Drive components, piezoelectric micropumps and electronic devices

Abstract

This application provides a driving component, a piezoelectric micropump, and an electronic device. The piezoelectric micropump includes a housing and a piezoelectric ceramic assembly. The piezoelectric ceramic assembly includes a bicrystalline piezoelectric sheet and a flexible electrical connector. The bicrystalline piezoelectric sheet is disposed on the flexible electrical connector. The flexible electrical connector is connected to the housing. A receiving cavity is formed between the flexible electrical connector and the housing, and the receiving cavity communicates with the outside through a through-hole. The flexible electrical connector can drive the bicrystalline piezoelectric sheet to deform, thereby realizing the intake and exhaust of gas in the receiving cavity. This application can reduce the energy consumption of the piezoelectric micropump.

Description

Technical Field

[0001] This application relates to the field of electric drive pump technology, and more specifically, to a drive assembly, a piezoelectric micropump, and electronic equipment. Background Technology

[0002] In the prior art, in order to improve the heat dissipation effect of electronic devices, piezoelectric micropumps are usually used to generate high pressure and high speed airflow to enhance the heat exchange efficiency of electronic devices.

[0003] However, current piezoelectric micropumps primarily utilize piezoelectric ceramics to drive metal sheets, thereby changing the volume of gas within the containment cavity. This necessitates that the deformation of the piezoelectric ceramics act on the metal sheet. Consequently, to ensure sufficient driving force, the driving voltage must be increased to enhance the deformation of the piezoelectric ceramics, significantly increasing the energy consumption of the piezoelectric micropump.

[0004] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Utility Model Content

[0005] One objective of this application is to provide a new technical solution for a drive component, a piezoelectric micropump, and an electronic device.

[0006] According to a first aspect of this application, a piezoelectric micropump is provided, wherein the piezoelectric micropump comprises: case; A piezoelectric ceramic assembly, comprising a bicrystalline piezoelectric sheet and a flexible electrical connector, wherein the bicrystalline piezoelectric sheet is disposed on the flexible electrical connector; the flexible electrical connector is connected to the housing. The flexible electrical connector forms a cavity between itself and the housing, and the cavity is connected to the outside through a through hole. The flexible electrical connector can drive the bicrystalline piezoelectric sheet to deform, so as to realize the intake and exhaust of gas in the cavity.

[0007] Optionally, the orthographic projection of the bicrystalline piezoelectric sheet toward the flexible electrical connector is smaller than the orthographic projection of the receiving cavity toward the flexible electrical connector.

[0008] Optionally, the flexible electrical connector includes a fixing part and a supporting part, the fixing part being connected to the housing; the supporting part having a through hole through the thickness direction of the flexible electrical connector, and a cantilever part being formed between adjacent through holes; the supporting part also having a vibration part, the vibration part being connected to the fixing part through the cantilever part. The bicrystalline piezoelectric sheet includes a first bicrystalline piezoelectric sheet and a second bicrystalline piezoelectric sheet, which are disposed on opposite sides of the vibrating part along the thickness direction.

[0009] Optionally, the piezoelectric ceramic assembly further includes a first jet film, which is disposed on the side of the first bicrystalline piezoelectric sheet away from the vibrating part; The first jet film has a first jet hole on the side opposite to the first bicrystalline piezoelectric sheet, and the first jet hole is connected to the through hole.

[0010] Optionally, the cantilever portion includes a first cantilever portion, a second cantilever portion, a third cantilever portion, and a fourth cantilever portion, wherein the first cantilever portion, the second cantilever portion, the third cantilever portion, and the fourth cantilever portion are symmetrically arranged on the periphery of the vibrating portion.

[0011] Optionally, the vibration part further includes a first vibration part and a second vibration part, wherein the first vibration part and the second vibration part are respectively located on opposite sides of the flexible electrical connector.

[0012] Optionally, the first vibrating part includes a first side and a second side, the first side and the second side being two sides of the first vibrating part that are opposite to each other along the thickness direction; the second vibrating part includes a third side and a fourth side, the third side and the fourth side being two sides of the second vibrating part that are opposite to each other along the thickness direction. The first bicrystalline piezoelectric element includes a first sub-bicrystalline piezoelectric element and a second sub-bicrystalline piezoelectric element. The first sub-bicrystalline piezoelectric element is connected to the first side surface, and the second sub-bicrystalline piezoelectric element is connected to the third side surface. The second bicrystalline piezoelectric element includes a third sub-bicrystalline piezoelectric element and a fourth sub-bicrystalline piezoelectric element. The third sub-bicrystalline piezoelectric element is connected to the second side surface, and the fourth sub-bicrystalline piezoelectric element is connected to the fourth side surface.

