An intelligent audio control system based on ultrasonic emission

Abstract

This utility model discloses an intelligent audio control system based on ultrasonic transmission, relating to the field of home appliance control technology. The system includes a power supply module, a SoC module, a power amplifier ultrasonic module, a digital microphone module, and an LCD display module. The power supply module is used to supply power to each module. The SoC module provides IIS, PDM, and IIC signals to the power amplifier ultrasonic module and the digital microphone module and implements encoding. The power amplifier ultrasonic module is used to drive the ultrasonic transmitter. The digital microphone module is used to receive the signals transmitted back from the ultrasonic transmitter. The LCD display module is used for interactive display of the screen.

Description

Technical Field

[0001] This utility model relates to the field of home appliance control technology, specifically an intelligent audio control system based on ultrasonic transmission. Background Technology

[0002] With the development of technology and the continuous improvement of people's living standards, speakers with screens are gradually developing towards intelligence and diversified interaction. However, traditional interaction solutions have significant drawbacks. For example, touchscreens are prone to accidental touches in humid or oily environments; cameras rely on visible light imaging, and under conditions such as direct sunlight, backlighting, or low light, images are easily overexposed or blurred, causing gesture recognition, facial recognition, and other interactive functions to fail. Furthermore, using cameras for gesture recognition and facial recognition may lead to the leakage of user behavior data. Therefore, there is an urgent need for an intelligent speaker control system based on ultrasonic emission to solve the problems existing in traditional interaction methods. Utility Model Content

[0003] The purpose of this invention is to provide an intelligent audio control system based on ultrasonic emission to solve the problems raised in the prior art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an intelligent audio control system based on ultrasonic transmission, characterized in that the control system includes: a power module, a SoC module, a power amplifier ultrasonic module, a digital microphone module, and a liquid crystal display module; The power supply module is used to supply power to each module; the SoC module provides IIS, PDM, and IIC signals to the power amplifier ultrasonic module and the digital microphone module and performs encoding; the power amplifier ultrasonic module is used to drive the ultrasonic transmitter; the digital microphone module is used to receive the signals transmitted back from the ultrasonic transmitter; the LCD display module is used for interactive display of the screen. The power supply module is electrically connected to each of the other modules; the output terminal of the SoC module is electrically connected to the input terminal of the power amplifier ultrasonic module, the input terminal of the digital microphone module, and the input terminal of the liquid crystal display module, respectively.

[0005] As a preferred embodiment, the SoC module includes a first capacitor unit, a second capacitor unit, a first control unit, a second control unit, and a third control unit; The SoC module controls the liquid crystal display module, the digital microphone module, and the power amplifier ultrasonic module through a first control unit, a second control unit, and a third control unit.

[0006] As a preferred embodiment, the liquid crystal display module includes: a liquid crystal backlight circuit unit, a bias circuit unit, and a connector circuit unit; The liquid crystal backlight circuit unit and the bias circuit unit are electrically connected via the VCC_LB pin. The liquid crystal backlight circuit unit is electrically connected to the connector circuit unit via the LCD_VDDIO_EN pin, LEDK pin, and LEDA pin, respectively. The liquid crystal backlight circuit unit is electrically connected to the second control unit via the LCD_BL_PWM pin, LCD_VDDIO_EN pin, and VCC_LB_EN pin, respectively. The bias circuit unit is electrically connected to the connector circuit unit via the VSP pin and VSN pin, respectively. The bias circuit unit is electrically connected to the second control unit via the LCD_VDD_EN pin, respectively. The connector circuit unit is electrically connected via VDD1V8... The _DCDC pin, MIPI_D3_N pin, MIPI_D3_P pin, MIPI_D0_N pin, MIPI_D0_P pin, MIPI_CLK_N pin, MIPI_DLK_P pin, MIPI_D1_N pin, MIPI_D1_P pin, MIPI_D2_N pin, and MIPI_D2_P pin are connected to the third control unit. The connector circuit unit is connected to the second control unit through the TOUCH_INT pin, TOUCH_RST_N pin, LCD_RST_N pin, SPI_A_SSO pin, SPI_A_CLK pin, SPI_A_MISO pin, and SPI_A_MOSI pin.

[0007] As a preferred embodiment, the power amplifier ultrasonic module is electrically connected to the first control unit via the VDDAO_3V3 pin; the power amplifier ultrasonic module is electrically connected to the second control unit via the I2S_LRCLK_1 pin, I2S_SCLK_1 pin, I2S_DOUT_1 pin, CPU_I2C_EE_MO_SDA pin, CPU_I2C_EE_MO_SCL pin, and UAMP_SDB pin, respectively.

[0008] As a preferred embodiment, the power module includes: a first power unit, a second power unit, a third power unit, a fourth power unit, a fifth power unit, and a DC chip; The first power supply unit, the third power supply unit, the fourth power supply unit, and the DC chip are electrically connected in pairs via the VCC9V pin; the first power supply unit is electrically connected to the third control unit via the 1V8 pin, providing a 1.8V power supply voltage to the third power supply unit; the second power supply unit and the DC chip are both electrically connected to the power amplifier ultrasonic module via the 20V pin, providing a 20V power supply voltage to the power amplifier ultrasonic module; the second power supply unit is electrically connected to the first control unit via the 3V3 pin, providing a 3.3V power supply voltage to the first control unit; the third power supply unit is connected to the first capacitor unit and the first control unit via the VDDEE pin. The first power supply unit is electrically connected to the first capacitor unit and provides VDDEE power to the first control unit. The third power supply unit is connected to the first control unit via the VDDEE_PWM pin and provides pulse voltage to the first control unit. The fourth power supply unit is electrically connected to the first control unit via the VDDCPU pin and the VDDCPU_PWM pin, and is also electrically connected to the second capacitor unit via the VDDCPU_ pin. The fifth power supply unit is electrically connected to the first control unit via the +20V pin and the 5V_EN pin, and is also electrically connected to the liquid crystal backlight circuit unit via the VCC5V pin.

[0009] As a preferred embodiment, the digital microphone module includes a first digital microphone unit, a second digital microphone unit, and a third digital microphone unit; The first digital microphone unit, the second digital microphone unit, and the third digital microphone unit are electrically connected in pairs via the PDM_CLK pin.

[0010] Compared with the prior art, the beneficial effects of this utility model are: 1. Stable interaction: By using ultrasonic technology, the accidental touches of traditional touchscreens in humid or oily environments are avoided. It also solves the problem of interaction failure caused by overexposure in traditional gesture recognition and face recognition interaction methods, which significantly improves the stability of interaction.

[0011] 2. High security: This system does not rely on cameras for gesture recognition, facial recognition and other interactions, effectively avoiding the leakage of user behavior data and protecting user privacy and security.

[0012] 3. Anti-interference: Since the ultrasonic signal emitted by the ultrasonic transmitter is less affected by ambient light, electromagnetic interference, etc., compared with the traditional interaction method, this utility model can maintain good interaction performance in complex environments through ultrasonic interaction and has stronger anti-interference ability. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the system structure of an intelligent audio control system based on ultrasonic emission according to the present invention; Figure 2 This is a schematic diagram of the circuit structure of the first power supply unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 3 This is a schematic diagram of the circuit structure of the second power supply unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 4 This is a schematic diagram of the circuit structure of the third power supply unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 5 This is a schematic diagram of the circuit structure of the fourth power supply unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 6 This is a schematic diagram of the circuit structure of the fifth power supply unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 7 This is a schematic diagram of the circuit structure of a DC chip in an intelligent audio control system based on ultrasonic emission, according to this utility model. Figure 8 This is a schematic diagram of the circuit structure of the first capacitor unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 9 This is a schematic diagram of the circuit structure of the second capacitor unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 10 This is a schematic diagram of the circuit structure of the first control unit of an intelligent audio control system based on ultrasonic transmission according to this utility model; Figure 11 This is a schematic diagram of the circuit structure of the second control unit of an intelligent audio control system based on ultrasonic transmission according to this utility model; Figure 12 This is a schematic diagram of the circuit structure of the third control unit of an intelligent audio control system based on ultrasonic transmission according to this utility model. Figure 13 This is a schematic diagram of the liquid crystal backlight circuit unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 14 This is a schematic diagram of the bias circuit unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 15 This is a schematic diagram of the circuit structure of the connector circuit unit of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 16This is a schematic diagram of the power amplifier ultrasonic module circuit structure of an intelligent audio control system based on ultrasonic emission according to this utility model. Figure 17 This is a schematic diagram of the circuit structure of the first digital microphone unit of an intelligent audio control system based on ultrasonic transmission according to this utility model. Figure 18 This is a schematic diagram of the circuit structure of the second digital microphone unit of an intelligent audio control system based on ultrasonic transmission according to this utility model. Figure 19 This is a schematic diagram of the circuit structure of the third digital microphone unit of an intelligent audio control system based on ultrasonic transmission according to this utility model. Detailed Implementation

