of the second group of first-phase intermediate lower winding sections 312 is arranged near the side wall 305 of the lower package 300. The connecting portions of the first group of first-phase intermediate lower winding sections 312 and the second group of first-phase intermediate lower winding sections 312 are in thermal contact with the first heat sink 301. The first-phase output lower winding section 319 includes a first-phase output terminal, a first-phase output leg, and a first-phase output horizontal bottom. The first-phase output terminal of the first-phase output lower winding section 319 is arranged near the side wall 305 of the lower package 300.

[0085] like Figure 8 As shown, the arrangement of multiple second-phase lower winding sections and multiple third-phase lower winding sections is basically the same as the arrangement of multiple first-phase lower winding sections. For example... Figure 9 As shown, the first auxiliary magnetic core 104 is arranged between the lower intermediate winding section of the first phase and the lower intermediate winding section of the second phase, wherein both the lower intermediate winding sections of the first phase and the second phase are arranged in the central portion 309 of the lower package 300. The second auxiliary magnetic core 106 is arranged between the lower intermediate winding section of the second phase and the lower intermediate winding section of the third phase, wherein both the lower intermediate winding sections of the second phase and the third phase are arranged in the central portion 309 of the lower package 300.

[0086] During the formation of the lower package 300, multiple lower winding segments are placed on heat sinks 301, 302, and 303. In some embodiments, a first-phase lower winding segment is arranged on the first heat sink 301, a second-phase lower winding segment is arranged on the second heat sink 302, and a third-phase lower winding segment is arranged on the third heat sink 303. A first auxiliary magnetic core 104 is placed above the first heat sink 301 and the second heat sink 302. A first edge portion of the bottom of the first auxiliary magnetic core 104 is located above the first heat sink 301. A second edge portion of the bottom of the first auxiliary magnetic core 104 is located above the second heat sink 302. A second auxiliary magnetic core 106 is placed above the second heat sink 302 and the third heat sink 303. A first edge portion of the bottom of the second auxiliary magnetic core 106 is located above the second heat sink 302. A second edge portion of the bottom of the second auxiliary magnetic core 106 is located above the third heat sink 303.

[0087] like Figure 9 As shown, in one embodiment, for Figure 8After the multiple lower winding segments and auxiliary magnetic cores shown are injection molded, the multiple lower winding segments and auxiliary magnetic cores 104 and 106 are partially encapsulated by appropriate molding material and fixed into the shape of the lower package 300 by a high-temperature and high-pressure injection molding process. After the lower package 300 is formed, some areas of the multiple lower winding segments and auxiliary magnetic cores remain exposed, such as... Figure 9 As shown. In an alternative embodiment, the injection molding process is applied only to the multiple lower winding segments (and corresponding heat sinks), while reserving space for the auxiliary magnetic cores 104 and 106. After the lower package 300 is formed, the auxiliary magnetic cores 104 and 106 are then inserted into this reserved space. In this structure, portions of the multiple lower winding segments and the auxiliary magnetic cores also remain exposed, similar to... Figure 9 The structure shown.

[0088] In some embodiments, the injection molding process is a high-temperature, high-pressure injection molding process, using plastic resins such as PPS and PBT. It should be noted that during injection molding, the distribution and amount of molding material within the lower encapsulation 300 can be precisely controlled through mold design. By selectively applying pressure and designing the internal geometry of the mold, certain areas can be tightly compacted, thereby eliminating space for molding material entry. Conversely, by intentionally creating cavities or voids in specific areas of the mold, molding material is allowed to flow into and remain in these areas. In this way, targeted encapsulation, optimized material utilization, and improved thermal or mechanical properties can be achieved according to the structural and functional requirements of the lower encapsulation 300.

[0089] One advantageous feature of this disclosure is that it employs... Figure 7 and Figure 9 The diagram illustrates a special winding segment structure used to form a three-phase winding coil. Multiple metal winding segments are injection molded and encapsulated in an upper and lower package, then interlocked and top-welded together at the interface. Welding can be achieved via laser welding or by applying solder paste to the welding area and heating it, enabling efficient and reliable mass production. This design also eliminates the pin loosening problem caused by conventional pin insertion on the housing frame, thus avoiding welding failures due to mechanical loosening or gaps between adjacent winding segments.

