Buck converter
By using a stacked design of power modules and inductors, the problems of large area and low heat dissipation efficiency of buck converters are solved, resulting in a more compact and efficient buck converter design.
Patent Information
- Application Number
- CN202522555726.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-12-02
AI Technical Summary
Existing buck converters have a large planar design, which makes it difficult to meet miniaturization requirements, and the circuit design and heat dissipation efficiency of high-power products need to be improved.
The design employs a stacked structure of power modules and inductors, with the pins of the inductors connected to or not in contact with the lead frame. Combined with metal connectors and an iron core, the layout of the inductors and power components is optimized to achieve efficient heat dissipation.
It reduces the footprint of the buck converter, lowers parasitic inductance and transmission impedance, improves heat dissipation efficiency, and is suitable for various packaging methods without additional structural modifications.
Smart Images
Figure CN224947452U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a buck converter, and more particularly to a buck converter having an inductor and a metal-oxide-semiconductor field-effect transistor. Background Technology
[0002] With technological advancements, semiconductor components are becoming increasingly precise and refined. Electronic products are trending towards miniaturization and high power handling. For example, in buck converters, current technology uses a planar design to construct the driver chip, power components, and inductors. However, this architecture occupies a large footprint, which does not meet the requirements for product miniaturization. Furthermore, high-power products also need to consider their circuit design and heat dissipation performance.
[0003] Therefore, how to improve the efficiency of buck converters through structural design improvements and overcome the above-mentioned defects has become one of the important issues that this project aims to address. Utility Model Content
[0004] In view of this, the present invention provides a buck converter, including a power module and an inductor. The power module includes a lead frame, a first power element, a second power element, and a driver chip, all of which are disposed on the lead frame. The inductor is located above the power module, wherein the first pin of the inductor is electrically connected to the first power element and the second power element respectively, and the second pin of the inductor is connected to the lead frame or is not in contact with the lead frame.
[0005] According to one feasible implementation, the lead frame includes at least one conductive member, the driver chip is electrically connected to the conductive member via a lead, and is electrically connected to the first power element via another lead.
[0006] According to a feasible implementation scheme, the buck converter also includes a connector made of metal, and the first pin is electrically connected to the first power element and the second power element through the connector.
[0007] According to a feasible implementation scheme, the first pin is made of metal and is electrically connected to the first power element and the second power element in a contact manner.
[0008] According to a feasible implementation, the inductor also includes an iron core, with the first pin exposed on the surface of the iron core.
[0009] According to a feasible implementation scheme, the second pin is connected to the first pin, and the second pin is exposed on the surface of the iron core.
[0010] According to a feasible implementation scheme, there are multiple power modules and inductor components.
[0011] One of the beneficial effects of this utility model is that, in one embodiment, the buck converter provided by this utility model reduces the area of the buck converter used (designed) by designing the inductor components and power modules in a stacked manner. In some embodiments, the area used can be reduced by at least 50%.
[0012] One of the beneficial effects of this invention is that, in one embodiment, the buck converter provided by this invention achieves the lowest parasitic inductance in the path from the power element to the inductor element, as well as the lowest transmission impedance.
[0013] One of the beneficial effects of this utility model is that, in one embodiment, the buck converter provided by this utility model reduces the buck path and minimizes it.
[0014] One of the beneficial effects of this utility model is that, in one embodiment, the buck converter provided by this utility model can use a driver chip and a metal oxide semiconductor field-effect transistor (MOSFET) package, and the method of "the second pin of the inductor is connected to the lead frame or not in contact with the lead frame". The buck converter has a wide range of applications and does not require additional structural modifications.
[0015] One of the beneficial effects of this utility model is that, in one embodiment, the buck converter provided by this utility model connects a first power element and a second power element through an inductor. The high temperature heat of the first power element and the second power element can be dissipated through at least one of the first pin and the second pin of the inductor. The high temperature heat of the first power element and the second power element can also be conducted outward through the lower lead frame.
[0016] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the appearance of a buck converter according to an embodiment of the present invention; Figure 2 for Figure 1 An exploded view of the embodiment shown; Figure 3 for Figure 1 An exploded view of the embodiment shown; Figure 4 This is a cross-sectional schematic diagram of a buck converter according to an embodiment of the present invention; Figure 5 This is a cross-sectional schematic diagram of a buck converter according to an embodiment of the present invention; Figure 6 This is a cross-sectional schematic diagram of a step-down converter according to an embodiment of the present invention.
[0018] Explanation of reference numerals in the attached figures: Z1, buck converter; Z2, buck converter; Z3, buck converter; Z4, buck converter; 1, power module; 11, lead frame; 111, conductive component; 12, first power element; 13, second power element; 14, driver chip; 15, lead; 2, inductor; 21, first pin; 22, second pin; 23, core; 231, surface; 3, connector; 4, package. Detailed Implementation
[0019] The following specific embodiments illustrate the implementation of the "buck converter" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.