[0013] Optionally, the piezoelectric ceramic assembly further includes a second jet film and a third jet film. The second jet film is disposed on the side of the first sub-bicrystalline piezoelectric sheet opposite to the first side, and a second jet hole is provided on the side of the second jet film opposite to the first sub-bicrystalline piezoelectric sheet. The third jet film is disposed on the side of the second sub-bicrystalline piezoelectric sheet opposite to the third side, and a third jet hole is provided on the side of the third jet film opposite to the second sub-bicrystalline piezoelectric sheet. The through hole includes a first through hole and a second through hole, the first through hole being connected to the second jet hole, and the second through hole being connected to the third jet hole.

[0014] Optionally, the cantilever portion includes a fifth cantilever portion, a sixth cantilever portion, a seventh cantilever portion, an eighth cantilever portion, a ninth cantilever portion, a tenth cantilever portion, an eleventh cantilever portion, and a twelfth cantilever portion. The fifth cantilever portion, the sixth cantilever portion, the seventh cantilever portion, and the eighth cantilever portion are symmetrically arranged on the periphery of the first vibration portion; the ninth cantilever portion, the tenth cantilever portion, the eleventh cantilever portion, and the twelfth cantilever portion are symmetrically arranged on the periphery of the second vibration portion.

[0015] Optionally, the flexible electrical connector may be made of at least one of PI film, PET film, PEN film and PEEK film.

[0016] According to a second aspect of this application, a driving component is provided, wherein the component is applied to a piezoelectric micropump as described in any of the first aspects.

[0017] According to a third aspect of this application, an electronic device is provided, comprising a piezoelectric micropump as described in any of the first aspects.

[0018] The piezoelectric micropump in this application directly drives the bicrystalline piezoelectric sheet to deform and change the volume of gas in the containment cavity through a flexible electrical connector, eliminating the need for a metal sheet and thus effectively reducing the energy consumption of the piezoelectric micropump.

[0019] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments of this application with reference to the accompanying drawings. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0021] Figure 1 This is a schematic diagram of the structure of a piezoelectric micropump in one embodiment of this application.

[0022] Figure 2 This is an exploded view of the piezoelectric ceramic component in the first embodiment of this application.

[0023] Figure 3 This is an assembly diagram of the piezoelectric ceramic component in the first embodiment of this application.

[0024] Figure 4 yes Figure 3 Side view.

[0025] Figure 5 This is an exploded view of the piezoelectric ceramic component in the second embodiment of this application.

[0026] Figure 6 This is an assembly diagram of the piezoelectric ceramic assembly in the second embodiment of this application.

[0027] Figure 7 This is an exploded view of the piezoelectric ceramic component in the third embodiment of this application.

[0028] Figure 8 This is a top view of the flexible electrical connector in the third embodiment of this application.

[0029] Figure 9 This is a bottom view of the flexible electrical connector in the third embodiment of this application.

[0030] Explanation of reference numerals in the attached figures: 1. Shell; 101. Through hole; 2. Piezoelectric ceramic assembly; 201, First bicrystalline piezoelectric element; 2011, First sub-bicrystalline piezoelectric element; 2012, Second sub-bicrystalline piezoelectric element; 202, Second bicrystalline piezoelectric element; 2021, Third sub-bicrystalline piezoelectric element; 2022, Fourth sub-bicrystalline piezoelectric element; 203, Flexible electrical connector; 2031, Fixing part; 2032, Bearing part; 20321, Through-hole part; 20322, Cantilever part; 203221, First cantilever part; 203222, Second cantilever part; 203223, Third cantilever part; 203224, Fourth cantilever part; 203225, Fifth cantilever part; 203226, Sixth cantilever part; 203227, Seventh cantilever part Cantilever section; 203228, Eighth cantilever section; 203229, Ninth cantilever section; 2032210, Tenth cantilever section; 2032211, Eleventh cantilever section; 2032212, Twelfth cantilever section; 20323, Vibrating section; 203231, First vibrating section; 2032311, First side surface; 2032312, Second side surface; 203232, Second vibrating section; 2032321, Third side surface; 2032322, Fourth side surface; 204, First jet film; 2041, First jet orifice; 205, Second jet film; 2051, Second jet orifice; 206, Third jet film; 2061, Third jet orifice; 3. Receiving cavity. Detailed Implementation

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0032] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0037] According to one embodiment of this application, a piezoelectric micropump is provided. The piezoelectric micropump includes a housing 1 and a piezoelectric ceramic component 2. The piezoelectric ceramic component 2 includes a bicrystalline piezoelectric sheet and a flexible electrical connector 203. The bicrystalline piezoelectric sheet is disposed on the flexible electrical connector 203. The flexible electrical connector 203 is connected to the housing 1. A receiving cavity 3 is formed between the flexible electrical connector 203 and the housing 1. The receiving cavity 3 communicates with the outside through a through hole 101. The flexible electrical connector 203 can drive the bicrystalline piezoelectric sheet to deform, so as to realize the intake and exhaust of gas in the receiving cavity 3.