[0090] Another advantageous feature of this disclosure is the use of a stacked upper and lower package structure. The winding segments in the upper package are connected to the winding segments in the lower package via a welding process. Heat conduction is achieved in the lower package through the winding segments that contact the ceramic plate (heat sink). Heat generated in the windings is efficiently conducted downwards through the ceramic plate to the external heat sink. This structure not only enables high-current operation with better thermal performance but also contributes to the miniaturization of three-phase common-mode chokes.

[0091] Figure 10The thermal contact between the lower winding section and the heat sink is shown according to various embodiments of the present disclosure. For example... Figure 10 As shown, the bottom horizontal surfaces of the first phase input lower winding section 311, the first phase middle lower winding section 312, and the first phase output lower winding section 319 maintain close thermal contact with the upper surface of the first heat sink 301. This structure establishes an effective heat conduction path to transfer the heat generated in the lower winding sections to the heat sink below, thereby improving overall thermal performance.

[0092] In some embodiments, a thin thermally conductive interface material (TIM) may be sandwiched between the horizontal bottom of the lower winding section and the upper surface of the first heat sink 301 to further enhance thermal coupling and reduce contact thermal resistance. The TIM layer may include thermally conductive grease, thermally conductive adhesive, thermally conductive pads, or other compliant materials suitable for maintaining uniform contact under thermal cycling and mechanical stress conditions.

[0093] Figure 11 A cross-sectional view of a lower package according to various embodiments of the present disclosure is shown. The cross-sectional view also shows a portion of a main magnetic core 102 disposed above the lower package 300.

[0094] Each lower winding segment includes a horizontal bottom and a rounded corner region connected to the horizontal bottom. The horizontal bottom of each lower winding segment is thermally coupled to a ceramic plate (heat sink 301) disposed below it. For example, as Figure 11 As shown, the output lower winding segment 319 includes a horizontal bottom and a rounded corner region. The rounded corner region is formed between the output terminal and the horizontal bottom.

[0095] The rounded corner areas of each lower winding segment are surrounded by molding material 351, which also fills the gap between the rounded corner areas and the adjacent surface of the ceramic plate 301, thereby providing insulation and mechanical support. The corner portions of the ceramic plate 301 are also encapsulated with molding material. This structure provides mechanical protection and electrical insulation for both the lower winding segments and the ceramic plate while maintaining an effective heat conduction path from the winding segments through the ceramic plate. The molding encapsulation also avoids exposure of sharp metal edges, reduces the risk of stress concentration, and improves the overall structural reliability of the assembly under thermal cycling conditions.

[0096] To further improve insulation reliability and prevent delamination or voids after repeated thermal cycles, a ceramic plate (heat sink 301) is embedded in molding resin. The edges of the ceramic plate are surrounded and secured by molding material, thus firmly positioning the ceramic plate, preventing delamination between the ceramic plate and the molding resin, and ensuring long-term insulation integrity and stable thermal performance. Furthermore, the encapsulating material arranged between the heat sink 301 and the winding segment and surrounding the rounded corner areas helps increase the insulation distance between the heat sink 301 and the winding segment.

[0097] Figure 12A perspective view of a three-phase common-mode choke according to various embodiments of the present disclosure is shown. Figure 12 As shown, each upper winding segment includes a terminal portion that contacts a corresponding terminal portion of a lower winding segment. When the upper package 200 is stacked on top of the lower package 300, these contacting terminal portions are soldered together at their respective contact locations.

[0098] like Figure 12 As shown, region 360 represents a predetermined area for applying solder paste to the top surface. Region 361 represents a predetermined area for applying solder paste to the sidewall region. A soldering process is then performed to electrically and mechanically connect each upper winding segment to its corresponding lower winding segment, thereby forming a continuous winding.

[0099] Through this welding process, the upper winding segment of each phase is electrically and mechanically connected to the corresponding lower winding segment, thereby forming a continuous winding for that phase. Therefore, the first phase (phase A), the second phase (phase B), and the third phase (phase C) form the first-phase winding coil, the second-phase winding coil, and the third-phase winding coil, respectively. The welded joint provides a low-resistance electrical connection and a robust mechanical bond between the upper and lower winding segments, thus ensuring stable current conduction and structural integrity during high-current operation.

