Electrical connection components and electronic devices

Abstract

This application provides an electrical connection component and an electronic device, relating to the field of electronic device technology. The electrical connection component includes a conductive element and at least two heat sinks. Each conductive element includes at least two first connecting portions, which are electrically connected to each other and each first connecting portion is electrically connected to at least a portion of a circuit board. At least one heat sink is connected to each first connecting portion, with at least a portion of the heat sink protruding from the surface of the corresponding first connecting portion. In this embodiment of the electrical connection component, the heat sinks effectively increase the contact area between the first connecting portion of the conductive element and the air, resulting in better heat exchange between the first connecting portion and the surrounding air, thereby improving the heat dissipation effect of the electrical connection component.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electrical connection component and an electronic device. Background Technology

[0002] Electronic devices such as energy storage inverters need to transmit electrical energy between different circuit boards through internal electrical connection structures during operation.

[0003] In related technologies, electrical connections between two adjacent circuit boards are usually achieved through copper busbars. The heat generated during the operation of the copper busbars is mainly dissipated through natural heat exchange between the surface of the copper busbars and the surrounding air.

[0004] However, the contact area between the copper busbar and the circuit board and the air is small, resulting in poor heat exchange between the connection and the surrounding air, thus leading to poor heat dissipation of the copper busbar. Utility Model Content

[0005] This application provides an electrical connection component and an electronic device. The heat sink can effectively increase the contact area between the first connection portion of the conductive component and the air, thereby improving the heat exchange capacity between the first connection portion and the surrounding air, and thus improving the heat dissipation effect of the electrical connection component.

[0006] In a first aspect, embodiments of this application provide an electrical connection assembly for electrically connecting at least two circuit boards, comprising a conductive element and at least two heat sinks. The conductive element includes at least two first connection portions, each first connection portion being electrically connected to each other, and each first connection portion being electrically connected to at least a portion of the circuit board. At least one heat sink is connected to each first connection portion, and at least a portion of the heat sink connected to the first connection portion protrudes from the surface of the corresponding first connection portion.

[0007] In some possible implementations, the heat sink includes a first connecting segment and a first heat dissipation segment connected to the first connecting segment, the first connecting segment being connected to a corresponding first connecting portion, and the first heat dissipation segment extending in a direction away from the corresponding first connecting portion.

[0008] In some possible implementations, there is a first included angle between the first heat dissipation section and the first connecting section.

[0009] In some possible implementations, the first included angle is greater than or equal to 110° and less than or equal to 150°.

[0010] And / or, the first connection portion includes a second connection segment and a second heat dissipation segment connected to the second connection segment, the second connection segment being used to connect to a corresponding circuit board, and the second heat dissipation segment extending in a direction away from the corresponding circuit board.

[0011] In some possible implementations, there is a second included angle between the second heat dissipation section and the second connecting section, which is different from the first included angle.

[0012] And / or, the second heat dissipation segment corresponds one-to-one with the first heat dissipation segment, the second heat dissipation segment is located outside the first heat dissipation segment, and there is a gap between the second heat dissipation segment and the corresponding first heat dissipation segment.

[0013] In some possible implementations, the second included angle is greater than or equal to 140° and less than or equal to 160°.

[0014] And / or, the second included angle is greater than the first included angle.

[0015] In some possible implementations, the conductive element further includes a second connecting portion, which is electrically connected to each of the first connecting portions.

[0016] In some possible implementations, at least one heat sink is connected to the second connection portion, and at least a portion of the heat sink connected to the second connection portion protrudes from the surface of the second connection portion.

[0017] And / or, the second connection portion includes a third connection segment and at least two fourth connection segments, each fourth connection segment being electrically connected to each first connection portion in a one-to-one correspondence, the third connection segment being electrically connected to each fourth connection segment, and the third connection segment being used for electrical connection with a circuit board; along the thickness direction of the conductive element, the third connection segment is spaced apart from at least one first connection portion.

[0018] In some possible implementations, the conductive element is a copper busbar.

[0019] And / or, the heat sink is a heat sink fin.

[0020] Secondly, embodiments of this application provide an electronic device including at least two circuit boards and any of the electrical connection components provided in the first aspect. The electrical connection components are electrically connected to each circuit board.

[0021] The electrical connection component and electronic device provided in this application embodiment are electrically connected one-to-one with each of the first connection portions of the electrical connection component and at least a portion of the circuit boards, so that the conductive components can form a conductive path between at least a portion of the circuit boards through the mutually electrically connected first connection portions, thereby realizing the transmission of electrical energy between different circuit boards.

[0022] Each first connection portion is connected to at least one heat sink, and the heat sink protrudes at least partially from the surface of the corresponding first connection portion. This allows the protruding heat sink to effectively increase the surface area of ​​the first connection portion in contact with the surrounding air, so that the heat generated by the first connection portion itself and the heat conducted to the first connection portion from other locations of the conductive element can be further transferred to the surrounding air through the heat sink, thereby enhancing the heat exchange capacity between the first connection portion and the air.

[0023] In this way, the connection points of each first connection part and the corresponding circuit board can be cooled by heat sinks, reducing the accumulation of heat at the connection points between the conductive parts and the circuit boards, thereby improving the heat dissipation effect at the connection points between the conductive parts and the circuit boards, and improving the overall heat dissipation performance of the electrical connection assembly. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0025] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of a first structure of an electrical connection assembly provided in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of a second structure of an electrical connection assembly provided in an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10. Circuit board; 20. Electrical connection assembly;

[0030] 100. Conductive component; 110. First connecting part; 111. Second connecting section; 112. Second heat dissipation section; 120. Second connecting part; 121. Third connecting section; 122. Fourth connecting section;

[0031] 200, Heat sink; 210, First connecting section; 220, First heat sink section;

[0032] 300, gap.