[0014] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0015] Example: Figures 1-19 As shown, this utility model provides a technical solution: an intelligent audio control system based on ultrasonic transmission. The control system includes: a power supply module, a SoC module, a power amplifier ultrasonic module, a digital microphone module, and a liquid crystal display module. The power supply module supplies power to each module. The SoC module provides IIS, PDM, and IIC signals to the power amplifier ultrasonic module and the digital microphone module and performs encoding. The power amplifier ultrasonic module drives the ultrasonic transmitter. The digital microphone module receives signals transmitted back from the ultrasonic transmitter. The liquid crystal display module interactively displays the screen. The power supply module is electrically connected to each module. The output terminal of the SoC module is electrically connected to the input terminals of the power amplifier ultrasonic module, the digital microphone module, and the liquid crystal display module, respectively.

[0016] The SoC module includes a first capacitor unit, a second capacitor unit, a first control unit, a second control unit, and a third control unit; the SoC module controls the liquid crystal display module, the digital microphone module, and the power amplifier ultrasonic module through the first control unit, the second control unit, and the third control unit.

[0017] The liquid crystal display module includes: a liquid crystal backlight circuit unit, a bias circuit unit, and a connector circuit unit; the liquid crystal backlight circuit unit and the bias circuit unit are electrically connected via the VCC_LB pin; the liquid crystal backlight circuit unit is electrically connected to the connector circuit unit via the LCD_VDDIO_EN pin, the LEDK pin, and the LEDA pin; the liquid crystal backlight circuit unit is electrically connected to the second control unit via the LCD_BL_PWM pin, the LCD_VDDIO_EN pin, and the VCC_LB_EN pin; the bias circuit unit is electrically connected to the connector circuit unit via the VSP pin and the VSN pin; the bias circuit unit is electrically connected to the second control unit via the LCD_VDD_EN pin. The connector circuit unit is connected to the third control unit via the VDD1V8_DCDC pin, MIPI_D3_N pin, MIPI_D3_P pin, MIPI_D0_N pin, MIPI_D0_P pin, MIPI_CLK_N pin, MIPI_DLK_P pin, MIPI_D1_N pin, MIPI_D1_P pin, MIPI_D2_N pin, and MIPI_D2_P pin. The connector circuit unit is connected to the second control unit via the TOUCH_INT pin, TOUCH_RST_N pin, LCD_RST_N pin, SPI_A_SSO pin, SPI_A_CLK pin, SPI_A_MISO pin, and SPI_A_MOSI pin.

[0018] The power amplifier ultrasonic module is electrically connected to the first control unit via the VDDAO_3V3 pin; the power amplifier ultrasonic module is electrically connected to the second control unit via the I2S_LRCLK_1 pin, I2S_SCLK_1 pin, I2S_DOUT_1 pin, CPU_I2C_EE_MO_SDA pin, CPU_I2C_EE_MO_SCL pin, and UAMP_SDB pin, respectively.

[0019] The power module includes: a first power unit, a second power unit, a third power unit, a fourth power unit, a fifth power unit, and a DC chip; the first power unit, the third power unit, the fourth power unit, and the DC chip are electrically connected in pairs via VCC9V pins; the first power unit is electrically connected to the third control unit via a 1V8 pin, providing a 1.8V power supply voltage to the third power unit; the second power unit and the DC chip are both electrically connected to the power amplifier ultrasonic module via 20V pins, providing a 20V power supply voltage to the power amplifier ultrasonic module; the second power unit is electrically connected to the first control unit via a 3V3 pin, providing a 3.3V power supply voltage to the first control unit; the third power unit... The VDDEE pin is electrically connected to the first capacitor unit and the first control unit, respectively, and provides VDDEE power to the first capacitor unit and the first control unit, respectively; the third power supply unit is connected to the first control unit through the VDDEE_PWM pin and provides pulse voltage to the first control unit; the fourth power supply unit is electrically connected to the first control unit through the VDDCPU pin and the VDDCPU_PWM pin, respectively, and is electrically connected to the second capacitor unit through the VDDCPU_ pin; the fifth power supply unit is electrically connected to the first control unit through the +20V pin and the 5V_EN pin, respectively, and is electrically connected to the liquid crystal backlight circuit unit through the VCC5V pin.

[0020] The digital microphone module includes a first digital microphone unit, a second digital microphone unit, and a third digital microphone unit; the first digital microphone unit, the second digital microphone unit, and the third digital microphone unit are electrically connected in pairs via the PDM_CLK pin.