[0100] Figure 13 A perspective view of a single-phase common-mode choke according to various embodiments of the present disclosure is shown. The structural configuration of the single-phase common-mode choke 400 is similar to... Figures 1-12 The three-phase common-mode choke 100 is similar, except that it includes only one auxiliary magnetic core and two sets of windings. The single auxiliary magnetic core is arranged between the two sets of windings to provide a differential-mode flux path while maintaining the common-mode inductance characteristics.

[0101] It should be noted that Figure 13 The single-phase common-mode choke shown is not limited to AC applications. In some embodiments, the same structure can also be used in DC circuits as a choke to suppress conducted noise and smooth current ripple.

[0102] Figure 14 A perspective view of a three-phase four-wire common-mode choke according to various embodiments of the present disclosure is shown. The overall structure of the three-phase four-wire common-mode choke 500 is similar to... Figures 1-12 The three-phase common-mode choke 100 is similar, except that it includes three auxiliary magnetic cores and four sets of windings. The three auxiliary magnetic cores are arranged between adjacent windings to provide their own differential-mode flux paths, while the main magnetic core provides a common-mode flux path shared by the four sets of windings.

[0103] It should be noted that Figure 14The three-phase four-wire common-mode choke 500 shown can also be used as two single-phase chokes connected in parallel. In such embodiments, each pair of windings is configured to suppress both common-mode and differential-mode noise, thereby providing greater flexibility in a variety of power conversion applications.

[0104] Figure 15 Perspective views of two different main magnetic cores according to various embodiments of the present disclosure are shown. The main magnetic core 702 shown on the left corresponds to... Figures 1-12 The structure used in the embodiments. The main magnetic core 702 is a nanocrystalline amorphous magnetic core. In some embodiments, the nanocrystalline amorphous magnetic core is formed by winding a thin strip into a ring. The main magnetic core 712 shown on the right illustrates an optional hybrid magnetic core structure designed to improve the high-frequency characteristics of common-mode and differential-mode inductance while maintaining high inductance values. In this embodiment, the main magnetic core comprises inner and outer layers. The inner layer portion 716 is formed of a powder magnetic material made of alloy soft magnetic powder with high saturation magnetic flux density, such as iron-silicon (FeSi), iron-nickel (FeNi), iron-silicon-aluminum (FeSiAl), or an amorphous magnetic core. The outer layer portion is formed of a nanocrystalline amorphous magnetic material, such as a nanocrystalline amorphous magnetic core wound from a thin strip.

[0105] Figure 15 This hybrid structure combines the high saturation flux density of powder magnetic materials with the excellent high permeability and low core loss characteristics of nanocrystalline amorphous materials. The combination of the inner powder core and the outer nanocrystalline amorphous core provides high dimensional accuracy, small interior corner radii, and stable geometry.

[0106] like Figure 15 As shown, the inner fillet radius 714 of the main magnetic core 712 is smaller than the inner fillet radius 704 of the main magnetic core 702. This structure of the main magnetic core 712 is beneficial for mass production and reduces the overall lateral size of the device. Therefore, this composite magnetic core can provide better operating performance under high differential mode current conditions while maintaining high common mode inductance and compact overall size.

[0107] Figure 16 A schematic diagram of a power conversion system including a three-phase common-mode choke according to various embodiments of the present disclosure is shown. As shown, three AC input power supplies AC1, AC2, and AC3 provide three-phase signal input power. Three differential-mode inductors L1, L2, and L3 are connected in series in the three-phase lines to suppress differential-mode noise components.

[0108] Three capacitors, C1, C2, and C3, are connected between each phase line and ground, providing a low-impedance loop for common-mode noise current, thereby improving electromagnetic interference (EMI) suppression performance. (The above is combined with...) Figures 1-12The three-phase common-mode choke 100 is coupled between the three-phase input power supply and the power conversion circuit 1600. The three-phase common-mode choke 100 attenuates the common-mode noise and differential-mode noise in the power conversion circuit 1600.

[0109] The power conversion circuit 1600 may include a front-end power factor correction (PFC) circuit, an isolated DC / DC converter, and multiple downstream non-isolated power converters. This architecture achieves high-efficiency multi-stage power conversion while maintaining compliance with electromagnetic compatibility (EMC) requirements.