[0038] Specifically, such as Figure 1As shown in the embodiments of this application, the housing 1 can be a cylindrical housing with a receiving space, or an annular housing with a hollow structure. The housing 1 can be connected to the piezoelectric ceramic component 2, and the receiving cavity 3 is formed between the housing 1 and the piezoelectric ceramic component 2. The side wall of the housing 1 is provided with a through hole 101 for communicating the receiving cavity 3 with the outside, or the piezoelectric ceramic component 2 is provided with a through hole 101 for communicating the receiving cavity 3 with the outside. The through hole 101 allows gas in the receiving cavity 3 to be drawn in and discharged.

[0039] The piezoelectric ceramic component 2 includes a bicrystalline piezoelectric sheet, which is a bicrystalline oscillation structure. The two piezoelectric ceramic layers in the bicrystalline oscillation structure can deform synchronously or in opposite directions after being energized, so as to generate efficient and larger-amplitude expansion and contraction deformation.

[0040] The piezoelectric ceramic assembly 2 further includes a flexible electrical connector 203, which can be connected to the housing 1 to form the receiving cavity 3 between the flexible electrical connector 203 and the piezoelectric ceramic assembly 2. The flexible electrical connector 203 is provided with the bicrystalline piezoelectric sheet, which can electrically connect the bicrystalline piezoelectric sheet to an external circuit, allowing the bicrystalline piezoelectric sheet to deform under the drive of an electrical signal such as a driving voltage or driving current, thereby changing the volume of gas within the receiving cavity 3.

[0041] For example, when a voltage is applied to the bicrystalline piezoelectric sheet via the flexible electrical connector 203, the piezoelectric ceramic component 2 will undergo a bending deformation away from the housing 1 when the length and width of the bicrystalline piezoelectric sheet are extended (i.e., the piezoelectric ceramic component 2 arches upward under the action of the bicrystalline piezoelectric sheet). At this time, the volume of the receiving cavity 3 increases, and external gas can enter the receiving cavity 3 through the through hole 101 for storage. When the length and width of the bicrystalline piezoelectric sheet are shortened, the piezoelectric ceramic component 2 will undergo a bending deformation closer to the housing 1 (i.e., the piezoelectric ceramic component 2 bends downward under the action of the bicrystalline piezoelectric sheet). At this time, the gas stored in the receiving cavity 3 will be compressed and ejected from the through hole 101.

[0042] Therefore, because the aperture of the through hole 101 is small, the flow velocity of the large amount of gas stored in the accommodating cavity 3 increases and the static pressure decreases when it passes through the through hole 101, thus forming a high-pressure, high-speed airflow that is ejected from the through hole 101, thereby effectively improving the driving force of the piezoelectric micropump. Moreover, since the driving component (i.e., the piezoelectric ceramic component 2) provided in this embodiment does not include a metal sheet, and the bicrystalline piezoelectric sheet is driven to deform by a flexible electrical connector 203 made of flexible material, the driving effect of the piezoelectric ceramic component 2 is also effectively improved. Under the same voltage conditions, the piezoelectric ceramic component 2 can produce greater deformation, so that the piezoelectric micropump requires a lower driving voltage to achieve the same driving force.

[0043] Therefore, compared with the existing technology of using piezoelectric ceramics to drive metal sheets, the driving component provided in this application not only ensures the electrical connection effect of the dual-crystal piezoelectric sheet, but also reduces the energy consumption required when the piezoelectric ceramic drives the metal sheet, thereby significantly increasing the amplitude of the piezoelectric ceramic component 2, reducing the energy consumption of the piezoelectric micropump, and improving the driving force of the piezoelectric micropump.

[0044] Furthermore, the material of the housing 1 can be a metal material such as iron-nickel alloy, titanium alloy, or stainless steel, or an elastic material such as engineering plastic; the material of the bicrystalline piezoelectric sheet can be a piezoelectric material such as lead zirconate titanate, barium titanate, potassium sodium niobate, or aluminum nitride. Those skilled in the art can choose according to actual needs, and this application does not impose specific restrictions here.

