A laser packaging structure

Abstract

This application relates to the field of laser display technology, and more particularly to a laser packaging structure. The packaging structure includes a base plate, a housing, a laser chip, and a cover plate. The housing is hollow inside and has a top opening communicating with the internal space. The bottom of the housing is connected to the base plate. The laser chip is disposed on the base plate and located inside the housing. The cover plate closes to the top opening and includes a plate body, a transparent lens, and an adhesive. The plate body has a light-transmitting hole and is welded to the top end face of the housing. The transparent lens covers the light-transmitting hole. The adhesive connects the transparent lens and the plate body. The packaging structure provided by this application can reduce the laser packaging cost while avoiding affecting the function of the laser chip, thereby ensuring the lifespan of the laser.

Description

Technical Field

[0001] This application relates to the field of laser display technology, and more particularly to a laser packaging structure. Background Technology

[0002] Packaging, as a key step in the laser manufacturing process, not only needs to provide mechanical support and electrical interconnection for the laser chip, but also needs to build a reliable protective barrier to resist the corrosion of pollutants such as moisture and dust in the external environment, while ensuring the thermal management efficiency of the chip during operation, which directly determines the output performance and service life of the laser.

[0003] In the selection of housings for laser packaging, ceramic materials have become the mainstream choice for medium and high power laser packaging due to their excellent insulation properties, thermal conductivity and chemical stability, forming a typical packaging structure based on ceramic tube shells. Driven by the need to control packaging costs, the industry generally adopts the adhesive sealing process to seal the opening of the ceramic tube shell and the cover plate. This process involves applying an adhesive to the joint surface between the opening of the ceramic tube shell and the cover plate, and then curing it to form a sealed structure.

[0004] However, during the solidification process of the colloid from a molten state to a solid state, the organic components such as oils and esters contained within it will undergo thermal decomposition and release volatile substances. These volatile substances cannot be effectively discharged due to the airtightness of the encapsulation cavity, and will continue to diffuse and adsorb onto the active area and optical interface surface of the laser chip, thereby affecting the function of the laser chip and thus affecting the lifespan of the laser. Utility Model Content

[0005] This application discloses a laser packaging structure that can reduce the laser packaging cost while avoiding affecting the function of the laser chip, thereby ensuring the lifespan of the laser.

[0006] To achieve the above objectives, this application discloses a laser packaging structure, comprising: Base plate; A shell, the shell being hollow inside, and the shell having a top opening and a bottom opening communicating with the internal space, the bottom of the shell being connected to the base plate; A laser chip, which is disposed on the base plate and located inside the tube housing; A cover plate that closes onto the top opening, the cover plate comprising: The plate body has light-transmitting holes and is welded to the top end face of the tube shell; A transparent lens, which covers the light-transmitting hole; A colloid, which connects the transparent lens and the plate.

[0007] Therefore, during laser chip packaging, the laser chip and housing are first placed on a base plate, and a transparent lens is bonded to the base plate using an adhesive. Finally, a welding process is used to weld the base plate with the transparent lens to the housing. It is evident that before welding the base plate to the housing, the transparent lens is already encapsulated on the base plate with an adhesive. The volatile substances generated during the curing process of the adhesive will not affect the laser chip inside the housing. In other words, in this embodiment, while reducing the laser packaging cost, the base plate and transparent lens are connected by an adhesive seal, and the volatile substances are located outside the housing and do not enter the internal space of the housing. This avoids the formation of an adsorption layer in the active area and optical interface, ensuring the function of the laser chip and improving the lifespan of the laser.

[0008] In one possible implementation, the plate has a first surface facing away from the tube shell, and the first surface has a groove, the groove comprising: The bottom of the tank includes a receiving portion and a light-transmitting portion. The receiving portion surrounds the outside of the light-transmitting portion, the light-transmitting hole is formed in the light-transmitting portion, and the transparent lens is located on the receiving portion. The colloid is located between the groove wall and the transparent lens.