[0033] To facilitate understanding of the embodiments of this application, the spline curves and arrows used in the reference numerals in the accompanying drawings are explained below: the components indicated by spline curves without arrows can be solid components, that is, components with solid structures; the components indicated by spline curves with arrows can be virtual components, that is, components without solid structures; in some cases, the components indicated by spline curves with arrows can also be assemblies with solid structures or virtual structures.

[0034] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the embodiments of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships (if present), are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Where there is no conflict, embodiments of this application and the various features thereof can be combined with each other, all of which are within the scope of protection of this application.

[0037] Electronic devices such as energy storage inverters need to transmit electrical energy between different circuit boards through internal electrical connection structures during operation.

[0038] In related technologies, electrical connections between two adjacent circuit boards are usually achieved through copper busbars. The heat generated during the operation of the copper busbars is mainly dissipated through natural heat exchange between the surface of the copper busbars and the surrounding air.

[0039] However, the contact area between the copper busbar and the circuit board and the air is small, resulting in poor heat exchange between the connection and the surrounding air, thus leading to poor heat dissipation of the copper busbar.

[0040] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 2 This is a schematic diagram of a first structure of the electrical connection assembly 20 provided in an embodiment of this application.

[0041] In view of this, such as Figure 1 and Figure 2 As shown, this application embodiment provides an electrical connection assembly 20 for electrically connecting at least two circuit boards 10, including a conductive element 100 and at least two heat sinks 200. The conductive element 100 includes at least two first connection portions 110, each first connection portion 110 being electrically connected to each other, and each first connection portion 110 being electrically connected to at least a portion of the circuit board 10 in a one-to-one correspondence. At least one heat sink 200 is connected to each first connection portion 110, and at least a portion of the heat sink 200 connected to the first connection portion 110 protrudes from the surface of the corresponding first connection portion 110.

[0042] Specifically, each of the first connecting parts 110 is electrically connected to at least a portion of the circuit boards 10 in a one-to-one correspondence, so that the conductive element 100 can form a conductive path between at least a portion of the circuit boards 10 through the mutually electrically connected first connecting parts 110, thereby realizing the transmission of electrical energy between different circuit boards 10.

[0043] Each first connecting portion 110 is connected to at least one heat sink 200, and the heat sink 200 protrudes at least partially from the surface of the corresponding first connecting portion 110. This protruding heat sink 200 can effectively increase the surface area of ​​the first connecting portion 110 in contact with the surrounding air, so that the heat generated by the first connecting portion 110 itself and the heat conducted to the first connecting portion 110 from other locations of the conductive member 100 can be further transferred to the surrounding air through the heat sink 200, thereby enhancing the heat exchange capacity between the first connecting portion 110 and the air.

[0044] In this way, the connection positions of each first connection part 110 and the corresponding circuit board 10 can be cooled by the heat sink 200, reducing the accumulation of heat at the connection positions of the conductive part 100 and the circuit board 10, thereby improving the heat dissipation effect at the connection positions of the conductive part 100 and each circuit board 10, and improving the overall heat dissipation performance of the electrical connection assembly 20.

[0045] In some embodiments, the conductive element 100 may be made of copper, copper alloy, aluminum, aluminum alloy or other materials with conductive properties.

[0046] The conductive element 100 can be plate-shaped, strip-shaped, sheet-shaped, or other structures that can form conductive paths between multiple circuit boards 10.

[0047] In some embodiments, the number of first connection parts 110 may be two, three or more. The specific number of first connection parts 110 may be determined according to the number of circuit boards 10 that need to be connected, so that each first connection part 110 forms a one-to-one electrical connection relationship with at least a portion of the circuit boards 10.

[0048] In some embodiments, the first connecting portion 110 and the corresponding circuit board 10 may be connected by welding, screw connection, bolt connection, riveting, crimping, plugging, or other connection methods that can achieve electrical connection. Different first connecting portions 110 and corresponding circuit boards 10 may use the same connection method or different connection methods.

[0049] In some embodiments, one heat sink 200 may be provided on each first connection portion 110, or two or more heat sinks 200 may be provided. The number of heat sinks 200 on each first connection portion 110 may be the same, or the number may be set differently according to the heat generation, installation space or heat dissipation requirements of different first connection portions 110.

[0050] In some embodiments, when multiple heat sinks 200 are disposed on the same first connecting portion 110, they can be disposed at intervals or arranged in a predetermined direction.

[0051] In some embodiments, the heat sink 200 may be in the form of a sheet, plate, strip, column, needle, or other structure that can increase the contact area with air.

[0052] The heat sink 200 can be made of copper, aluminum, copper alloy, aluminum alloy or other materials with thermal conductivity.

[0053] In some embodiments, the heat sink 200 may be integrally formed with the first connecting portion 110 or may be separately disposed from the first connecting portion 110. The separately disposed heat sink 200 may be fixed to the first connecting portion 110 by welding, riveting, fastening, snap-fitting, thermally conductive bonding, or other connection methods.

