PCB Embedded Power Modules and Inverters

Abstract

This utility model relates to a PCB embedded power module, comprising: a driver board (1); an embedded PCB board (2) having a front side (21) and a back side (22); and a PCB connection frame (3) located between the front side (21) of the embedded PCB board (2) and the driver board (1); wherein the PCB connection frame is configured to realize mechanical and electrical connection between the driver board (1) and the embedded PCB board (2). This utility model also relates to an inverter including the above-described PCB embedded power module.

Description

Technical Field

[0001] This utility model relates to the field of power module technology, and in particular to PCB embedded power modules and inverters including such power modules. Background Technology

[0002] In existing technologies, traditional power module driver board solutions typically require a significant height gap between the driver board and the embedded printed circuit board (PCB) for mounting connectors or press-fit pins. However, these connectors or press-fit pins only provide electrical connections and cannot offer mechanical fixation, thus necessitating additional structural components (such as screws) for mechanical secure mounting of the driver board. The use of screws not only occupies board space, reducing the available space for electronic components, but also forces an increase in the driver board's size. Furthermore, traditional connectors or press-fit pins are usually quite tall, generally exceeding 10mm, making them unsuitable for height-sensitive applications. In summary, traditional solutions have low integration, resulting in limited power density for the entire power module.

[0003] In some existing solutions, electronic components are placed directly on the front side of an embedded PCB. Since embedded PCBs typically contain high-power chips, they generate significant heat that is conducted to the front side of the PCB, potentially causing the electronic components to exceed their tolerance range. Current solutions often avoid the areas of highest heat generation, placing the electronic components on cooler surface areas. However, this further reduces the available board area, necessitating a larger PCB size to accommodate the component placement. Furthermore, for effective heat dissipation, the entire back side of the PCB usually needs to be tightly connected to a heatsink, making it impossible to place electronic components on the back, further limiting the available board area. Therefore, these solutions often require a trade-off between increasing PCB area and reducing the number of components, making it difficult to create a fully integrated driver board and limiting its applications. Summary of the Invention

[0004] To overcome at least one of the above problems, the purpose of this utility model is to provide a PCB embedded power module that not only eliminates the need for additional fasteners to fix the driver board, thus improving the utilization rate of the driver board area, but also significantly reduces the overall height of the PCB embedded power module.

[0005] To this end, the present invention provides a PCB embedded power module, comprising: a driver board; an embedded PCB board having a front side and a back side; and a PCB connection frame located between the front side of the embedded PCB board and the driver board; wherein the PCB connection frame is configured to realize mechanical and electrical connection between the driver board and the embedded PCB board.

[0006] In the above solution, a PCB connection frame is used between the driver board and the embedded PCB board to replace connectors and threaded fasteners, enabling direct and reliable mechanical fixing and electrical connection between the two. This reduces additional connectors and wiring space, thereby improving the overall module integration and reducing the module height. Furthermore, the hollow design of the frame allows electronic components to be arranged on the back of the driver board, further improving integration and power density. In this application, the PCB connection frame is essentially a two-layer or multi-layer PCB.

[0007] In a preferred embodiment of this invention, the PCB connection frame is fixedly connected to the drive board and the embedded PCB board by welding. This connection method not only ensures reliable mechanical fixation but also guarantees stable electrical connection, replacing the function of connectors or crimp pins.

[0008] In a specific embodiment of this utility model, the PCB connection frame may include multiple PCB frame components, each PCB frame component having a strip-shaped insulating substrate with a first surface and opposing second surfaces. The first surface has multiple first conductive soldering areas, spaced apart from each other along the longitudinal direction of the insulating substrate. The second surface has multiple second conductive soldering areas, also spaced apart from each other along the longitudinal direction of the insulating substrate and opposing the multiple first conductive soldering areas. The PCB connection frame is soldered to the lower surface of the drive board via the first conductive soldering areas and to the front surface of the embedded PCB board via the second conductive soldering areas. In this embodiment, by providing opposing conductive soldering areas on the first surface (e.g., the upper surface) and the second surface (e.g., the lower surface) of each PCB frame component, and optionally providing metallized vias between the opposing conductive soldering areas as needed, electrical connection between the conductive soldering areas on both sides can be achieved. This reduces parasitic inductance and parasitic resistance, improving the switching performance and reliability of the power module. Furthermore, the double-sided soldering of multiple PCB connection frames significantly increases the mechanical fixing points and area, enhancing the module's resistance to vibration and thermal cycling.

