A thermally expansion-matched quartz crystal oscillator ring

Abstract

This utility model provides a quartz crystal oscillator socket with thermal expansion matching, relating to the field of electronic component technology. It includes a socket body with a solder-sealed step at the bottom, the top of which is welded to the bottom of the socket body. An internal cavity is provided within the socket body, which is shell-shaped. A chamfered area is provided at the inner top of the socket body. The cavity reduces overall weight and heat capacity, while also forming a buffer zone to suppress thermal stress conducted by the socket to the crystal. A rounded chamfer is provided at the inner edge of the central cavity to prevent scratching the edge of the quartz crystal during assembly, avoiding microcracks and mechanical stress concentration. The central hollow structure reduces overall weight and heat capacity, forming a physical buffer zone, reducing the direct stress conducted by the socket to the quartz crystal due to thermal expansion or contraction caused by temperature changes, and preventing deformation or damage to the crystal due to differences in thermal expansion coefficients.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and in particular to a quartz crystal oscillator mount with thermal expansion matching. Background Technology

[0002] According to Chinese Patent No. CN207503067U, this utility model discloses a quartz crystal oscillator, including a cover, indicator light, heat dissipation mesh, housing, groove, output terminal, protective pad, positioning sticker, fixing hole, spindleless component, page plate, electric push rod, PLC controller, heat dissipation slot, cooling fan, motor, baffle, temperature sensor, chip, base, and fixing plate. The bottom of the housing is fitted with a positioning sticker and a fixing hole. The output terminal is installed on the other side of the housing. One side of the fixing plate is connected to the base, and the top of the base is connected to the chip. The inside of the cover has a heat dissipation slot. One side of the cover is fitted with an electric push rod, and one side of the electric push rod is connected to the baffle. A temperature sensor is embedded in the bottom of the cover, and an indicator light is installed on the top of the cover. This oscillator provides more stable installation, maintains a stable ambient temperature for the oscillator output, and facilitates monitoring of the oscillator's operating status.

[0003] The aforementioned prior art and related documents have the following technical problems: 1. In the current market, it is common for packaging stress to be concentrated due to thermal expansion mismatch when the temperature changes, which can affect frequency stability, temperature drift and even cause chip damage. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a quartz crystal oscillator race with thermal expansion matching.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a quartz crystal oscillator seat ring with thermal expansion matching, comprising a seat ring body, wherein the bottom of the seat ring body is provided with a welding step, and the top of the welding step is welded to the bottom of the seat ring body, the top of the welding step is provided with a welding connection layer, and the bottom of the welding connection layer is positioned and connected to the top of the welding step, the top of the welding step is rounded, the top of the welding step is provided with a quartz crystal, and the bottom of the quartz crystal is fitted to the top of the welding step, and the interior of the seat ring body is provided with a device cavity.

[0006] Preferably, the seat ring body material is made of a composite material formed by sintering alloy and ceramic microparticles.

[0007] Preferably, one side of the seat ring body is provided with a chamfered area, and the top of the chamfered area is rounded.

[0008] Preferably, the bottom of the welding step is provided with a positioning hole, and the positioning hole at the bottom of the welding step is cut.

[0009] Preferably, the bottom of the positioning hole is provided with a positioning step, and the top of the positioning step is welded to the positioning hole.

[0010] Preferably, the bottom of the positioning step is provided with two electrode leads, and the tops of the two electrode leads pass through the positioning step and the welding step and are electrically connected to the quartz crystal oscillator.

[0011] Preferably, a heat stress relief layer is provided on one side of the welding step, and the heat stress relief layer wraps around the outside of the welding step.

[0012] Beneficial effects In this invention, a device cavity is provided inside the seat ring body. The device cavity is formed by shelling, and a chamfered area is provided on the inner top of the seat ring body. The device cavity is used to reduce the overall weight and heat capacity, and at the same time form a buffer zone to suppress the thermal conduction stress of the seat ring on the crystal plate. At the same time, an arc chamfer is provided on the inner edge of the central cavity to prevent scratching the edge of the quartz crystal plate during assembly, avoid microcracks and mechanical stress concentration. The central hollow structure reduces the overall weight and heat capacity, and forms a physical buffer zone to reduce the direct conduction stress of the seat ring on the quartz crystal plate caused by thermal expansion or contraction due to temperature changes. It avoids deformation or damage to the crystal plate caused by differences in thermal expansion coefficients, and improves the working stability of the oscillator in temperature fluctuation environments. At the same time, the hollow design reduces the thermal coupling between the seat ring and the crystal plate, reduces the interference of thermal shock on the crystal resonant frequency, and ensures the frequency accuracy of the oscillator.

