Drive components, piezoelectric micropumps and electronic devices

Abstract

This application provides a driving component, a piezoelectric micropump, and an electronic device. The piezoelectric micropump includes a housing with a receiving cavity formed inside, the receiving cavity communicating with the outside through a through hole in the housing; a support plate disposed in the receiving cavity and fixedly connected to the housing; and a piezoelectric ceramic assembly including a substrate and a piezoelectric ceramic, the substrate having a bending portion and a vibrating portion, the bending portion surrounding the vibrating portion, and the support plate connected to the connecting portion; the piezoelectric ceramic is in close contact with the vibrating portion. This application can improve the vibration effect of the piezoelectric micropump.

Description

Technical Field

[0001] This application relates to the field of electric drive pump technology, and more specifically, to a drive assembly, a piezoelectric micropump, and electronic equipment. Background Technology

[0002] In existing technologies, piezoelectric micropumps are typically used to generate high-pressure, high-speed airflow to enhance the heat exchange efficiency of electronic devices in order to improve their heat dissipation. However, the drive components in current piezoelectric micropumps are usually directly fixed to the housing, resulting in small deformation of the drive components and severely affecting the vibration performance of the piezoelectric micropump.

[0003] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Utility Model Content

[0004] One objective of this application is to provide a new technical solution for a drive component, a piezoelectric micropump, and an electronic device.

[0005] According to a first aspect of this application, a piezoelectric micropump is provided, wherein the piezoelectric micropump comprises: A housing having a receiving cavity formed within it, the receiving cavity communicating with the outside through a through hole in the housing; A support plate is disposed in the receiving cavity and is fixedly connected to the housing; A piezoelectric ceramic assembly includes a substrate and a piezoelectric ceramic. The substrate has a bending portion and a vibrating portion. The bending portion is arranged around the vibrating portion and is connected to a support plate. The piezoelectric ceramic is in close contact with the vibrating portion.

[0006] Optionally, the support plate includes a connecting portion and a hollow portion, the connecting portion is disposed around the hollow portion, and the connecting portion is connected to the bending portion; the hollow portion is disposed opposite to the piezoelectric ceramic. The connecting part is used to electrically connect the piezoelectric ceramic to an external circuit.

[0007] Optionally, the support plate is an FPC, the connection portion includes an electrical connection portion, the electrical connection portion is disposed around the edge of the hollow portion, and the electrical connection portion is connected to the side of the piezoelectric ceramic away from the substrate.

[0008] Optionally, a gap is formed between the support plate and the piezoelectric ceramic; It also includes an electrical connector, which is connected to the connection portion, and the piezoelectric ceramic assembly is connected to an external circuit through the electrical connector.

[0009] Optionally, two piezoelectric ceramic components are provided, with the two piezoelectric ceramic components located on opposite sides of the receiving cavity.

[0010] Optionally, it further includes a jet film, which is disposed on the side of the substrate away from the piezoelectric ceramic, and a vibration cavity is formed between the jet film and the substrate; The jet membrane includes jet holes, which are connected to the through holes.

[0011] Optionally, a pressure relief cavity is formed between the support plate and the housing, and the pressure relief cavity communicates with the outside through a pressure relief hole on the housing.

[0012] Optionally, the area of ​​the substrate projected onto the support plate is smaller than the area of ​​the cutout portion.

[0013] Optionally, multiple bending portions are provided, and the multiple bending portions are evenly distributed around the periphery of the vibrating portion.

[0014] According to a second aspect of this application, a driving component is provided, wherein the component is applied to a piezoelectric micropump as described in any of the first aspects.

[0015] According to a third aspect of this application, an electronic device is provided, comprising a piezoelectric micropump as described in any of the first aspects.

[0016] The piezoelectric micropump in this application is connected to the support plate through the bent part of the substrate. This avoids the problem of small deformation of the piezoelectric ceramic component caused by directly fixing the piezoelectric ceramic component to the housing after the support plate is fixedly connected to the housing, thus effectively improving the vibration effect of the piezoelectric micropump.

