An electronically commutated motor

Abstract

This utility model provides an electronically commutated motor, including: a motor and a driver. The output shaft of the motor is located at the front end of the motor. The driver includes a main control board and a housing. The main control board is located at the end of the motor away from the output shaft, and the housing covers the main control board. An electrical component is carried on the side of the main control board away from the motor. A heat dissipation substrate is provided at the end of the electrical component away from the main control board. The heat dissipation substrate conducts the heat generated by the electrical component to the housing. The electrical component includes a first electrical component and a second electrical component. In the direction away from the main control board, the height of the first electrical component is less than the height of the second electrical component. The heat dissipation substrate includes a first heat dissipation substrate and a second heat dissipation substrate. The first heat dissipation substrate is located at the first electrical component, and the second heat dissipation substrate is located at the second electrical component. The distance between the first heat dissipation substrate and the main control board is less than the distance between the second heat dissipation substrate and the main control board, so that the heat generated by the electrical component is quickly and efficiently transferred to the driver housing.

Description

Technical Field

[0001] This utility model relates to the field of motor technology, specifically to an electronically commutated motor. Background Technology

[0002] With the rapid development of technology, the integration and intelligence of motor drivers are constantly improving, and the number of electrical components inside them has increased significantly. During the operation of the motor, the electrical components in the driver will generate a lot of heat. If the heat cannot be dissipated in time, the high temperature will affect the switching characteristics of semiconductor devices, leading to a decrease in driving efficiency and even causing control signal distortion. Furthermore, long-term high-temperature operation will accelerate the aging of electrical components, shorten the life of the motor driver, and increase the failure rate.

[0003] However, the heat generated by the electrical components in current motor drives cannot be efficiently transferred to the drive housing, affecting the performance and reliability of the motor. Utility Model Content

[0004] This invention addresses the existing problem that the heat generated by electrical components in a motor driver cannot be efficiently transferred to the driver housing.

[0005] To solve the above problems, this utility model provides an electronically commutated motor, including: a motor and a driver, wherein the output shaft of the motor is located at the front end of the motor, and the driver includes a main control board and a housing; The main control board is located at the end of the motor away from the output shaft, and the housing is covered by the main control board; the side of the main control board away from the motor carries electrical components, and the end of the electrical components away from the main control board is provided with a heat dissipation substrate, which conducts the heat generated by the electrical components to the housing; The electrical components include a first electrical component and a second electrical component. In the direction away from the main control board, the height of the first electrical component is less than the height of the second electrical component. The heat dissipation substrate includes a first heat dissipation substrate and a second heat dissipation substrate. The first heat dissipation substrate is located on a first electrical component, and the second heat dissipation substrate is located on a second electrical component. The distance between the first heat dissipation substrate and the main control board is less than the distance between the second heat dissipation substrate and the main control board.

[0006] The technical effects achieved by adopting this technical solution are as follows: For the first and second electrical components with different heights, the first and second heat dissipation substrates with different distances are matched to make the heat dissipation substrates have a stepped heat dissipation structure, which solves the problem of uneven heat dissipation caused by the difference in the height of the electrical components, and enables the heat generated by the electrical components to be transferred to the driver housing quickly and efficiently.

[0007] Preferably, the electrical component includes a third electrical component, and the height of the second electrical component is less than the height of the third electrical component in the direction away from the main control board; the heat dissipation substrate also includes a third heat dissipation substrate, which is located on the third electrical component, and the distance between the second heat dissipation substrate and the main control board is less than the distance between the third heat dissipation substrate and the main control board.

[0008] The technical effects achieved by adopting this solution are as follows: By setting three electrical components of different heights (first, second, and third) and matching them with corresponding heat dissipation substrates (first, second, and third), more refined heat dissipation management is achieved. The first heat dissipation substrate closest to the first electrical component with the smallest height, the second heat dissipation substrate at a medium distance with the second electrical component with a medium height, and the third heat dissipation substrate furthest away with the third electrical component with the tallest height. This stepped design ensures that each electrical component can obtain a heat dissipation area that matches its height and heat generation, while also perfectly utilizing the three-dimensional space inside the housing. Without increasing the overall volume of the motor, the heat dissipation efficiency is improved by optimizing the layout of the heat dissipation substrates.