[0021] More specifically, as one embodiment, the system includes: a power module, a SoC module, a power amplifier ultrasonic module, a digital microphone module, and a liquid crystal display module; See Figure 1 The input terminals of the power amplifier ultrasonic module, microphone module, and LCD display module are all connected to the SoC module, and each module is connected to the power supply module. The power module includes: a first power unit, a second power unit, a third power unit, a fourth power unit, a fifth power unit, and a DC chip. See Figure 2The first power supply unit includes capacitor C80, capacitor C81, resistor R1, resistor R3, capacitor C84, capacitor C82, resistor R20, chip U6, capacitor C83, resistor R9, inductor L3, resistor R10, capacitor C79, capacitor C366, capacitor C78, ​​and capacitor C77. The first terminal of capacitor C80 is grounded, and the second terminal of capacitor C80 is connected to the second terminal of capacitor C81. The first terminal of capacitor C81 is grounded. The first terminal of resistor R3 is grounded, and the second terminal of resistor R3 is connected to the first terminal of resistor R1. The second terminal of resistor R1 is connected to the second terminal of capacitor C81. The first terminal of capacitor C84 is grounded, and the second terminals of resistors R3 and R1 are connected together to the second terminal of capacitor C84. The second terminal of capacitor C84 is connected to pin 4 of chip U6, pin 5 of chip U6 is connected to the second terminal of resistor R1, and pin 2 of chip U6 is grounded. The first terminal of resistor R9 is grounded, and the second terminal of resistor R9 is connected to pin 3 of chip U6. The first terminal of capacitor C79 is connected to the second terminal of resistor R9, and the second terminal of capacitor C79 is connected to capacitor C366. The first terminal of capacitor C366 is grounded; the first terminal of resistor R10 is connected to the first terminal of capacitor C79; the second terminal of resistor R10 is connected to the second terminal of capacitor C79; the first terminal of capacitor C82 is grounded; the second terminal of capacitor C82 is connected to the first terminal of resistor R20; the second terminal of resistor R20 is connected to pin 6 of chip U6; the first terminal of capacitor C83 is connected to pin 1 of chip U6; the second terminal of capacitor C83 is connected to the second terminal of resistor R20; the first terminal of inductor L3 is connected to the second terminal of capacitor C83; the second terminal of inductor L3 is connected to the second terminal of resistor R10; the first terminal of capacitor C78 is grounded; the second terminal of capacitor C78 is connected to the second terminal of inductor L3; the first terminal of capacitor C77 is grounded; the second terminal of capacitor C77 is connected to the second terminal of capacitor C78. See Figure 3 The second power supply unit includes capacitor C306, capacitor C71, resistor R235, resistor R2, capacitor C2, chip U5, capacitor C72, resistor R257, capacitor C1, resistor R238, inductor L7, resistor R237, capacitor C66, capacitor C368, capacitor C65, and capacitor C62. The first terminal of capacitor C306 is grounded, and the second terminal of capacitor C306 is connected to the second terminal of capacitor C71. The first terminal of capacitor C71 is grounded. The first terminal of resistor R2 is grounded, and the second terminal of resistor R2 is connected to the first terminal of resistor R235. The second terminal of resistor R235 is connected to the second terminal of capacitor C71. The first terminal of capacitor C2 is grounded, and the second terminal of capacitor C2 is connected to pin 4 of chip U5. The first terminals of resistor R235 and R2 are both connected to the second terminal of capacitor C2. Pin 2 of chip U5 is grounded. The first terminal of resistor R238 is grounded, and the second terminal of resistor R238 is connected to pin 3 of chip U5. The first terminal of capacitor C66 is connected to the first terminal of resistor R237, and the second terminal of capacitor C66 is connected to the second terminal of resistor R237. The first terminal of capacitor C368 is grounded, the second terminal of capacitor C368 is connected to the second terminal of capacitor C66, the first terminal of resistor R237 is connected to the second terminal of resistor R238, the second terminal of resistor R237 is connected to the second terminal of inductor L7, the first terminal of capacitor C72 is grounded, the second terminal of capacitor C72 is connected to the first terminal of resistor R257, the second terminal of resistor R257 is connected to pin 6 of chip U5, the first terminal of capacitor C1 is connected to pin 1 of chip U5, the second terminal of capacitor C1 is connected to the second terminal of resistor R257, the first terminal of inductor L7 is connected to the second terminal of capacitor C1, the first terminal of capacitor C65 is grounded, the second terminal of capacitor C66 is connected to the second terminal of inductor L7, the first terminal of capacitor C52 is grounded, and the second terminal of capacitor C52 is connected to the second terminal of capacitor C65. See Figure 4 The third power supply unit includes capacitors C94, C89, C90, and C91; resistors R140, R137, R145, R139, and R141; capacitor C93; chip U10; capacitor C87; resistor R144; capacitor C92; capacitor C187; resistor R143; inductor L8; capacitor C367; resistor R297; resistor R138; capacitor C88; resistor R146; resistor R149; resistor R176; capacitor C86; capacitor C186; capacitor C185; capacitor C184; capacitor C183; capacitor C123; capacitor C96; and capacitor C95. The first terminal of capacitor C94 is grounded. The second terminal of capacitor C94 is connected to the second terminal of capacitor C89. The first terminal of capacitor C89 is grounded. The second terminal of capacitor C89 is connected to the second terminal of capacitor C90. The first terminal of capacitor C90 is grounded. The second terminal of capacitor C90 is connected to the second terminal of resistor R139. The first terminal of resistor R141 is grounded. The second terminal of resistor R141 is connected to the first terminal of resistor R139. Pins 2, 3, and 4 of chip U10 are connected in parallel to the second terminal of resistor R139. The first terminal of capacitor C93 is grounded. The second terminals of resistors R141 and R139 are both connected to the second terminal of capacitor C93. The second terminal of capacitor C93 is connected to pin 9 of chip U10. The first terminal of resistor R137... One end of the resistor is grounded. The second end of the resistor R137 is connected to pin 10 of chip U10. The first end of the resistor R145 is connected to the second end of capacitor C90. The second end of the resistor R145 is connected to the second end of the resistor R137. The first end of capacitor C91 is grounded. The second end of capacitor C91 is connected to the first end of resistor R140. The second end of resistor R140 is connected to the second end of capacitor C92. The second end of capacitor C92 is connected to pin 1 of chip U10. Pins 5, 16, and 15 of chip U10 and the first end of inductor L8 are all located on the line between the second end of resistor R140 and the second end of capacitor C92. The first end of capacitor C186 is grounded. The second end of capacitor C186 is connected to the second end of inductor L8. The first terminal of capacitor C185 is grounded; the second terminal of capacitor C185 is connected to the second terminal of capacitor C186; the first terminal of capacitor C184 is grounded; the second terminal of capacitor C184 is connected to the second terminal of capacitor C185; the first terminal of capacitor C183 is grounded; the second terminal of capacitor C183 is connected to the second terminal of capacitor C184; the first terminal of capacitor C123 is grounded; the second terminal of capacitor C123 is connected to the second terminal of capacitor C183; the first terminal of capacitor C96 is grounded; the second terminal of capacitor C96 is connected to the second terminal of capacitor C95; the first terminal of resistor R143 is grounded; the second terminal of resistor R143 is connected to pin 11 of chip U10; resistor R29... The first terminal of resistor C7 is connected to the second terminal of resistor R143. The second terminal of resistor R297 is connected to the first terminal of resistor R138. The second terminal of resistor R138 is connected to the second terminal of capacitor C367. The first terminal of capacitor C367 is grounded. The first terminal of capacitor C88 is connected to the first terminal of resistor R297. The second terminal of capacitor C88 is connected to the first terminal of resistor R146. The second terminal of resistor R146 is connected to the second terminal of capacitor C367. The first terminal of resistor R149 is connected to the first terminal of capacitor C88. The second terminal of resistor R149 is connected to the first terminal of resistor R176. The first terminal of capacitor C86 is grounded. The second terminals of resistors R149 and R176 are combined and connected to the second terminal of capacitor C86. The first terminal of capacitor C187 is grounded.The second terminal of capacitor C187 is connected to pin 12 of chip U10. Pin 17 of chip U10 is grounded. Pins 6 and 14 of chip U10 are connected to ground in parallel. The first terminal of resistor R144 is grounded, and the second terminal of resistor R144 is connected to pin 8 of chip U10. The first terminal of capacitor C87 is grounded, and the second terminal of capacitor C87 is connected to pin 13 of chip U10. See Figure 5 The fourth power supply unit includes capacitors C189, C39, C44, C57, resistor R184, C67, inductor L6, resistor R186, capacitors C196, C195, C192, C191, C190, resistors R189, R190, R183, C201, C199, R188, C200, R187, R298, R31, C364, C36, R191, R194, R195, C203, R192, and chip U3. The first terminal of capacitor C189 is grounded. The second terminal of capacitor C189 is connected to the second terminal of capacitor C39. The first terminal of capacitor C39 is grounded. The second terminal of capacitor C39 is connected to the second terminal of capacitor C44. The first terminal of capacitor C44 is grounded. Pins 2, 3, and 4 of chip U3 are connected in parallel to the second terminal of capacitor C44. The first terminal of capacitor C201 is grounded. The second terminal of capacitor C201 is connected to pin 9 of chip U3. The first terminal of resistor R183 is connected to the VDDCPU_EN pin. The second terminal of resistor R183 is connected to the second terminal of capacitor C210. ​​The first terminal of resistor R189 is grounded. The second terminal of resistor R189 is connected to pin 10 of chip U3. The first terminal of resistor R190 is connected to capacitor C44. The second terminal of resistor R190 is connected to the second terminal of resistor R189. The first terminal of capacitor C57 is grounded. The second terminal of capacitor C57 is connected to the first terminal of resistor R184. The second terminal of resistor R184 is connected to the second terminal of capacitor C67. The first terminal of capacitor C67 is connected to pin 1 of chip U3. Pins 5, 16, and 15 of chip U3, and the first terminal of inductor L6 are all located on the line between the second terminal of resistor R184 and the second terminal of capacitor C67. The first terminal of resistor R186 is connected to the second terminal of inductor L6. The second terminal of resistor R186 is connected to the second terminal of capacitor C196. The first terminal of capacitor C196 is grounded. The second terminal of capacitor C196 is connected to the second terminal of capacitor C195. The first terminal of capacitor C195 is grounded. The second terminal of capacitor C195 is connected to the second terminal of capacitor C192. The first terminal of capacitor C192 is grounded. The second terminal of capacitor C192 is connected to the second terminal of capacitor C191. The first terminal of capacitor C191 is grounded. The second terminal of capacitor C191 is connected to the second terminal of capacitor C190. The first terminal of capacitor C190 is grounded. The first terminal of resistor R298 is grounded. The second terminal of resistor R298 is connected to the first terminal of resistor R187. The second terminal of resistor R187 is connected to pin 11 of chip U3. The first terminal of resistor R31 is connected to the second terminal of resistor R187. The