[0017] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments of this application with reference to the accompanying drawings. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0019] Figure 1 This is a schematic diagram of the structure of the piezoelectric micropump in the first embodiment of this application.

[0020] Figure 2 This is a schematic diagram of the structure of the support plate and piezoelectric ceramic assembly in the first embodiment of this application.

[0021] Figure 3 This is a top view of the support plate in the first embodiment of this application.

[0022] Figure 4This is a top view of the piezoelectric ceramic assembly in the first embodiment of this application.

[0023] Figure 5 This is a partial cross-sectional view of the support plate and piezoelectric ceramic assembly in the first embodiment of this application.

[0024] Figure 6 This is a schematic diagram of the structure of the support plate and the piezoelectric ceramic assembly in the second embodiment of this application.

[0025] Figure 7 This is a top view of the support plate in the second embodiment of this application.

[0026] Figure 8 This is a top view of the piezoelectric ceramic assembly in the second embodiment of this application.

[0027] Figure 9 This is a top view of the piezoelectric micropump in the third embodiment of this application.

[0028] Figure 10 This is a bottom view of the piezoelectric micropump in the third embodiment of this application.

[0029] Figure 11 This is a schematic diagram of the processing of the driving component in one embodiment of this application.

[0030] Explanation of reference numerals in the attached figures: 1. Support plate; 101. Connecting part; 102. Hollowed-out part; 103. Electrical connection part; 2. Piezoelectric ceramic assembly; 201. Substrate; 2010. Support leg; 2011. Bending part; 2012. Vibrating part; 202. Piezoelectric ceramic; 3. Electrical connectors; 4. Jet film; 401. Jet orifice; 5. Housing; 501. Through hole; 502. Pressure relief hole; 6. Receiving cavity; 601. Vibration cavity; 602. Pressure relief cavity. Detailed Implementation

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0032] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0037] According to one embodiment of this application, a piezoelectric micropump is provided. The piezoelectric micropump includes a housing 5, a support plate 1, and a piezoelectric ceramic assembly 2. A receiving cavity 6 is formed inside the housing 5, and the receiving cavity 6 communicates with the outside through a through hole 501 on the housing 5. The support plate 1 is disposed in the receiving cavity 6 and is fixedly connected to the housing 5. The piezoelectric ceramic assembly 2 includes a substrate 201 and a piezoelectric ceramic 202. A bending portion 2011 and a vibrating portion 2012 are disposed on the substrate 201. The bending portion 2011 is disposed around the vibrating portion 2012 and is connected to the support plate 1. The piezoelectric ceramic 202 is attached to the vibrating portion 2012.

[0038] Specifically, such as Figure 1As shown, the housing 5 described in this embodiment can be a cylindrical housing 5 with a accommodating space, or an annular housing 5 with a hollow structure. The housing 5 contains the accommodating cavity 6, and the housing 5 is provided with a through hole 501 for communicating the accommodating cavity 6 with the outside, allowing gas to be drawn in and discharged from the accommodating cavity 6.

[0039] The support plate 1 can be fixedly connected to the housing 5 to provide a platform for supporting and fixing the piezoelectric ceramic assembly 2.

[0040] The piezoelectric ceramic assembly 2 includes a substrate 201, on which a bending portion 2011 and a vibrating portion 2012 are provided. The bending portion 2011 can be formed by folding a support leg 2010 punched from a circular metal sheet around the vibrating portion 2012. The bending portion 2011 can be connected to the support plate 1 so that the piezoelectric ceramic assembly 2 forms a suspended structure after being connected to the support plate 1. The vibrating portion 2012 is used to mount the piezoelectric ceramic 202. The vibrating portion 2012 can be positioned opposite the hollow portion 102 after the bending portion 2011 is connected to the support plate 1, so that the piezoelectric ceramic assembly 2 can release pressure through the hollow portion 102.

[0041] The piezoelectric ceramic component 2 also includes a piezoelectric ceramic 202, which has an inverse piezoelectric effect and can generate expansion and contraction deformation after being energized, so as to change the volume of gas in the accommodating cavity 6.