[0009] Since the transparent lens is located on the receiving part and the colloid is located between the groove wall and the transparent lens, the colloid is confined in the groove on the first surface of the plate. The volatiles are discharged outside the cavity or in a local small space and cannot enter the tube shell. This avoids the formation of an adsorption layer at the active area and optical interface of the laser chip, effectively reducing problems such as threshold current drift, slope efficiency decrease, and optical loss increase, and significantly extending the life of the laser.

[0010] Furthermore, the receiving part provides rigid support and precise positioning for the transparent lens, ensuring high coaxiality between the transparent lens and the light-transmitting hole and small optical path offset. The thickness and width of the adhesive layer formed by the colloid are constrained by the groove wall and the receiving part, reducing scattering and reflection losses caused by uneven adhesive layer, improving coupling efficiency and light output consistency, and is suitable for medium and high power scenarios with high requirements for optical path accuracy.

[0011] It should be noted that the groove can be formed by a material removal process or by stamping.

[0012] In one possible implementation, the minimum distance between the groove wall and the side edge of the transparent lens is greater than 0.1 mm.

[0013] Since the minimum distance between the groove wall and the side edge of the transparent lens is greater than 0.1mm, the gap between the groove wall and the side edge of the transparent lens can accommodate enough colloid to form a continuous and uniformly thick colloid ring. This ensures a local seal between the transparent lens and the edge of the light-transmitting hole. Furthermore, under temperature cycling and humid conditions, the colloid has sufficient space to release deformation, reducing the risk of cracking and leakage, and ensuring long-term high airtightness. At the same time, it can prevent the colloid ring layer formed by the colloid from being too thin due to an excessively small gap between the groove wall and the side edge of the transparent lens, which would affect the bonding strength between the transparent lens and the plate, thereby improving the reliability of the connection between the transparent lens and the plate.

[0014] In one possible implementation, the groove wall includes a first vertical groove sidewall, a horizontal groove sidewall, and a second vertical groove sidewall connected in sequence. The first vertical groove sidewall is also connected to the first surface, and the second vertical groove sidewall is connected to the receiving part. The colloid is disposed between the first vertical groove sidewall and the transparent lens.

[0015] Since the colloid is positioned between the first vertical groove sidewall and the transparent lens, the first vertical groove sidewall provides a clear filling boundary for the colloid, forming a continuous and uniform colloid ring to ensure a local seal between the transparent lens and the plate. Since the transverse groove sidewall connects the first vertical groove sidewall and the second vertical groove sidewall, the transverse groove sidewall and the first vertical groove sidewall together constrain the colloid, preventing the colloid from flowing into the light-transmitting hole or covering the effective light-transmitting area of ​​the transparent lens, avoiding light path obstruction and scattering loss, and ensuring light output consistency and coupling efficiency.

[0016] In one possible implementation, the height of the second vertical groove sidewall is h1, and the thickness of the transparent lens is m, where h1 < 1 / 2m.

[0017] By making h1 < 1 / 2m, the vertical constraint of the second vertical groove sidewall on the edge of the transparent lens can be reduced, so that the transparent lens is mainly supported by the receiving part. In this way, more deformation space can be left at the edge of the transparent lens. During the curing shrinkage and temperature cycling process of the colloid, the stress generated by the difference in the thermal expansion coefficient of the material can be effectively released, reducing the risk of edge chipping and cracking of the transparent lens.

[0018] In addition, when the height of the second vertical groove sidewall is lower, the outward discharge channel formed by the first vertical groove sidewall and the transverse groove sidewall is more unobstructed, and the volatiles generated by the colloid during the curing process can be directly discharged, avoiding the volatile substances from entering the internal space of the tube shell and contaminating the active area and optical interface of the laser chip, thus further extending the service life of the laser.

[0019] In one possible implementation, the height of the first vertical groove sidewall is h2, where h2 > 1 / 2m.