[0045] In one embodiment, the orthographic projection of the bicrystalline piezoelectric sheet toward the flexible electrical connector 203 is smaller than the orthographic projection of the receiving cavity 3 toward the flexible electrical connector 203.

[0046] Specifically, such as Figure 1 As shown, in this embodiment of the application, by setting the orthographic projection of the bicrystalline piezoelectric sheet toward the flexible electrical connector 203 to be smaller than the orthographic projection of the receiving cavity 3 toward the flexible electrical connector 203, the compression effect of the piezoelectric ceramic component 2 on the gas in the receiving cavity 3 during vibration is effectively improved, resulting in a higher gas flow rate and lower static pressure, thereby achieving better heat dissipation for electronic devices.

[0047] The bicrystalline piezoelectric element includes a first bicrystalline piezoelectric element 201 and a second bicrystalline piezoelectric element 202. The first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202 are disposed on opposite sides of the flexible electrical connector 203 along the thickness direction. The orthographic projections of the first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202 onto the flexible electrical connector 203 are both smaller than the orthographic projection of the receiving cavity 3 onto the flexible electrical connector 203, so as to avoid interference of the housing 1 with the deformation of the first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202, thereby further improving the driving force of the piezoelectric ceramic component 2.

[0048] In one embodiment, the flexible electrical connector 203 is either an FPC (Flexible Printed Circuit) or an FFC (Flexible Flat Cable) to improve the driving effect of the flexible electrical connector 203 on the bicrystalline piezoelectric sheet.

[0049] Of course, the flexible electrical connector 203 can also be other structures, and those skilled in the art can choose according to actual needs. This application does not impose specific restrictions here.

[0050] In one embodiment, the FPC is square, the bicrystalline piezoelectric sheet is circular, the side length of the FPC is greater than the diameter of the bicrystalline piezoelectric sheet, and the bicrystalline piezoelectric sheet is disposed in the central region of the FPC.

[0051] Specifically, such as Figure 2 and Figure 3 As shown, in this embodiment of the application, by setting the FPC to be square and the bicrystalline piezoelectric sheet to be circular, it is convenient to connect the FPC to the housing 1 to ensure the stability and reliability of the piezoelectric ceramic component 2 during operation. On the other hand, it is also convenient for the bicrystalline piezoelectric sheet to form a dome-shaped structure during deformation, so that the piezoelectric ceramic component 2 can generate a larger deformation under the same size conditions.

[0052] In addition, in other embodiments, the piezoelectric ceramic component 2 may also be provided with a through hole 101 for communicating the receiving cavity 3 with the outside.

[0053] Therefore, as Figures 2 to 4 As shown, in this embodiment of the application, a first jet film 204 including a first jet hole 2041 is provided on the side of the first bicrystalline piezoelectric sheet 201 away from the FPC, so that the first jet hole 2041 can communicate with the through hole 101, thereby effectively improving the output stability of the piezoelectric micropump airflow.

[0054] Among them, such as Figure 3 As shown, the first jet membrane 204 includes four symmetrically arranged jet sections, each of which is provided with a first jet hole 2041. In this embodiment, the airflow output through the four first jet holes 2041 further improves the driving force of the piezoelectric micropump, making the heat dissipation range of the piezoelectric micropump wider.

[0055] Of course, in other embodiments, the first jet membrane 204 may have only one jet section, or two jet sections, or three jet sections, as long as the gas in the receiving cavity 3 can be output. Those skilled in the art can choose according to actual needs, and this application does not make specific restrictions here.

[0056] In one embodiment, the flexible electrical connector 203 includes a fixing part 2031 and a supporting part 2032. The fixing part 2031 is connected to the housing 1. The supporting part 2032 has a through hole 20321 extending along the thickness direction of the flexible electrical connector 203. A cantilever 20322 is formed between adjacent through holes 20321. The supporting part 2032 also has a vibration part 20323, which is connected to the fixing part 2031 through the cantilever 20322. The bicrystalline piezoelectric sheet includes a first bicrystalline piezoelectric sheet 201 and a second bicrystalline piezoelectric sheet 202. The first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 are disposed on opposite sides of the vibration part 20323 along the thickness direction.