[0054] In some embodiments, the heat sink 200 may protrude entirely from the surface of the first connecting portion 110, or only a portion of it may protrude from the surface of the first connecting portion 110, as long as the protruding portion can effectively increase the heat exchange area between the first connecting portion 110 and the air.

[0055] In some embodiments, the heat sinks 200 on different first connection portions 110 may adopt the same structure, size and arrangement, or may adopt different structures, sizes or arrangements according to the installation space around each first connection portion 110, heat distribution and heat dissipation requirements.

[0056] Figure 3This is a schematic diagram of a second structure of the electrical connection assembly 20 provided in an embodiment of this application. In the figure, X is defined as the first included angle, and Y is defined as the second included angle.

[0057] In some possible implementations, such as Figure 2 and Figure 3 As shown, the heat sink 200 includes a first connecting section 210 and a first heat sink section 220 connected to the first connecting section 210. The first connecting section 210 is connected to a corresponding first connecting portion 110, and the first heat sink section 220 extends in a direction away from the corresponding first connecting portion 110.

[0058] The heat sink 200 includes a first connecting section 210 and a first heat sink section 220 connected to the first connecting section 210. The first connecting section 210 is connected to the corresponding first connecting part 110, so that a stable connection relationship is formed between the first connecting part 110 and the heat sink 200, and the heat at the first connecting part 110 can be transferred to the first heat sink section 220 through the first connecting section 210.

[0059] The first heat dissipation section 220 extends in a direction away from the corresponding first connecting portion 110, thereby allowing the first heat dissipation section 220 to extend into the air space surrounding the first connecting portion 110, reducing the overlap between the surface of the first heat dissipation section 220 and the surface of the first connecting portion 110, and giving the first heat dissipation section 220 more sufficient air contact space, thereby increasing the surface area of ​​the heat sink 200 that actually participates in heat exchange.

[0060] At the same time, after the first heat dissipation section 220 extends away from the first connecting part 110, it can further conduct the relatively concentrated heat at the first connecting part 110 to the surrounding space, so that the heat can be exchanged with the surrounding air in a larger space, reducing the possibility of heat concentrating near the first connecting part 110.

[0061] In this way, the connection and heat transfer between the heat sink 200 and the first connecting part 110 are realized through the first connecting section 210, and the area for heat exchange with the air is expanded by the outward-extending first heat sink section 220, thereby improving the heat dissipation efficiency of the heat sink 200 to the first connecting part 110 and helping to reduce heat accumulation near the first connecting part 110.

[0062] In some embodiments, the first connecting segment 210 and the first heat dissipation segment 220 can be integrally formed, for example by stamping, bending, extrusion or machining; the first connecting segment 210 and the first heat dissipation segment 220 can also be formed separately and then connected into one.

[0063] In some embodiments, the first connecting segment 210 may be in the form of a sheet, plate, strip or block, or may adopt other structural forms that can form a connection with the first connecting portion 110.

[0064] In some embodiments, the first connecting segment 210 may be entirely attached to the first connecting portion 110, or only a portion thereof may be in contact with the first connecting portion 110, as long as the connection and heat transfer between the first connecting segment 210 and the first connecting portion 110 can be achieved.

[0065] In some embodiments, the first connecting segment 210 can be connected to the first connecting part 110 by welding, riveting, screw connection, bolt connection, snap-fitting, crimping or thermally conductive bonding, or other methods that can achieve connection.

[0066] In some embodiments, the first heat dissipation section 220 may be in the form of a sheet, plate, strip, belt, or other structure capable of exchanging heat with the air.

[0067] In some embodiments, the first heat dissipation section 220 may extend in a straight line or in an arc, curve or bend, as long as the first heat dissipation section 220 has at least a portion extending in a direction away from the first connection portion 110.

[0068] In some embodiments, the first heat dissipation segment 220 may extend from the edge of the first connecting segment 210, or from the middle of the first connecting segment 210 or other locations.

[0069] In some embodiments, a first heat dissipation segment 220 may be connected to a first connection segment 210, or two or more first heat dissipation segments 220 may be connected. When multiple first heat dissipation segments 220 are provided, the first heat dissipation segments 220 may be spaced apart or extend in different directions.

[0070] In some embodiments, the extension length of the first heat dissipation segment 220 in the direction away from the first connection portion 110 can be set according to the installation space around the first connection portion 110 and the heat dissipation requirements. The first heat dissipation segments 220 of different heat dissipation components 200 may have the same extension length or different extension lengths.

[0071] In some embodiments, the first connecting section 210 and the first heat dissipation section 220 in different heat dissipation components 200 may adopt the same structure and size, or they may adopt different structures or sizes according to the position of the corresponding first connecting part 110, the surrounding space and heat dissipation requirements.

[0072] In some possible implementations, such as Figure 3 As shown, there is a first included angle between the first heat dissipation section 220 and the first connecting section 210, as shown in the figure. Figure 3 As shown by X in the diagram.

[0073] The first heat dissipation section 220 and the first connecting section 210 have a first included angle, so that the first heat dissipation section 220 extends at an angle relative to the first connecting section 210. This allows the first heat dissipation section 220 to extend in a direction away from the plane where the first connecting section 210 is located, reducing the situation where the first heat dissipation section 220 and the surface of the first connecting part 110 are close to each other or overlap in a large area.

[0074] In this way, the first heat dissipation section 220 can have more external space and expose more of its two side surfaces to the air, thereby increasing the area of ​​the first heat dissipation section 220 that actually participates in air heat exchange.