[0110] Figure 17 Various embodiments of the present disclosure are shown for manufacturing Figure 3 The flowchart shown is for the method of using a three-phase common-mode choke. Figure 17 The flowchart shown is merely an example and should not unduly limit the scope of the claims. Many variations, alternatives, and modifications will be understood by those skilled in the art. For example, Figure 17 The steps shown can be added, removed, replaced, reordered, or repeated.

[0111] In step 1702, multiple lower winding segments are placed on multiple heat sinks, wherein the horizontal bottom of the multiple lower winding segments are in thermal contact with the multiple heat sinks respectively.

[0112] In step 1704, a first injection molding process is performed to partially encapsulate multiple lower winding segments to form a lower package with a central portion and peripheral sidewalls, wherein the central portion and peripheral sidewalls together form an opening.

[0113] In step 1706, a second injection molding process is performed to partially encapsulate multiple upper winding segments to form an upper package.

[0114] In step 1708, the main magnetic core is arranged inside the opening of the lower package.

[0115] In step 1710, the upper package is stacked on top of the lower package.

[0116] In step 1712, after the upper package is stacked on top of the lower package, the corresponding upper winding segments are welded to the lower winding segments to form multiple windings.

[0117] In some embodiments, after the upper package is stacked on top of the lower package, a portion of each of the plurality of lower winding segments comes into contact with a portion of a corresponding upper winding segment of the plurality of upper winding segments, and the contact portions are welded together to form an electrical connection and a mechanical connection.

[0118] The method further includes: forming a plurality of assembly calibration posts protruding from the center of the lower package, forming a plurality of assembly calibration openings in the upper package, and aligning the assembly calibration posts with their corresponding assembly calibration openings, such that after the upper package is stacked on top of the lower package, the assembly calibration posts pass through their respective assembly calibration openings.

[0119] In some embodiments, a plurality of auxiliary magnetic cores are arranged in a lower package and located on a plurality of heat sinks. The plurality of lower winding segments include: a plurality of first-phase lower winding segments, each including a first-phase input lower winding segment, a plurality of first-phase intermediate lower winding segments, and a first-phase output lower winding segment; a plurality of second-phase lower winding segments, each including a second-phase input lower winding segment, a plurality of second-phase intermediate lower winding segments, and a second-phase output lower winding segment; and a plurality of third-phase lower winding segments, each including a third-phase input lower winding segment, a plurality of third-phase intermediate lower winding segments, and a third-phase output lower winding segment. The plurality of upper winding segments include: a plurality of first-phase upper winding segments, each including a plurality of first-phase group intra-connected upper winding segments and first-phase group inter-connected upper winding segments; a plurality of second-phase upper winding segments, each including a plurality of second-phase group intra-connected upper winding segments and second-phase group inter-connected upper winding segments; and a plurality of third-phase upper winding segments, each including a plurality of third-phase group intra-connected upper winding segments and third-phase group inter-connected upper winding segments.

[0120] In some embodiments, the first phase input lower winding segment includes a first phase input terminal, a first phase input leg, and a first phase input horizontal bottom, wherein the first phase input lower winding segment is disposed near the sidewall of the lower package, and the first phase input horizontal bottom is in thermal contact with a first heat sink among a plurality of heat sinks; the plurality of first phase intermediate lower winding segments include a first group of first phase intermediate lower winding segments and a second group of first phase intermediate lower winding segments, wherein each of the plurality of first phase intermediate lower winding segments is a U-shaped winding segment with a first leg and a second leg extending from a connecting portion; the first leg of the first group of first phase intermediate lower winding segments is disposed near the sidewall of the lower package, and the second leg of the first group of first phase intermediate lower winding segments is disposed in the central portion of the lower package; the first leg of the second group of first phase intermediate lower winding segments is disposed in the central portion of the lower package, and the second leg of the second group of first phase intermediate lower winding segments is disposed in the central portion of the lower package. The first phase output lower winding section is located near the side wall of the lower package body; the connection portion of the first group of first phase intermediate lower winding sections and the connection portion of the second group of first phase intermediate lower winding sections are in thermal contact with the first heat sink among the multiple heat sinks; the first phase output lower winding section includes a first phase output terminal, a first phase output support leg and a first phase output horizontal bottom, wherein the first phase output terminal of the first phase output lower winding section is arranged near the side wall of the lower package body; the arrangement of the multiple second phase lower winding sections and the multiple third phase lower winding sections is basically the same as the arrangement of the multiple first phase lower winding sections; wherein, the first auxiliary magnetic core among the multiple auxiliary magnetic cores is arranged between the first phase intermediate lower winding section located in the central part of the lower package body and the second phase intermediate lower winding section located in the central part of the lower package body, and the second auxiliary magnetic core among the multiple auxiliary magnetic cores is arranged between the second phase intermediate lower winding section located in the central part of the lower package body and the third phase intermediate lower winding section located in the central part of the lower package body.

