Heat dissipation devices and laser equipment

Abstract

This application discloses a heat dissipation device and a laser device. The heat dissipation device includes a housing, multiple first heat sinks, and a fan. An airflow channel is provided inside the housing, and an air inlet and an air outlet communicating with the airflow channel are provided on the housing. The multiple first heat sinks can be arranged side-by-side on the housing. Each first heat sink includes a first fin assembly disposed in the airflow channel, a first heat-conducting plate disposed on the housing, and a heat pipe disposed on the heat-conducting plate. The heat pipe penetrates the housing and is connected to the first fins. The fan can be located at the air inlet and / or air outlet of the housing. Heat from external devices can be transferred to the heat pipes and the first fin assembly via the first heat-conducting plate. The fan drives airflow in the airflow channel to accelerate the heat dissipation of the first fin assembly. When any first heat sink malfunctions, it can be directly disassembled for replacement or repair, resulting in lower maintenance costs.

Description

Technical Field

[0001] This application relates to the field of laser equipment, and in particular to a heat dissipation device and a laser device. Background Technology

[0002] Air-cooled lasers are characterized by their simple structure, high integration, and lack of the need for complex external cooling systems, resulting in a high degree of device integration. Air-cooled lasers eliminate the need for cooling water, antifreeze, and chillers, reducing operating costs and maintenance complexity, eliminating the risk of leaks, and offering strong adaptability—dissipating heat simply by venting air, making them easy to integrate into other devices. In contrast, the heat dissipation modules of commercially available air-cooled lasers are all integrated and cannot be disassembled; if any components in the heat dissipation module fail, the entire module must be scrapped, leading to high repair costs. Utility Model Content

[0003] This application proposes a heat dissipation device and a laser equipment, which adopts a modular design for the heat dissipation module, allowing multiple modules to be stacked and installed to reduce maintenance costs.

[0004] This application discloses a heat dissipation device for use in a laser, comprising:

[0005] The housing has an internal airflow channel, and the housing is also provided with an air inlet and an air outlet that communicate with the airflow channel;

[0006] Multiple first heat sinks are disposed within and installed on the housing. Each first heat sink includes a first fin assembly, a first heat-conducting plate, and a heat pipe. The first fin assembly is disposed in the airflow channel, the first heat-conducting plate is disposed on the housing, and one end of the heat pipe is disposed on the first heat-conducting plate, while the other end passes through the housing and is connected to the first fin.

[0007] A fan is provided at the air inlet and / or air outlet of the housing.

[0008] In some embodiments, the heat dissipation device further includes a second heat sink, which is disposed within and installed in the housing and spaced apart from the first heat sink. The second heat sink includes a second heat-conducting plate and a second fin assembly disposed on the second heat-conducting plate, the second fin assembly being located in the airflow channel.

[0009] In some embodiments, the first fin assembly is provided with a through hole, and the heat pipe is disposed in the through hole.

[0010] In some embodiments, the first heat sink and the second heat sink are arranged along the length of the housing, and the first heat-conducting plate and the second heat-conducting plate are disposed on opposite sides of the housing.

[0011] In some embodiments, the airflow channel inside the housing is arranged along the length of the housing, the air inlet and air outlet are respectively located at both ends of the housing, and the fan is located at the air inlet of the housing.

[0012] In some embodiments, a plurality of the first heat sinks are positioned close to the fan and arranged along the width of the housing.

[0013] In some embodiments, the cross-sectional area of ​​the air inlet is larger than the cross-sectional area of ​​the air outlet.

[0014] In some embodiments, the first radiator is disposed near the air inlet, the second radiator is disposed near the air outlet, the housing is recessed on the side facing the second heat-conducting plate to form a recess, and the cross-sectional area of ​​the airflow channel in the recess is smaller than the cross-sectional area of ​​the air outlet.

[0015] In some embodiments, the heat dissipation device further includes a guide plate connecting the first heat-conducting plate and the second heat-conducting plate, the guide plate being used to mount optical fibers.

[0016] This application also proposes a laser device, including the above-described heat dissipation device and a pump source disposed on the side of the first heat-conducting plate away from the housing.