[0009] Preferably, the first electrical component is an insulated gate bipolar transistor module; and / or the second electrical component is a transformer; and / or the third electrical component is a film capacitor.

[0010] The technical effects achieved by adopting this technical solution are as follows: the insulated gate bipolar transistor module, as the main switching device, is equipped with the closest first heat dissipation substrate to ensure efficient dissipation of high-frequency switching losses; the transformer, due to its low-to-medium frequency heating characteristics, adopts a second heat dissipation substrate at a moderate distance; the film capacitor, as a temperature-sensitive energy storage element, achieves gentle heat dissipation through the farthest third heat dissipation substrate. Therefore, this technical solution achieves more precise and efficient thermal management by specifically matching key heat-generating components with dedicated heat dissipation structures.

[0011] Preferably, the housing is provided with heat dissipation fins.

[0012] The technical effects achieved by adopting this technical solution are as follows: the heat generated by the electrical components is conducted to the housing through the heat dissipation substrate and then dissipated through the heat dissipation fins by the heat dissipation fins, eliminating the need for additional fans or liquid cooling devices, reducing system power consumption and noise, and making it especially suitable for applications with high requirements for quiet operation.

[0013] Preferably, the housing has an opening, and the main control board is divided into a first region and a second region; the first region is the cavity inside the housing corresponding to the heat dissipation fins, and the second region is the cavity inside the housing corresponding to the opening.

[0014] The technical effects achieved by adopting this technical solution are as follows: By dividing the main control board into a first area with corresponding heat dissipation fins and a second area with corresponding openings, the first area forms a closed and efficient heat dissipation cavity. The heat dissipation of core heat-generating components such as insulated gate bipolar transistor modules, transformers, and film capacitors is centrally managed through the heat dissipation fin structure. At the same time, the second area forms a maintenance channel through the opening design, allowing for quick inspection or replacement of vulnerable parts without disassembling the entire housing.

[0015] Preferably, the electrical components include an insulated-gate bipolar transistor module, a transformer, a metal-oxide-semiconductor field-effect transistor, and a thin-film capacitor, wherein the insulated-gate bipolar transistor module, the transformer, the metal-oxide-semiconductor field-effect transistor, and the thin-film capacitor are located in the first region.

[0016] The technical effect achieved by adopting this technical solution is as follows: By concentrating key heat-generating components such as insulated gate bipolar transistor modules, transformers, metal-oxide-semiconductor field-effect transistors, and thin-film capacitors in a first area with heat dissipation fins, this zoned centralized heat dissipation can optimize the operating temperature gradient of each electrical component within the optimal range.

[0017] Preferably, the electrical components include terminals, relays, common-mode inductors, display interfaces, and DC-DC power supplies, with the terminals, relays, common-mode inductors, display interfaces, and DC-DC power supplies located in the second area.

[0018] The technical effects achieved by adopting this technical solution are as follows: By concentrating electrical components such as terminals, relays, common-mode inductors, display interfaces, and DC-DC converters in a second area with openings, the openings provide convenient access for components that require frequent operation and maintenance, allowing wiring adjustments or component replacements to be completed without disassembling the entire housing.

[0019] Preferably, the housing also includes a cover plate that engages with the opening.

[0020] The technical effects achieved by adopting this technical solution are as follows: by setting a snap-on cover at the opening of the housing, the internal electrical components can be effectively protected and dust can be prevented from entering the drive.

[0021] Preferably, the housing includes an end cover and a side panel, with heat dissipation fins and openings disposed on the end cover, and the heat dissipation fins extending from the end cover to the side panel.

[0022] The technical effect achieved by adopting this technical solution is that the heat dissipation fins are extended from the end cover to the side plate, making the heat dissipation fins more widely distributed and further improving the heat dissipation effect.

[0023] Preferably, the heat dissipation substrate is made of heat dissipation material; and / or the thickness of the heat dissipation substrate is 20~200μm.