[0013] In this invention, a positioning hole is provided at the bottom of the welding step, and a positioning step is provided at the bottom of the positioning hole. The welding step and the positioning step are set to improve the reliability and assembly accuracy of the hermetic packaging. The welding step and the positioning hole form a longitudinal insertion structure. During packaging, the metal cover, quartz crystal and ceramic base can be automatically guided and aligned. The welding step provides a flat welding surface, and the positioning hole structure makes the upper and lower packaging fit more tightly and avoids gaps. When the solder melts, it will not form bubbles or incomplete soldering due to displacement or warping. Finally, a structure with complete sealing and stable solder joints is formed. Attached Figure Description

[0014] Figure 1 This is an isometric view of the present invention; Figure 2 This is an isometric drawing of the present invention; Figure 3 This is a front view of the present invention; Figure 4 For the present utility model Figure 3 A cross-sectional view of AA.

[0015] Legend: 1. Seat ring body; 2. Equipment cavity; 3. Quartz crystal oscillator; 4. Chamfered area; 5. Weld seal step; 6. Positioning step; 7. Positioning hole; 8. Welded connection layer; 9. Heat stress relief layer; 10. Electrode lead. Detailed Implementation

[0016] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0017] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific Implementation Example 1: Reference Figure 1-4A quartz crystal oscillator race with thermal expansion matching includes a race body 1. The bottom of the race body 1 is provided with a welded step 5, and the top of the welded step 5 is welded to the bottom of the race body 1. The race body 1 is made of a composite material of alloy and ceramic microparticles sintered together. The top side of the race body 1 is provided with a chamfered area 4, and the top of the chamfered area 4 is rounded. The bottom of the welded step 5 is provided with a positioning hole 7, and the positioning hole 7 at the bottom of the welded step 5 is cut. The bottom of the positioning hole 7 is provided with a positioning step 6, and the top of the positioning step 6 is bonded to the positioning hole 7. The bottom of the positioning step 6 is provided with two electrode leads 10, and the tops of the two electrode leads 10 pass through the positioning step 6 and the welded step 5 and are electrically connected to the quartz crystal oscillator 3, thereby serving as the output of the quartz crystal oscillator 3. A heat stress relief layer 9 is provided on one side of the welded step 5, and the heat stress relief layer 9 wraps around the outside of the welded step 5. A welding connection layer 8 is provided on the top of the welded step 5, and the bottom of the welding connection layer 8 is positioned and connected to the top of the welded step 5. The top of the welded step 5 is rounded. A quartz crystal oscillator 3 is provided on the top of the welded step 5, and the bottom of the quartz crystal oscillator 3 is fitted to the top of the welded step 5. The inside of the seat ring body 1 is provided with a device cavity 2. An equipment cavity 2 is provided inside the seat ring body 1. The equipment cavity 2 is formed by shelling, and the inner top of the seat ring body 1 has a chamfered area 4. The equipment cavity 2 is used to reduce the overall weight and heat capacity, and at the same time form a buffer to suppress the thermal conduction stress of the seat ring on the crystal plate. At the same time, an arc chamfer is set on the inner edge of the central cavity to prevent scratches on the edge of the quartz crystal oscillator 3 during assembly, avoiding microcracks and mechanical stress concentration. The central hollow structure reduces the overall weight and heat capacity, and forms a physical buffer to reduce the direct conduction stress of the seat ring on the quartz crystal oscillator 3 due to thermal expansion or contraction caused by temperature changes. It also avoids crystal plate deformation or damage caused by differences in thermal expansion coefficients, and improves the oscillator's performance in temperature fluctuation environments. The hollow design reduces the thermal coupling between the housing ring and the crystal chip, minimizing thermal shock interference to the crystal resonant frequency and ensuring the frequency accuracy of the oscillator. A positioning hole 7 is located at the bottom of the solder seal step 5, and a positioning step 6 is located at the bottom of the positioning hole 7. This design, along with the positioning step 6, enhances the reliability and assembly accuracy of the hermetic sealing. The solder seal step 5 and the positioning hole 7 form a longitudinal insertion structure, allowing the metal top cover, quartz crystal oscillator 3, and ceramic base to automatically align during packaging. The solder seal step 5 provides a flat welding surface, and the positioning hole 7 structure ensures a tighter fit between the upper and lower packages, preventing gaps. During welding, the solder will not form bubbles or incomplete welds due to displacement or warping, ultimately resulting in a completely sealed structure with stable solder joints. Specific Implementation Example 2: Reference Figure 1-4Based on the basic structure in Specific Embodiment 1, a flexible buffer layer is added to one side of the welded connection layer 8. After the flexible buffer layer is added, when the temperature rises or falls, the flexible buffer layer can absorb the stress generated by thermal expansion, avoiding crystal breakage or solder fatigue. The further technical solution solves the problem that the crystal is easily subjected to mechanical impact or continuous micro-vibration during transportation, installation or operation.