[0042] For example, when a driving voltage is applied to the piezoelectric ceramic 202 to shorten its length and width, the substrate 201 cannot shorten, so it will bend towards the piezoelectric ceramic 202. At this time, the volume of the receiving cavity 6 increases, and external gas can enter the receiving cavity 6 through the through hole 501 for storage. When a driving voltage is applied to the piezoelectric ceramic 202 to lengthen its length and width, the substrate 201 cannot lengthen, so it will bend away from the piezoelectric ceramic 202. At this time, the gas stored in the receiving cavity 6 will be compressed and ejected from the through hole 501.

[0043] Therefore, because the aperture of the through hole 501 is small, the flow velocity of the large amount of gas stored in the accommodating cavity 6 increases and the static pressure decreases when it passes through the through hole 501, thus forming a high-pressure, high-speed airflow that is ejected from the through hole 501, effectively improving the driving force of the piezoelectric micropump. Moreover, since the driving component (i.e., the piezoelectric ceramic component 2) provided in this embodiment is fixed to the housing 5 through the support plate 1, it has a larger deformation than the driving component directly fixed to the housing 5 in the prior art. Furthermore, since the piezoelectric ceramic component 2 is also connected to the support plate 1 through the bent portion 2011 of the substrate 201 to form a suspension structure, the piezoelectric ceramic component 2 can generate a larger amplitude, thereby significantly improving the vibration effect of the piezoelectric micropump.

[0044] In one embodiment, the support plate 1 includes a connecting portion 101 and a hollow portion 102. The connecting portion 101 is disposed around the hollow portion 102 and is connected to the bending portion 2011. The hollow portion 102 is disposed opposite to the piezoelectric ceramic 202. The connecting portion 101 is used to provide the piezoelectric ceramic 202 with an external circuit for electrical connection.

[0045] Specifically, the connecting part 101 described in this application embodiment can be connected to the piezoelectric ceramic component 2 so that the piezoelectric ceramic component 2 can form a suspension structure, which facilitates the piezoelectric ceramic component 2 to generate a larger amplitude.

[0046] The connecting portion 101 allows the piezoelectric ceramic 202 to be electrically connected to an external circuit. For example... Figures 1 to 5 As shown, an electrical connection portion 103 is provided on the connecting portion 101. One end of the electrical connection portion 103 is electrically connected to the side of the piezoelectric ceramic 202 away from the substrate 201, and the other end of the electrical connection portion 103 is electrically connected to an external circuit through the connecting portion 101, effectively preventing the edge of the piezoelectric ceramic 202 from turning up; or as... Figures 6 to 8 As shown, an electrical connector 3 can also be fixed on the connecting part 101 so that the piezoelectric ceramic 202 can be electrically connected to an external circuit through the electrical connector 3, thereby suppressing the edge of the piezoelectric ceramic 202 from turning over.

[0047] The hollowed-out portion 102 is disposed in the middle region of the support plate 1. On the one hand, it effectively reduces the weight of the support plate 1, so that the piezoelectric ceramic component 2 can obtain a larger amplitude under the same voltage conditions. On the other hand, it also provides a pressure relief space for the piezoelectric micropump to prevent excessive pressure from damaging the piezoelectric micropump, while ensuring the unidirectional flow effect of gas in the piezoelectric micropump.

[0048] In one embodiment, the support plate 1 is an FPC, and the connecting portion 101 includes an electrical connecting portion 103. The electrical connecting portion 103 is disposed around the edge of the hollow portion 102, and the electrical connecting portion 103 is connected to the side of the piezoelectric ceramic 202 away from the substrate 201.

[0049] Specifically, such as Figure 2 and Figure 3 As shown, this embodiment of the application, by setting the support plate 1 as an FPC, can, on the one hand, reduce the constraint of the solder joints between the support plate 1 and the piezoelectric ceramic component 2 on the piezoelectric ceramic component 2, thereby increasing the driving force of the piezoelectric ceramic component 2; on the other hand, the FPC can also drive the piezoelectric ceramic component 2, enabling the piezoelectric ceramic component 2 to produce greater deformation under the same voltage conditions. Of course, the support plate 1 can also be other flexible electrical connectors, as long as they can achieve electrical connection with the piezoelectric ceramic 202. Those skilled in the art can choose according to actual needs, and this application does not impose specific limitations here.

