Microphone and electronic device

Abstract

This application discloses a microphone and an electronic device. The microphone includes a substrate, a first isolation plate, a second isolation plate, and a MEMS chip. The substrate has a first surface; the first isolation plate and the second isolation plate are stacked, and the first isolation plate is connected to the first surface of the substrate; the MEMS chip is disposed on the side of the second isolation plate opposite to the substrate; the substrate has a sound hole corresponding to the MEMS chip, the first isolation plate has a first through hole, and the second isolation plate has a second through hole, the sound hole communicating with the MEMS chip through the first through hole and the second through hole; it also includes an adhesive layer, which is disposed at least between the first isolation plate and the second isolation plate, and the adhesive layer is located at the edge of the first isolation plate and the second isolation plate.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more specifically, to a microphone and electronic device. Background Technology

[0002] With the development of science and technology and the improvement of living standards, various electronic products have gradually entered thousands of households and become necessities for people's lives; people's requirements for the performance of electronic products are also getting higher and higher.

[0003] Many electronic products contain microphones. Because microphone diaphragms are nanometer- or micrometer-sized, they have low stiffness, are made of brittle materials, and are subject to initial processing stress. Therefore, microphone diaphragms are highly sensitive to external forces, and their performance is easily affected by external loads, even easily breaking under high-speed vibration or airflow impact. For example, the most common scenarios in electronic product use are drops or direct exposure to high-speed airflow, which can easily cause microphone diaphragms to break.

[0004] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] One objective of this application is to provide a new technical solution for microphones and electronic devices.

[0006] According to a first aspect of this application, a microphone is provided, the microphone comprising:

[0007] A substrate having a first surface;

[0008] A first isolation plate and a second isolation plate are stacked together, and the first isolation plate is connected to the first surface of the substrate;

[0009] MEMS chip, wherein the MEMS chip is disposed on the side of the second isolation plate opposite to the substrate;

[0010] The substrate has an acoustic hole corresponding to the MEMS chip, the first isolation plate has a first through hole, the second isolation plate has a second through hole, and the acoustic hole is connected to the MEMS chip through the first through hole and the second through hole;

[0011] An adhesive layer is provided at least between the first isolation plate and the second isolation plate, and the adhesive layer is located at the edge of the first isolation plate and the second isolation plate.

[0012] Optionally, the first through hole and the second through hole are partially connected and partially misaligned.

[0013] Optionally, the area of ​​the first through hole is larger than the area of ​​the second through hole.

[0014] Optionally, the number of the first through holes is at least three, and the at least three first through holes are distributed at intervals, forming a first closed area between two adjacent first through holes;

[0015] The number of the second through holes is at least three, and the at least three second through holes are distributed at intervals, forming a second closed area between two adjacent second through holes;

[0016] The first through hole is provided corresponding to the second closed area, and the second through hole is provided corresponding to the first closed area.

[0017] Optionally, at least three of the first through holes are evenly distributed around the axis of the acoustic hole;

[0018] At least three of the second through holes are evenly distributed around the axis of the acoustic hole.

[0019] Optionally, the first through hole and the second through hole are offset.

[0020] Optionally, the number of the first through holes is at least three, and the at least three first through holes are evenly spaced around the axis of the sound hole; the second through holes are coaxially arranged with the sound hole.

[0021] Optionally, the microphone further includes a surround plate disposed on the side of the first isolation plate opposite to the second isolation plate. The surround plate is cylindrical and extends into the sound hole, and a gap is provided between the surround plate and the inner wall of the substrate corresponding to the sound hole.

[0022] Optionally, both the first and second isolation plates are made of polyimide; and / or, both the first and second isolation plates have a thickness of 50+ / -5μm.

[0023] Optionally, the adhesive layer is provided in three layers, with one adhesive layer provided between the substrate and the first isolation plate, between the first isolation plate and the second isolation plate, and between the second isolation plate and the MEMS chip.

[0024] According to a second aspect of this application, an electronic device is provided, the electronic device including a microphone as described in the first aspect.