[0020] In summary: The device employs a hollow cavity 2 within the body 1 of the mounting ring. The cavity 2 is shell-extracted, and the top inner part of the mounting ring 1 has a chamfered area 4. This allows the cavity 2 to reduce the overall weight and heat capacity, while also forming a buffer zone to suppress the thermal stress conducted by the mounting ring to the crystal plate. Additionally, a rounded chamfer is provided at the inner edge of the central cavity to prevent scratching the edges of the quartz crystal oscillator 3 during assembly, avoiding microcracks and mechanical stress concentration. The central hollow structure reduces the overall weight and heat capacity, forming a physical buffer zone that reduces the direct stress conducted by the mounting ring to the quartz crystal oscillator 3 due to thermal expansion or contraction caused by temperature changes. This prevents deformation or damage to the crystal plate caused by differences in thermal expansion coefficients, improving the oscillator's operational stability under fluctuating temperature conditions. Furthermore, the hollow design reduces the thermal coupling between the mounting ring and the crystal plate, minimizing the interference of thermal shock on the crystal resonant frequency and ensuring the oscillator's frequency accuracy. The design incorporates a positioning hole 7 at the bottom of the welding step 5, and a positioning step 6 at the bottom of the positioning hole 7. This design improves the reliability and assembly accuracy of the hermetic sealing. The welding step 5 and the positioning hole 7 form a longitudinal insertion structure, allowing the metal top cover, quartz crystal oscillator 3, and ceramic base to be automatically guided and aligned during encapsulation. The welding step 5 provides a flat welding surface, and the positioning hole 7 structure ensures a tighter fit between the upper and lower encapsulation components, preventing gaps. During welding, the solder will not form bubbles or incomplete welds due to displacement or warping, ultimately resulting in a completely sealed structure with stable solder joints.

[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A quartz crystal oscillator holder with thermal expansion matching, comprising a holder body (1), characterized in that: The bottom of the seat body (1) is provided with a welding step (5), and the top of the welding step (5) is welded to the bottom of the seat body (1). The top of the welding step (5) is provided with a welding connection layer (8), and the bottom of the welding connection layer (8) is positioned to the top of the welding step (5). The top of the welding step (5) is rounded. The top of the welding step (5) is provided with a quartz crystal oscillator (3), and the bottom of the quartz crystal oscillator (3) is fitted to the top of the welding step (5). The interior of the seat body (1) is provided with a device cavity (2).

2. The quartz crystal oscillator holder with thermal expansion matching according to claim 1, characterized in that: The seat body (1) is made of a composite material formed by sintering alloy and ceramic particles.

3. The quartz crystal oscillator holder with thermal expansion matching according to claim 1, characterized in that: The seat body (1) has a chamfered area (4) on one side, and the top of the chamfered area (4) is rounded.

4. The quartz crystal oscillator holder with thermal expansion matching according to claim 1, characterized in that: The bottom of the welding step (5) is provided with a positioning hole (7), and the positioning hole (7) at the bottom of the welding step (5) is cut.

5. A quartz crystal oscillator holder with thermal expansion matching according to claim 4, characterized in that: The bottom of the positioning hole (7) is provided with a positioning step (6), and the top of the positioning step (6) is welded to the positioning hole (7).

6. A quartz crystal oscillator holder with thermal expansion matching according to claim 5, characterized in that: The bottom of the positioning step (6) is provided with two electrode leads (10), and the top of the two electrode leads (10) passes through the welding step (5) of the positioning step (6) and is electrically connected to the quartz crystal oscillator (3).

7. A quartz crystal oscillator holder with thermal expansion matching according to claim 1, characterized in that: A heat stress relief layer (9) is provided on one side of the weld seal step (5), and the heat stress relief layer (9) is wrapped around the outside of the weld seal step (5).

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