[0050] Among them, such as Figures 3 to 5 As shown, in this embodiment of the application, the piezoelectric ceramic 202 and the external circuit are electrically connected through the electrical connection part 103. This not only enables the FPC to drive the piezoelectric ceramic component 2, so that the piezoelectric micropump requires a lower driving voltage to achieve the same driving force, but also eliminates the need for the electrical connector 3, making the overall structure of the piezoelectric micropump simpler.

[0051] In addition, such as Figure 9 and Figure 10 As shown, multiple electrical connection portions 103 can be provided in this embodiment. For example, three electrical connection portions 103 can be provided, which are evenly arranged around the edge of the hollow portion 102. In this way, the piezoelectric micropump described in this embodiment is connected to different lines of the external circuit through the three electrical connection portions 103, which effectively improves the driving effect of the external circuit on the piezoelectric ceramic 202.

[0052] Of course, in other embodiments, the electrical connection part 103 may be provided in two, four or five different quantities, as long as the electrical connection between the piezoelectric ceramic component 2 and the external circuit can be realized. Those skilled in the art can choose according to actual needs, and this application does not make specific restrictions here.

[0053] In one embodiment, a gap is formed between the support plate 1 and the piezoelectric ceramic 202; the piezoelectric micropump further includes an electrical connector 3, which is connected to the connection part 101, and the piezoelectric ceramic assembly 2 is connected to an external circuit through the electrical connector 3.

[0054] Specifically, such as Figures 6 to 8 As shown, in this embodiment, a gap is provided between the support plate 1 and the piezoelectric ceramic 202. On the one hand, this provides clearance for the piezoelectric ceramic component 2 during bending deformation, allowing the suspended piezoelectric ceramic component 2 to generate a larger amplitude, thereby improving the driving effect of the piezoelectric micropump. On the other hand, the longer bending portion 2011 further reduces the constraint of the weld points between the support plate 1 and the piezoelectric ceramic component 2 on the piezoelectric ceramic component 2, enabling the piezoelectric ceramic component 2 to have a stronger driving force under the same voltage conditions.

[0055] Among them, such as Figure 6 and Figure 8 As shown in the embodiment of this application, an electrical connector 3 is also provided, which can electrically connect the piezoelectric ceramic component 2 and the external circuit so that the external circuit can drive the piezoelectric ceramic component 2 to deform.

[0056] In addition, such as Figure 6 As shown, the bending portion 2011 can also serve as a fixing structure for the electrical connector 3 to ensure the fixing effect of the electrical connector 3, thereby facilitating the smooth vibration of the piezoelectric ceramic assembly 2 and effectively improving the performance of the piezoelectric micropump.

[0057] In one embodiment, two piezoelectric ceramic components 2 are provided, and the two piezoelectric ceramic components 2 are respectively located on opposite sides of the receiving cavity 6.

[0058] Specifically, such as Figure 9 and Figure 10 As shown, in this embodiment of the application, a piezoelectric ceramic component 2 is respectively arranged on both sides of the receiving cavity 6. On the one hand, the volume change of the receiving cavity 6 can be increased by the two piezoelectric ceramic components 2, so that the flow rate and velocity of the gas in the receiving cavity 6 are higher, thereby improving the working efficiency of the piezoelectric micropump. On the other hand, a greater vibration effect can be obtained by the synchronous deformation of the two piezoelectric ceramic components 2 or the synchronous reverse deformation of the two piezoelectric ceramic components 2, thereby improving the driving efficiency of the piezoelectric micropump.

[0059] In one embodiment, the piezoelectric micropump further includes a jet membrane 4, which is disposed on the side of the substrate 201 away from the piezoelectric ceramic 202, and a vibration cavity 601 is formed between the jet membrane 4 and the substrate 201; wherein, the jet membrane 4 includes a jet hole 401, which communicates with the through hole 501.