[0121] Although the embodiments and advantages of this disclosure have been described in detail, it should be understood that various changes, substitutions and modifications may be made thereto without departing from the spirit and scope of this disclosure as defined by the appended claims.

[0122] Furthermore, it is not intended that the scope of this disclosure be limited to specific embodiments of the processes, machines, manufactures, compositions of matter, methods, and steps described herein. Those skilled in the art will readily understand from this disclosure that, according to the present invention, processes, machines, manufactures, compositions of matter, methods, or steps that are currently existing or to be developed later for performing substantially the same function or achieving substantially the same result as the corresponding embodiments described herein can be utilized. Therefore, it is intended that such processes, machines, manufactures, compositions of matter, methods, or steps be included within the scope of the appended claims.

Claims

1. A magnetic device, characterized in that, include: An upper package body, the upper package body comprising multiple upper winding segments; The lower package includes multiple lower winding segments, an opening formed between the central portion and the sidewall of the lower package, multiple auxiliary magnetic cores, and multiple heat sinks, wherein: The plurality of auxiliary magnetic cores are arranged within the central portion; and Each of the plurality of heat sinks has a first surface exposed to the back of the lower package and a second surface in thermal contact with at least one of the plurality of lower winding segments; and A main magnetic core is disposed within the opening of the lower package.

2. The magnetic device according to claim 1, characterized in that, in: The lower package is formed by placing the plurality of lower winding segments on the plurality of heat sinks, placing the plurality of auxiliary magnetic cores above the plurality of heat sinks, and performing a first injection molding process to partially encapsulate at least a portion of the plurality of lower winding segments, the plurality of auxiliary magnetic cores, and the plurality of heat sinks, such that after the lower package is formed, portions of the plurality of lower winding segments and portions of the plurality of auxiliary magnetic cores are still exposed. as well as The upper encapsulation body partially encapsulates the plurality of upper winding segments by performing a second injection molding process, such that after the upper encapsulation body is formed, parts of the plurality of upper winding segments are still exposed.

3. The magnetic device according to claim 1, characterized in that, in: The plurality of lower winding segments include a plurality of first-phase lower winding segments, a plurality of second-phase lower winding segments, and a plurality of third-phase lower winding segments, wherein: The plurality of first-phase lower winding segments include a first-phase input lower winding segment, a plurality of first-phase intermediate lower winding segments, and a first-phase output lower winding segment; The plurality of second-phase lower winding sections include a second-phase input lower winding section, a plurality of second-phase intermediate lower winding sections, and a second-phase output lower winding section; and The plurality of third-phase lower winding sections include a third-phase input lower winding section, a plurality of third-phase intermediate lower winding sections, and a third-phase output lower winding section.

4. The magnetic device according to claim 3, characterized in that, in: The first phase input lower winding section includes a first phase input terminal, a first phase input support leg, and a first phase input horizontal bottom, wherein the first phase input lower winding section is arranged near the side wall of the lower package, and the first phase input horizontal bottom is in thermal contact with the first heat sink among the plurality of heat sinks; The plurality of first-phase intermediate lower winding segments include a first group of first-phase intermediate lower winding segments and a second group of first-phase intermediate lower winding segments, wherein: Each of the plurality of first phase intermediate lower winding segments is a U-shaped winding segment, having a first leg and a second leg extending from the connecting portion; The first leg of the first phase lower winding segment of the first group is arranged near the side wall of the lower package; The second leg of the first phase lower winding segment of the first group is arranged in the central part of the lower package; The first leg of the second group of the first phase intermediate lower winding segment is arranged in the central part of the lower package; The second leg of the second group of the first phase intermediate lower winding segment is arranged near the sidewall of the lower package; and The connecting portion of the first group of first-phase lower winding segments and the connecting portion of the second group of first-phase lower winding segments are in thermal contact with the first heat sink among the plurality of heat sinks; and The first phase output lower winding section includes a first phase output terminal, a first phase output support leg, and a first phase output horizontal bottom, wherein the first phase output terminal of the first phase output lower winding section is arranged near the side wall of the lower package, and the first phase output horizontal bottom is in thermal contact with the first heat sink among the plurality of heat sinks.