[0020] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.
[0021] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the appearance of a step-down converter Z1 according to an embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the embodiment shown. Figure 3 for Figure 1 An exploded view of the embodiment shown.
[0022] The buck converter Z1 includes a power module 1 and an inductor 2. The power module 1 includes a lead frame 11, a first power element 12, a second power element 13, and a driver chip 14, all of which are disposed on the lead frame 11. In some embodiments, the power module 1 is a Dr-MOS, the first power element 12 can be defined as a high-side MOSFET, and the second inductor 2 can be defined as a low-side MOSFET. The first power element 12, the second power element 13, and the driver chip 14 are electrically connected (e.g., through wires (see figure below) or by solder pads). The inductor 2 is located above the power module 1. The first pin 21 of the inductor 2 is electrically connected to both the first power element 12 and the second power element 13, and the second pin 22 of the inductor 2 is connected to the lead frame 11. In some embodiments, the second pin 22 of the inductor element 2 is connected to the lead frame 11 but does not contact the lead frame 11, and the end of the second pin 22 can be plugged into a circuit board for use.
[0023] Please see Figure 4 This is a cross-sectional schematic diagram of a buck converter Z2 according to an embodiment of the present invention. In this embodiment, the power module 1 includes a package 4, which encloses a lead frame 11, a first power element 12, a second power element 13, and a driver chip 14. The lead frame 11 includes conductive members 111 (see also...). Figure 2 and Figure 3 The driver chip 14 is electrically connected to the conductive member 111 via a lead 15, and is also electrically connected to the first power element 12 via another lead 15. Furthermore, in Figure 1 and Figure 4 In this embodiment, the buck converter further includes a connector 3, which is made of metal. The first pin 21 is electrically connected to the first power element 12 and the second power element 13 through the connector 3. The connector 3 is, for example, a copper plate or copper foil, and can be used in a Copper Clip package in the manufacturing process.
[0024] Please see Figure 5 This is a cross-sectional schematic diagram of a buck converter Z3 according to an embodiment of the present invention. In this embodiment, the end of the second pin 22 is exposed outside the lead frame 11 and can be used as a pin to be plugged into the circuit board.
[0025] Please see Figure 6This is a cross-sectional schematic diagram of a buck converter Z4 according to an embodiment of the present invention. In this embodiment, the first pin 21 is directly electrically contacted with the first power element 12 and the second power element 13, and the end of the second pin 22 is connected to the conductive member 111. The package 4 encapsulates the inductor 2, the first power element 12, the second power element 13, the driver chip 14, and the lead frame 11.
[0026] According to some embodiments, the inductor element 2 further includes an iron core 23, with the first lead 21 exposed on the surface 231 of the iron core 23. Figure 4 and Figure 5 In this embodiment, the first pin 21 assists in dissipating the high-temperature heat generated by the power module 1 to the outside. Furthermore, a second pin 22 is connected to the first pin 21, and the second pin 22 is exposed on the surface 231 of the core body 23. Thus, the first pin 21 can conduct the high-temperature heat to the second pin 22, from which it is dissipated to the outside.
[0027] It should be noted that the buck converter has not only one set of power modules 1 and inductors 2. In some embodiments, the buck converter includes multiple power modules 1 and (correspondingly stacked) inductors 2.
[0028] One of the beneficial effects of this utility model is that, in one embodiment, the buck converter provided by this utility model reduces the area of the buck converter used (designed) by designing the inductor components and power modules in a stacked manner. In some embodiments, the area used can be reduced by at least 50%.
Claims
1. A buck converter, characterized in that, The buck converter includes: A power module includes a lead frame, a first power element, a second power element, and a driver chip, wherein the first power element, the second power element, and the driver chip are all disposed on the lead frame; and An inductor is located above the power module. The first pin of the inductor is electrically connected to the first power element and the second power element, respectively. The second pin of the inductor is connected to the lead frame or is not in contact with the lead frame.
2. The buck converter according to claim 1, characterized in that, The lead frame includes at least one conductive member, the driver chip is electrically connected to the conductive member via a lead, and is electrically connected to the first power element via another lead.
3. The buck converter according to claim 1, characterized in that, The buck converter also includes a connector made of metal, through which the first pin is electrically connected to the first power element and the second power element.
4. The buck converter according to claim 1, characterized in that, The first pin is made of metal and is electrically connected to the first power element and the second power element in a contact manner.
5. The buck converter according to claim 1, characterized in that, The inductor also includes an iron core, with the first pin exposed on the surface of the iron core.
6. The buck converter according to claim 5, characterized in that, The second pin is connected to the first pin, and the second pin is exposed on the surface of the iron core.
7. The buck converter according to claim 1, characterized in that, There are multiple power modules and inductors.