An electronic device

Abstract

This disclosure relates to an electronic device. The electronic device includes: a motherboard; an expansion structure mounted on the motherboard and forming a first cavity between the expansion structure and the motherboard for expanding the functionality of the motherboard; wherein the expansion structure has at least one first vent hole; and a first speaker fixedly mounted on the side of the expansion structure opposite to the motherboard and covering the at least one first vent hole; wherein the rear cavity of the first speaker communicates with the first cavity through the at least one first vent hole, together forming the rear acoustic cavity structure of the first speaker. The electronic device proposed in this disclosure adds a sound outlet position above the motherboard and utilizes the vent hole of the expansion structure and the cavity space to form the rear acoustic cavity structure of the speaker, significantly increasing the acoustic cavity volume and optimizing the sound output effect.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device hardware design, and more particularly to an electronic device. Background Technology

[0002] In related technologies, electronic devices mainly use a single-speaker solution for audio output, placing a single speaker directly at the bottom of the device. Some high-performance devices use a dual-speaker design, placing a speaker at the top and a speaker at the bottom of the device to achieve a dual-speaker effect. However, due to the limited internal stacking space of the phone, the overall sound quality is not good.

[0003] In addition, conventional equipment uses only the internal cavity as its sealed space to form a sound chamber when it uses a speaker to produce sound, so its speaker volume and sound effect are not good. Utility Model Content

[0004] To overcome the problems existing in related technologies, this disclosure provides an electronic device. The electronic device proposed in this disclosure adds a sound outlet position above the motherboard and utilizes the vent holes of the extended structure and the cavity space to form a rear sound cavity structure for the speaker, significantly increasing the sound cavity volume and optimizing the sound output effect.

[0005] This disclosure provides an electronic device, including:

[0006] Motherboard;

[0007] An expansion structure is mounted on the motherboard and forms a first cavity with the motherboard to expand the functionality of the motherboard; wherein, the expansion structure is provided with at least one first vent hole;

[0008] A first speaker is fixedly installed on the side of the expansion structure opposite to the motherboard and covers the at least one first vent hole;

[0009] The rear cavity of the first loudspeaker is connected to the first cavity through at least one first vent hole, and together they form the rear acoustic cavity structure of the first loudspeaker.

[0010] In this way, by adding a sound outlet above the motherboard and utilizing the ventilation holes and cavity space of the extended structure to form the rear sound cavity structure of the speaker, the volume of the sound cavity is greatly increased and the sound output effect is optimized.

[0011] In some alternative embodiments, the electronic device further includes:

[0012] A sealing ring is disposed between the first speaker and the expansion structure, and surrounds the at least one first vent hole, for sealing the mounting gap between the first speaker and the expansion structure;

[0013] The sealing space formed by the sealing ring is connected to the rear cavity of the first speaker and is also connected to the first cavity through the first vent hole.

[0014] In this way, the sealing ring can effectively prevent external impurities such as dust and moisture from entering the first speaker, protecting the sound quality and service life of the first speaker, while further improving the problem of sound leakage from the first speaker through the rear cavity structure.

[0015] In some alternative embodiments, the sealing ring is a sealing foam.

[0016] In this way, the sealing foam fills the tiny gaps to make the installation between the first speaker and the expansion structure more compact, which has a good effect of absorbing tolerances and improving the installation reliability and stability of the first speaker.

[0017] In some alternative embodiments, the sealing ring is disposed at the outer edge of the surface of the first speaker facing the extended structure.

[0018] This increases the volume of the rear acoustic cavity structure, further optimizing the sound output of the first speaker.

[0019] In some alternative embodiments, the extended structure includes a shield and / or a stack of plates.

[0020] Thus, by setting up a shielding cover, the electromagnetic shielding effect of the motherboard can be improved, and by setting up a stacked board, the functions of the motherboard can be effectively expanded.

[0021] In some optional embodiments, the stacked plate is welded to the main board and forms a second cavity with the main board, and at least one second vent hole is provided on the stacked plate; the shield is welded to the stacked plate and forms a third cavity with the stacked plate; the first vent hole is provided on the shield;

[0022] The second cavity, the at least one second vent hole, and the third cavity together form the first cavity.

[0023] Thus, in this embodiment, the cavity space formed between the stacked plates and the motherboard and the shielding cover is used as the rear acoustic cavity structure. While achieving a more extreme stacking effect, the volume of the rear acoustic cavity structure is increased, further optimizing the low-frequency performance of the first speaker and ensuring the sound output effect.

[0024] In some alternative embodiments, the stacked plates include cavity composite plates or sandwich plates.

[0025] Thus, the present invention effectively expands the motherboard performance through cavity composite plates or sandwich plates.

[0026] In some alternative embodiments, the electronic device further includes:

[0027] The motherboard and the expansion structure are located within the space of the rear housing;

[0028] A first decorative element is disposed in the area near the top of the rear shell, including a first mounting area and a second mounting area;

[0029] The camera assembly is disposed in the first mounting area;

[0030] A second decorative element is disposed in the second installation area;

[0031] The first speaker is disposed between the second decorative element and the extended structure;

[0032] The second decorative element is provided with at least one first sound outlet hole, and the first speaker outputs sound to the outside through the front sound cavity structure and the at least one first sound outlet hole.

[0033] Thus, by setting a second decorative element in the mounting area of ​​the first decorative element for mounting the rear camera, and setting a first speaker in the Z-direction space of the second decorative element, it is possible to increase the sound output position and improve the stereo effect without increasing the overall thickness of the device as much as possible.

[0034] In some alternative embodiments, a sound outlet channel is formed between the first speaker and the second decorative element, and the sound outlet channel communicates with the first sound outlet hole;

[0035] The front cavity of the first loudspeaker is connected to the sound outlet channel, and together with the sound outlet channel, they form the front sound cavity structure.