[0057] Specifically, such as Figure 5 and Figure 6 As shown, the fixing part 2031 described in this embodiment can be connected to the housing 1 by welding, bonding, snap-fitting, or other methods to ensure the stability and reliability of the piezoelectric ceramic component 2 during operation. The fixing part 2031 is arranged around the periphery of the bearing part 2032 to facilitate the connection between the piezoelectric ceramic component 2 and the housing 1, and to ensure the vibration effect of the piezoelectric ceramic component 2. The supporting part 2032 includes a through hole 20321, a cantilever part 20322, and a vibration part 20323. The through hole 20321 is disposed on the side of the supporting part 2032 near the fixing part 2031. Multiple through holes 20321 are provided, and the cantilever part 20322 is formed between the multiple through holes 20321. The vibration part 20323 is connected to the fixing part 2031 through the cantilever part 20322. The first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 are respectively disposed on the two opposite sides of the vibration part 20323 along the thickness direction.

[0058] Therefore, the piezoelectric ceramic component 2 described in this application embodiment, through the flexible electrical connector 203 with a cantilever structure, not only ensures the electrical connection between the first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202 and the external circuit, but also further enhances the deformation effect of the first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202. This allows the first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202 to generate efficient and larger-amplitude bending vibrations under the drive of the flexible electrical connector 203, thereby further improving the driving force of the piezoelectric micropump. Moreover, by providing the through-hole portion 20321 on the flexible electrical connector 203, the weight of the flexible electrical connector 203 is effectively reduced, allowing for a further increase in the amplitude of the first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202 under the same driving voltage, thereby further reducing the energy consumption of the piezoelectric micropump.

[0059] The cantilever portion 20322, the fixed portion 2031, and the vibrating portion 20323 are provided with rounded chamfers to further eliminate the sharp corners of the through-hole portion 20321, so that the stress formed on the piezoelectric ceramic component 2 can be released along a smooth curve, thereby further reducing the driving voltage required by the vibrating portion 20323 and reducing the energy consumption of the piezoelectric micropump.

[0060] Furthermore, since the first bicrystalline piezoelectric element 201 and the second bicrystalline piezoelectric element 202 can vibrate on their own when energized, the embodiments of this application may also provide the first bicrystalline piezoelectric element 201 or the second bicrystalline piezoelectric element 202 only on one side of the vibrating part 20323 along the thickness direction, so as to further simplify the overall structure of the piezoelectric micropump.

[0061] In one embodiment, the piezoelectric ceramic assembly 2 further includes a first jet film 204, which is disposed on the side of the first bicrystalline piezoelectric sheet 201 away from the vibrating part 20323; wherein, the side of the first jet film 204 away from the first bicrystalline piezoelectric sheet 201 is provided with a first jet hole 2041, which communicates with the through hole 101.

[0062] Specifically, such as Figure 5 and Figure 6 As shown, in this embodiment, the first jet membrane 204 enables the gas in the receiving cavity 3 to be continuously, stably, and directionally delivered through the first jet orifice 2041, effectively improving the continuous output stability of the piezoelectric micropump. Furthermore, it overcomes the shortcomings of traditional valveless micropumps, such as small flow rate and discontinuous output, greatly satisfying the heat dissipation requirements of electronic devices.

[0063] Among them, such as Figure 6 As shown, the first jet membrane 204 includes four symmetrically arranged jet sections, each of which is provided with a first jet hole 2041. Thus, in this embodiment of the application, the driving force of the piezoelectric micropump is further improved through the airflow output of the four first jet holes 2041, and the heat dissipation range of the piezoelectric micropump is made wider.

[0064] In one embodiment, the cantilever portion 20322 includes a first cantilever portion 203221, a second cantilever portion 203222, a third cantilever portion 203223, and a fourth cantilever portion 203224, wherein the first cantilever portion 203221, the second cantilever portion 203222, the third cantilever portion 203223, and the fourth cantilever portion 203224 are symmetrically arranged on the periphery of the vibration portion 20323.

[0065] Specifically, such as Figure 5 and Figure 6 As shown, in this embodiment of the application, the cantilever portion 20322 symmetrically arranged on the periphery of the vibration portion 20323 further ensures the structural symmetry of the entire flexible electrical connector 203. This makes it easier for the first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 to vibrate more uniformly in all directions when the flexible electrical connector 203 drives the first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 to deform, thereby reducing the internal stress and energy loss caused by structural asymmetry and further reducing the energy consumption of the piezoelectric micropump.

[0066] In other embodiments, the cantilever portion 20322 may be provided in one, two, or three forms, as long as it can drive the first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 to deform. Those skilled in the art can choose according to actual needs, and this application does not impose specific restrictions here.

[0067] In one embodiment, the vibration part 20323 further includes a first vibration part 203231 and a second vibration part 203232, the first vibration part 203231 and the second vibration part 203232 being located on opposite sides of the flexible electrical connector 203.