[0017] This application discloses a heat dissipation device and a laser device. The heat dissipation device includes a housing, multiple first heat sinks, and a fan. An airflow channel is provided inside the housing, and an air inlet and an air outlet communicating with the airflow channel are provided on the housing. The multiple first heat sinks can be arranged side-by-side on the housing. Each first heat sink includes a first fin assembly disposed in the airflow channel, a first heat-conducting plate disposed on the housing, and a heat pipe disposed on the heat-conducting plate. The heat pipe penetrates the housing and is connected to the first fins. The fan can be located at the air inlet and / or air outlet of the housing. Heat from external devices can be transferred to the heat pipes and the first fin assembly via the first heat-conducting plate. The fan drives airflow in the airflow channel to accelerate the heat dissipation of the first fin assembly. When any first heat sink malfunctions, it can be directly disassembled for replacement or repair, resulting in lower maintenance costs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the heat dissipation device in one embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the heat dissipation device in one embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the heat dissipation device in one embodiment of this application.

[0021] Label Explanation:

[0022] 10. Shell; 11. Square tube; 12. Flat tube; 13. Recess; 14. Air inlet; 15. Air outlet; 20. First radiator; 21. First heat conduction plate; 22. First fin assembly; 23. Heat pipe; 30. Second radiator; 31. Second heat conduction plate; 32. Second fin assembly; 41. Guide plate; 42. Support component.

[0023] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments in this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that all directional indications in the embodiments of this application, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indication will also change accordingly.

[0026] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0027] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0028] This application provides a heat dissipation device, referring to... Figures 1 to 3The heat dissipation device includes: a housing 10, which has an internal airflow channel, and an air inlet 14 and an air outlet 15 communicating with the airflow channel; a plurality of first radiators 20, which are disposed on the housing 10, and each first radiator 20 includes a first fin group 22 disposed in the airflow channel, a first heat-conducting plate 21 disposed on the housing 10, and a heat pipe 23 disposed on the heat-conducting plate, the heat pipe 23 passing through the housing 10 and connected to the first fins; and a fan disposed at the air inlet 14 and / or the air outlet 15 of the housing 10.

[0029] In this embodiment, the shell 10 serves as the core support structure, and its interior is designed to be hollow, thus forming a continuous airflow channel. Air inlets 14 and outlets 15 are located on both sides (or at specific locations) of the shell 10 to ensure smooth airflow through its interior. When the fan operates, external cold air is drawn into the airflow channel through the air inlets 14, flows through the various heat dissipation modules installed within the shell 10, absorbs heat, and becomes hot air, which is then discharged from the outlets 15. This directional flow forms the basis of heat dissipation. The hollow shell 10 structure acts as an air duct, ensuring the orderly and concentrated flow of cooling air, effectively removing heat and avoiding the low heat dissipation efficiency caused by turbulence. This integrated air duct design also simplifies the overall structure. The modular first heat sink 20 is key to the efficient heat dissipation and maintainability of the entire device; it consists of a first fin group 22, a first heat-conducting plate 21, and a heat pipe 23 working in concert. The first heat-conducting plate 21 is directly mounted on the housing 10 and is typically in close contact with the main heat-generating components inside the laser (such as the pump source). Its primary function is to rapidly absorb and conduct heat. The first fin assembly 22 is located inside the airflow channel of the housing 10 and is physically connected to the first heat-conducting plate 21. It consists of numerous parallel metal fins, greatly increasing the contact area with the cooling air. The heat pipe 23 is a key heat transfer element. It penetrates the housing 10, with one end connected to the first heat-conducting plate 21 outside the housing 10 and the other end connected to the first fin assembly 22 inside the airflow channel of the housing 10. This design enables heat transfer across the walls.