second terminal of resistor R31 is connected to the second terminal of capacitor C364. The first terminal of capacitor C364 is grounded. The first terminal of capacitor C36 is connected to resistor R364. The first terminal of capacitor C36 is connected to the first terminal of resistor R191. The second terminal of resistor R191 is connected to the second terminal of resistor R31. The first terminal of resistor R194 is connected to the first terminal of capacitor C36. The second terminal of resistor R194 is connected to the first terminal of resistor R195. The second terminal of resistor R195 is connected to the first terminal of resistor R192. The first terminal of capacitor C203 is grounded. The second terminals of resistors R194 and R195 are both connected to the second terminal of capacitor C203. The first terminal of capacitor C200 is grounded. The second terminal of capacitor C200 is connected to pin 12 of chip U3. Pin 17 of chip U3 is grounded. Pins 6 and 14 of chip U3 are connected to ground in parallel. The first terminal of resistor R188 is grounded.The second terminal of resistor R188 is connected to pin 8 of chip U3, the first terminal of capacitor C199 is grounded, and the second terminal of capacitor C199 is connected to pin 13 of chip U3. See Figure 6 The fifth power supply unit includes resistor R361, transistor Q15, capacitor C379, capacitor C380, resistor R324, resistor R326, capacitor C383, chip U2, capacitor C382, resistor R322, inductor L34, resistor R323, capacitor C378, capacitor C384, capacitor C377, and capacitor C375. The second terminal of resistor R361 is connected to the first terminal of transistor Q15, and the second terminal of transistor Q15 is grounded. The first terminal of capacitor C379 is grounded, and the second terminal of capacitor C379 is connected to the second terminal of capacitor C380. The first terminal of capacitor C380 is grounded, and the second terminal of capacitor C380 is connected to the second terminal of resistor R324. The first terminal of resistor R324 is connected to the second terminal of resistor R326, and the second terminal of resistor R324 is connected to pin 5 of chip U2. The first terminal of resistor R326 is grounded. The third terminal of transistor Q15 is located on the line between the first terminal of resistor R324 and the second terminal of resistor R326. The second terminals of resistors R326 and R324 are connected to the second terminal of capacitor C383, and the first terminal of capacitor C383 is grounded. The second terminal of capacitor C383 is connected to pin 4 of chip U2, and pin 2 of chip U2 is grounded. Resistor R3... The first terminal of resistor R322 is grounded. The second terminal of resistor R322 is connected to pin 3 of chip U2. The first terminal of resistor R323 is connected to the second terminal of resistor R322. The second terminal of resistor R323 is connected to the second terminal of inductor L34. The first terminal of capacitor C378 is connected to the first terminal of resistor R323. The second terminal of capacitor C378 is connected to the second terminal of resistor R323. The first terminal of capacitor C384 is grounded. The second terminal of capacitor C384 is connected to the second terminal of capacitor C378. The first terminal of capacitor C382 is connected to pin 1 of chip U2. The second terminal of capacitor C382 is connected to pin 6 of chip U2. The first terminal of inductor L34 is connected to the second terminal of capacitor C382. The second terminal of inductor L34 is connected to the second terminal of capacitor C377. The first terminal of capacitor C377 is grounded. The second terminal of capacitor C377 is connected to the second terminal of capacitor C375. The first terminal of capacitor C375 is grounded. See Figure 7 Among them, pins 1 and 2 of the DC chip are connected to ground in parallel, and pins 4, 7 and 8 of the DC chip are grounded; The SoC module includes a first capacitor unit, a second capacitor unit, a first control unit, a second control unit, and a third control unit; See Figure 8The first capacitor unit includes capacitors 2C63, 2C62, 2C61, 2C64, 2C13, 2C11, 2C65, 2C66, 2C20, 2C16, and 2C1. Capacitors 2C63, 2C62, 2C61, 2C64, 2C13, 2C11, 2C65, 2C66, 2C20, 2C16, and 2C1 are connected in parallel, and the first terminals of capacitors 2C63, 2C62, 2C61, 2C64, 2C13, 2C11, 2C65, 2C66, 2C20, 2C16, and 2C1 are all grounded. See Figure 9 The second capacitor unit includes capacitors 2C6, 2C58, 2C22, 2C24, 2C25, 2C59, and 2C60. Capacitors 2C6, 2C58, 2C22, 2C24, 2C25, 2C59, and 2C60 are connected in parallel, and the first terminals of capacitors 2C6, 2C58, 2C22, 2C24, 2C25, 2C59, and 2C60 are all grounded. See Figure 10 The first control unit includes chip U1-A, capacitor 2C5, capacitor 2C41, resistor 2R2, resistor 2R19, diode VD3, capacitor 2C23, resistor 2R10, resistor 2R27, capacitor 2C9, capacitor 2C3, filter 2Y2, resistor 2R27, capacitor 2C42, capacitor 2C10, capacitor 2C67, resistor 2R1, and resistor 2R71. The first terminal of capacitor 2C5 is grounded, and the second terminal of capacitor 2C5 is connected to pin F8 of chip U1-A; the first terminal of capacitor 2C41 is grounded, and the second terminal of capacitor 2C41 is connected to pin AC9 of chip U1-A; the second terminal of resistor 2R2 is connected to pin W19 of chip U1-A; the first terminal of resistor 2R19 is connected to the second terminal of diode VD3, and the second terminal of resistor 2R19 is connected to pin Y24 of chip U1-A; the first terminal of diode VD3 is grounded; the first terminal of capacitor 2C23 is grounded, and the second terminal of capacitor 2C23 is located on the line between the second terminal of resistor 2R19 and pin Y24 of chip U1-A; the second terminal of resistor 2R10 is connected to pin AA25 of chip U1-A, the first terminal of resistor 2R10 is connected to the second terminal of capacitor 2C9, the first terminal of capacitor 2C9 is grounded, and the first terminal of capacitor 2C9 is connected to the first terminal of capacitor 2C3; The first terminal of capacitor 2C3 is grounded, and the second terminal of capacitor 2C3 is connected to pin AA24 of chip U1-A; the first terminal of resistor 2R27 and the third pin of filter 2Y2 are both located on the line between the second terminal of capacitor 2C9 and the first terminal of resistor 2R10; the second terminal of resistor 2R27 and the first pin of filter 2Y2 are both located on the line between the second terminal of capacitor 2C3 and pin AA24 of chip U1-A; the fourth pin of filter 2Y2 is grounded, and the second pin of filter 2Y2 is located on the line between the first terminal of capacitor 2C9 and the first terminal of capacitor 2C3; the first terminal of capacitor 2C42 is connected to pin U18 of chip U1-A, and the second terminal of capacitor 2C42 is grounded; the first terminal of capacitor 2C10 is connected to pin V18 of chip U1-A, and the second terminal of capacitor 2C10 is grounded; the Y20 pin of chip U1-A is connected to the second terminal of capacitor 2C67. The first terminal of capacitor 2C67 is grounded, the second terminal of capacitor 2C67 is connected to the second terminal of resistor 2R1, the first terminal of resistor 2R1 is grounded, and the second terminal of resistor 2R1 is connected to the first terminal of resistor 2R71. See Figure 11 The second control unit includes chip U2-I, resistor 10R1, and capacitor 10C1. The first terminal of capacitor 10C1 is connected to pin F9 of chip U2-I, and the second terminal of capacitor 10C1 is grounded; the first terminal of resistor 10R1 is located on the connection line between the first terminal of capacitor 10C1 and pin F9 of chip U2-I. See Figure 12 The third control unit includes chip U1-H, capacitor 8C14, capacitor 8C7, capacitor 8C15, and capacitor 8C16. The first terminal of capacitor 8C14 is connected to pin I16 of chip U1-H, and the second terminal of capacitor 8C14 is grounded; the first terminal of capacitor 8C7 is connected to pin R18 of chip U1-H, and the second terminal of capacitor 8C7 is grounded; the first terminal of capacitor 8C15 is connected to pin K17 of chip U1-H, and the second terminal of capacitor 8C15 is grounded; the first terminal of capacitor 8C16 is connected to pin M17 of chip U1-H, and the second terminal of capacitor 8C16 is grounded; pins L16 and K17 of chip U1-H are connected together. The liquid crystal display module includes: a liquid crystal backlight circuit unit, a bias circuit unit, and a connector circuit unit. See Figure 13 The LCD backlight circuit unit includes capacitor C326, resistor R289, capacitor C327, resistor R290, transistor Q6, capacitor C333, transistor Q8, resistor R291, fuse FB18, capacitor C5204, capacitor C193, inductor L5200, chip U5200, diode D5200, capacitor C5205, capacitor C23, resistor R12, resistor R5204, resistor R13, capacitor C194, resistor R5205, and resistor R5206. The first terminal of capacitor C326 is grounded. The second terminal of capacitor C326 is connected to the second terminal of resistor R289. The first terminal of resistor R289 is connected to the third terminal of transistor Q8. The second terminal of transistor Q8 is grounded. The first terminal of transistor Q8 is connected to the first terminal of resistor R291. The second terminal of resistor R289 is connected to the second terminal of capacitor C327. The first terminal of capacitor C327 is connected to the second terminal of resistor R290. The first terminal of resistor R289 and the third terminal of transistor Q8 are both connected to the first terminal of resistor R290. The second terminal of resistor R290 is connected to the first terminal of transistor Q6. The second terminal of transistor Q6 is connected to the second terminal of capacitor C327. The third terminal of transistor Q6 is connected to the second terminal of capacitor C333. The first terminal of capacitor C333 is grounded. The second terminal of fuse FB18 is connected to the second terminal of capacitor C5204. The first terminal of capacitor C5204 is connected to the first terminal of capacitor C193. The second terminal of capacitor C193 is connected to the second terminal of capacitor C5204. Pin 2 of chip U5200, the first terminal of capacitor C5204, and the first terminal of capacitor C193 are all grounded. The first terminal of inductor L5200 is connected to the second terminal of capacitor C193. Pin 6 of chip U5200 is located on the connection between the second terminal of capacitor C193 and the first terminal of inductor L5200. The second terminal of resistor R12 is connected to the second terminal of resistor R5204. The first terminal of resistor R5204 is grounded. The second terminals of resistors R12 and R5204 are all connected to pin 4 of chip U5200. The second terminal of inductor L5200 is connected to the second terminal of capacitor C194. The first terminal of capacitor C194 is connected to the second terminal of resistor R13, and the first terminal of resistor R13 is grounded. The first pin of chip U5200 is located on the line between the second terminal of inductor L5200 and the second terminal of capacitor C194. The positive terminal of diode D5200 is connected to the second terminal of inductor L5200, and the negative terminal of diode D5200 is connected to the fifth pin of chip U5200. The first terminal of capacitor C5205 is grounded, and the second terminal of capacitor C5205 is connected to the negative terminal of diode D5200. The first terminal of capacitor C23 is grounded, and the second terminal of capacitor C23 is connected to the second terminal of capacitor C5205. The first terminal of resistor R5205 is grounded, and the second terminal of resistor R5205 is connected to the third pin of chip U5200. The first terminal of resistor R5206 is grounded, and the second terminal of resistor R5206 is connected to the second terminal of resistor R5205. See Figure 14 The bias circuit unit includes inductor L16, capacitor C6, capacitor C5, resistor R56, resistor R57, resistor R54, chip U9, capacitor C12, capacitor C4, capacitor C9, resistor R105, resistor R55, capacitor C8, inductor L17, capacitor C3, capacitor C7, capacitor 8C3, and capacitor 8C2. The second terminal of inductor L16 is connected to pin 1 of chip U9; the first terminal of capacitor C6 is grounded, and the second terminal of capacitor C6 is connected to the second terminal of capacitor C5. The first terminal of capacitor C5 is connected to the first terminal of resistor R56, and the second terminal of resistor R56 is connected to the second terminal of capacitor C5. Pin 2 of chip