[0020] Therefore, by using h2 > 1 / 2m, the sidewall of the first vertical groove can become the main blocking structure for the molten colloid. Together with the sidewall of the transverse groove, it forms a dual constraint of "vertical colloid blocking + transverse support", which effectively controls the climbing height and overflow range of the molten colloid, preventing the molten colloid from contaminating the first surface of the board and other assembly surfaces. At the same time, it ensures that the cured colloid is continuous and uniform, improves the sealing reliability, and is suitable for harsh environments such as waterproof and dustproof.

[0021] In one possible implementation, the distance between the sidewall of the first vertical groove and the sidewall of the transparent lens is greater than 0.4 mm.

[0022] With a distance greater than 0.4mm between the sidewall of the first vertical groove and the sidewall of the transparent lens, the thickness tolerance and assembly alignment error of the transparent lens can be effectively accommodated, reducing assembly interference caused by dimensional deviations, facilitating automatic dispensing, bonding and curing processes, adapting to mass production and improving yield.

[0023] In addition, during the curing process of the colloid, a larger gap between the sidewall of the first vertical groove and the sidewall of the transparent lens is beneficial to promoting the discharge of volatiles and generated bubbles, thereby improving the sealing effect of the colloid.

[0024] In one possible implementation, an arcuate portion is provided between the groove wall and the first surface.

[0025] Because there is an arc-shaped portion between the groove wall and the first surface, when the colloid is placed between the groove wall and the side wall of the transparent lens, the capacity of the colloid can be increased, the bonding area between the colloid and the plate can be improved, which is beneficial to improving the sealing effect between the transparent lens and the plate.

[0026] In one possible implementation, a wire-passing hole is provided on the side wall of the casing, the wire-passing hole being used to pass through a lead wire connected to the laser chip.

[0027] Because the side wall of the tube shell is provided with wire-passing holes, the wire-passing holes provide fixed wire exit positions. Multiple wire-passing holes can be grouped according to the pin layout of the laser chip to avoid wire crossing, tangling and interference, which facilitates wire bonding, soldering and automated wire threading, and improves assembly consistency and efficiency.

[0028] In addition, the wire-passing holes on the side wall of the casing make it easier to achieve multi-channel grouping of wires, avoid the light-transmitting area and the heat dissipation area of ​​the substrate, the lead path is shorter, and the sealing and adhesive design is more flexible.

[0029] In one possible implementation, the transparent lens is coated with an antireflective film.

[0030] By coating a transparent lens with an anti-reflective film, interface reflection can be reduced, transmittance can be increased, imaging contrast and color reproduction can be improved, glare and stray light can be reduced, the light transmission performance of the transparent lens can be improved, and light energy loss can be reduced.

[0031] Compared with the prior art, the beneficial effects of this application are as follows: In laser chip packaging, the laser chip and housing are first placed on a base plate, and a transparent lens is bonded to the base plate using an adhesive. Finally, a welding process is used to weld the base plate with the transparent lens to the housing. It is evident that before welding the base plate to the housing, the transparent lens is already encapsulated on the base plate with an adhesive. The volatile substances generated during the curing process of the adhesive will not affect the laser chip inside the housing. In other words, in this embodiment, while reducing the laser packaging cost, the base plate and transparent lens are connected by an adhesive seal, and the volatile substances are located outside the housing and do not enter the internal space of the housing. This avoids the formation of an adsorption layer in the active area and optical interface, ensuring the function of the laser chip and improving the lifespan of the laser. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the packaging structure of the laser provided in the embodiments of this application; Figure 2 This is an exploded view of the laser packaging structure provided in the embodiments of this application; Figure 3 This is an exploded view of the cover plate provided in the embodiment of this application; Figure 4 This is a top view of the cover plate provided in the embodiment of this application; Figure 5 This is an isometric view of the cover plate provided in the embodiment of this application; Figure 6 yes Figure 5 One of the cross-sectional views at point AA in the middle; Figure 7 yes Figure 5 Sectional view at point AA (second section); Figure 8 yes Figure 7 A magnified view of a portion of point B in the middle; Figure 9 This is a schematic diagram of the structure of the tube shell with a wire passage hole provided in the embodiment of this application; Figure 10 yes Figure 1 Cross-sectional view at point CC.