[0030] The heat generated by the laser is first absorbed by the first heat-conducting plate 21, which is in contact with the heat-generating element. Next, the heat is transferred to the heat pipe 23 connected to it. The heat pipe 23 utilizes the phase change of its internal working fluid (liquid absorbs heat and evaporates, vapor releases heat and condenses at the cold end) to efficiently "pump" heat from the outside of the housing 10 to the first fin assembly 22 inside the housing 10. Finally, the first fin assembly 22 releases the heat to the cooling air flowing through the airflow channel, completing the heat dissipation. The heat pipe 23 has extremely high thermal conductivity, rapidly transferring heat from the heat source to the heat dissipation fins, reducing thermal resistance. Each first heat sink 20 (heat-conducting plate + heat pipe 23 + fin assembly) forms an independent heat dissipation module. These modules can be installed and removed independently. If a module is damaged, only that specific module needs to be replaced, without scrapping the entire heat dissipation system, significantly reducing maintenance costs and time. Multiple such modular first heat sinks 20 can be installed side-by-side or stacked on the housing 10, increasing the number of heat dissipation modules to meet the heat dissipation needs of lasers with different power, improving product serialization capabilities and application flexibility.

[0031] In some embodiments, the heat dissipation device includes a second heat sink 30 disposed on the housing 10, the second heat sink 30 being spaced apart from the first heat sink 20, the second heat sink 30 including a second heat-conducting plate 31 disposed on the housing 10, and a second fin group 32 disposed on the second heat-conducting plate 31, the second fin group 32 being located in the airflow channel.

[0032] In this embodiment, the core heat-conducting component of the second heat sink 30 is the second heat-conducting plate 31. It is typically made of a metal with excellent thermal conductivity (such as aluminum or copper alloy) and can be directly connected to the resonant cavity housing of the laser device, ensuring close contact with the heat source. To improve thermal conductivity, thermally conductive silicone grease or other high-performance thermally conductive media are often filled between the contact surface of the second heat-conducting plate 31 and the resonant cavity. The second fin group 32 consists of a large number of parallel metal fins, located inside the airflow channel of the housing 10, and is physically connected to the second heat-conducting plate 31. These fins greatly increase the contact area with the cooling air. The fin surface may be machined with grooves or corrugated structures to disrupt the boundary layer of airflow and further enhance the heat transfer effect. The second heat sink 30 and the first heat sink 20 are arranged alternately within the housing 10. This layout takes into account the different physical locations of the resonant cavity and other heat-generating components of the laser. Each heat sink (the first heat sink 20 and the second heat sink 30) is an independent heat dissipation module. They can be flexibly installed in different parts of the housing 10 according to the specific location of the heat source inside the laser. This design allows the heat dissipation device to precisely target each major heat source, achieving directional and efficient targeted heat dissipation. Although physically separated, the first fin group 22 of the first heat sink 20 and the second fin group 32 of the second heat sink 30 are both located in the same continuous airflow channel. The cooling airflow generated by one or a group of fans can flow through these two sets of fins sequentially or simultaneously, achieving "multi-purpose airflow," ensuring the overall efficiency of the heat dissipation system and simplifying the structure.

[0033] As the core optical component of a laser, the resonant cavity is highly sensitive to temperature fluctuations. Effective thermal management directly affects the stability of laser output, beam quality, and device lifespan. During laser operation, the gain medium and other components within the resonant cavity generate a significant amount of heat. This heat is first conducted to the second heat-conducting plate 31, which is in close contact with it. The second heat-conducting plate 31 acts as a heat spreader, rapidly diffusing the concentrated heat laterally across its entire surface and conducting it to the base of the second fin assembly 32 connected to it. When the fan operates, cooling airflow passes through the second fin assembly 32. Heat is transferred from the fin surface to the air, carried away by the airflow, and exhausted outside the device, thereby continuously reducing the temperature of the resonant cavity. Providing a separate second heat sink 30 for the resonant cavity offers precise and robust heat dissipation. This ensures that the resonant cavity, especially the gain medium, can be maintained at a suitable and stable operating temperature. This is crucial for suppressing the thermal lensing effect of the laser, reducing thermally induced wavelength drift, and ensuring output beam quality and energy stability. The second heat sink 30, as an independent module, further enhances the maintainability and design flexibility of the entire heat dissipation system. If the second heat sink 30 is damaged, it can be replaced individually, significantly reducing maintenance costs. At the same time, this modular design facilitates product line expansion; by adjusting the number and layout of different heat sink modules, it can flexibly adapt to lasers of different power and models.