[0075] Meanwhile, after the first heat dissipation section 220 is tilted, a space for air to enter and flow can be formed between it and the first connecting part 110, which is conducive to the circulation of air and heat diffusion around the first heat dissipation section 220.

[0076] Therefore, by making the first heat dissipation section 220 extend at an angle relative to the first connecting section 210, the heat exchange capacity between the first heat dissipation section 220 and the surrounding air can be improved, thereby further enhancing the heat dissipation effect of the heat sink 200.

[0077] In some embodiments, the first included angle can be an acute angle, a right angle, or an obtuse angle, and can be specifically set according to the extension direction of the first heat dissipation section 220, the installation space around the first connecting part 110, and the heat dissipation requirements.

[0078] In some embodiments, the first included angle can be formed by bending the heat sink 200 or directly during the forming process of the heat sink 200.

[0079] In some embodiments, the first connecting segment 210 and the first heat dissipation segment 220 can be connected by an arc-shaped transition portion, in which case the first included angle can be determined according to the respective main extension directions of the first connecting segment 210 and the first heat dissipation segment 220.

[0080] In some embodiments, when the same heat sink 200 has multiple first heat sink segments 220, the first included angle formed between each first heat sink segment 220 and the first connecting segment 210 may be the same or different.

[0081] In some embodiments, the heat sinks 200 on different first connection portions 110 may have the same first included angle, or different first included angles may be set according to the space conditions around different first connection portions 110.

[0082] In some embodiments, the first heat dissipation section 220 may be tilted toward one side of the first connecting section 210 or toward the other side of the first connecting section 210. The specific tilting direction may be set according to the structural layout of the electrical connection component 20.

[0083] In some embodiments, the first heat dissipation section 220 may be inclined as a whole relative to the first connecting section 210, or only a part of it may be inclined relative to the first connecting section 210, as long as the first heat dissipation section 220 and the first connecting section 210 form a first angle.

[0084] In some possible implementations, such as Figure 3 As shown, the first included angle is greater than or equal to 110° and less than or equal to 150°.

[0085] And / or, the first connection portion 110 includes a second connection segment 111 and a second heat dissipation segment 112 connected to the second connection segment 111. The second connection segment 111 is used to connect to the corresponding circuit board 10, and the second heat dissipation segment 112 extends in a direction away from the corresponding circuit board 10.

[0086] When the first included angle is greater than or equal to 110° and less than or equal to 150°, the first heat dissipation section 220 can maintain a relatively sufficient degree of inclination. However, if the first included angle is too small, the first heat dissipation section 220 has a larger degree of folding relative to the first connecting section 210, making it more likely to approach the connection area between the first connecting section 210 and the first connecting part 110, potentially interfering with the connection operation or structure between the first connecting section 210 and the first connecting part 110. Conversely, if the first included angle is too large, the inclination of the first heat dissipation section 220 relative to the first connecting section 210 decreases, making it more likely to approach the surface of the first connecting part 110, thereby compressing the air space around the first heat dissipation section 220 and reducing its exposure to air. Therefore, limiting the first included angle to between 110° and 150° can reduce structural interference while maintaining a good unfolded state for the first heat dissipation section 220, thus balancing connection convenience and heat dissipation effect.

[0087] The first connecting portion 110 includes a second connecting section 111 and a second heat dissipation section 112 connected to the second connecting section 111. The second connecting section 111 is used to connect to the corresponding circuit board 10, and the second heat dissipation section 112 extends in a direction away from the corresponding circuit board 10. This arrangement allows the first connecting portion 110 to perform its electrical connection function while extending outwards from the circuit board 10 using the second heat dissipation section 112. This increases the surface area of ​​the first connecting portion 110 exposed to the air and allows heat generated or conducted to the second connecting section 111 to further diffuse to the second heat dissipation section 112. Thus, in addition to heat dissipation through the heat sink 200, the first connecting portion 110 can also exchange heat with the surrounding air through its own second heat dissipation section 112, thereby increasing the heat dissipation path at the connection point and further improving the heat dissipation capacity of the connection area between the first connecting portion 110 and the circuit board 10.

[0088] In some embodiments, the first included angle can be 110°, 115°, 120°, 125°, 130°, 135°, 140°, 145° or 150°, or any other angle between any two of the above angles.

[0089] In some embodiments, the second connecting segment 111 and the second heat dissipation segment 112 can be integrally formed, or they can be formed separately and then connected into one.

[0090] In some embodiments, the second connecting segment 111 may be in the form of a sheet, plate, strip or block, and its shape may be set according to the connecting area on the circuit board 10 and the overall structure of the first connecting portion 110.

[0091] In some embodiments, the second heat dissipation section 112 may be in the form of a sheet, plate, strip, belt, or other structure that can increase the contact area with air.

[0092] In some embodiments, the second heat dissipation section 112 may extend in a straight line, or it may extend in a bent, arc or curved shape, as long as the second heat dissipation section 112 has at least a portion extending in a direction away from the corresponding circuit board 10.

[0093] In some embodiments, a second connecting segment 111 may connect to a second heat dissipation segment 112, or connect to two or more second heat dissipation segments 112. The multiple second heat dissipation segments 112 may be spaced apart or extend in different directions.

[0094] In some embodiments, the second heat dissipation section 112 may extend outward from the edge of the second connecting section 111, or from the middle of the second connecting section 111 or other locations.

[0095] In some embodiments, the second heat dissipation section 112 in different first connection portions 110 may have the same shape, size and extension direction, or may have different shapes, sizes or extension directions depending on the positional relationship of different circuit boards 10, installation space and heat dissipation requirements.