[0034] Explanation of reference numerals in the attached figures: 100-Laser packaging structure; 110 - Base Plate; 120 - Tube shell; 121 - Top opening; 122 - Bottom opening; 123 - Wire hole; 130-laser chip; 140 - Cover plate; 141 - Plate body; 1411 - Light-transmitting hole; 1412 - Groove; 14121 - Groove bottom; 1412a - Receiving part; 1412b - Light-transmitting part; 14122 - Groove wall; 141a - First surface; 141b - Arc part; 142 - Transparent lens; 143 - Colloid; 150-lead wire; 11A - First vertical groove sidewall; 11B - Horizontal groove sidewall; 11C - Second vertical groove sidewall. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0037] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0038] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0039] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0040] The technical solution of this application will be further described below with reference to specific embodiments and accompanying drawings.

[0041] See Figure 1 and Figure 3 This application provides a laser packaging structure 100, which includes a base plate 110, a housing 120, a laser chip 130, and a cover plate 140. The housing 120 is hollow inside and has a top opening 121 and a bottom opening 122 communicating with the internal space. The bottom of the housing 120 is connected to the base plate 110. The laser chip 130 is disposed on the base plate 110 and located inside the housing 120. The cover plate 140 covers the top opening 121 and includes a plate body 141, a transparent lens 142, and an adhesive 143. The plate body 141 has a light-transmitting hole 1411 and is welded to the top end face of the housing 120. The transparent lens 142 covers the light-transmitting hole 1411. The adhesive 143 is connected between the transparent lens 142 and the plate body 141.

[0042] The base plate 110 can be made of oxygen-free copper, ceramic, etc., and a patch area is provided on the base plate 110 for mounting the laser chip 130.

[0043] The aforementioned shell 120 and base plate 110 can be set separately or integrally formed. Optionally, when both the base plate 110 and the shell 120 are made of ceramic material, the shell 120 and the base plate 110 are integrally formed.

[0044] The laser chip 130 mentioned above can be any of an infrared laser diode chip, a blue laser diode chip, or a pump laser chip 130, etc., and this embodiment does not limit it.

[0045] Therefore, when packaging the laser chip 130, the laser chip 130 and the housing 120 are first placed on the base plate 110, and the transparent lens 142 is bonded to the plate 141 using an adhesive 143. Finally, the plate 141 with the transparent lens 142 is welded to the housing 120 using a welding process. It can be seen that before the plate 141 is welded to the housing 120, the transparent lens 142 has been encapsulated on the plate 141 by the adhesive 143. The volatile substances generated by the adhesive 143 during the curing process will not affect the laser chip 130 inside the housing 120. In other words, in this embodiment, when the plate 141 and the transparent lens 142 are connected by adhesive sealing, the volatile substances are located outside the housing 120 and do not enter the internal space of the housing 120, thereby avoiding the formation of an adsorption layer in the active area and the optical interface, ensuring the function of the laser chip 130 and improving the service life of the laser.

[0046] in addition, Figure 1 The X arrow in the diagram represents the length of the package structure, the Y arrow represents the width of the package structure, and the Z arrow represents the height of the package structure.

[0047] Optionally, after the transparent lens 142 is attached to the plate 141 by the colloid 143, the volatile substances on it can be removed by a plasma cleaning process, thereby ensuring the elimination of volatile substances on the cover plate 140.

[0048] In some possible embodiments, see Figures 3 to 6 The plate 141 has a first surface 141a facing away from the tube shell 120. A groove 1412 is provided on the first surface 141a. The groove 1412 includes a groove bottom 14121 and a groove wall 14122. The groove bottom 14121 includes a receiving part 1412a and a light-transmitting part 1412b. The receiving part 1412a surrounds the outside of the light-transmitting part 1412b. A light-transmitting hole 1411 is formed in the light-transmitting part 1412b. A transparent lens 142 is located on the receiving part 1412a. A colloid 143 is located between the groove wall 14122 and the transparent lens 142.