[0034] In some embodiments, the first fin group 22 has through holes, and the heat pipe 23 is disposed in the through holes. The first fin group 22 is composed of multiple independent metal fins (usually made of aluminum or copper) stacked together, which are fixed in the airflow channel in a specific manner. Each fin has a pre-formed through hole, the size of which matches the outer diameter of the heat pipe 23, and the position is precisely designed to ensure that the heat pipe 23 can smoothly pass through the corresponding through holes on all fins in sequence. To optimize the connection effect and heat conduction efficiency, the structure of the through hole edge may be specially treated. For example, part of the metal at the through hole edge is folded up to form a ring-shaped vertical edge. This can increase the contact area between the fin and the heat pipe 23, and sometimes facilitates further fixation by welding or other methods. A ring-shaped sleeve structure extends from the through hole edge, through which the heat pipe 23 passes directly. This design can achieve a tight mechanical fit between the heat pipe 23 and the fin, sometimes even without welding, ensuring stability and reducing contact thermal resistance. Sometimes, the fixed sleeve is designed with a perforated shape, which facilitates the installation and removal of the heat dissipation fins and ensures direct contact between the heat pipe 23 and the heat exchange medium, thus improving heat exchange efficiency. After the entire assembly is completed, the heat pipe 23 will firmly penetrate the entire first fin assembly 22, with its two ends connected to the first heat-conducting plate 21 located on the outside of the housing 10 and the fin portion in the airflow channel inside the housing 10, respectively. Through the tight fit of the through holes and auxiliary structures (such as sleeves), the contact thermal resistance between the heat pipe 23 and the fins is significantly reduced, ensuring that heat can be efficiently transferred from the heat pipe 23 to the fins. In some designs, if the fins are "tightly" attached to the heat pipe 23 by means of sleeves, then in the event of damage to a fin or heat pipe 23, there is theoretically a possibility of replacing only a single or partial fin and heat pipe 23. This is more flexible than replacing the entire assembly and reduces maintenance costs.

[0035] In some embodiments, the first heat sink 20 and the second heat sink 30 are arranged along the length of the housing 10, and the first heat-conducting plate 21 and the second heat-conducting plate 31 are located on opposite sides of the housing 10. The first heat sink 20 and the second heat sink 30 are arranged sequentially along the length (i.e., the longer direction) of the housing 10. This layout makes full use of the longitudinal space of the housing 10, allowing the heat dissipation device to be made more compact in both width and height directions, which is particularly suitable for applications with limited space but high requirements for heat dissipation capacity, such as long and narrow laser equipment chassis. The first heat-conducting plate 21 of the first heat sink 20 and the second heat-conducting plate 31 of the second heat sink 30 are respectively located on opposite sides of the housing 10. This means that the first heat-conducting plate 21 may face upwards towards the housing 10, while the second heat-conducting plate 31 faces downwards towards the housing 10. This design clearly separates the mounting bases and heat dissipation paths of the two main heat sources physically. However, the first fin group 22 and the second fin group 32 inside them are located in the same continuous airflow channel. Cooling airflow generated by one or more fans can flow sequentially through the two fin groups, achieving sequential or simultaneous heat dissipation from different heat sources, ensuring the integrity of the heat dissipation system. The first heat-conducting plate 21 and the second heat-conducting plate 31 are located on different sides of the housing 10, providing independent and non-interfering mounting surfaces for the two main heat-generating components inside the laser. This allows each heat source to obtain optimal contact area and pressure, simplifying the mechanical structure design and improving installation convenience and reliability. This creates two parallel heat flow paths within the heat dissipation device, effectively preventing heat interference between different heat sources, which is particularly beneficial for temperature-sensitive components or those requiring precise temperature control.