[0096] In some possible implementations, such as Figure 3 As shown, there is a second included angle between the second heat dissipation section 112 and the second connecting section 111. The second included angle is different from the first included angle. The second included angle is as follows: Figure 3 As shown in Y.

[0097] And / or, the second heat dissipation section 112 corresponds one-to-one with the first heat dissipation section 220, the second heat dissipation section 112 is located outside the first heat dissipation section 220, and there is a gap 300 between the second heat dissipation section 112 and the corresponding first heat dissipation section 220.

[0098] The second heat dissipation section 112 and the second connecting section 111 have a second included angle, and the second included angle is different from the first included angle. This allows the second heat dissipation section 112 and the first heat dissipation section 220 to form different tilt postures, so that the two extend outward in different directions or with different degrees of tilt, thereby reducing the situation where the first heat dissipation section 220 and the second heat dissipation section 112 overlap, block each other, or cause structural interference in space.

[0099] In this way, the first heat dissipation section 220 and the second heat dissipation section 112 can each form a relatively sufficient air contact space, so that their surfaces are exposed to the surrounding air more, and it is conducive to the flow of air around them.

[0100] Therefore, by setting different first and second included angles, the positions of the first heat dissipation section 220 and the second heat dissipation section 112 can be reasonably staggered, improving the heat exchange effect of both while taking into account the structural layout.

[0101] The second heat dissipation section 112 corresponds one-to-one with the first heat dissipation section 220, and the second heat dissipation section 112 is located outside the corresponding first heat dissipation section 220. This allows the corresponding first heat dissipation section 220 and the second heat dissipation section 112 to be arranged in a relatively concentrated area, reducing the space occupied by them in other directions, thereby helping to control the overall size of the electrical connection assembly 20. At the same time, there is a gap 300 between the second heat dissipation section 112 and the corresponding first heat dissipation section 220, which can prevent them from being too close to each other, so that the first heat dissipation section 220 and the second heat dissipation section 112 each have a surface that can contact the air, and a heat exchange space for air to enter and flow is formed between them.

[0102] In this way, the first heat dissipation section 220 and the second heat dissipation section 112 can exchange heat with the surrounding air respectively, and the air between them can participate in heat exchange, thereby reducing the space occupied by the structure while improving the heat dissipation capacity at the connection position.

[0103] In some embodiments, the second included angle can be greater than the first included angle or less than the first included angle, as long as the second included angle is different from the first included angle.

[0104] In some embodiments, the angle difference between the first included angle and the second included angle can be set according to the length and thickness of the first heat dissipation segment 220 and the second heat dissipation segment 112 and the surrounding installation space, so that the first heat dissipation segment 220 and the second heat dissipation segment 112 are staggered.

[0105] In some embodiments, the gap 300 between the second heat dissipation segment 112 and the corresponding first heat dissipation segment 220 may remain substantially consistent along the extension direction of the second heat dissipation segment 112 and / or the first heat dissipation segment 220, or it may gradually increase or decrease along the extension direction.

[0106] In some embodiments, the gap 300 between different second heat dissipation sections 112 and the corresponding first heat dissipation section 220 can be the same size, or it can be set to different sizes according to the installation space and heat dissipation requirements of the corresponding positions.

[0107] In some embodiments, the second heat dissipation section 112 and the first heat dissipation section 220 can be arranged substantially parallel to each other or inclined to each other, as long as a gap of 300 is maintained between them.

[0108] In some possible implementations, such as Figure 3 As shown, the second included angle is greater than or equal to 140° and less than or equal to 160°.

[0109] And / or, the second included angle is greater than the first included angle.

[0110] When the second included angle is greater than or equal to 140° and less than or equal to 160°, the second heat dissipation section 112 can be kept at an appropriate degree of inclination.

[0111] When the second included angle is too small, the second heat dissipation section 112 has a larger degree of folding relative to the second connecting section 111, and is more likely to approach the connection area between the second connecting section 111 and the circuit board 10 or the connection area between the first connecting section 210 and the first connecting part 110, which may interfere with the corresponding connection structure or assembly operation. When the second included angle is too large, the inclination of the second heat dissipation section 112 relative to the second connecting section 111 is reduced, and it is more likely to approach the surface of the circuit board 10, thereby compressing the air space between the second heat dissipation section 112 and the circuit board 10 and reducing the degree to which the second heat dissipation section 112 is fully exposed to the air.

[0112] Therefore, limiting the second included angle to between 140° and 160° can reduce structural interference while maintaining sufficient heat exchange space between the second heat dissipation section 112 and the circuit board 10, thus balancing structural layout and heat dissipation effect.

[0113] The second included angle is greater than the first included angle, making the inclination of the second heat dissipation segment 112 relative to the second connecting segment 111 less than the inclination of the first heat dissipation segment 220 relative to the first connecting segment 210. This allows the first heat dissipation segment 220 to extend outward more fully, creating different spatial extension postures between the first and second heat dissipation segments 220. Thus, when the second heat dissipation segment 112 is located outside the first heat dissipation segment 220, it reduces the possibility of the second heat dissipation segment 112 excessively tilting towards the space where the first heat dissipation segment 220 is located, decreasing the likelihood of the second heat dissipation segment 112 obstructing or encroaching on the heat exchange space around the first heat dissipation segment 220. This allows the first heat dissipation segment 220 to have more sufficient contact with the surrounding air. Simultaneously, the second heat dissipation segment 112 can still exchange heat with the air using its own surface. Therefore, while increasing the heat exchange area of ​​the conductive component 100 using the second heat dissipation segment 112, it also helps to ensure the heat exchange effect of the first heat dissipation segment 220.