[0049] Since the transparent lens 142 is located on the receiving part 1412a and the colloid 143 is located between the groove wall 14122 and the transparent lens 142, the colloid 143 is confined within the groove 1412 of the first surface 141a of the plate 141. The volatiles are discharged outside the cavity or in a local small space and cannot enter the housing 120. This avoids the formation of an adsorption layer at the active area and optical interface of the laser chip 130, effectively reducing problems such as threshold current drift, slope efficiency decrease, and optical loss increase, and significantly extending the life of the laser.

[0050] Furthermore, the receiving part 1412a provides rigid support and precise positioning for the transparent lens 142, ensuring high coaxiality between the transparent lens 142 and the light-transmitting hole 1411 and small optical path offset. The thickness and width of the adhesive layer formed by the colloid 143 are jointly constrained by the groove wall 14122 and the receiving part 1412a, reducing scattering and reflection losses caused by uneven adhesive layer, improving coupling efficiency and light output consistency, and is suitable for medium and high power scenarios with high requirements for optical path accuracy.

[0051] Alternatively, during the packaging process of the laser chip 130, the bottom end face of the housing 120 is welded to the base plate 110, and the cover plate 140 is welded to the top end face of the housing 120 to ensure high airtightness and long-term stability. Furthermore, the colloid 143 is only used for local sealing of the edges of the transparent lens 142 and the light-transmitting hole 1411, with low stress and environmental load, thereby reducing the aging and cracking of the colloid 143 and further improving the service life of the laser.

[0052] In some possible embodiments, see Figure 4 The minimum distance between the groove wall 14122 and the side edge of the transparent lens 142 is greater than 0.1 mm.

[0053] Since the minimum distance between the groove wall 14122 and the side edge of the transparent lens 142 is greater than 0.1mm, the gap between the groove wall 14122 and the side edge of the transparent lens 142 can accommodate enough colloid 143 to form a continuous and uniformly thick adhesive ring. This ensures local sealing between the transparent lens 142 and the edge of the light-transmitting hole 1411. Furthermore, under temperature cycling and humid conditions, the colloid 143 has sufficient space to release deformation, reducing the risk of cracking and leakage, and ensuring long-term high airtightness. At the same time, it can prevent the adhesive ring layer formed by the colloid 143 from being too thin due to the small gap between the groove wall 14122 and the side edge of the transparent lens 142, which would affect the bonding strength between the transparent lens 142 and the plate 141, thereby improving the reliability of the connection between the transparent lens 142 and the plate 141.

[0054] It should be noted that the distance between the groove wall 14122 and the side edge of the transparent lens 142 is as follows: Figure 4 As shown in L.

[0055] In addition, the groove wall 14122 can be a straight groove wall 14122 or a stepped groove wall 14122. The following mainly uses the stepped groove wall 14122 as an example for illustration.

[0056] In some possible embodiments, see Figure 7 and Figure 8The groove wall 14122 includes a first vertical groove sidewall 11A, a horizontal groove sidewall 11B, and a second vertical groove sidewall 11C connected in sequence. The first vertical groove sidewall 11A is also connected to the first surface 141a, and the second vertical groove sidewall 11C is connected to the receiving part 1412a. The colloid 143 is disposed between the first vertical groove sidewall 11A and the transparent lens 142.

[0057] Since the colloid 143 is disposed between the first vertical groove sidewall 11A and the transparent lens 142, the first vertical groove sidewall 11A provides a clear filling boundary for the colloid 143, which can form a continuous and uniform colloid ring, ensuring the local sealing of the transparent lens 142 and the plate 141. Since the transverse groove sidewall 11B is connected between the first vertical groove sidewall 11A and the second vertical groove sidewall 11C, the transverse groove sidewall 11B and the first vertical groove sidewall 11A together constrain the colloid 143, preventing the colloid 143 from flowing into the light-transmitting hole 1411 or covering the effective light-transmitting area of ​​the transparent lens 142, avoiding light path obstruction and scattering loss, and ensuring light output consistency and coupling efficiency.