[0068] Specifically, such as Figures 7 to 9 As shown, in this embodiment of the application, by providing the first vibration part 203231 and the second vibration part 203232 on opposite sides of the flexible electrical connector 203, more gas can be stored in the receiving cavity 3, thereby enabling the piezoelectric micropump to deliver airflow with greater flow rate and velocity when it outputs, further improving the working efficiency of the piezoelectric micropump.

[0069] In one embodiment, the first vibrating part 203231 includes a first side surface 2032311 and a second side surface 2032312, the first side surface 2032311 and the second side surface 2032312 being two sides of the first vibrating part 203231 that are opposite to each other along the thickness direction; the second vibrating part 203232 includes a third side surface 2032321 and a fourth side surface 2032322, the third side surface 2032321 and the fourth side surface 2032322 being two sides of the second vibrating part 203232 that are opposite to each other along the thickness direction; the first twin crystal The piezoelectric element 201 includes a first sub-bicrystalline piezoelectric element 2011 and a second sub-bicrystalline piezoelectric element 2012. The first sub-bicrystalline piezoelectric element 2011 is connected to the first side surface 2032311, and the second sub-bicrystalline piezoelectric element 2012 is connected to the third side surface 2032321. The second bicrystalline piezoelectric element 202 includes a third sub-bicrystalline piezoelectric element 2021 and a fourth sub-bicrystalline piezoelectric element 2022. The third sub-bicrystalline piezoelectric element 2021 is connected to the second side surface 2032312, and the fourth sub-bicrystalline piezoelectric element 2022 is connected to the fourth side surface 2032322.

[0070] Specifically, such as Figure 8 and Figure 9 As shown, in the embodiments of this application, the first vibration unit 203231 and the second vibration unit 203232 can drive the first sub-bicrystalline piezoelectric sheet 2011, the second sub-bicrystalline piezoelectric sheet 2012, the third sub-bicrystalline piezoelectric sheet 2021 and the fourth sub-bicrystalline piezoelectric sheet 2022 to deform synchronously. Alternatively, the first vibration unit 203231 and the second vibration unit 203232 can drive the first sub-bicrystalline piezoelectric sheet 2011, the second sub-bicrystalline piezoelectric sheet 2012, the third sub-bicrystalline piezoelectric sheet 2021, and the fourth sub-bicrystalline piezoelectric sheet 2022 to deform synchronously in opposite directions. That is, in this embodiment of the application, the first vibration unit 203231 drives the first sub-bicrystalline piezoelectric sheet 2011 and the third sub-bicrystalline piezoelectric sheet 2021 to arch upward, thereby achieving the intake of gas into the receiving cavity 3; the second vibration unit 203232 drives the second sub-bicrystalline piezoelectric sheet 2012 and the fourth sub-bicrystalline piezoelectric sheet 2022 to bend downward, thereby achieving the discharge of gas from the receiving cavity 3.

[0071] Therefore, by setting the first sub-bicrystalline piezoelectric element 2011, the second sub-bicrystalline piezoelectric element 2012, the third sub-bicrystalline piezoelectric element 2021, and the fourth sub-bicrystalline piezoelectric element 2022, this embodiment of the application not only increases the volume of the receiving cavity 3, but also optimizes the intake and exhaust processes of the piezoelectric micropump, further improving the working efficiency of the piezoelectric micropump.

[0072] In one embodiment, the piezoelectric ceramic assembly 2 further includes a second jet film 205 and a third jet film 206. The second jet film 205 is disposed on the side of the first sub-bicrystalline piezoelectric sheet 2011 opposite to the first side surface 2032311, and a second jet hole 2051 is provided on the side of the second jet film 205 opposite to the first sub-bicrystalline piezoelectric sheet 2011. The third jet film 206 is disposed on the side of the second sub-bicrystalline piezoelectric sheet 2012 opposite to the third side surface 2032321, and a third jet hole 2061 is provided on the side of the third jet film 206 opposite to the second sub-bicrystalline piezoelectric sheet 2012. The through hole 101 includes a first through hole 101 and a second through hole 101, the first through hole 101 communicating with the second jet hole 2051, and the second through hole 101 communicating with the third jet hole 2061.

[0073] Specifically, such as Figure 7 As shown, the embodiment of this application, through the setting of the second jet film 205 and the third jet film 206, not only improves the output stability of the piezoelectric micropump airflow, but also effectively avoids the air leakage problem caused by the through hole 20321, and further ensures the driving effect of the piezoelectric ceramic component 2.