[0024] The technical effects achieved by adopting this technical solution are as follows: the heat dissipation substrate made of a heat dissipation material with high thermal conductivity enables the heat generated by electrical components to be quickly transferred to the heat dissipation fins; the ultra-thin design of the heat dissipation substrate reduces the thickness of the thermal resistance layer, further shortening the thermal response speed. Attached Figure Description

[0025] Figure 1 An exploded view of the structure of the electronically commutated motor provided in the embodiments of this application; Figure 2 This is a schematic diagram of the electronic commutator motor structure provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the shell provided in an embodiment of this application; Figure 4 This is a schematic diagram of the main control board provided in an embodiment of this application; Figure 5 This is a structural schematic diagram of the main control board provided in an embodiment of this application from another perspective; Figure 6 An exploded view of the motor portion provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures: 1. Motor; 11. Output shaft; 12. Motor front end cover; 121. First threaded hole; 13. Motor side panel; 131. Second threaded hole; 14. Motor rear end cover; 141. Third threaded hole; 142. Fourth threaded hole; 15. First screw; 2. Driver; 21. Main control board; 211. First area; 212. Second area; 22. Housing; 221. Heat sink fins; 2211. First heat sink fin; 2212. Second heat sink fin; 2213. Third heat sink fin; 2214. Fourth heat sink fin; 222. Opening; 223. Cover plate; 224. End cap; 225. Side panel; 226. Fifth threaded hole; 227. Second screw; 23. Electrical component; 231. Insulated gate bipolar transistor module; 232. Transformer; 233. Thin film capacitor; 234. Metal-oxide-semiconductor field-effect transistor; 235. Terminal block; 236. Relay; 237. Common mode inductor; 238. Display interface; 239. DC-DC converter; 24. Heat sink; 241. First heat sink; 242. Second heat sink; 243. Third heat sink; 244. Fourth heat sink. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below.

[0028] This application provides an electronically commutated motor, see... Figures 1 to 5 As shown, Figure 1 This is an exploded view illustrating the structure of the electronically commutated motor provided in the embodiments of this application. Figure 2 This is a schematic diagram of the electronic commutator motor structure provided in an embodiment of this application. Figure 3 This is a schematic diagram of the shell structure provided in an embodiment of this application. Figure 4 This is a schematic diagram of the main control board provided in an embodiment of this application. Figure 5 This is a schematic diagram of the main control board provided in another perspective of the embodiments of this application. The electronic commutation motor includes a motor 1 and a driver 2. The output shaft 11 of the motor 1 is located at the front end of the motor 1. The driver 2 includes a main control board 21 and a housing 22. The main control board 21 is located at the end of the motor 1 away from the output shaft 11. The housing 22 covers the main control board 21, and the side of the main control board 21 away from the motor 1 carries an electrical component 23. The end of the electrical component 23 away from the main control board 21 is provided with a heat dissipation substrate 24, which conducts the heat generated by the electrical component 23 to the housing. The electrical component 23 includes a first electrical component and a second electrical component. In the direction away from the main control board 21, the height of the first electrical component is less than the height of the second electrical component. The heat dissipation substrate 24 includes a first heat dissipation substrate 241 and a second heat dissipation substrate 242. The first heat dissipation substrate 241 is located at the first electrical component, and the second heat dissipation substrate 242 is located at the second electrical component. The distance between the first heat dissipation substrate 241 and the main control board 21 is less than the distance between the second heat dissipation substrate 242 and the main control board 21. For the first and second electrical components of different heights, the first heat dissipation substrate 241 and the second heat dissipation substrate 242 with different distances are matched, so that the heat dissipation substrate 24 has a stepped heat dissipation structure, which solves the problem of uneven heat dissipation caused by the height difference of the electrical components 23, and enables the heat generated by the electrical components 23 to be transferred to the housing 22 quickly and efficiently.

[0029] Furthermore, the electrical component 23 also includes a third electrical component. In the direction away from the main control board 21, the height of the second electrical component is less than the height of the third electrical component. The heat dissipation substrate 24 also includes a third heat dissipation substrate 243, which is located on the third electrical component. The distance between the second heat dissipation substrate 242 and the main control board 21 is less than the distance between the third heat dissipation substrate 243 and the main control board 21. By setting three different heights for the first, second, and third electrical components and matching them with corresponding distances for the first heat dissipation substrate 241, second heat dissipation substrate 242, and third heat dissipation substrate 243, more refined heat dissipation management is achieved. The first heat dissipation substrate 241, which is closest to the main control board 21, corresponds to the first electrical component with the smallest height. The second heat dissipation substrate 242, which is at a medium distance from the main control board 21, corresponds to the second electrical component with a medium height. The third heat dissipation substrate 243, which is furthest from the main control board 21, corresponds to the third electrical component with the largest height. This stepped design ensures that the electrical components 23 can obtain a heat dissipation area that matches their height and heat generation, and also makes perfect use of the three-dimensional space inside the housing 22. Without increasing the overall volume of the motor, the heat dissipation efficiency is improved by optimizing the layout of the heat dissipation substrate.