[0009] In a preferred embodiment of this invention, multiple first conductive soldering areas and multiple second conductive soldering areas are all composed of a copper-clad layer; at least one of the first conductive soldering areas of at least one of the multiple PCB frame components is electrically connected to the opposite second conductive soldering area via a metallized via penetrating the insulating substrate. Furthermore, depending on different electrical connection requirements, an appropriate number of first and second conductive soldering areas can be selected to achieve electrical connection via metallized vias. In this embodiment, the metallized vias can be formed in the insulating substrate using mechanical drilling, laser drilling, or blind / buried via processes. However, it should be understood that some PCB frame components may not have any metallized vias, serving only a mechanical connection function, which is also within the scope of this application.

[0010] In this invention, multiple PCB frame components can have different lengths, and the area and number of conductive soldering areas can also be varied according to specific needs. Furthermore, the height of the PCB frame components can be flexibly adjusted to accommodate different driver boards (different customer requirements will affect the height of the components on the back of the driver board). Depending on the position of the power chip on the front of the embedded PCB board and the connection requirements of electronic components, different numbers and types of PCB frame components can be selected, and different arrangement methods can be chosen to form PCB connection frames of different configurations. In one example, the multiple PCB frame components may include two types of frame components, namely a first PCB frame component and a second PCB frame component, wherein the length of the first PCB frame component is different from the length of the second PCB frame component. It should be understood that, as needed, more types of PCB frame components can also be provided, all of which are covered within the scope of this application.

[0011] According to a preferred embodiment of this invention, the PCB connection frame is composed of multiple unconnected and independent PCB frame components. Because each PCB frame component exists independently, its position can be freely arranged according to the actual wiring or power chip distribution, thereby optimizing the circuit layout. Furthermore, the independent components can move independently during thermal expansion or mechanical vibration, reducing overall stress concentration and improving reliability. Alternatively, the PCB connection frame can also be composed of multiple PCB frame components fixedly connected into a single PCB connection frame. This approach achieves higher mechanical strength but may reduce flexibility. The insulating substrate material can be selected from FR4, high Tg materials, and ceramic substrates, depending on power density and thermal management requirements.

[0012] In a preferred embodiment of this invention, the thickness of each PCB frame component between the first conductive soldering area and the second conductive soldering area is 1mm to 6mm, preferably 3mm. Compared with existing power modules using traditional connectors or crimp pins of about 10mm, the overall height of the PCB-embedded power module is reduced, which is beneficial to improving the integration and volume utilization of the power module. Although the thickness is reduced, sufficient mechanical support can still be provided through multi-point welding fixation to ensure vibration resistance and thermal cycling resistance; compared with traditional large connectors or crimp pins, the amount of material used is reduced, the PCB processing and welding process is simpler, and it is conducive to mass production.

[0013] According to a preferred embodiment of this invention, the front side of the embedded PCB board includes a first region corresponding to the embedded power chip and a second region corresponding to the region where no power chip is embedded, wherein the PCB connection frame is disposed in the second region. This arrangement of the PCB connection frame avoids the area in the middle of the embedded PCB board where heat generation is most severe (i.e., the empty area in the middle of the frame), reducing heat conduction from the embedded PCB board to the driver board and ensuring the normal operation of the electronic components on the driver board. Furthermore, placing the PCB connection frame in the second region where no power chip is embedded does not affect the arrangement of the power chip and the circuit design. It should be understood that in this invention, the division between the first and second regions can be flexibly adjusted according to the distribution of the power chip and wiring requirements. The PCB connection frame can slightly extend beyond the edge of the first region, but it must ensure that it does not interfere with the heat dissipation of the power chip.

[0014] In one embodiment of this invention, the PCB embedded power module further includes a heat sink, which is fixedly connected to the back side of the embedded PCB board. The heat sink directly contacts the back side of the embedded PCB board, forming a heat conduction path and effectively reducing the operating temperature of the power chip. The size, thickness, and material of the heat sink can be designed according to the module power and heat dissipation requirements, providing high flexibility.