[0058] In addition, since the second vertical groove sidewall 11C is connected to the receiving part 1412a, when assembling the transparent lens 142, the second vertical groove sidewall 11C can precisely limit the transparent lens 142, ensuring the coaxiality of the transparent lens 142 and the light-transmitting hole 1411. In some possible embodiments, see Figure 8 The height of the second vertical groove sidewall 11C is h1, and the thickness of the transparent lens 142 is m, where h1 < 1 / 2 m.

[0059] By making h1 < 1 / 2m, the vertical constraint of the second vertical groove sidewall 11C on the edge of the transparent lens 142 can be reduced, so that the transparent lens 142 is mainly supported by the receiving part 1412a. In this way, more deformation space can be left at the edge of the transparent lens 142. During the curing shrinkage and temperature cycling process of the colloid 143, the stress generated by the difference in the coefficient of thermal expansion of the material can be effectively released, reducing the risk of edge chipping and cracking of the transparent lens 142.

[0060] In addition, when the height of the second vertical groove sidewall 11C is lower, the outward discharge channel formed by the first vertical groove sidewall 11A and the transverse groove sidewall 11B is more unobstructed, and the volatiles generated by the colloid 143 during the curing process can be directly discharged, avoiding the volatile substances from entering the internal space of the housing 120 and contaminating the active area and optical interface of the laser chip 130, thus further extending the service life of the laser.

[0061] In some possible embodiments, see Figure 8 The height of the first vertical groove sidewall 11A is h2, h2 > 1 / 2m.

[0062] Therefore, by using h2 > 1 / 2m, the first vertical groove sidewall 11A can become the main blocking structure for the molten colloid 143. Together with the transverse groove sidewall 11B, it forms a dual constraint of "vertical blocking + transverse support", effectively controlling the climbing height and overflow range of the molten colloid 143. This prevents the molten colloid 143 from contaminating the first surface 141a of the plate 141 and other assembly surfaces, while ensuring that the cured colloid 143 is continuous and uniform, improving sealing reliability, and making it suitable for harsh environments such as waterproofing and dustproofing.

[0063] In some possible embodiments, the distance between the first vertical groove sidewall 11A and the sidewall of the transparent lens 142 is greater than 0.4 mm.

[0064] With the distance between the sidewall 11A of the first vertical groove and the sidewall of the transparent lens 142 being greater than 0.4mm, the thickness tolerance and assembly alignment error of the transparent lens 142 can be effectively accommodated, reducing assembly interference caused by dimensional deviations, facilitating automatic dispensing, bonding and curing processes, adapting to mass production and improving yield.

[0065] In addition, during the curing process of colloid 143, when the gap between the first vertical groove sidewall 11A and the sidewall of the transparent lens 142 is large, it is beneficial to promote the discharge of volatiles and generated bubbles, thereby improving the sealing effect of colloid 143.

[0066] In some possible embodiments, see Figure 6 An arc-shaped portion 141b is provided between the groove wall 14122 and the first surface 141a.

[0067] Since an arc portion 141b is provided between the groove wall 14122 and the first surface 141a, when the colloid 143 is provided between the groove wall 14122 and the side wall of the transparent lens 142, the capacity of the colloid 143 can be increased, the bonding area between the colloid 143 and the plate 141 can be increased, which is beneficial to improving the sealing effect between the transparent lens 142 and the plate 141.

[0068] In addition, the arc portion 141b can guide the flow of the molten colloid 143 when it is injected, which helps to improve the flow and venting effect of the molten colloid 143, thereby improving the sealing continuity.

[0069] In some possible embodiments, see Figure 9 and Figure 10 The side wall of the housing 120 is provided with a wire hole 123 for threading a lead 150 connected to the laser chip 130.

[0070] It should be noted that the wire hole 123 is sealed to the lead wire 150. That is, when the lead wire 150 passes through the wire hole 123, the wire hole 123 can be sealed. Alternatively, a sealing element can be provided between the lead wire 150 and the wire hole 123. In this way, the sealing performance of the tube shell 120 can be guaranteed.