[0036] In some embodiments, the airflow channel within the housing 10 is arranged along the length of the housing 10, with the air inlet 14 and air outlet 15 located at opposite ends of the housing 10, and the fan located at the air inlet 14 of the housing 10. Multiple first heat sinks 20 are positioned close to the fan and arranged along the width of the housing 10. The airflow channel within the housing 10 is arranged along the length of the housing 10, forming a straight airflow path. The air inlet 14 and air outlet 15 are located at opposite ends of the housing 10. This arrangement ensures that the flow path of cooling air can cover the entire heat dissipation area, reducing airflow detours and dead zones, laying the foundation for efficient heat dissipation. The multiple first heat sinks 20 are positioned close to the fan and arranged along the width of the housing 10. This arrangement allows low-temperature cooling air to preferentially and fully flow through these areas of concentrated heat, achieving efficient heat exchange. Arranging multiple heat sinks along the width of the housing 10 fully utilizes the cross-sectional area of ​​the airflow path, ensuring that each heat dissipation module faces the high-speed airflow, achieving balanced heat dissipation. The various components work collaboratively under the above arrangement, forming an efficient heat dissipation process. The fan starts, drawing in ambient temperature air and forcing it into the air inlet 14 of the housing 10, creating a stable airflow from the air inlet 14 to the air outlet 15 within the airflow channel. The cooling air first flows through the fins of multiple first radiators 20 arranged along the width direction near the air inlet 14. Forced convection heat exchange occurs between the air and the fin surface, with the cold air absorbing heat and becoming hot air. Because the first radiators 20 are close to the fan, they receive the coolest and most stable cooling air, resulting in the highest heat dissipation efficiency. The hot air, after heat exchange, continues to flow along the length direction towards the air outlet 15, ultimately exiting the device, completing the entire heat dissipation cycle. This layout design offers several significant advantages: the straight airflow path has low resistance and smooth airflow; the multiple first radiators 20, close to the fan and arranged along the width direction, allow the main heat-generating components to receive priority cooling from the low-temperature airflow, significantly improving heat dissipation efficiency; and the arrangement of multiple first radiators 20 along the width direction itself embodies the concept of modularity. This arrangement provides a neat and organized structure, facilitating the installation, maintenance, and replacement of heat sinks as standard modules. If a heat sink fails, it can be repaired specifically. The straight and uniform airflow helps create a more uniform temperature field within the housing 10, preventing localized overheating. Timely cooling of the main heat sources directly improves the operational stability and lifespan of the laser's core components.

[0037] In some embodiments, the cross-sectional area of ​​the air inlet 14 is larger than that of the air outlet 15. Because of the larger cross-sectional area of ​​the air inlet 14, the fan can draw in a large amount of air with lower resistance. As the airflow moves towards the air outlet 15, the channel gradually narrows, and according to the fluid continuity theorem, the airflow gradually accelerates. This initially accelerated airflow first acts directly on the first fin group 22 of the first radiator 20 near the air inlet 14. The high-speed airflow can more effectively disrupt the air boundary layer on the fin surface, greatly enhancing convective heat transfer and ensuring rapid and efficient dissipation of the large amount of heat generated by components such as pump sources with high heat flux densities.

[0038] In some embodiments, the first radiator 20 is disposed near the air inlet 14, and the second radiator 30 is disposed near the air outlet 15. The housing 10 is recessed on the side facing the second heat-conducting plate 31 to form a recess 13. The cross-sectional area of ​​the airflow channel in the recess 13 is smaller than the cross-sectional area of ​​the air outlet 15. The specific structure of the housing 10 is as follows: the section of the housing 10 in which the first radiator 20 is installed is a square tube 11 structure, and the section of the housing 10 in which the second radiator 30 is installed is a flat tube 12 structure. There is a certain height difference between the two, so a slope is formed at the connection. The bottom of the slope is lower than the upper surface of the flat tube 12 structure. This slope is then connected to the flat tube 12 structure through another slope. The two slopes form a V-shaped groove, which is the aforementioned recess 13.