U9 is connected to the second terminal of resistor R56, pin 3 of chip U9 is grounded, the first terminal of resistor R57 is connected to the first terminal of resistor R56, and the second terminal of resistor R57 is grounded together with pin 5 of chip U9. Pin 4 of chip U9 is located on the line between the first terminals of resistors R56 and R57. The second terminal of resistor R54 is connected to pin 6 of chip U9. The first terminal of capacitor C12 is grounded and connected to pin 13 of chip U9. The first terminal of capacitor C4 is grounded and connected to pin 7 of chip U9. The first terminal of capacitor C9 is grounded and connected to resistor R105. The first terminal is connected to the second terminal of resistor R105, which is connected to the first terminal of resistor R55. The second terminal of resistor R55 is connected to pin 10 of chip U9. Pin 8 of chip U9 is located on the line between the second terminal of capacitor C9 and the first terminal of resistor R105. Pin 9 of chip U9 is located on the line between the second terminal of resistor R105 and the first terminal of resistor R55. The first terminal of capacitor C8 is located on the line between the second terminal of resistor R105 and the first terminal of resistor R55. The second terminal of capacitor C8 is connected to the second terminal of resistor R55. The first terminal of capacitor C3 is grounded. The second terminal of capacitor C3 is connected to the second terminal of capacitor C8. The first terminal of inductor L17 is connected to pin 11 of chip U9. The second terminal of inductor L17 is grounded. The first terminal of capacitor C7 is connected to pin 12 of chip U9. The second terminal of capacitor C7 is grounded. The first terminal of capacitor 8C3 is grounded. The second terminal of capacitor 8C3 is connected to the second terminal of capacitor 8C2. The first terminal of capacitor 8C2 is grounded. See Figure 15 The connector circuit unit includes resistors R225 and R224, fuse FB19, capacitor C188, resistor R116, transistor Q10, capacitor C10, capacitor C113, capacitor C124, capacitor C125, diode D1, diode D2, diode D3, diode D4, resistor R148, resistor R147, transistor Q11, and chip CON16. The second terminal of resistor R116 is connected to the first terminal of transistor Q10; the first terminal of capacitor C188 is located on the connection between the second terminal of resistor R116 and the first terminal of transistor Q10. The second terminal of capacitor C188 is connected to the first terminal of resistor R225. The second terminal of resistor R225 is connected to the VCC3V3 pin. The first terminal of resistor R224 is connected to the first terminal of resistor R225. The second terminal of transistor Q10 is connected to the first terminal of resistor R224. The third terminal of transistor Q10 is connected to the first terminal of fuse FB19. The second terminal of fuse FB19 is connected to the second terminal of capacitor C10. The first terminal of capacitor C10 is grounded. The second terminal of capacitor C10 is connected to the second terminal of capacitor C113. The first terminal of capacitor C113 is grounded. The second terminal of capacitor C113 is connected to the 17th pin of chip CON16. The first terminal of capacitor C124 is grounded. The second terminal of capacitor C124 is connected to the 21st pin of chip CON16. The first terminal is grounded. The second terminal of capacitor C125 is connected to pin 22 of chip CON16. The first terminal of diode D1 is grounded and the second terminal of diode D1 is connected to pin 41 of chip CON16. The first terminal of diode D2 is grounded and the second terminal of diode D2 is connected to pin 42 of chip CON16. The first terminal of diode D3 is grounded and the second terminal of diode D3 is connected to pin 43 of chip CON16. The first terminal of diode D4 is grounded and the second terminal of diode D4 is connected to pin 44 of chip CON16. Pins 8, 24, 27, 30, 33, 36, 39, 45, 46, and 47 of chip CON16 are connected to ground in parallel. The second terminal of resistor R148 is connected to the first terminal of transistor Q11. The second terminal of transistor Q11 is connected to the second terminal of resistor R147. The first terminal of resistor R147 is connected to the first terminal of resistor R148. See Figure 16 The power amplifier ultrasonic module includes chip U19, fuse FB15, capacitor C100, capacitor C99, resistor R218, capacitor C101, capacitor C102, resistor R219, resistor R14, resistor R207, resistor R208, capacitor C321, capacitor C322, capacitor C323, resistor R220, capacitor C302, capacitor C325, capacitor C320, capacitor C331, capacitor C319, fuse FB17, capacitor C328, and capacitor... C329, Capacitor C330, Capacitor C303, Capacitor C318, Capacitor C332, Capacitor C317, Fuse FB16, Capacitor C304, Resistor R213, Resistor R215, Capacitor C305, Inductor L25, Inductor L26, Capacitor C312, Capacitor C313, Capacitor C307, Resistor R216, Resistor R217, Capacitor C308, Inductor L27, Inductor L28, Capacitor C314, Capacitor C316, Ultrasonic transmitter CON13;The second terminal of fuse FB15 is connected to the second terminal of capacitor C100. The first terminals of capacitors C100 and C101 are grounded together. The second terminal of capacitor C100 is connected to the second terminal of capacitor C99. The second terminal of capacitor C99 is connected to pin 2 of chip U19 and the first terminal of resistor R218. The first terminal of capacitor C99 is connected to the first terminal of capacitor C100 and pin 1 of chip U19. The first terminal of resistor R218 is connected to pin 2 of chip U19. The second terminal of resistor R216 is connected to pin 3 of chip U19. Pin 1 of chip U19 is located on the connection line between the first terminals of capacitors C100 and C101. The second terminal of capacitor C101 is connected to pin 4 of chip U19. The first terminal of capacitor C102 is connected to the first terminal of capacitor C101. The second terminal of capacitor C102 is connected to the second terminal of capacitor C101. The first terminal of resistor R219 is grounded. The second terminal of resistor R219 is connected to chip U19. Pin 5 of chip U19; the first terminals of capacitors C323, C322, and C321 are all grounded; the second terminal of capacitor C323 is connected to the first terminal of resistor R14; the second terminal of resistor R14 is connected to pin 6 of chip U19; the second terminal of capacitor C322 is connected to the first terminal of resistor R207; the second terminal of resistor R207 is connected to pin 7 of chip U19; the second terminal of capacitor C321 is connected to the first terminal of resistor R208; the second terminal of resistor R208 is connected to pin 8 of chip U19; the first terminal of capacitor C325 is connected to the first terminal of capacitor C302; the second terminal of capacitor C325 is connected to pin 13 of chip U19; the second terminal of chip C302 is connected to pin 12 of chip U19; the first terminal of resistor R220 is grounded; the second terminal of resistor R220 is connected to the second terminal of capacitor C302 and pin 12 of chip U19; pins 19, 24, and 29 of chip U19 are grounded.The first terminal of capacitor C318, the first terminal of capacitor C332, and the negative terminal of capacitor C317 are grounded. The second terminal of capacitor C318 is connected to pins 15 and 16 of chip U19. The second terminal of capacitor C332 is connected to the second terminal of capacitor C318. The positive terminal of capacitor C317 is connected to the second terminal of capacitor C332. The first terminal of fuse FB16 is connected to the positive terminal of capacitor C317. The first terminal of capacitor C303 is connected to pin 18 of chip U19. The second terminal of capacitor C303 is connected to pin 17 of chip U19. Pin 17 of chip U19 is connected to the first terminal of capacitor C308. The second terminal of capacitor C308 is connected to the first terminal of resistor R217. The second terminal of resistor R217 and the first terminal of resistor R216 are grounded together. The second terminal of resistor R216 is connected to the first terminal of capacitor C307. The second terminal of capacitor C307 is connected to pin 20 of chip U19. The first terminal of inductor L27 is connected to the second terminal of capacitor C307. The second terminal of inductor L27 is connected to the second terminal of capacitor C314. The first terminals of capacitors C314 and C316 are grounded together. The first terminal of capacitor C316 is connected to the second terminal of inductor L28. The first terminal of inductor L28 is connected to the first terminal of capacitor C308. The second terminal of inductor L28 is connected to pin 4 of ultrasonic transmitter CON13. The second terminal of inductor L27... Connect the following terminals: CON330 to pin 3 of the ultrasonic transmitter CON13; C330's first terminal is connected to pin 21 of chip U19, and its second terminal is connected to pin 20 of chip U19; C329's first terminal is connected to pin 22 of chip U19, and its second terminal is connected to pin 23 of chip U19; C305's first terminal is connected to pin 23 of chip U19; C305's second terminal is connected to the first terminal of resistor R215; the second terminals of resistors R215 and R213 are grounded together; the second terminal of resistor R213 is connected to the first terminal of capacitor C304; and the second terminal of capacitor C304 is connected to chip U19. Pin 26 of chip U19 is connected to the second terminal of capacitor C328. The first terminal of capacitor C328 is connected to pin 25 of chip U19. The first terminal of inductor L25 is connected to the second terminal of capacitor C304. The second terminal of inductor L25 is connected to the second terminal of capacitor C312. The first terminals of capacitors C312 and C313 are grounded together. The first terminal of capacitor C313 is connected to the second terminal of inductor L26. The first terminal of inductor L26 is connected to the first terminal of capacitor C305. The second terminal of inductor L25 is connected to pin 1 of ultrasonic transmitter CON13. The second terminal of inductor L26 is connected to pin 2 of ultrasonic transmitter CON13.Pins 27 and 28 of chip U19 are connected in parallel to the second terminal of capacitor C320. The first terminal of capacitor C320 is connected to the first terminal of capacitor C331, and the second terminal of capacitor C331 is connected to the second terminal of capacitor C320. The positive terminal of capacitor C319 is connected to the second terminal of capacitor C331, and the negative terminal of capacitor C319 is connected to the first terminal of capacitor C331. The negative terminal of capacitor C319 is grounded. The positive terminal of capacitor C319 is connected to the first terminal of fuse FB17. Pins 5 and 6 of ultrasonic transmitter CON13 are grounded. The digital microphone module includes a first digital microphone unit, a second digital microphone unit, and a third digital microphone unit. See Figure 17 The first digital microphone unit includes resistor R17, chip X2, chip X8, capacitor C33, resistor R16, capacitor C37, capacitor C13, diode VD17, diode VD18, chip MIC1, diode VD19, capacitor C15, capacitor C16, capacitor C17, and fuse FB1. The second end of resistor R17 is connected to pin 2 of chip X2, and pins 2, 4, 6, C1, and C2 of chip X2 are connected to ground in parallel. Pins 1, 3, and 5 of chip X8 are connected to ground in parallel. Pins C1 and C2 of chip X8 are also connected to ground in parallel. The first end of resistor R16 is connected to pin 2 of chip X8. The second end of resistor R16 is connected to the second end of capacitor C13. The first end of capacitor C13 is connected to the first end of capacitor C37. The second end of capacitor C37 is connected to pin 4 of chip X8. The second end of capacitor C13 is connected to the second end of diode VD17. The first end of diode VD17 is connected to the first end of capacitor C13. The first end of diode VD18 is connected to the first end of diode VD17. The first end of diode VD17 is grounded. The second end of diode VD18 is connected to the second end of capacitor C37 and pin 4 of chip MIC1. The first end of diode VD18 is connected to... Pin 2 of chip MIC1; the first end of capacitor C33 is connected to pin 6 of chip X8, and the second end of capacitor C33 is grounded; pin 3 of chip MIC1 is connected to the first end of diode VD19, the first end of diode VD19 is grounded, the second end of diode VD19 is connected to pin 5 