[0074] The second jet membrane 205 and the third jet membrane 206 can form an integral structure, or the second jet membrane 205 and the third jet membrane 206 can be separate structures, as long as the air leakage problem caused by the through hole 20321 can be avoided. Those skilled in the art can choose according to actual needs, and this application does not make specific restrictions here.

[0075] In one embodiment, the cantilever portion 20322 includes a fifth cantilever portion 203225, a sixth cantilever portion 203226, a seventh cantilever portion 203227, an eighth cantilever portion 203228, a ninth cantilever portion 203229, a tenth cantilever portion 2032210, an eleventh cantilever portion 2032211, and a twelfth cantilever portion 2032212. The fifth cantilever portion 203225, the sixth cantilever portion 203226, the seventh cantilever portion 203227, and the eighth cantilever portion 203228 are symmetrically arranged on the periphery of the first vibration portion 203231; the ninth cantilever portion 203229, the tenth cantilever portion 2032210, the eleventh cantilever portion 2032211, and the twelfth cantilever portion 2032212 are symmetrically arranged on the periphery of the second vibration portion 203232.

[0076] Specifically, such as Figure 8 and Figure 9As shown, in this embodiment of the application, the cantilever portion 20322 symmetrically arranged on the periphery of the first vibration portion 203231 and the second vibration portion 203232 further ensures the structural symmetry of the entire flexible electrical connector 203. This makes it easier for the first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 to vibrate more uniformly in all directions when the flexible electrical connector 203 drives the first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 to deform, thereby reducing the internal stress and energy loss caused by structural asymmetry and further reducing the energy consumption of the piezoelectric micropump.

[0077] In one embodiment, the flexible electrical connector 203 is made of at least one of PI (Polyimide Film), PET (Polyethylene Terephthalate Film), PEN (Polyethylene Naphthalate Film), and PEEK (Polyetheretherketone) film.

[0078] Specifically, the flexible electrical connector 203 described in this application embodiment can be an FPC, which can reduce the energy consumption of the first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202 and improve the driving force of the piezoelectric micropump by utilizing the high flexibility of the FPC itself.

[0079] The flexible electrical connector 203 can be made of any one of PI film, PET film, PEN film or PEEK film, or a combination of multiple films such as PI film, PET film, PEN film or PEEK film, so that the flexible electrical connector 203 has a wider range of applications.

[0080] According to another embodiment of this application, a driving component is provided, which is applied to the piezoelectric micropump of this application.

[0081] Specifically, the driving component described in this application embodiment may include a first bicrystalline piezoelectric sheet 201, a second bicrystalline piezoelectric sheet 202, and a flexible electrical connector 203, wherein the flexible electrical connector 203 is disposed between the first bicrystalline piezoelectric sheet 201 and the second bicrystalline piezoelectric sheet 202; or the driving component may further include a first bicrystalline piezoelectric sheet 201 and a flexible electrical connector 203, wherein the first bicrystalline piezoelectric sheet 201 is disposed on one side of the flexible electrical connector 203 along the thickness direction; or the driving component may further include a second bicrystalline piezoelectric sheet 202 and a flexible electrical connector 203, wherein the second bicrystalline piezoelectric sheet 202 is disposed on one side of the flexible electrical connector 203 along the thickness direction.

[0082] According to another embodiment of this application, an electronic device is provided, the electronic device including the piezoelectric micropump of this application.

[0083] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0084] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A piezoelectric micropump, characterized by, include: Shell (1); A piezoelectric ceramic assembly (2) includes a bicrystalline piezoelectric sheet and a flexible electrical connector (203), wherein the bicrystalline piezoelectric sheet is disposed on the flexible electrical connector (203); the flexible electrical connector (203) is connected to the housing (1); The flexible electrical connector (203) forms a cavity (3) between the housing (1) and the housing (1). The cavity (3) is connected to the outside through a through hole (101). The flexible electrical connector (203) can drive the bicrystalline piezoelectric sheet to deform so as to realize the intake and exhaust of gas in the cavity (3).

2. The piezoelectric micropump according to claim 1, characterized in that The orthographic projection of the bicrystalline piezoelectric sheet toward the flexible electrical connector (203) is smaller than the orthographic projection of the receiving cavity (3) toward the flexible electrical connector (203).

3. The piezoelectric micropump according to claim 1, characterized in that The flexible electrical connector (203) includes a fixing part (2031) and a supporting part (2032). The fixing part (2031) is connected to the housing (1). The supporting part (2032) has a through hole (20321) through it along the thickness direction of the flexible electrical connector (203). A cantilever part (20322) is formed between adjacent through holes (20321). The supporting part (2032) is also provided with a vibration part (20323). The vibration part (20323) is connected to the fixing part (2031) through the cantilever part (20322). The bicrystalline piezoelectric sheet includes a first bicrystalline piezoelectric sheet (201) and a second bicrystalline piezoelectric sheet (202), which are disposed on opposite sides of the vibrating part (20323) along the thickness direction.