[0039] After flowing through the first radiator 20, the airflow temperature rises. When this airflow enters the recess 13 on the housing 10 for the second radiator 30, the channel locally contracts, and according to the Venturi effect, the airflow is accelerated again. This acceleration ensures that the heated air can still pass through the second fin group 32 of the second radiator 30 at a sufficient flow rate, thereby effectively carrying away the heat generated by components such as the resonant cavity and preventing a decrease in the cooling effect of the downstream radiator due to the increased air temperature. The airflow then exits through the outlet 15 with the smallest cross-sectional area. The design of the tapered channel and the recess 13 creates a specific pressure distribution within the channel. This pressure distribution helps guide the airflow to cover the heat dissipation fins more evenly, reducing eddies and dead zones, ensuring that all parts of the radiator are effectively cooled. This achieves differentiated and precise thermal management for components with different heat dissipation characteristics and requirements. This system prioritizes efficient heat dissipation for the high-heat-flux first heat sink 20, while simultaneously employing secondary acceleration technology to ensure effective cooling of the temperature-sensitive second heat sink 30 (such as the resonant cavity), effectively solving the common problem of insufficient cooling in downstream heat sinks. This efficient and balanced thermal management directly translates into reduced operating temperatures of core components, significantly improving the stability and lifespan of the laser during long-term operation. The structural design, including the recessed portion 13, also helps improve airflow organization and enhances the overall reliability of the system.

[0040] In some embodiments, the heat dissipation device further includes a guide plate 41 connecting the first heat-conducting plate 21 and the second heat-conducting plate 31. The guide plate 41 is used to mount optical fibers. Since there is a certain height difference between the square tube 11 structure segment and the flat tube 12 structure segment, the optical fiber needs the guide plate 41 to provide auxiliary support for connecting the pump source on the first heat-conducting plate 21 on the upper surface of the housing 10 to the resonant cavity on the lower surface. The guide plate 41 can first extend along the length direction of the housing 10 from the edge of the square tube 11 structure toward the flat tube 12 structure, then extend along the width direction, and then extend downward to the side of the flat tube 12 structure. If necessary, a support member 42 can also be provided on the lower surface of the guide plate 41. The lower end of the support member 42 is connected to the upper surface of the flat tube 12 structure, serving to support the guide plate 41 and improve structural strength.

[0041] The core function of the guide plate 41 is to serve as a support and guiding mechanism for the optical fiber. After the optical fiber is output from the pump source, it can be fixedly laid along the preset path of the guide plate 41. This design avoids the optical fiber from being suspended or bent arbitrarily inside the equipment, and especially prevents signal attenuation or optical fiber damage caused by excessively small bending radii. The path design of the guide plate 41 (first along the length direction, then along the width direction as needed, and finally gently downward) ensures that the optical fiber maintains a smooth and natural bend throughout the entire path, greatly improving the reliability of the connection and the stability of laser transmission. The guide plate 41 connects the first heat-conducting plate 21 and the second heat-conducting plate located at different heights and sides of the housing 10, effectively adding a structural support between the square tube 11 section and the flat tube 12 section of the housing 10. To further enhance its stability, a support member 42 can be set on the lower surface of the guide plate 41, and the lower end of the support member 42 is connected to the upper surface of the flat tube 12 structure. This forms a stable triangular or frame-like support structure, significantly improving the rigidity and vibration and impact resistance of the guide plate 41 and even the entire housing 10 at the connection point. The guide plate 41 provides standardized management and protection for the optical fibers, significantly reducing the risk of malfunctions caused by fiber bending, loosening, or interference with moving parts, thus improving the long-term stability of the laser equipment. Simultaneously, the reinforced structural design enhances the equipment's ability to withstand mechanical stress during transportation and use. The clearly defined fiber optic cabling path allows operators to easily and accurately connect and inspect the fibers during installation and subsequent maintenance.