[0025] In the microphone provided in this application embodiment, a double-layer isolation plate, consisting of a first isolation plate and a second isolation plate, is used to isolate the substrate from the MEMS chip. An adhesive layer is also sandwiched between the first isolation plate and the second isolation plate. This isolates the MEMS chip from external forces that could cause substrate deformation, reduces the transmission of mechanical shocks, and effectively protects the MEMS chip. This reduces the sensitivity of the MEMS chip's diaphragm to various external load conditions, effectively lowers the risk of MEMS chip failure, and further ensures the stability of the microphone's performance.

[0026] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0028] Figure 1 This is a schematic cross-sectional view of a microphone according to an embodiment of this application. Figure 1 ;

[0029] Figure 2 This is a schematic diagram of a partial structure of a microphone according to an embodiment of this application. Figure 1 ;

[0030] Figure 3 This is a schematic diagram of a partial structure of a microphone according to an embodiment of this application. Figure 2 ;

[0031] Figure 4 This is a schematic cross-sectional view of a microphone according to an embodiment of this application. Figure 2 ;

[0032] Figure 5 This is a schematic diagram of a partial structure of a microphone according to an embodiment of this application. Figure 3 ;

[0033] Figure 6 This is a schematic diagram of a partial structure of a microphone according to an embodiment of this application. Figure 4 .

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Microphone; 10. Substrate; 100. Sound hole; 11. First isolation plate; 110. First through hole; 111. First closed area; 12. Second isolation plate; 120. Second through hole; 121. Second closed area; 13. MEMS chip; 14. Adhesive layer; 15. Enclosure plate; 16. Housing. Detailed Implementation

[0036] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0037] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0038] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0039] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0040] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0041] Reference Figures 1-6 As shown, according to one embodiment of this application, a microphone 1 is provided. The microphone 1 includes a substrate 10, a first isolation plate 11, a second isolation plate 12, and a MEMS chip 13. The substrate 10 has a first surface; the first isolation plate 11 and the second isolation plate 12 are stacked, and the first isolation plate 11 is connected to the first surface of the substrate 10; the MEMS chip 13 is disposed on the side of the second isolation plate 12 opposite to the substrate 10.

[0042] The substrate 10 has a sound hole 100 corresponding to the MEMS chip 13, the first isolation plate 11 has a first through hole 110, the second isolation plate 12 has a second through hole 120, and the sound hole 100 is connected to the MEMS chip 13 through the first through hole 110 and the second through hole 120.

[0043] It also includes an adhesive layer 14, which is provided at least between the first isolation plate 11 and the second isolation plate 12, and the adhesive layer 14 is located at the edge of the first isolation plate 11 and the second isolation plate 12.

[0044] The microphone 1 provided in this application embodiment mainly includes a substrate 10, a first isolation plate 11 and a second isolation plate 12 stacked together, and a MEMS chip 13, thus constructing the basic structure of the microphone.

[0045] An adhesive layer 14 is provided at the edge of the first isolation plate 11 and the edge of the second isolation plate 12. The adhesive layer 14 not only firmly connects the first isolation plate 11 and the second isolation plate 12, but also forms a gap between the middle regions of the first isolation plate 11 and the middle regions of the second isolation plate 12. This gap provides a horizontal slit through which airflow can pass. External sound waves can reach the back cavity of the MEMS chip 13 through the sound hole 100, the first through hole 110, the horizontal slit, and the second through hole 120. This ensures that the sound waves do not damage the diaphragm of the MEMS chip 13, ensuring that the microphone has excellent acoustic performance. On the other hand, it can reduce the impact of high-speed airflow, thereby protecting the diaphragm of the MEMS chip 13.

[0046] Furthermore, by setting a double-layer isolation plate of first isolation plate 11 and second isolation plate 12 to isolate the substrate 10 from the MEMS chip 13, and an adhesive layer 14 is sandwiched between the first isolation plate 11 and the second isolation plate 12, the dangerous driving force that may cause deformation of the substrate 10 can be isolated from the MEMS chip 13, the transmission of mechanical impact can be slowed down, and the MEMS chip 13 can be effectively protected. This reduces the sensitivity of the diaphragm of the MEMS chip 13 to the load of various external working conditions, effectively reduces the risk of failure of the MEMS chip 13, and further ensures the stability of the microphone 1's performance.

[0047] Reference Figure 2 , Figure 3 As shown, in one embodiment, the first through hole 110 and the second through hole 120 are partially connected and partially misaligned.