of chip MIC1; the first end of capacitor C15 is connected to the first end of diode VD19, the second end of capacitor C15 is connected to the second end of diode VD19; the first end of capacitor C16 is connected to the first end of capacitor C15, and the second end of capacitor C16 is connected to the second end of capacitor C15; the first end of fuse FB1 is connected to the second end of capacitor C16, the second end of fuse FB1 is connected to the second end of capacitor C17, and the first end of capacitor C17 is connected to the first end of capacitor C16. See Figure 18 The second digital microphone unit includes chip X9, resistor R25, chip X5, capacitor C32, capacitor C29, diode VD25, capacitor C30, diode VD26, resistor R23, chip MIC2, diode VD20, capacitor C25, capacitor C18, capacitor C24, and fuse FB2. Pins 2, 4, 6, C1, and C2 of chip X9 are connected to ground in parallel. The first end of resistor R25 is connected to ground, and the second end of resistor R25 is connected to pin 3 of chip X9. Pin 5 of chip X9 is also connected to ground. Pins 1, 3, and 5 of chip X5 are connected to ground in parallel. Pins C1 and C2 of chip X5 are also connected to ground in parallel. The first end of capacitor C29 is grounded, and the second end of capacitor C29 is connected to pin 4 of chip X5. The first end of diode VD25 is grounded, and the second end of diode VD25 is connected to the second end of capacitor C29. The first end of capacitor C30 is grounded, and the second end of capacitor C30 is connected to pin 2 of chip X5. The first end of resistor R23 is connected to the second end of capacitor C30, and the second end of resistor R23 is connected to the second end of diode VD26. The second end of diode VD26 is grounded. Pin 1 of chip MIC2 is connected to the second terminal of diode VD26, pin 4 of chip MIC2 is connected to the second terminal of diode VD25, and pin 2 of chip MIC2 is grounded; the first terminal of capacitor C32 is connected to pin 6 of chip X5, and the second terminal of capacitor C32 is grounded; pin 3 of chip MIC2 is connected to the first terminal of diode VD20, and the first terminal of diode VD20 is grounded; the second terminal of diode VD20 is connected to pin 5 of chip MIC2; the first terminal of capacitor C25 is grounded, and the second terminal of capacitor C25 is connected to the second terminal of diode VD20; the first terminal of capacitor C18 is grounded, and the second terminal of capacitor C18 is connected to the second terminal of capacitor C25; the first terminal of fuse FB2 is connected to the second terminal of capacitor C18, and the second terminal of fuse FB2 is connected to the second terminal of capacitor C24, and the first terminal of capacitor C24 is grounded. See Figure 19 The third digital microphone unit includes chip X1, resistor R26, chip X10, capacitor C34, capacitor C38, diode VD24, capacitor C31, diode VD22, resistor R24, chip MIC3, diode VD21, capacitor C28, capacitor C26, capacitor C27, and fuse FB3. Pins 2, 4, 6, C1, and C2 of chip X11 are connected to ground in parallel; the second terminal of resistor R26 is connected to pin 3 of chip X11; pins 1, 3, and 5 of chip X10 are connected to ground in parallel; pins C1 and C2 of chip X10 are connected to ground in parallel; the first terminal of capacitor C38 is grounded; the second terminal of capacitor C38 is connected to pin 4 of chip X10; the first terminal of diode VD24 is grounded; the second terminal of diode VD24 is connected to the second terminal of capacitor C38; the second terminal of diode VD24 is connected to pin 4 of chip MIC3; the first terminal of capacitor C31 is grounded; the second terminal of capacitor C31 is connected to pin 2 of chip X10; the first terminal of resistor R24 ​​is connected to the second terminal of capacitor C31; the second terminal of resistor R24 ​​is connected to the second terminal of diode VD22; and so on. The first terminal of diode VD22 is grounded, and the second terminal of diode VD22 is connected to pin 2 of chip MIC3; the first terminal of capacitor C34 is connected to pin 6 of chip X10, and the second terminal of capacitor C34 is grounded; pin 2 of chip MIC3 is connected to pin VDDMIC3, pin 3 of chip MIC3 is connected to the first terminal of diode VD21, the first terminal of diode VD21 is grounded, the second terminal of diode VD21 is connected to pin 5 of chip MIC3, the first terminal of capacitor C28 is grounded, the second terminal of capacitor C28 is connected to the second terminal of diode VD21, the first terminal of capacitor C26 is grounded, the second terminal of capacitor C26 is connected to the second terminal of capacitor C28, the first terminal of fuse FB3 is connected to the second terminal of capacitor C26, the second terminal of fuse FB3 is connected to the second terminal of capacitor C27, and the first terminal of capacitor C27 is grounded. In the first power supply unit of the power module, the second terminal of capacitor C77 is connected to pins V18 and U18 of chip U1-A in the first control unit of the SoC module, respectively; the second terminal of capacitor C80 in the first power supply unit of the power module, the second terminal of capacitor C94 in the third power supply unit, the second terminal of capacitor C189 in the fourth power supply module, and pin 3 of the DC chip are connected in pairs; the second terminal of capacitor C52 in the second power supply unit of the power module is connected to pins F8 and AC9 of chip U1-A in the first control unit of the SoC module, and the second terminal of resistor 10R1 in the second control unit; the second power supply unit of the power module... The second terminal of capacitor C306 in the Yuanzhong module, pin 5 of the DC chip, the second terminal of fuse FB16 in the power amplifier ultrasonic module, and the second terminal of fuse FB17 in the power amplifier ultrasonic module are connected in pairs; pins T14, N15, K12, K13, M11, M12, P14, R13, R15, P12, K11, and T16 of chip U1-A in the first control unit of the SoC module are connected in parallel to the second terminal of inductor L8 in the third power supply unit of the power supply module, the second terminal of capacitor C95 in the third power supply unit, and the second terminal of resistor R138 in the third power supply unit. The second terminal of capacitor 2C63 in the first capacitor unit of the SoC module; the second terminal of resistor R176 in the third power supply unit of the power supply module is connected to pin AG6 of chip U1-A in the first control unit of the SoC module; pins T12, T13, U11, U13, V11, V12, V14, W12, and W13 of chip U1-A in the first control unit of the SoC module are connected in parallel to the second terminal of capacitor C190 in the fourth power supply unit, the second terminal of resistor R31 in the fourth power supply unit, and the second terminal of resistor R192 in the fourth power supply module. The second terminal of capacitor 2C6 in the second capacitor unit; the second terminal of resistor R195 in the fourth power unit of the power module is connected to pin AF6 of chip U1-A in the first control unit of the SoC module; the second terminal of capacitor C379 in the fifth power unit of the power module is connected to the second terminal of resistor 2R71 in the first control unit of the SoC module; the second terminal of capacitor C375 in the fifth power unit of the power module is connected to the second terminal of capacitor C326 in the LCD backlight circuit unit of the LCD display module; the first terminal of resistor R361 in the fifth power unit of the power module is connected to pin H9 of chip U1-A in the first control unit of the SoC module; In this configuration, the second terminal of capacitor C333 in the LCD backlight circuit unit of the LCD display module, the first terminal of fuse FB18 in the LCD backlight circuit unit, the first terminal of inductor L16 in the bias circuit unit, pin 12 and pin 7 of chip U9 in the bias circuit unit, and the second terminal of capacitor 8C2 in the bias circuit unit are connected in pairs; the second terminal of resistor R291 in the LCD backlight circuit unit is connected to pin G11 of chip U2-I in the second control unit of the SoC module; the first terminal of resistor R290 in the LCD backlight circuit unit, the first terminal of resistor R116 in the connector circuit unit, pin F11 of chip U2-I in the second control unit, and pin B9 of chip U2-I are connected in pairs; the LCD backlight circuit... In the unit, the first end of resistor R12 is connected to pin C9 of chip U2-I in the second control unit; pins 1 and 2 of chip CON16 in the connector circuit unit of the LCD display module are connected in parallel to the second end of capacitor C23 in the LCD backlight circuit unit; pins 4, 5, 6, and 7 of chip CON16 in the connector circuit unit are connected in parallel to the second end of resistor R5206 in the LCD backlight circuit unit; the second end of capacitor C6 in the bias circuit unit is connected to pin 13 of chip CON16 in the connector circuit unit; the second end of capacitor C3 in the bias circuit is connected to pin 15 of chip CON16 in the connector circuit unit; the first end of resistor R54 in the bias circuit unit is connected to the second control unit. Pin A7 of chip U2-I in the unit; terminal 3 of transistor Q11 in the connector circuit unit is connected to pin C8 of chip U2-I in the second control unit; terminal 2 of resistor R224 in the connector circuit unit, terminal 1 of resistor R148 in the connector circuit unit, pin R18 of chip U1-H in the third control unit of the SoC module, and pin M17 of chip U1-H in the third control unit are connected in pairs; terminal 2 of transistor Q11 in the connector circuit unit is connected to pin 19 of chip CON16 in the connector circuit unit; pin 10 of chip CON16 is connected to pin F12 of chip U2-I; pin 21 of chip CON16 is connected to pin A9 of chip U2-I; chip CON1... Pin 22 of chip 6 is connected to pin C10 of chip U2-I; pin 25 of chip CON16 is connected to pin W25 of chip U1-H; pin 26 of chip CON16 is connected to pin W24 of chip U1-H; pin 28 of chip CON16 is connected to pin V23 of chip U1-H; pin 29 of chip CON16 is connected to pin V24 of chip U1-H; pin 31 of chip CON16 is connected to pin U25 of chip U1-H; pin 32 of chip CON16 is connected to pin U24 of chip U1-H; pin 34 of chip CON16 is connected to pin R20 of chip U1-H; pin 35 of chip CON16 is connected to pin R19 of chip U1-H.Pin 37 of chip CON16 is connected to pin U19 of chip U1-H; pin 38 of chip CON16 is connected to pin T19 of chip U1-H; pin 41 of chip CON16 is connected to pin AB10 of chip U1-A in the first control unit of the SoC module; pin 42 of chip CON16 is connected to pin AA10 of chip U1-A; pin 43 of chip CON16 is connected to pin AB9 of chip U1-A; pin 44 of chip CON16 is connected to pin AA8 of chip U1-A. In the ultrasonic amplifier module, the first terminal of fuse FB15 is connected to the first terminal of resistor 2R2 in the first control unit of the SoC module; the first terminal of resistor R14 in the ultrasonic amplifier module is connected to pin H11 of chip U2-I in the second control unit of the SoC module; the first terminal of resistor R207 in the ultrasonic amplifier module is connected to pin F12 of chip U2-I; the first terminal of resistor R208 in the ultrasonic amplifier module is connected to pin B8 of chip U2-I; pin 10 of chip U19 in the ultrasonic amplifier module is connected to pin G13 of chip U2-I; pin 11 of chip U19 is connected to pin H12 of chip U2-I; pin 12 of chip U19 is connected to pin F14 of chip U2-I. In this digital microphone module, pin 1 of chip X2, pin 2 of fuse FB1, pin 6 of chip X8, pin 1 of chip X9, pin 6 of chip X5, pin 2 of fuse FB2, pin 1 of chip X11, pin 6 of chip X10, and pin 2 of fuse FB3 are connected in pairs; the first terminal of resistor R17 in the first digital microphone unit is also connected in pairs. The first terminals of resistor R25 in the second digital microphone unit and resistor R26 in the third digital microphone unit are connected in pairs; pin 5 of chip X2 is connected to pin 2 of chip X8; pin 3 of chip X2 is connected to pin 4 of chip X8; pin 5 of chip X9 is connected to pin 5 of chip X11; pin 3 of chip X9, pin 4 of chip X5, and pin 4 of chip MIC2 in the second digital microphone unit are connected in pairs; pin 3 of chip X11, pin 4 of chip X10, and pin 4 of chip MIC3 in the third digital microphone unit are connected in pairs; pin 2 of chip X10 is connected to the second terminal of capacitor C31 in the third digital microphone unit.