[0114] In some embodiments, the second included angle can be 140°, 145°, 150°, 155° or 160°, or any other angle between any two of the above angles.

[0115] In some embodiments, the second included angle may be slightly larger than the first included angle, or it may be significantly larger than the first included angle. The angle difference between the two can be set according to the length and spacing of the first heat dissipation section 220 and the second heat dissipation section 112, as well as the surrounding installation space.

[0116] In some embodiments, the second included angle at different first connecting portions 110 may have the same angle difference with the first included angle, or they may have different angle differences.

[0117] In some possible implementations, such as Figure 2 As shown, the conductive component 100 also includes a second connecting portion 120, which is electrically connected to each of the first connecting portions 110.

[0118] The conductive component 100 further includes a second connecting portion 120, which is electrically connected to each of the first connecting portions 110. This allows the second connecting portion 120 to electrically connect multiple first connecting portions 110, forming a continuous conductive path between them. Thus, the first connecting portions 110 do not need to be connected to each other through independent conductive structures; current can be transmitted between different first connecting portions 110 using the second connecting portion 120. This allows the conductive component 100 to form an integral conductive structure capable of connecting multiple circuit boards 10.

[0119] Meanwhile, the second connection part 120 can centrally connect each of the first connection parts 110, which helps to simplify the connection relationship between multiple first connection parts 110 and facilitates the arrangement of the overall structure of the conductive component 100 according to the positional relationship of multiple circuit boards 10, thereby improving the adaptability of the electrical connection assembly 20 to the connection scenario of multiple circuit boards 10.

[0120] In some embodiments, the second connecting portion 120 may be integrally formed with each of the first connecting portions 110, so that the second connecting portion 120 and each of the first connecting portions 110 directly form a conductive connection.

[0121] In other embodiments, the second connecting portion 120 may be separately disposed from at least one first connecting portion 110 and connected by welding, riveting, bolting, pressing or other means that can form a conductive connection.

[0122] In some embodiments, the second connecting portion 120 may be plate-shaped, sheet-shaped, strip-shaped, band-shaped, or block-shaped, or may be formed into a bent or tortuous structure according to the positional relationship between each of the first connecting portions 110.

[0123] In some embodiments, the second connecting portion 120 may extend in a straight direction or may include one or more bending regions to accommodate the first connecting portion 110 located at different positions or in different directions.

[0124] In some embodiments, each first connecting portion 110 may be connected to the same side of the second connecting portion 120, or may be connected to different sides of the second connecting portion 120, or may be spaced apart along the length direction, width direction or circumferential direction of the second connecting portion 120.

[0125] In some embodiments, each first connecting portion 110 may be connected to the end, middle or the area between the end and middle of the second connecting portion 120, and the specific connection position may be set according to the position of each circuit board 10.

[0126] In some embodiments, the thickness and width of the second connection portion 120 may remain substantially consistent along the extension direction, or may vary according to the current carrying requirements or structural arrangement at different locations.

[0127] In some possible implementations, at least one heat sink 200 is connected to the second connection portion 120, and at least a portion of the heat sink 200 connected to the second connection portion 120 protrudes from the surface of the second connection portion 120.

[0128] And / or, such as Figure 2As shown, the second connection portion 120 includes a third connection segment 121 and at least two fourth connection segments 122. Each fourth connection segment 122 is electrically connected to each first connection portion 110 in a one-to-one correspondence. The third connection segment 121 is electrically connected to each fourth connection segment 122. The third connection segment 121 is used to electrically connect to a circuit board 10. Along the thickness direction of the conductive member 100, the third connection segment 121 is spaced apart from at least one first connection portion 110.

[0129] At least one heat sink 200 is connected to the second connecting portion 120, and the heat sink 200 connected to the second connecting portion 120 at least partially protrudes from the surface of the second connecting portion 120. This protruding heat sink 200 effectively increases the heat exchange area of ​​the second connecting portion 120 in contact with the surrounding air, allowing the heat generated by the second connecting portion 120 itself, as well as the heat conducted to the second connecting portion 120 by each of the first connecting portions 110, to be further transferred to the heat sink 200 and dissipated into the surrounding air through the heat sink 200. Thus, the heat dissipation effect is no longer limited to each of the first connecting portions 110, but can further cover the second connecting portion 120, thereby reducing the possibility of heat accumulation at different locations of the conductive component 100 and improving the overall heat dissipation capacity of the conductive component 100.

[0130] The second connection portion 120 includes a third connection segment 121 and at least two fourth connection segments 122. Each fourth connection segment 122 is electrically connected to each first connection portion 110 in a one-to-one correspondence. The third connection segment 121 is electrically connected to each fourth connection segment 122. Thus, the third connection segment 121 and each fourth connection segment 122 can be used to form a conductive connection between multiple first connection portions 110, and the third connection segment 121 can be further electrically connected to a circuit board 10, thereby forming a conductive structure that can adapt to multiple connection positions.