[0015] This invention also provides an inverter that includes the aforementioned PCB-embedded power module. The PCB-embedded power module provides power conversion, drive, and control functions. By integrating the PCB-embedded power module into the inverter, a compact modular design can be achieved, improving power density and electrical performance. Attached Figure Description

[0016] Referring to the accompanying drawings and reading the following detailed description, further features and advantages of this utility model will become clearer:

[0017] Figure 1 A perspective view of one embodiment of the PCB embedded power module according to the present invention is shown;

[0018] Figure 2 for Figure 1 The side view of the PCB embedded power module shown;

[0019] Figure 3 for Figure 1 An exploded view of the PCB embedded power module shown.

[0020] Figure 4 The arrangement of the PCB connection frame according to the present invention on the front side of the embedded PCB board is shown;

[0021] Figure 5 A perspective view of a portion of a PCB connection frame according to the present invention is shown;

[0022] Figures 6A to 6C An embodiment of a PCB frame component according to the present invention is shown; and

[0023] Figure 7 Another embodiment of the PCB frame component according to the present invention is shown. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The descriptions of orientations used in the following description, such as "upper," "lower," "inner," and "outer," are for convenience only unless explicitly stated otherwise and are not intended to limit the technical solutions of the invention. Furthermore, terms such as "first" and "second" are used below to describe elements of this application; these terms are only used to distinguish individual elements and are not intended to limit the nature, sequence, order, or number of these elements. Additionally, it should be noted that in this specification, the same technical features are represented by the same or similar reference numerals.

[0025] In this article, "embedded PCB board" refers to a special PCB structure in which power devices or chips are embedded on a printed circuit board (PCB).

[0026] Figures 1 to 3 A preferred embodiment of the PCB embedded power module according to the present invention is shown. As can be seen from the figure, the PCB embedded power module 100 includes a driver board 1, an embedded PCB board 2, a PCB connection frame 3, and a heat sink 4. See especially... Figure 2 The embedded PCB board 2 has a front side 21 and a back side 22, and power chips or related circuit components (not shown) are embedded within it. A PCB connection frame 3 is located between the driver board 1 and the front side 21 of the embedded PCB board 2. A heat sink 4 is fixedly connected to the back side 22 of the embedded PCB board 2. The heat sink can be made of a metal material, such as aluminum or copper, to achieve good thermal conductivity. The heat sink can be fixed to the back side 22 of the embedded PCB board by sintering, soldering, or thermally conductive adhesive. In the PCB embedded power module, the embedded PCB board not only carries the power chips and control circuitry but also provides electrical connections and mechanical support.

[0027] In this application, the "PCB connection frame" is actually a PCB-shaped connection frame that not only has mechanical connection functions but also electrical connection functions, and it also has conductivity, insulation, and layout functions. Since the PCB connection frame 3 is located between the front surface 21 of the embedded PCB board 2 and the lower surface of the driver board 1, it can not only mechanically fix the driver board 1 to the embedded PCB board 2 but also electrically connect them, thus achieving both electrical and mechanical connections between the driver board 1 and the embedded PCB board 2. This solution does not require additional measures (such as threaded fasteners) to fix the driver board 1, thereby improving the utilization rate of the driver board area.

[0028] See Figure 4 This illustrates a layout of the PCB connection frame 3 applied to the PCB embedded power module 100 according to the present invention. In this embodiment, since the PCB embedded power module 100 includes three independent embedded PCB boards 2, three identically configured PCB connection frames 3 can be used (see [reference]). Figure 5 In this embodiment, the PCB connection frame 3 is composed of multiple independent strip-shaped PCB frame components. These PCB frame components can include various types, such as a first PCB frame component 3a and a second PCB frame component 3b, which have different lengths and different numbers of conductive soldering areas. For different types of driver boards, the heights of the first PCB frame component 3a and the second PCB frame component 3b can also be flexibly adjusted to accommodate devices at different heights on the back of the driver board.

[0029] It should be understood that the PCB connection frame shown in the figure is merely exemplary. Since each PCB frame component exists independently, its position can be freely arranged according to the actual wiring or power chip distribution, thereby optimizing the circuit layout. In addition, although the PCB connection frame in the given embodiment may consist of multiple independent frame components, it may also be fixedly connected into a single frame to provide different layout and strength design options, which are also covered within the scope of this application.