[0042] This application also proposes a laser device, including the aforementioned heat dissipation device and a pump source located on the side of the first heat-conducting plate 21 away from the housing 10. Alternatively, the resonant cavity can be located on the second heat-conducting plate 31. By directly mounting the pump source on the first heat-conducting plate 21 and specifically configuring it with a first heat sink 20 enhanced by heat pipes 23, efficient heat dissipation of the maximum heat source is achieved. This effectively controls the temperature of the pump source, ensuring the stability of its output power and wavelength, thereby improving the overall performance of the laser. The modular heat dissipation design and the application of an air-cooling scheme eliminate the need for a complex external water-cooling system and large chiller, resulting in a more compact structure and a high degree of integration. Simultaneously, it eliminates the risks of water leakage and complex maintenance associated with water-cooling systems, improving the long-term operational reliability of the equipment. The modular heat sink design means that if a heat dissipation module fails, it can be replaced individually without scrapping the entire heat dissipation system, significantly reducing subsequent maintenance costs and downtime. This design also facilitates product series expansion and power upgrades.

[0043] The working principle of the heat dissipation device and laser equipment in this embodiment is as follows: The heat dissipation device includes a housing 10, multiple first heat sinks 20, and a fan. An airflow channel is provided inside the housing 10, and an air inlet 14 and an air outlet 15 communicating with the airflow channel are provided on the housing 10. Multiple first heat sinks 20 can be arranged side-by-side on the housing 10. Each first heat sink 20 includes a first fin group 22 disposed in the airflow channel, a first heat-conducting plate 21 disposed on the housing 10, and a heat pipe 23 disposed on the heat-conducting plate. The heat pipe 23 penetrates the housing 10 and is connected to the first fins. The fan can be located at the air inlet 14 and / or the air outlet 15 of the housing 10. Heat from external devices can be transferred to the heat pipe 23 and the first fin group 22 via the first heat-conducting plate 21. The fan drives airflow in the airflow channel to accelerate the heat dissipation of the first fin group 22. When any first heat sink 20 malfunctions, it can be directly disassembled for replacement or repair, resulting in lower maintenance costs.

[0044] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A heat dissipation device for use in a laser, comprising: The housing has an internal airflow channel, and the housing is also provided with an air inlet and an air outlet that communicate with the airflow channel; Multiple first heat sinks are disposed within and installed on the housing. Each first heat sink includes a first fin assembly, a first heat-conducting plate, and a heat pipe. The first fin assembly is disposed in the airflow channel, the first heat-conducting plate is disposed on the housing, and one end of the heat pipe is disposed on the first heat-conducting plate, while the other end passes through the housing and is connected to the first fin. A fan is provided at the air inlet and / or air outlet of the housing.

2. The heat dissipating device according to claim 1, wherein The heat dissipation device further includes a second radiator, which is disposed inside and installed in the housing and spaced apart from the first radiator. The second radiator includes a second heat-conducting plate and a second fin group disposed on the second heat-conducting plate, and the second fin group is located in the airflow channel.

3. The heat dissipating device of claim 1, wherein The first fin assembly is provided with a through hole, and the heat pipe is disposed in the through hole.

4. The heat dissipating device of claim 2, wherein The first heat sink and the second heat sink are arranged along the length of the housing, and the first heat-conducting plate and the second heat-conducting plate are located on opposite sides of the housing.

5. The heat dissipating device of claim 2, wherein The airflow channel inside the housing is arranged along the length of the housing, the air inlet and air outlet are respectively located at both ends of the housing, and the fan is located at the air inlet of the housing.

6. The heat dissipating device according to claim 5, wherein Multiple first heat sinks are positioned close to the fan and arranged along the width of the housing.

7. The heat dissipating device of claim 2, wherein The cross-sectional area of ​​the air inlet is larger than the cross-sectional area of ​​the air outlet.

8. The heat dissipating device according to claim 7, wherein The first radiator is positioned near the air inlet, and the second radiator is positioned near the air outlet. The housing is recessed on the side facing the second heat-conducting plate to form a recessed portion, and the cross-sectional area of ​​the airflow channel in the recessed portion is smaller than the cross-sectional area of ​​the air outlet.

9. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device further includes a guide plate connecting the first heat-conducting plate and the second heat-conducting plate, the guide plate being used to install optical fibers.

10. A laser device, characterized in that, It includes the heat dissipation device according to any one of claims 1 to 9, and a pump source disposed on the side of the first heat-conducting plate away from the housing.

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