5. The magnetic device according to claim 4, characterized in that, in: Each of the plurality of lower winding segments includes a horizontal bottom and a leg, forming a rounded corner region between the horizontal bottom and the leg, wherein: The rounded corner area is surrounded by a molding material, which also fills the gap between the rounded corner area and the corresponding heat sink; and The edges of the corresponding heat sink are surrounded by the molding material.

6. The magnetic device according to claim 4, characterized in that, in: The plurality of second-phase lower winding sections and the plurality of third-phase lower winding sections each have a substantially the same arrangement as the plurality of first-phase lower winding sections, and wherein: The first auxiliary magnetic core of the plurality of auxiliary magnetic cores is arranged between the first phase intermediate lower winding segment arranged in the central portion of the lower package and the second phase intermediate lower winding segment arranged in the central portion of the lower package; and The second auxiliary magnetic core of the plurality of auxiliary magnetic cores is arranged between the second phase intermediate lower winding section arranged in the central part of the lower package and the third phase intermediate lower winding section arranged in the central part of the lower package.

7. The magnetic device according to claim 4, characterized in that, in: The plurality of upper winding segments include a plurality of first-phase upper winding segments, a plurality of second-phase upper winding segments, and a plurality of third-phase upper winding segments, wherein: The plurality of first phase upper winding sections include a plurality of upper winding sections connected within the first phase group and an upper winding section connected between the first phase groups. The plurality of second-phase upper winding sections include a plurality of upper winding sections connected within a second-phase group and an upper winding section connected between second-phase groups; and The plurality of third-phase upper winding sections include a plurality of upper winding sections connected within the third phase group and an upper winding section connected between the third phase groups.

8. The magnetic device according to claim 7, characterized in that, in: The first phase group connection upper winding segment is configured to connect the middle lower winding segment of the first phase of the first group and the middle lower winding segment of the second phase of the second group; The second phase group inter-winding section is configured to connect the first group of second phase intermediate lower winding sections and the second group of second phase intermediate lower winding sections; and The third phase group inter-connection upper winding section is configured to connect the middle lower winding section of the first third phase group and the middle lower winding section of the second third phase group.

9. The magnetic device according to claim 1, characterized in that, in: The plurality of upper winding segments and the plurality of lower winding segments are configured to form: A first winding, configured to be coupled between a first phase of a three-phase power supply and a first phase of a power conversion system; A second winding, configured to be coupled between a second phase of the three-phase power supply and a second phase of the power conversion system; as well as A third winding is configured to be coupled between the third phase of the three-phase power supply and the third phase of the power conversion system, wherein: The first winding, the second winding, and the third winding constitute a three-phase common-mode choke. The first auxiliary magnetic core of the plurality of auxiliary magnetic cores is configured to provide a first differential mode flux path for the first phase and the second phase of the power conversion system; as well as The second auxiliary magnetic core among the plurality of auxiliary magnetic cores is configured to provide a second differential mode flux path for the second phase and the third phase of the power conversion system.

10. The magnetic device according to claim 1, characterized in that, in: The main magnetic core includes an inner portion and an outer portion, wherein: The internal portion is formed of powdered magnetic material; and The outer portion is formed of nanocrystalline magnetic material.

11. The magnetic device according to claim 1, characterized in that, in: The lower package includes a plurality of assembly calibration posts protruding from the central portion of the lower package; and The upper package includes a plurality of assembly calibration openings, wherein, after the upper package is stacked on the lower package, the assembly calibration post extends through the respective assembly calibration opening to align the upper package with the lower package.