[0030] See Figure 6A , Figure 6B , Figure 6C as well as Figure 7Each PCB frame component may include an insulating substrate 30, which has a first surface 31 (upper surface in the figure) and a second surface 32 (lower surface in the figure). The insulating substrate 30 may be made of materials commonly used in PCB substrates, such as epoxy resin-glass fiber cloth composites like FR4, polytetrafluoroethylene composites, or modified epoxy resins. A plurality of first conductive solder areas 33 are arranged longitudinally at intervals on the first surface 31, and a plurality of second conductive solder areas 34 are arranged longitudinally at intervals on the second surface 32. At least one first conductive solder area 33 is electrically connected to a corresponding second conductive solder area 34 via a metallized via 5. As can be seen from the figure, the plurality of first conductive solder areas 33 and the plurality of second conductive solder areas 34 are symmetrically arranged about the insulating substrate 30. The shapes of the plurality of first conductive solder areas 33 may be the same or different, and they may be equidistant or unequally spaced, depending on the specific electrical connection requirements. The same applies to the plurality of second conductive solder areas 34. Depending on specific requirements, some relative first conductive soldering areas 33 and second conductive soldering areas 34 may not have metal vias, thus eliminating the need for electrical connection. In some embodiments, certain frame components in the PCB connection frame may also omit metallized vias, serving only a mechanical fixing function. For example, in... Figure 6C In the illustrated embodiment, metallized vias 5 are present between partially opposite conductive soldering areas of the first PCB frame member 3a, while no metallized vias are present between the remaining conductive soldering areas. Figure 7 In the example shown, the second PCB frame member 3b can be constructed without any metallized vias, serving only a mechanical fixing function.

[0031] In a specific embodiment, both the first conductive soldering area 33 and the second conductive soldering area 34 can be formed by a copper-clad layer, that is, copper is clad on the surface of the insulating substrate 30. Alternatively, a local metal layer can be formed on the surface of the insulating substrate by chemical copper plating or electroplating. In addition, in a specific embodiment, the metallized via 5 can be formed by mechanical drilling or laser drilling, and a conductive metal layer is deposited on the via wall to achieve conductivity.

[0032] In this invention, by arranging opposing conductive soldering areas on both sides of the insulating substrate and using metallized vias to achieve through interconnection, the PCB connection frame can achieve double-sided electrical connection, improving the flexibility of circuit wiring. Double-sided soldering fixation enhances the overall structural reliability and vibration resistance.

[0033] During assembly, the first conductive soldering area 33 of each PCB frame component is electrically and mechanically connected to the lower surface of the drive board through soldering, and the second conductive soldering area 34 is electrically and mechanically connected to the front surface 21 of the embedded PCB board 2 through soldering. This achieves mechanical fixation and electrical interconnection between the drive board 1 and the embedded PCB board 2, thus forming a stable electrical connection. By providing the PCB connection frame 3 with the above configuration, multiple solder points are distributed on the conductive soldering areas on the upper and lower sides of the connection frame, providing good structural support and preventing loosening due to vibration or thermal cycling. The PCB connection frame uses multi-point soldering or metallized via connections, resulting in short and uniform current paths, improving stability during high-speed switching.

[0034] In a preferred embodiment, the thickness of each PCB frame component between the first conductive soldering area 33 and the second conductive soldering area 34 can be from 1 mm to 6 mm, for example, 3 mm. Compared with power modules using conventional connectors or crimp pins of about 10 mm in the prior art, the overall height of the PCB embedded power module is reduced, which is beneficial to improving the integration and volume utilization of the power module.

[0035] See you again Figure 4 The front side 21 of the embedded PCB board 2 includes a first region 21a corresponding to the (internal) embedded power chip (not shown) and a second region 21b corresponding to the absence of an embedded power chip. Since the PCB connection frame 3 in this invention is composed of multiple independent PCB frame components of different lengths, it can be arranged within the second region 21b, avoiding the area in the middle of the embedded PCB board 2 where heat generation is most severe (i.e., the first region 21a with a hollow center), reducing heat conduction from the embedded PCB board to the driver board 1, and ensuring the normal operation of the electronic components on the driver board. Furthermore, the hollow design of the PCB connection frame also allows for the arrangement of electronic components on the back of the driver board, improving integration and power density.