[0131] Meanwhile, along the thickness direction of the conductive element 100, the third connecting segment 121 is spaced apart from at least one first connecting portion 110, allowing the third connecting segment 121 and the corresponding first connecting portion 110 to be in different spatial positions. This provides space for the circuit boards 10 connected to the third connecting segment 121 and the first connecting portion 110 respectively, reducing the possibility of interference between different circuit boards 10 or corresponding connection structures. In this way, by forming a spatially misaligned conductive path through the third connecting segment 121, the fourth connecting segment 122, and the first connecting portion 110, the conductive element 100 can be improved to adapt to the positional relationships of different circuit boards 10 while achieving electrical connection of multiple circuit boards 10.

[0132] In some embodiments, one, two or more heat sinks 200 may be provided on the second connection part 120. The specific number can be set according to the size of the second connection part 120, the heat generation situation and the surrounding installation space.

[0133] In some embodiments, the heat sink 200 on the second connecting portion 120 can be integrally formed with the second connecting portion 120 or can be separately provided and connected by welding, riveting, fastening, snap-fitting or thermally conductive bonding.

[0134] In some embodiments, the heat sink 200 on the second connection portion 120 may protrude entirely from the surface of the second connection portion 120, or may only protrude partially from the surface of the second connection portion 120.

[0135] In some embodiments, the third connecting segment 121 and each of the fourth connecting segments 122 can be integrally formed, or they can be formed separately and then connected by welding, riveting, fastening or other means that can form an electrical connection.

[0136] In some embodiments, the third connecting segment 121 may be plate-shaped, sheet-shaped, strip-shaped or block-shaped, or may be formed into a bent structure according to the connection position with the circuit board 10.

[0137] In some embodiments, the fourth connecting segment 122 may be straight, bent, or zigzag, and its extension direction and length may be set according to the positional relationship between the corresponding first connecting portion 110 and the third connecting segment 121.

[0138] In some embodiments, the number of fourth connecting segments 122 can be two, three or more, and they are electrically connected one-to-one with the corresponding number of first connecting portions 110.

[0139] In some embodiments, each fourth connecting segment 122 may be connected to the same side of the third connecting segment 121, or to different sides of the third connecting segment 121, or may be spaced apart along the length or width direction of the third connecting segment 121.

[0140] In some embodiments, the third connecting segment 121 may be spaced apart from one first connecting portion 110 along the thickness direction of the conductive member 100, or it may be spaced apart from two or more first connecting portions 110 along the thickness direction of the conductive member 100.

[0141] In some embodiments, the spacing between the third connecting segment 121 and different first connecting portions 110 along the thickness direction of the conductive element 100 can be the same, or it can be set to different distances according to the positional relationship of the corresponding circuit boards 10.

[0142] In some possible implementations, the conductive element 100 is a copper busbar.

[0143] And / or, the heat sink 200 is a heat sink fin.

[0144] The conductive component 100 is made of copper busbar, which utilizes the excellent conductivity of copper to reduce resistance during current transmission between different circuit boards 10, thereby reducing the resistance-induced heat generation of the conductive component 100 itself. Simultaneously, copper has good thermal conductivity, allowing heat generated or received at localized locations such as the first connection portion 110 to be conducted and diffused to other areas along the copper busbar. This reduces the possibility of excessive heat concentration at localized connection locations and facilitates subsequent heat dissipation to the surrounding air through the heat sink 200 and the surface of the copper busbar itself. Therefore, using a copper busbar balances the current-carrying capacity and heat conduction capacity of the electrical connection component 20.

[0145] The heat sink 200 employs heat dissipation fins, which, through a relatively thin and outwardly extending fin structure, achieve a large air contact area within a small structural volume. This allows heat transferred to the heat dissipation fins to be released to the surrounding air through the larger heat exchange surface. Simultaneously, the heat dissipation fin structure is relatively simple, facilitating manufacturing through stamping, bending, or other processing methods, and allowing for adjustments to the shape, size, and arrangement of the fins according to the installation space. Therefore, using heat dissipation fins improves the heat exchange capacity of the heat sink 200 while maintaining structural compactness and manufacturing convenience, and also helps reduce the manufacturing cost of the electrical connection assembly 20.

[0146] In some embodiments, the copper busbar can be made of pure copper, oxygen-free copper, or other copper materials with copper as the main conductive material.

[0147] In some embodiments, the surface of the copper busbar may be provided with a tin plating layer, a nickel plating layer, or other surface treatment layers to improve the oxidation resistance of the copper busbar surface or to meet the requirements of different connection processes.

[0148] In some embodiments, the thickness of the heat dissipation fins may remain substantially consistent along the extension direction, or it may vary gradually along the extension direction.

[0149] In some embodiments, multiple heat dissipation fins can be arranged parallel to each other, at different angles, or staggered according to the surrounding structure.

[0150] This application also provides an electronic device, such as... Figure 1 As shown, it includes at least two circuit boards 10 and any of the aforementioned electrical connection components 20. The electrical connection components 20 are electrically connected to each circuit board 10.

[0151] The electronic device includes at least two circuit boards 10 and an electrical connection component 20. The electrical connection component 20 is electrically connected to each circuit board 10, thereby establishing a conductive path between different circuit boards 10, enabling the transmission of electrical energy between the circuit boards 10, thus meeting the electrical connection requirements between different circuit boards 10 inside the electronic device.

[0152] Meanwhile, since the electrical connection component 20 can connect multiple circuit boards 10, the need to set up independent conductive structures for electrical connections between different circuit boards 10 can be reduced, which helps to simplify the electrical connection relationship inside the electronic device and improve the integration of electrical connection structures between multiple circuit boards 10.