12. The magnetic device according to claim 1, characterized in that, in: After the upper package is stacked on the lower package, the corresponding winding segments of the plurality of upper winding segments and the plurality of lower winding segments are welded together at their respective contact portions to form a plurality of windings.

13. A power conversion system, characterized in that, include: A three-phase common-mode choke, the three-phase common-mode choke having an input configured to be coupled to a three-phase AC power supply, and the three-phase common-mode choke being configured to suppress common-mode noise; as well as A power conversion circuit, the power conversion circuit being coupled to the output of the three-phase common-mode choke, wherein the three-phase common-mode choke includes: An upper package body, the upper package body comprising multiple upper winding segments; The lower package includes multiple lower winding segments, an opening formed between the central portion and the sidewall of the lower package, multiple auxiliary magnetic cores, and multiple heat sinks, wherein: The plurality of auxiliary magnetic cores are arranged within the central portion; and Each of the plurality of heat sinks has a first surface exposed to the back of the lower package and a second surface in thermal contact with at least one of the plurality of lower winding segments; and A main magnetic core is disposed within the opening of the lower package.

14. The power conversion system of claim 13, wherein: The plurality of lower winding segments include: Multiple first-phase lower winding segments, the multiple first-phase lower winding segments including a first-phase input lower winding segment, multiple first-phase intermediate lower winding segments and a first-phase output lower winding segment; Multiple second-phase lower winding segments, wherein the multiple second-phase lower winding segments include a second-phase input lower winding segment, multiple second-phase intermediate lower winding segments, and a second-phase output lower winding segment; and Multiple third-phase lower winding segments, wherein the multiple third-phase lower winding segments include a third-phase input lower winding segment, multiple third-phase intermediate lower winding segments, and a third-phase output lower winding segment; and The plurality of upper winding segments include: Multiple first-phase upper winding segments, the multiple first-phase upper winding segments including multiple upper winding segments connected within the first phase group and an upper winding segment connected between the first phase groups; A plurality of second-phase upper winding segments, the plurality of second-phase upper winding segments including a plurality of intra-second-phase group connecting upper winding segments and an inter-second-phase group connecting upper winding segment; and Multiple third-phase upper winding segments, including multiple upper winding segments connected within a third-phase group and an upper winding segment connected between third-phase groups.

15. The power conversion system of claim 14, wherein: The first phase input lower winding section includes a first phase input terminal, a first phase input support leg, and a first phase input horizontal bottom, wherein the first phase input lower winding section is arranged near the side wall of the lower package, and the first phase input horizontal bottom is in thermal contact with the first heat sink among the plurality of heat sinks; The plurality of first-phase intermediate lower winding segments include a first group of first-phase intermediate lower winding segments and a second group of first-phase intermediate lower winding segments, wherein: Each of the plurality of first phase intermediate lower winding segments is a U-shaped winding segment, having a first leg and a second leg extending from the connecting portion; The first leg of the first phase lower winding segment of the first group is arranged near the side wall of the lower package; The second leg of the first phase lower winding segment of the first group is arranged in the central part of the lower package; The first leg of the second group of the first phase intermediate lower winding segment is arranged in the central part of the lower package; The second leg of the second group of the first phase intermediate lower winding segment is arranged near the sidewall of the lower package; and The connecting portion of the first group of first phase lower winding segments and the connecting portion of the second group of first phase lower winding segments are in thermal contact with the first heat sink among the plurality of heat sinks; The first phase output lower winding section includes a first phase output terminal, a first phase output support leg, and a first phase output horizontal bottom, wherein the first phase output terminal of the first phase output lower winding section is arranged near the sidewall of the lower package, and the first phase output horizontal bottom is in thermal contact with the first heat sink among the plurality of heat sinks; and The plurality of second-phase lower winding sections and the plurality of third-phase lower winding sections each have a substantially the same arrangement as the plurality of first-phase lower winding sections, wherein: The first auxiliary magnetic core of the plurality of auxiliary magnetic cores is arranged between the first phase intermediate lower winding segment arranged in the central portion of the lower package and the second phase intermediate lower winding segment arranged in the central portion of the lower package; and The second auxiliary magnetic core of the plurality of auxiliary magnetic cores is arranged between the second phase intermediate lower winding section arranged in the central part of the lower package and the third phase intermediate lower winding section arranged in the central part of the lower package.