[0071] Since the side wall of the housing 120 is provided with wire-passing holes 123, the wire-passing holes 123 provide a fixed exit position for the lead wires 150. Multiple wire-passing holes 123 can be grouped according to the pin layout of the laser chip 130 to avoid the lead wires 150 crossing, tangling and interfering, which facilitates wire bonding, soldering and automated wire threading, and improves assembly consistency and efficiency.

[0072] In addition, the wire-passing hole 123 on the side wall of the housing 120 makes it easier to achieve multi-channel grouping of wires, avoid the light-transmitting area and the heat dissipation area of ​​the substrate, the lead wire 150 path is shorter, and the sealing and adhesive design is more flexible.

[0073] In some possible embodiments, an antireflective coating is deposited on the transparent lens 142.

[0074] By coating the transparent lens 142 with an anti-reflection film, interface reflection can be reduced, transmittance can be increased, imaging contrast and color reproduction can be improved, glare and stray light can be reduced, the light transmission performance of the transparent lens 142 can be improved, and light energy loss can be reduced.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A laser packaging structure (100), characterized in that, include: Base plate (110); The tube shell (120) is hollow inside and has a top opening (121) communicating with the internal space of the tube shell (120). The bottom of the tube shell (120) is connected to the base plate (110). A laser chip (130) is disposed on the base plate (110) and located inside the tube shell (120); Cover plate (140), the cover plate (140) covering the top opening (121), the cover plate (140) comprising: The plate (141) is provided with a light-transmitting hole (1411) and the plate (141) is welded to the top end face of the tube shell (120); A transparent lens (142) covers the light-transmitting hole (1411). A colloid (143) is attached between the transparent lens (142) and the plate (141).

2. The laser packaging structure (100) according to claim 1, characterized in that, The plate (141) has a first surface (141a) facing away from the tube shell (120), and a groove (1412) is provided on the first surface (141a), the groove (1412) comprising: The groove bottom (14121) includes a receiving portion (1412a) and a light-transmitting portion (1412b). The receiving portion (1412a) surrounds the outside of the light-transmitting portion (1412b). The light-transmitting hole (1411) is formed in the light-transmitting portion (1412b). The transparent lens (142) is located on the receiving portion (1412a). The groove wall (14122) and the colloid (143) are located between the groove wall (14122) and the transparent lens (142).

3. The laser packaging structure (100) according to claim 2, characterized in that, The minimum distance between the groove wall (14122) and the side edge of the transparent lens (142) is greater than 0.1 mm.

4. The laser packaging structure (100) according to claim 2, characterized in that, The groove wall (14122) includes a first vertical groove sidewall (11A), a horizontal groove sidewall (11B), and a second vertical groove sidewall (11C) connected in sequence. The first vertical groove sidewall (11A) is also connected to the first surface (141a), and the second vertical groove sidewall (11C) is connected to the receiving part (1412a). The colloid (143) is disposed between the first vertical groove sidewall (11A) and the transparent lens (142).

5. The laser packaging structure (100) according to claim 4, characterized in that, The height of the second vertical groove sidewall (11C) is h1, and the thickness of the transparent lens (142) is m, where h1 < 1 / 2m.

6. The laser packaging structure (100) according to claim 5, characterized in that, The height of the first vertical groove sidewall (11A) is h2, h2 > 1 / 2m.

7. The laser packaging structure (100) according to claim 4, characterized in that, The distance between the first vertical groove sidewall (11A) and the sidewall of the transparent lens (142) is greater than 0.4 mm.

8. The laser packaging structure (100) according to claim 2, characterized in that, An arc portion (141b) is provided between the groove wall (14122) and the first surface (141a).

9. The laser packaging structure (100) according to claim 1, characterized in that, The side wall of the casing (120) is provided with a wire hole (123), which is used to pass through the lead wire (150) connected to the laser chip (130).

10. The laser packaging structure (100) according to claim 1, characterized in that, The transparent lens (142) is coated with an anti-reflective film.

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