[0048] In this specific example, the first through-hole 110 and the second through-hole 120 are partially connected and partially offset. This ensures that the sound waves can effectively act on the diaphragm of the MEMS chip 13, maintaining the excellent performance of the microphone itself. It can also reduce the impact of high-speed airflow, provide instantaneous protection for the diaphragm of the MEMS chip 13, reduce the energy level of strong airflow transmitted to the diaphragm of the MEMS chip 13, and protect the MEMS chip 13 from damage by strong airflow.

[0049] Reference Figure 2 , Figure 3 As shown, in one embodiment, the area of ​​the first through hole 110 is larger than the area of ​​the second through hole 120.

[0050] In this specific example, since the first through hole 110 and the second through hole 120 are partially connected and partially offset, the area of ​​the first through hole 110 closer to the sound hole 100 is larger than the area of ​​the second through hole 120 farther away from the sound hole 100. This optimizes the passage path of airflow and sound waves, ensuring that sound waves can pass smoothly while more effectively blocking and diverting high-speed airflow, reducing the impact energy of strong airflow on the diaphragm of the MEMS chip 13, and enhancing the microphone's resistance to airflow impact.

[0051] Reference Figure 2 , Figure 3 As shown, in one embodiment, at least three first through holes 110 are provided, and the at least three first through holes 110 are distributed at intervals, with a first closed area 111 formed between two adjacent first through holes 110;

[0052] The number of the second through holes 120 is at least three, and the at least three second through holes 120 are distributed at intervals, forming a second closed area 121 between two adjacent second through holes 120;

[0053] The first through hole 110 is correspondingly provided with the second closed area 121, and the second through hole 120 is correspondingly provided with the first closed area 111.

[0054] In this specific example, at least three first through holes 110 and at least three second through holes 120 are spaced apart, with the first through holes 110 corresponding to the second closed area 121 and the second through holes 120 corresponding to the first closed area 111. This creates a staggered arrangement of the first through holes 110 and the second through holes 120. Since the area of ​​the first through hole 110 is larger than the area of ​​the second through hole 120, their staggered arrangement can form a small hole structure, which provides space for sound waves to pass through. Furthermore, the first closed area 111 and the second closed area 121 can also block and divert strong airflow, reducing the energy level of the strong airflow transmitted to the diaphragm of the MEMS chip 13, thus better protecting the MEMS chip.

[0055] Reference Figure 2 , Figure 3 As shown, in one embodiment, at least three of the first through holes 110 are evenly distributed around the axis of the acoustic hole 100;

[0056] At least three second through holes 120 are evenly distributed around the axis of the acoustic hole 100.

[0057] In this specific example, at least three first through holes 110 and at least three second through holes 120 are evenly distributed around the axis of the sound hole 100, so that the airflow and sound waves are more evenly distributed when passing through the small hole structure formed by the misalignment of the first through holes 110 and the second through holes 120. This avoids uneven impact on the diaphragm of the MEMS chip caused by excessive concentration of local airflow or sound waves, and improves the stability and impact resistance of the overall microphone performance.

[0058] Reference Figures 4-6 As shown, in one embodiment, the first through hole 110 and the second through hole 120 are misaligned.

[0059] In this specific example, the first through-hole 110 and the second through-hole 120 are staggered. After the sound wave passes through the sound hole 100 and the first through-hole 110, it detours around the horizontal slit before reaching the second through-hole 120, and finally reaches the diaphragm of the MEMS chip 13 from the second through-hole 120. This can effectively buffer the high-speed airflow, protect the diaphragm of the MEMS chip 13 from the impact of the high-speed airflow, and at the same time ensure the acoustic performance of the microphone.

[0060] Reference Figure 5 , Figure 6 As shown, in one embodiment, at least three first through holes 110 are provided, and the at least three first through holes 110 are evenly spaced around the axis of the sound hole 100; the second through hole 120 is coaxially arranged with the sound hole 100.