[0060] Specifically, such as Figure 1 , Figure 2 and Figure 6 As shown, in this embodiment of the application, a jet film 4 is further provided on the side of the substrate 201 opposite to the piezoelectric ceramic 202. The jet film 4 can form a vibration cavity 601 together with the substrate 201. The jet film 4 is also provided with a jet hole 401, which can communicate with the through hole 501, and the jet hole 401 can allow gas to be drawn in and discharged from the vibration cavity 601.

[0061] Therefore, in this embodiment of the application, by setting the jet membrane 4, the gas in the vibration chamber 601 can be drawn into the fluid around the jet hole 401 when it is discharged to the outside, thereby further increasing the gas flow rate of the piezoelectric micropump.

[0062] In one embodiment, a pressure relief cavity 602 is formed between the support plate 1 and the housing 5, and the pressure relief cavity 602 is connected to the outside through a pressure relief hole 502 on the housing 5.

[0063] Specifically, such as Figure 1 As shown, since the support plate 1 has a perforated portion 102, this embodiment of the application provides a pressure relief chamber 602 between the support plate 1 and the housing 5. This allows excessive pressure in the piezoelectric micropump to be released sequentially through the perforated portion 102, the pressure relief chamber 602, and the pressure relief hole 502, effectively preventing damage to the piezoelectric micropump caused by excessive pressure. Simultaneously, the pressure relief chamber 602 also ensures unidirectional gas flow in the piezoelectric micropump, enabling a stable pumping flow rate and further improving the output stability of the piezoelectric micropump's airflow.

[0064] In one embodiment, the area of ​​the substrate 201 projected onto the support plate 1 is smaller than the area of ​​the cutout portion 102.

[0065] Specifically, such as Figure 3 and Figure 4 As shown, in this embodiment, by setting the area of ​​the substrate 201 projected onto the support plate 1 to be smaller than the area of ​​the hollow portion 102, external airflow can enter the vibration chamber 601 through the hollow portion 102 during the bending deformation of the piezoelectric ceramic component 2. This not only effectively increases the volume change of the receiving cavity 6, resulting in higher gas flow rate and velocity in the receiving cavity 6, but also significantly improves the working efficiency of the piezoelectric micropump.

[0066] In one embodiment, a plurality of bending portions 2011 are provided, and the plurality of bending portions 2011 are evenly disposed on the periphery of the vibrating portion 2012.

[0067] Specifically, such as Figure 4 and Figure 7 As shown, by setting multiple bending portions 2011 in this embodiment, the fixed effect between the piezoelectric ceramic component 2 and the support plate 1 is not only effectively improved, making it easier for the piezoelectric ceramic component 2 to form a suspended structure after being connected to the support plate 1, but also more conducive to the piezoelectric ceramic component 2 generating a larger amplitude, thereby improving the vibration effect of the piezoelectric micropump.

[0068] The bending portion 2011 can be set to two, three, four or five, etc., as long as it can fix the piezoelectric ceramic component 2 to the support plate 1. Those skilled in the art can choose according to actual needs, and this application does not make specific restrictions.

[0069] According to another embodiment of this application, a driving component is provided, which is applied to the piezoelectric micropump of this application.

[0070] Specifically, the driving component described in this application embodiment is the piezoelectric ceramic component 2. According to another embodiment of this application, a method for fabricating a driving component is provided, the method being applied to the piezoelectric micropump of this application, the method comprising: S101, the substrate 201 is stamped to form the support leg 2010 and the vibration part 2012 by a stamping process; Specifically, such as Figure 11 As shown, in the step of stamping the substrate 201 to form the support 2010 and the vibration part 2012 using a stamping process, the substrate 201 can be a circular metal sheet. Then, the peripheral side of the substrate 201 is stamped using a stamping process to form three support 2010s on the peripheral side of the substrate 201, and the vibration part 2012 is formed in the central region of the substrate 201.

[0071] Of course, in other embodiments, the substrate 201 can also be a rectangular metal sheet or a polygonal metal sheet, as long as it can be punched out to form the legs 2010. Those skilled in the art can choose according to actual needs, and this application does not impose specific limitations here.