[0030] Furthermore, the first electrical component is an insulated-gate bipolar transistor module 231; the second electrical component is a transformer 232; and the third electrical component is a thin-film capacitor 233. The insulated-gate bipolar transistor module 231, as the main switching device, is equipped with the closest first heat dissipation substrate 241 to ensure efficient dissipation of high-frequency switching losses. The transformer 232, due to its mid-to-low frequency heating characteristics, uses a second heat dissipation substrate 242 at a moderate distance. The thin-film capacitor 233, as a temperature-sensitive energy storage component, achieves gentle heat dissipation through the farthest third heat dissipation substrate 243. Therefore, this technical solution achieves more precise and efficient thermal management by specifically matching key heat-generating components with dedicated heat dissipation structures.

[0031] Furthermore, the housing 22 is provided with heat dissipation fins 221, which include a first heat dissipation fin 2211, a second heat dissipation fin 2212, and a third heat dissipation fin 2213. The first heat dissipation fin 2211 is located on a first electrical component, the second heat dissipation fin 2212 is located on a second electrical component, and the third heat dissipation fin 2213 is located on a third electrical component. In the direction away from the main control board 21, the size of the first heat dissipation fin 2211 is larger than the size of the second heat dissipation fin 2212, and the size of the second heat dissipation fin 2212 is larger than the size of the third heat dissipation fin 2213. A first heat dissipation substrate 241 is disposed between the insulated gate bipolar transistor module 231 and the first heat dissipation fin 2211, and abuts against the first heat dissipation fin 2211. A second heat dissipation substrate 242 is disposed between the transformer 232 and the second heat dissipation fin 2212. The first heat sink 241 is positioned between the film capacitor 233 and the third heat sink 2212, and abuts against the third heat sink 2213. This allows the heat generated by the insulated gate bipolar transistor module 231 to be conducted to the first heat sink 2211 through the first heat sink 241, the heat generated by the transformer 232 to be conducted to the second heat sink 2212 through the second heat sink 242, and the heat generated by the film capacitor 233 to be conducted to the third heat sink 2213 through the third heat sink 243. The heat generated by the electrical component 23 is conducted to the housing through the heat sink 241, and then dissipated through the heat sink 221. This eliminates the need for an additional fan or liquid cooling device, reducing system power consumption and noise, and is especially suitable for applications requiring high quiet operation.

[0032] It should be noted that the electrical component 23 is not limited to the insulated-gate bipolar transistor module 231, the transformer 232, and the thin-film capacitor 233. The first electrical component can also be a metal-oxide-semiconductor field-effect transistor 234, wherein the height of the metal-oxide-semiconductor field-effect transistor 234 can be equal to the height of the insulated-gate bipolar transistor module 231, or the height of the metal-oxide-semiconductor field-effect transistor 234 can be less than the height of the insulated-gate bipolar transistor module 231. When the electrical component 23 also includes the metal-oxide-semiconductor field-effect transistor 234, the heat dissipation substrate 24 also includes a fourth heat dissipation substrate 244, and the heat dissipation fins 221 also include a fourth heat dissipation fin 2214. The fourth heat dissipation substrate 244 is disposed between the metal-oxide-semiconductor field-effect transistor 234 and the fourth heat dissipation fin 2214, so that the heat generated by the metal-oxide-semiconductor field-effect transistor 234 is conducted to the fourth heat dissipation fin 2214 for heat dissipation through the fourth heat dissipation substrate 244.