[0061] In this specific example, at least three first through holes 110 are evenly spaced around the axis of the acoustic hole 100, and the second through holes 120 are coaxially arranged with the acoustic hole 100. This structure ensures that the sound waves can pass smoothly through the acoustic hole 100 into the diaphragm of the MEMS chip, while the staggered and evenly distributed first through holes 110 relative to the second through holes 120 effectively blocks and diverts the high-speed airflow, reduces the impact energy of the strong airflow on the diaphragm of the MEMS chip, and avoids the uneven impact caused by excessive concentration of local airflow or sound waves on the diaphragm of the MEMS chip.

[0062] Reference Figure 4 As shown, in one embodiment, the microphone further includes a surround plate 15, which is disposed on the side of the first isolation plate 11 opposite to the second isolation plate 12. The surround plate 15 is cylindrical and extends into the sound hole 100. A gap is provided between the surround plate 15 and the substrate 10 corresponding to the inner wall of the sound hole 100.

[0063] In this specific example, a baffle plate 15 is provided and extends into the acoustic hole 100, and a gap is provided between the baffle plate 15 and the inner wall of the acoustic hole 100; the baffle plate 15 can guide and buffer the airflow entering the acoustic hole 100, further buffering the direct impact of high-speed airflow on the diaphragm of the MEMS chip, while ensuring that the sound wave passes through effectively and does not affect the normal propagation of the sound wave.

[0064] For example, the enclosure 15 is coaxially arranged with the sound hole 100, and the outer diameter of the enclosure 15 is smaller than the diameter of the sound hole 100, thereby ensuring that there is a gap between the enclosure 15 and the inner wall of the sound hole 100.

[0065] In one embodiment, the first isolation plate 11 and the second isolation plate 12 are both made of polyimide; and / or, the thickness of the first isolation plate 11 and the second isolation plate 12 is 50+ / -5μm.

[0066] In this specific example, the first isolation plate 11 and the second isolation plate 12 are made of polyimide, which has good insulation, high temperature resistance, mechanical properties, and chemical stability. Furthermore, polyimide has a high glass transition temperature, thus exhibiting excellent heat resistance and thermal stability, thereby ensuring the high-temperature material stability of the microphone during reflow soldering. In other embodiments, the first isolation plate 11 and the second isolation plate 12 can also be made of metal, such as stainless steel, aluminum alloy, or copper.

[0067] The thickness of the first isolation plate 11 and the second isolation plate 12 is 50 + / - 5 μm. If the thickness of the first isolation plate 11 and the second isolation plate 12 is too large, it will encroach on the rear cavity space of the microphone unit, weakening the microphone's performance. If the thickness of the first isolation plate 11 and the second isolation plate 12 is too small, the rigidity of the first isolation plate 11 and the second isolation plate 12 will be insufficient, and it will not be able to provide sufficient and effective support and protection for the MEMS chip 13. Therefore, a suitable thickness can ensure that the first isolation plate 11 and the second isolation plate 12 have a certain strength to provide sufficient support and protection for the internal components, while also making the overall structure of the microphone relatively thin and light, meeting the development trend of miniaturization and thinness of electronic products. At the same time, it is also conducive to the propagation of sound waves in the sound transmission channel, ensuring the acoustic performance of the microphone.

[0068] Reference Figure 1 , Figure 4 As shown, in one embodiment, the adhesive layer 14 is provided in three layers, with one adhesive layer 14 provided between the substrate 10 and the first isolation plate 11, between the first isolation plate 11 and the second isolation plate 12, and between the second isolation plate 12 and the MEMS chip 13.

[0069] In this specific example, adhesive layers 14 are provided between the substrate 10 and the first isolation plate 11, between the first isolation plate 11 and the second isolation plate 12, and between the second isolation plate 12 and the MEMS chip 13. These three adhesive layers 14 provide an elastic buffer space between the substrate 10 deformation and the MEMS chip 13, thereby effectively reducing the deviation in microphone performance during overall application. They also effectively reduce the transfer of mechanical impact energy from drops to the MEMS chip, thus reducing the microphone's stress sensitivity and improving its resistance to mechanical shock.

[0070] Reference Figure 4 As shown, in one embodiment, the microphone further includes a housing 16 and an ASIC chip (not shown in the figure). The housing 16 is connected to the first surface of the substrate 10 and the two enclose a receiving space. The first isolation plate 11, the second isolation plate 12, the MEMS chip 13 and the ASIC chip are all located in the receiving space. The ASIC chip is disposed on the first surface of the substrate 10.