[0022] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An intelligent sound control system based on ultrasonic emission, characterized in that, The control system includes: a power module, a SoC module, a power amplifier ultrasonic module, a digital microphone module, and an LCD display module; The power supply module is used to supply power to each module; the SoC module provides IIS, PDM, and IIC signals to the power amplifier ultrasonic module and the digital microphone module and performs encoding; the power amplifier ultrasonic module is used to drive the ultrasonic transmitter; the digital microphone module is used to receive the signals transmitted back from the ultrasonic transmitter; the LCD display module is used for interactive display of the screen. The power supply module is electrically connected to each of the other modules; the output terminal of the SoC module is electrically connected to the input terminal of the power amplifier ultrasonic module, the input terminal of the digital microphone module, and the input terminal of the liquid crystal display module, respectively.

2. The intelligent sound control system based on ultrasonic emission according to claim 1, characterized in that: The SoC module includes a first capacitor unit, a second capacitor unit, a first control unit, a second control unit, and a third control unit; The SoC module controls the liquid crystal display module, the digital microphone module, and the power amplifier ultrasonic module through a first control unit, a second control unit, and a third control unit. 3.The intelligent sound control system based on ultrasonic emission of claim 2, wherein, The liquid crystal display module includes: a liquid crystal backlight circuit unit, a bias circuit unit, and a connector circuit unit; The liquid crystal backlight circuit unit and the bias circuit unit are electrically connected via the VCC_LB pin. The liquid crystal backlight circuit unit is electrically connected to the connector circuit unit via the LCD_VDDIO_EN pin, LEDK pin, and LEDA pin, respectively. The liquid crystal backlight circuit unit is electrically connected to the second control unit via the LCD_BL_PWM pin, LCD_VDDIO_EN pin, and VCC_LB_EN pin, respectively. The bias circuit unit is electrically connected to the connector circuit unit via the VSP pin and VSN pin, respectively. The bias circuit unit is electrically connected to the second control unit via the LCD_VDD_EN pin, respectively. The connector circuit unit is electrically connected via VDD1V8... The _DCDC pin, MIPI_D3_N pin, MIPI_D3_P pin, MIPI_D0_N pin, MIPI_D0_P pin, MIPI_CLK_N pin, MIPI_DLK_P pin, MIPI_D1_N pin, MIPI_D1_P pin, MIPI_D2_N pin, and MIPI_D2_P pin are connected to the third control unit. The connector circuit unit is connected to the second control unit through the TOUCH_INT pin, TOUCH_RST_N pin, LCD_RST_N pin, SPI_A_SSO pin, SPI_A_CLK pin, SPI_A_MISO pin, and SPI_A_MOSI pin.