[0033] In some other embodiments, see Figure 5As shown, the housing 22 includes an opening 222, and the main control board 21 is divided into a first region 211 and a second region 212. The first region 211 is the cavity inside the housing 22 corresponding to the heat dissipation fins 221, and the second region 212 is the cavity inside the housing 22 corresponding to the opening 222. By dividing the main control board 21 into the first region 211 corresponding to the heat dissipation fins 221 and the second region 212 corresponding to the opening 222, the first region 211 forms a closed, high-efficiency heat dissipation cavity, and the heat dissipation of core heat-generating components such as IGBTs and transformers 232 is centrally managed through the structure of the heat dissipation fins 221. At the same time, the second region 212 forms a maintenance channel through the opening 222, allowing for quick inspection or replacement of vulnerable parts without disassembling the entire housing 22. Furthermore, the electrical component 23 includes an insulated-gate bipolar transistor module 231, a transformer 232, a metal-oxide-semiconductor field-effect transistor 234, and a thin-film capacitor 233. The insulated-gate bipolar transistor module 231, transformer 232, metal-oxide-semiconductor field-effect transistor 234, and thin-film capacitor 233 are located in the first region 211. By concentrating key heat-generating components such as the insulated-gate bipolar transistor module 231, transformer 232, metal-oxide-semiconductor field-effect transistor 234, and thin-film capacitor 233 within the first region 211 with heat dissipation fins 221, this zoned centralized heat dissipation optimizes the operating temperature gradient of each component within its optimal range.

[0034] Furthermore, electrical components 23 include terminal blocks 235, relays 236, common-mode inductors 237, display interfaces 238, and DC-DC converters 239. These components are located in the second region 212. By centrally arranging auxiliary electrical components 23 such as terminal blocks 235, relays 236, common-mode inductors 237, display interfaces 238, and DC-DC converters 239 within the second region 212 with openings 222, the openings provide convenient physical access for components requiring frequent operation and maintenance, allowing wiring adjustments or component replacements to be completed without disassembling the entire housing 22. The first region 211 and the second region 212 are demarcated by the end face of the insulated-gate bipolar transistor module 231 near the common-mode inductor 237.

[0035] Further, see Figure 1 As shown, the housing 22 also includes a cover plate 223, which is fastened to the opening 222. By providing a fastening cover plate 223 at the opening 222 of the housing 22, the internal electrical components 23 can be effectively protected and dust can be prevented from entering the driver 2.

[0036] Furthermore, the housing 22 also includes an end cover 224 and a side plate 225. The heat dissipation fins 221 and the opening 222 are disposed on the end cover 224, and the side plate 225 is connected to the periphery of the end cover 224. The heat dissipation fins 221 extend from the end cover 224 to the side plate 225, so that the heat dissipation fins 221 are more widely distributed, and the heat dissipation effect is further improved.

[0037] Among them, see Figure 1 and Figure 6 As shown, Figure 6 The exploded view of the motor portion provided in this embodiment shows that the motor 1 includes a front cover 12, a side panel 13, and a rear cover 14. The front cover 12 is located at the end of the motor near the output shaft 11. The rear cover 14 is located between the motor 1 and the driver 2. The side panel 13 is located between the front cover 12 and the rear cover 14. The front cover 12 has a first threaded hole 121, the side panel 13 has a second threaded hole 131, and the rear cover 14 has a third threaded hole 141. A first screw 15 is sequentially inserted into the first threaded hole 121, the second threaded hole 131, and the third threaded hole 141 to securely connect the front cover 12, the side panel 13, and the rear cover 14. The first screw 15 sequentially passing through the threaded holes of the front cover 12, the side panel 13, and the rear cover 14 achieves a tight connection between the three components, improving the rigidity and stability of the overall structure and reducing the risk of vibration or loosening during assembly.

[0038] The motor rear end cover 14 has a fourth threaded hole 142, and the housing 22 has a fifth threaded hole 226. A second screw 227 passes through the fourth threaded hole 142 and the fifth threaded hole 226 to securely connect the motor rear end cover 14 and the housing 22. The second screw 227 directly fastens the motor rear end cover 14 to the housing 22, forming a stable mechanical connection. This further effectively improves the vibration resistance and load-bearing capacity of the electronic commutator motor during operation, reducing component loosening or displacement caused by vibration. The first screw 15 and the second screw 227 ensure a firm and reliable connection for the electronic commutator motor.

[0039] Furthermore, the heat dissipation fins 221 can be straight, U-shaped, or inclined. In order to further increase the surface area of ​​the heat dissipation fins 221, the heat dissipation fins 221 can be designed as a combination of straight, U-shaped and inclined shapes according to actual needs, so that the heat dissipation fins 221 can make full use of the space of the housing 22 and improve the heat dissipation performance.