[0036] In addition, the height of the PCB connection frame 3 can be reduced to 3mm. Compared with traditional connectors or crimp pins, the height of the PCB connection frame 3 according to this utility model is significantly reduced compared with the conventional connectors of about 10mm in the prior art, for example, reduced to about 1 / 2 to 1 / 4, which can leave more space in the height direction.

[0037] In one embodiment of this utility model, an inverter is also provided, which includes the PCB-embedded power module 100 described above. In this inverter, the PCB-embedded power module provides power conversion, drive, and control functions. By integrating the PCB-embedded power module into the inverter, a compact modular design can be achieved, improving power density and electrical performance.

[0038] Inverters employing the aforementioned PCB-embedded power modules exhibit improved switching performance, efficiency, and stability due to the compact structure, low parasitic inductance, and low parasitic resistance of the PCB-embedded power modules. The embedded PCB modules, combined with a rear heatsink, rapidly transfer heat to the external cooling system, reducing the inverter's operating temperature and enhancing reliability. Integrating the power modules into the inverter makes modularity more apparent, facilitating module replacement or upgrades. These inverters can be used in photovoltaic, wind power, electric vehicles, and industrial control applications, and the power module design can be flexibly adjusted according to power ratings.

[0039] Although the present invention has been disclosed above with reference to preferred embodiments, it is not limited thereto. Any combinations, changes, and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined in the claims.

Claims

1. A PCB embedded power module, characterized in that, The PCB embedded power module (100) includes: Driver board (1); An embedded PCB board (2) having a front side (21) and a back side (22); and PCB connection frame (3) is located between the front side (21) of the embedded PCB board (2) and the drive board (1); The PCB connection frame is configured to enable mechanical and electrical connections between the drive board (1) and the embedded PCB board (2).

2. The PCB embedded power module according to claim 1, characterized in that, The PCB connection frame (3) is fixedly connected to the drive board (1) and the embedded PCB board (2) by welding.

3. The PCB embedded power module according to claim 2, characterized in that, The PCB connection frame (3) includes a plurality of PCB frame components (3a, 3b), each of the PCB frame components having a strip-shaped insulating substrate (30), the insulating substrate having a first surface (31) and an opposing second surface (32); The first surface (31) is provided with a plurality of first conductive welding areas (33), which are spaced apart from each other along the longitudinal direction of the insulating substrate (30); and The second surface (32) is provided with a plurality of second conductive welding areas (34), which are also spaced apart from each other along the longitudinal direction of the insulating substrate (30) and opposite to the plurality of first conductive welding areas (33); The PCB connection frame (3) is welded to the lower surface of the drive board via the first conductive soldering area (33) and to the front side of the embedded PCB board (2) via the second conductive soldering area (34).

4. The PCB embedded power module according to claim 3, characterized in that, Both the first conductive soldering area (33) and the second conductive soldering area (34) are composed of copper cladding; and At least one of the plurality of PCB frame components, at least one of the first conductive solder areas is electrically connected through a metallized via (5) penetrating the insulating substrate (30) and a second conductive solder area opposite thereto.

5. The PCB embedded power module according to claim 3 or 4, characterized in that, The plurality of PCB frame components include at least a first PCB frame component (3a) and a second PCB frame component (3b), wherein the length of the first PCB frame component is different from the length of the second PCB frame component.

6. The PCB embedded power module according to claim 3 or 4, characterized in that, The multiple PCB frame components are fixedly connected to form an integrated PCB connection frame, or the multiple PCB frame components are independent of each other and not connected.

7. The PCB embedded power module according to claim 3 or 4, characterized in that, The thickness of each PCB frame component between the first conductive soldering area (33) and the second conductive soldering area (34) is 1 mm to 6 mm.

8. The PCB embedded power module according to any one of claims 1 to 4, characterized in that, The front side (21) of the embedded PCB board (2) includes a first region (21a) corresponding to where the power chip is embedded and a second region (21b) corresponding to where the power chip is not embedded, wherein the PCB connection frame (3) is disposed in the second region (21b).

9. The PCB embedded power module according to any one of claims 1 to 4, characterized in that, The PCB embedded power module also includes a heat sink (4), which is fixedly connected to the back side (22) of the embedded PCB board.

10. An inverter, characterized in that, Includes the PCB embedded power module according to any one of claims 1 to 9.

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