[0153] Therefore, applying the electrical connection component 20 to electronic devices can achieve reliable electrical connections between multiple circuit boards 10 while facilitating the centralized arrangement of the internal structure of the electronic devices.

[0154] Specifically, the electronic device in this application adopts all the technical solutions of any of the aforementioned electrical connection components 20, and therefore has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0155] In some embodiments, the electronic device may be an energy storage inverter, a photovoltaic inverter, a converter, a power supply device, a charging device, or other electronic devices that include multiple circuit boards 10 and have power transmission requirements.

[0156] In some embodiments, the number of circuit boards 10 can be two, three or more, and the electrical connection component 20 can be electrically connected to each circuit board 10 respectively.

[0157] In some embodiments, the circuit boards 10 may be arranged parallel to each other, perpendicular to each other, or at other angles. The structure of the electrical connection assembly 20 may be adapted to the positional relationship between the circuit boards 10.

[0158] In some embodiments, multiple circuit boards 10 may have the same size and structure, or they may adopt different sizes or structures depending on their respective functions.

[0159] In some embodiments, the circuit board 10 can be a power board, control board, drive board, filter board, bus board, or other circuit board 10 with electrical connection requirements. Different circuit boards 10 can perform the same or different electrical functions.

[0160] In some embodiments, the electrical connection component 20 can connect two adjacent circuit boards 10, or it can connect circuit boards 10 that are spaced apart from each other across one or more other structures.

[0161] In some embodiments, the electrical connection component 20 may use the same connection method with different circuit boards 10, or it may use welding, screw connection, bolt connection, crimping, plugging or other methods that can form an electrical connection according to the structure of the corresponding circuit board 10.

[0162] In some embodiments, an electronic device may be provided with an electrical connection component 20 to connect multiple circuit boards 10; or multiple electrical connection components 20 may be provided, with different electrical connection components 20 connecting different combinations of circuit boards 10 respectively.

[0163] In some embodiments, multiple circuit boards 10 connected by the same electrical connection component 20 may belong to the same functional module or to different functional modules in the electronic device, thereby realizing electrical connection between different circuit boards 10 according to the actual power transmission path.

[0164] It should be understood that the embodiments of this application are not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. An electrical connection assembly for electrically connecting at least two circuit boards (10), characterized in that include: The conductive element (100) includes at least two first connecting portions (110), each of the first connecting portions (110) being electrically connected to each other, and each of the first connecting portions (110) being electrically connected to at least a portion of the circuit board (10) in a one-to-one correspondence. At least two heat sinks (200), each of the first connecting portions (110) is connected to at least one of the heat sinks (200), and at least a portion of the heat sinks (200) connected to the first connecting portion (110) protrudes from the surface of the corresponding first connecting portion (110).

2. The electrical connection assembly of claim 1, wherein, The heat sink (200) includes a first connecting segment (210) and a first heat sink segment (220) connected to the first connecting segment (210). The first connecting segment (210) is connected to the corresponding first connecting portion (110), and the first heat sink segment (220) extends in a direction away from the corresponding first connecting portion (110).

3. The electrical connection assembly according to claim 2, characterized in that, The first heat dissipation section (220) and the first connecting section (210) have a first included angle.

4. The electrical connection assembly according to claim 3, characterized in that, The first included angle is greater than or equal to 110° and less than or equal to 150°; And / or, the first connection portion (110) includes a second connection segment (111) and a second heat dissipation segment (112) connected to the second connection segment (111), the second connection segment (111) being used to connect to the corresponding circuit board (10), and the second heat dissipation segment (112) extending in a direction away from the corresponding circuit board (10).

5. The electrical connection assembly according to claim 4, characterized in that, The second heat dissipation section (112) and the second connecting section (111) have a second included angle, which is different from the first included angle; And / or, the second heat dissipation section (112) corresponds one-to-one with the first heat dissipation section (220), the second heat dissipation section (112) is located outside the first heat dissipation section (220), and there is a gap (300) between the second heat dissipation section (112) and the corresponding first heat dissipation section (220).

6. The electrical connection assembly according to claim 5, characterized in that, The second included angle is greater than or equal to 140° and less than or equal to 160°; And / or, the second included angle is greater than the first included angle.

7. The electrical connection assembly according to any one of claims 1 to 6, characterized in that, The conductive element (100) further includes a second connecting portion (120), which is electrically connected to each of the first connecting portions (110).

8. The electrical connection assembly according to claim 7, characterized in that, At least one of the heat sinks (200) is connected to the second connecting portion (120), and at least a portion of the heat sink (200) connected to the second connecting portion (120) protrudes from the surface of the second connecting portion (120); And / or, the second connection portion (120) includes a third connection segment (121) and at least two fourth connection segments (122), each of the fourth connection segments (122) being electrically connected to each of the first connection portions (110) in a one-to-one correspondence, the third connection segment (121) being electrically connected to each of the fourth connection segments (122), the third connection segment (121) being used for electrical connection to one of the circuit boards (10); along the thickness direction of the conductive element (100), the third connection segment (121) is spaced apart from at least one of the first connection portions (110).

9. The electrical connection assembly according to any one of claims 1 to 6, characterized in that, The conductive component (100) is a copper busbar; And / or, the heat sink (200) is a heat sink fin.

10. An electronic device, characterized in that, include: At least two circuit boards (10); The electrical connection component (20) according to any one of claims 1 to 9 is electrically connected to each of the circuit boards (10).

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