4. The intelligent sound control system based on ultrasonic emission of claim 3, wherein: The power amplifier ultrasonic module is electrically connected to the first control unit via the VDDAO_3V3 pin; the power amplifier ultrasonic module is electrically connected to the second control unit via the I2S_LRCLK_1 pin, I2S_SCLK_1 pin, I2S_DOUT_1 pin, CPU_I2C_EE_MO_SDA pin, CPU_I2C_EE_MO_SCL pin, and UAMP_SDB pin, respectively.

5. The intelligent sound control system based on ultrasonic emission according to claim 4, characterized in that: The power module includes: a first power unit, a second power unit, a third power unit, a fourth power unit, a fifth power unit, and a DC chip; The first power supply unit, the third power supply unit, the fourth power supply unit, and the DC chip are electrically connected in pairs via the VCC9V pin; the first power supply unit is electrically connected to the third control unit via the 1V8 pin, providing a 1.8V power supply voltage to the third power supply unit; the second power supply unit and the DC chip are both electrically connected to the power amplifier ultrasonic module via the 20V pin, providing a 20V power supply voltage to the power amplifier ultrasonic module; the second power supply unit is electrically connected to the first control unit via the 3V3 pin, providing a 3.3V power supply voltage to the first control unit; the third power supply unit is connected to the first capacitor unit and the first control unit via the VDDEE pin. The first power supply unit is electrically connected to the first capacitor unit and provides VDDEE power to the first control unit. The third power supply unit is connected to the first control unit via the VDDEE_PWM pin and provides pulse voltage to the first control unit. The fourth power supply unit is electrically connected to the first control unit via the VDDCPU pin and the VDDCPU_PWM pin, and is also electrically connected to the second capacitor unit via the VDDCPU_ pin. The fifth power supply unit is electrically connected to the first control unit via the +20V pin and the 5V_EN pin, and is also electrically connected to the liquid crystal backlight circuit unit via the VCC5V pin. 6.The intelligent sound control system based on ultrasonic emission of claim 1, wherein: The digital microphone module includes a first digital microphone unit, a second digital microphone unit, and a third digital microphone unit; The first digital microphone unit, the second digital microphone unit, and the third digital microphone unit are electrically connected in pairs via the PDM_CLK pin.

Images