[0072] S102, Fold the support leg 2010 to form a bent portion 2011; Specifically, such as Figure 11 As shown, in the step of folding the support leg 2010 to form the bent portion 2011, the folding angle of the support leg 2010 is 90°, so that the bent portion 2011 formed by folding is perpendicular to the vibrating portion 2012.

[0073] Of course, in other embodiments, the folding angle of the support leg 2010 can also be an acute angle or an obtuse angle, as long as it can achieve the connection with the support plate 1. Those skilled in the art can choose according to actual needs, and this application does not make specific restrictions here.

[0074] S103, the piezoelectric ceramic 202 is disposed on the vibrating part 2012.

[0075] Specifically, such as Figure 11 As shown, in this embodiment of the application, by placing the piezoelectric ceramic 202 in the central region of the vibrating part 2012, the piezoelectric ceramic 202 can generate a larger amplitude when driven by an external circuit.

[0076] According to another embodiment of this application, an electronic device is provided, the electronic device including the piezoelectric micropump of this application.

[0077] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0078] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A piezoelectric micropump, characterized in that, include: The housing (5) has a cavity (6) inside it, and the cavity (6) is connected to the outside through a through hole (501) on the housing (5); A support plate (1) is disposed in the receiving cavity (6) and is fixedly connected to the housing (5); The piezoelectric ceramic assembly (2) includes a substrate (201) and a piezoelectric ceramic (202). The substrate (201) is provided with a bending portion (2011) and a vibrating portion (2012). The bending portion (2011) is arranged around the vibrating portion (2012) and the bending portion (2011) is connected to the support plate (1). The piezoelectric ceramic (202) is attached to the vibrating portion (2012).

2. The piezoelectric micropump according to claim 1, characterized in that, The support plate (1) includes a connecting part (101) and a hollow part (102). The connecting part (101) is arranged around the hollow part (102) and is connected to the bending part (2011). The hollow part (102) is arranged opposite to the piezoelectric ceramic (202). The connecting part (101) is used to electrically connect the piezoelectric ceramic (202) to an external circuit.

3. The piezoelectric micropump according to claim 2, characterized in that, The support plate (1) is an FPC, and the connecting part (101) includes an electrical connecting part (103). The electrical connecting part (103) is arranged around the edge of the hollow part (102), and the electrical connecting part (103) is connected to the side of the piezoelectric ceramic (202) away from the substrate (201).

4. The piezoelectric micropump according to claim 2, characterized in that, A gap is formed between the support plate (1) and the piezoelectric ceramic (202); It also includes an electrical connector (3), which is connected to the connection part (101), and the piezoelectric ceramic assembly (2) is connected to an external circuit through the electrical connector (3).

5. The piezoelectric micropump according to claim 1, characterized in that, Two piezoelectric ceramic components (2) are provided, and the two piezoelectric ceramic components (2) are located on opposite sides of the receiving cavity (6).

6. The piezoelectric micropump according to claim 1, characterized in that, It also includes a jet film (4), which is disposed on the side of the substrate (201) away from the piezoelectric ceramic (202), and a vibration cavity (601) is formed between the jet film (4) and the substrate (201). The jet membrane (4) includes a jet hole (401) which is connected to the through hole (501).

7. The piezoelectric micropump according to claim 1, characterized in that, A pressure relief chamber (602) is formed between the support plate (1) and the housing (5), and the pressure relief chamber (602) is connected to the outside through the pressure relief hole (502) on the housing (5).

8. The piezoelectric micropump according to claim 2, characterized in that, The area of ​​the substrate (201) projected onto the support plate (1) is smaller than the area of ​​the hollow portion (102).

9. The piezoelectric micropump according to claim 1, characterized in that, The bending portion (2011) is provided in multiple ways, and the multiple bending portions (2011) are evenly arranged on the periphery of the vibrating portion (2012).

10. A driving component, characterized in that, Applied to the piezoelectric micropump as described in any one of claims 1-9.

11. An electronic device, characterized in that, Including the piezoelectric micropump as described in any one of claims 1-9.

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