[0071] In this specific example, the microphone 1 also includes a housing 16 and an ASIC chip. The housing 16 is connected to the first surface of the substrate 10, and the two enclose a receiving space, within which the first isolation plate 11, the second isolation plate 12, the MEMS chip 13, and the ASIC chip are all housed. The housing 16 protects the internal components, preventing damage from external dust, moisture, mechanical impacts, etc., thus improving the microphone's reliability and stability. The ASIC chip is located on the first surface of the substrate 10 and works in conjunction with the MEMS chip 13 to process and convert sound signals, ensuring the microphone functions properly. For example, the substrate 10 is a PCB board.

[0072] According to another embodiment of this application, an electronic device is provided, the electronic device including the microphone 1 as described above.

[0073] The electronic device provided in this application embodiment includes the microphone 1 described above, which enables the microphone to maintain stable performance better when the electronic device is subjected to drops, high-speed airflow impacts, etc., reducing performance changes or damage caused by external factors, and improving the overall quality and reliability of the electronic device.

[0074] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0075] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A microphone, characterized in that, The microphone includes: A substrate (10) having a first surface; A first isolation plate (11) and a second isolation plate (12) are stacked together, and the first isolation plate (11) is connected to the first surface of the substrate (10). MEMS chip (13), the MEMS chip (13) is disposed on the side of the second isolation plate (12) away from the substrate (10); The substrate (10) has an acoustic hole (100) corresponding to the MEMS chip (13), the first isolation plate (11) has a first through hole (110), and the second isolation plate (12) has a second through hole (120). The acoustic hole (100) is connected to the MEMS chip (13) through the first through hole (110) and the second through hole (120). An adhesive layer (14) is provided at least between the first isolation plate (11) and the second isolation plate (12), and the adhesive layer (14) is located at the edge position of the first isolation plate (11) and the second isolation plate (12).

2. The microphone according to claim 1, characterized in that, The first through hole (110) and the second through hole (120) are partially connected and partially misaligned.

3. The microphone according to claim 2, characterized in that, The area of ​​the first through hole (110) is larger than the area of ​​the second through hole (120).

4. The microphone according to claim 3, characterized in that, The number of the first through holes (110) is at least three, and the at least three first through holes (110) are distributed at intervals, forming a first closed area (111) between two adjacent first through holes (110); The number of the second through holes (120) is at least three, and the at least three second through holes (120) are distributed at intervals, forming a second closed area (121) between two adjacent second through holes (120); The first through hole (110) is correspondingly provided with the second closed area (121), and the second through hole (120) is correspondingly provided with the first closed area (111).

5. The microphone according to claim 4, characterized in that, At least three of the first through holes (110) are evenly distributed around the axis of the acoustic hole (100); At least three of the second through holes (120) are evenly distributed around the axis of the acoustic hole (100).

6. The microphone according to claim 1, characterized in that, The first through hole (110) and the second through hole (120) are misaligned.

7. The microphone according to claim 6, characterized in that, The number of first through holes (110) is at least three, and the at least three first through holes (110) are evenly spaced around the axis of the sound hole (100); the second through hole (120) is coaxially arranged with the sound hole (100).

8. The microphone according to claim 7, characterized in that, The microphone also includes a surround plate (15), which is disposed on the side of the first isolation plate (11) away from the second isolation plate (12). The surround plate (15) is cylindrical and extends into the sound hole (100). A gap is provided between the surround plate (15) and the substrate (10) corresponding to the inner wall of the sound hole (100).

9. The microphone according to claim 1, characterized in that, The first isolation plate (11) and the second isolation plate (12) are both made of polyimide; and / or, the thickness of the first isolation plate (11) and the second isolation plate (12) is 50+ / -5μm.

10. The microphone according to any one of claims 1-9, characterized in that, The adhesive layer (14) is provided in three layers, with one adhesive layer (14) provided between the substrate (10) and the first isolation plate (11), between the first isolation plate (11) and the second isolation plate (12), and between the second isolation plate (12) and the MEMS chip (13).

11. An electronic device, characterized in that, The electronic device includes a microphone (1) as claimed in any one of claims 1-10.

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