[0040] Furthermore, the heat dissipation substrate 24 is made of a heat dissipation material; and / or the thickness of the heat dissipation substrate 24 is 20~200μm. The heat dissipation substrate 24, made of a highly thermally conductive heat dissipation material, allows the heat generated by the electrical component 23 to be rapidly transferred to the heat dissipation fins 221; the ultra-thin design of the heat dissipation substrate 24 reduces the thickness of the thermal resistance layer, further shortening the thermal response speed. The heat dissipation substrate 24 can be tightly attached to the surface of the electrical component 23 through a welding process or a coating process. The heat dissipation material can be a metal-based material (such as aluminum, copper, and their alloys), a thermally conductive interface material (such as silicone grease, gaskets, phase change materials), a highly thermally conductive non-metallic material (such as graphene, aluminum nitride), a composite material (such as metal-diamond, thermally conductive plastics), or a liquid metal (such as gallium-based alloys), etc.

[0041] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An electronically commutated electric motor, characterized in that It includes a motor (1) and a driver (2), the output shaft (11) of the motor is located at the front end of the motor (1), and the driver (2) includes a main control board (21) and a housing (22). The main control board (21) is located at one end of the motor (1) away from the output shaft (11), and the housing (22) covers the main control board (21). The main control board (21) carries an electrical component (23) on the side away from the motor (1). The electrical component (23) is provided with a heat dissipation substrate (24) at the end away from the main control board (21). The heat dissipation substrate (24) conducts the heat generated by the electrical component (23) to the housing (22). The electrical component (23) includes a first electrical component and a second electrical component. In the direction away from the main control board (21), the height of the first electrical component is less than the height of the second electrical component. The heat dissipation substrate (24) includes a first heat dissipation substrate (241) and a second heat dissipation substrate (242). The first heat dissipation substrate (241) is located on the first electrical component, and the second heat dissipation substrate (242) is located on the second electrical component. The distance between the first heat dissipation substrate (241) and the main control board (21) is less than the distance between the second heat dissipation substrate (242) and the main control board (21).

2. The electronically commutated electric motor of claim 1, characterized in that The electrical component (23) includes a third electrical component, and in the direction away from the main control board (21), the height of the second electrical component is less than the height of the third electrical component; The heat dissipation substrate (24) further includes a third heat dissipation substrate (243), which is located on the third electrical component. The distance between the second heat dissipation substrate (242) and the main control board (21) is less than the distance between the third heat dissipation substrate (243) and the main control board (21).

3. The electronically commutated electric motor of claim 2, characterized in that The first electrical component is an insulated gate bipolar transistor module (231); and / or The second electrical component is a transformer (232); and / or The third electrical component is a thin-film capacitor (233).

4. The electronically commutated electric motor of claim 1, wherein The housing (22) is provided with heat dissipation fins (221).

5. The electronically commutated electric motor of claim 4, characterized in that The housing (22) has an opening (222), and the main control board (21) is divided into a first region (211) and a second region (212). The first region (211) is the cavity inside the housing (22) corresponding to the heat dissipation fins (221), and the second region (212) is the cavity inside the housing (22) corresponding to the opening (222).

6. The electronically commutated electric motor of claim 5, characterized in that The electrical component (23) includes an insulated gate bipolar transistor module (231), a transformer (232), a thin film capacitor (233), and a metal-oxide-semiconductor field-effect transistor (234), wherein the insulated gate bipolar transistor module (231), the transformer (232), the thin film capacitor (233), and the metal-oxide-semiconductor field-effect transistor (234) are located in the first region (211).

7. The electronically commutated electric motor of claim 5, wherein The electrical components include a terminal block (235), a relay (236), a common-mode inductor (237), a display interface (238), and a DC-DC converter (239), wherein the terminal block (235), the relay (236), the common-mode inductor (237), the display interface (238), and the DC-DC converter (239) are located in the second region (212).

8. The electronically commutated electric motor of claim 5, wherein, The housing (22) also includes a cover plate (223) that engages with the opening (222).

9. The electronically commutated electric motor of claim 5, wherein, The housing (22) includes an end cap (224) and a side panel (225). The heat dissipation fins (221) and the opening (222) are disposed on the end cap (224). The heat dissipation fins (221) extend from the end cap (224) to the side panel (225).

10. The electronically commutated electric motor of claim 1, wherein, The heat dissipation substrate (24) is made of a heat dissipation material; and / or The thickness of the heat dissipation substrate (24) is 20~200μm.

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