4. The piezoelectric micropump according to claim 3, characterized in that The piezoelectric ceramic assembly (2) further includes a first jet film (204), which is disposed on the side of the first bicrystalline piezoelectric sheet (201) away from the vibrating part (20323); The first jet membrane (204) has a first jet hole (2041) on the side opposite to the first bicrystalline piezoelectric sheet (201), and the first jet hole (2041) is connected to the through hole (101).

5. The piezoelectric micropump according to claim 3, characterized in that The cantilever section (20322) includes a first cantilever section (203221), a second cantilever section (203222), a third cantilever section (203223), and a fourth cantilever section (203224), which are symmetrically arranged on the periphery of the vibration section (20323).

6. The piezoelectric micropump according to claim 3, characterized in that The vibration part (20323) further includes a first vibration part (203231) and a second vibration part (203232), the first vibration part (203231) and the second vibration part (203232) being located on opposite sides of the flexible electrical connector (203).

7. The piezoelectric micropump according to claim 6, characterized in that The first vibrating part (203231) includes a first side (2032311) and a second side (2032312), the first side (2032311) and the second side (2032312) being two sides of the first vibrating part (203231) that are opposite to each other along the thickness direction; the second vibrating part (203232) includes a third side (2032321) and a fourth side (2032322), the third side (2032321) and the fourth side (2032322) being two sides of the second vibrating part (203232) that are opposite to each other along the thickness direction; The first bicrystalline piezoelectric element (201) includes a first sub-bicrystalline piezoelectric element (2011) and a second sub-bicrystalline piezoelectric element (2012). The first sub-bicrystalline piezoelectric element (2011) is connected to the first side surface (2032311), and the second sub-bicrystalline piezoelectric element (2012) is connected to the third side surface (2032321). The second bicrystalline piezoelectric element (202) includes a third sub-bicrystalline piezoelectric element (2021) and a fourth sub-bicrystalline piezoelectric element (2022). The third sub-bicrystalline piezoelectric element (2021) is connected to the second side surface (2032312), and the fourth sub-bicrystalline piezoelectric element (2022) is connected to the fourth side surface (2032322).

8. The piezoelectric micropump according to claim 7, characterized in that, The piezoelectric ceramic assembly (2) further includes a second jet film (205) and a third jet film (206). The second jet film (205) is disposed on the side of the first sub-bicrystalline piezoelectric sheet (2011) away from the first side surface (2032311), and a second jet hole (2051) is provided on the side of the second jet film (205) away from the first sub-bicrystalline piezoelectric sheet (2011). The third jet film (206) is disposed on the side of the second sub-bicrystalline piezoelectric sheet (2012) away from the third side surface (2032321), and a third jet hole (2061) is provided on the side of the third jet film (206) away from the second sub-bicrystalline piezoelectric sheet (2012). The through hole (101) includes a first through hole (101) and a second through hole (101), the first through hole (101) is connected to the second jet hole (2051), and the second through hole (101) is connected to the third jet hole (2061).

9. The piezoelectric micropump according to claim 6, characterized in that, The cantilever section (20322) includes a fifth cantilever section (203225), a sixth cantilever section (203226), a seventh cantilever section (203227), an eighth cantilever section (203228), a ninth cantilever section (203229), a tenth cantilever section (2032210), an eleventh cantilever section (2032211), and a twelfth cantilever section (2032212). The fifth cantilever section (203225), the sixth cantilever section (2032210), the eleventh cantilever section (2032211), and the twelfth cantilever section (2032212)... The seventh cantilever (203226), the eighth cantilever (203227), and the eighth cantilever (203228) are symmetrically arranged on the periphery of the first vibration part (203231); the ninth cantilever (203229), the tenth cantilever (2032210), the eleventh cantilever (2032211), and the twelfth cantilever (2032212) are symmetrically arranged on the periphery of the second vibration part (203232).

10. The piezoelectric micropump according to claim 1, characterized in that, The flexible electrical connector (203) is made of at least one of PI film, PET film, PEN film and PEEK film.

11. A driving component, characterized in that, Applied to the piezoelectric micropump as described in any one of claims 1-10.

12. An electronic device, characterized in that, Including the piezoelectric micropump as described in any one of claims 1-10.

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