[0036] In this way, the space between the first speaker and the second decorative piece is used as the front sound cavity structure to optimize the sound output effect of the first speaker.

[0037] In some alternative embodiments, the first mounting area and the second mounting area are located on opposite sides of the first decorative element.

[0038] In this way, the distance between the camera component and the first speaker is relatively far, effectively reducing the interference of the speaker's sound on the camera function.

[0039] In some alternative embodiments, the first sound outlet includes a plurality of holes, which are distributed in the edge region of the second decorative element.

[0040] In this way, when the speaker emits sound, the sound diffuses in all directions through this ring of small holes, which helps to achieve a better stereo effect for the first speaker.

[0041] In some alternative embodiments, the electronic device further includes:

[0042] A mid-frame is mounted on the rear shell; the first speaker, the expansion structure, and the motherboard are stacked between the rear shell and the mid-frame; a second sound outlet is provided at the top and / or bottom of the mid-frame;

[0043] At least one second speaker is disposed at the top and / or bottom of the middle frame and outputs sound outward through the second sound outlet.

[0044] Thus, by providing a first speaker and at least one second speaker, this disclosure enhances the sound range and sound effect of the device.

[0045] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0046] This embodiment of the invention includes a first speaker in an electronic device, which is mounted on an expansion structure above the motherboard and covers the vent holes on the expansion structure. The vent holes connect to the first cavity of the expansion structure to create a sealed rear acoustic cavity structure. This design increases the speaker's position compared to placing speakers only at the top or bottom of the device, improving the sound output. Furthermore, it significantly increases the volume of the rear acoustic cavity, effectively improving low-frequency performance and sound propagation quality, resulting in richer and more immersive sound. Additionally, by utilizing the available space above the expansion structure and its internal cavity, the device's component utilization is improved without significantly increasing its thickness, ensuring a slim and lightweight design.

[0047] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0048] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0049] Figure 1 This is an internal structure of an electronic device according to an exemplary embodiment. Figure 1 .

[0050] Figure 2 This is an internal structure of an electronic device according to an exemplary embodiment. Figure 2 .

[0051] Figure 3 This is a schematic diagram of the back of an electronic device according to an exemplary embodiment.

[0052] Figure 4 This is a partial cross-sectional view of an electronic device according to an exemplary embodiment.

[0053] Figure 5 This is a block diagram illustrating the structure of an electron according to an exemplary embodiment.

[0054] Figures 1 to 4 The reference numerals in the attached figures are as follows:

[0055] 1. Mainboard; 2. Expansion structure; 21. First cavity; 22. First vent; 3. First speaker; 4. Sealing ring; 5. Stacked plate; 51. Second cavity; 52. Second vent; 6. Shielding cover; 61. Third cavity; 7. Back cover; 71. First decorative piece; 72. Second decorative piece; 721. First sound outlet; 8. Camera assembly. Detailed Implementation

[0056] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0057] This disclosure provides an electronic device. See also... Figure 1 , Figure 1 This is an internal structure of an electronic device according to an exemplary embodiment. Figure 1 ;like Figure 1 As shown, the electronic device disclosed herein includes:

[0058] Motherboard 1;

[0059] An expansion structure 2 is mounted on the motherboard 1 and forms a first cavity 21 between the expansion structure 2 and the motherboard 1 for expanding the functions of the motherboard 1; wherein, the expansion structure 2 is provided with at least one first vent hole 22.

[0060] The first speaker 3 is fixedly installed on the side of the expansion structure 2 away from the motherboard 1 and covers at least one first vent hole 22;

[0061] The rear cavity of the first speaker 3 is connected to the first cavity 21 through at least one first vent hole 22, and together they form the rear sound cavity structure of the first speaker 3.

[0062] Here, the electronic device proposed in this disclosure is a device with audio output function, capable of outputting sound to the outside through at least a first speaker. This electronic device includes fixed terminals, mobile terminals, or portable devices; fixed terminals include, but are not limited to, vehicle-mounted terminals, televisions, etc.; mobile terminals include, but are not limited to, mobile phones, tablet computers, etc.; portable devices include, but are not limited to, smartwatches, etc., and this disclosure does not impose further limitations in this regard.

[0063] The motherboard, located inside an electronic device, is typically situated within its casing (such as a battery cover) or frame. As a core component, it plays a crucial role. Its main functions include: First, hardware connection and support: The motherboard is the physical carrier of various hardware components, providing mounting locations for processors (such as the CPU), memory, hard drives, graphics cards, etc., and connecting them via slots and interfaces to ensure collaborative operation. Second, signal transmission for the software system: Circuits and buses on the motherboard transmit data and control signals, enabling high-speed data exchange between the CPU and memory / storage devices, ensuring normal device operation. Third, power distribution: The motherboard receives power from the power supply and distributes it to each hardware component, ensuring stable power for each. Fourth, system-level management: The chipset and functional components on the motherboard manage hardware initialization, configuration, and basic input / output operations, providing hardware support for the operating system and enabling users to easily operate the electronic device.

[0064] Optionally, the aforementioned motherboard is generally a printed circuit board (PCB).

[0065] In order to ensure the effective use of the functions on the motherboard or to increase the functions of the motherboard, many electronic devices usually set up some expansion structures to expand the functions of the motherboard.

[0066] In some alternative examples, the extended structure can be a support and protection structure, such as a protective cover, the inner cavity of which serves as the first cavity mentioned above, to support and protect some flexible or easily worn devices, and to reduce the damage to these devices caused by dust, liquids, etc., thereby extending the service life of the equipment.

[0067] In some alternative embodiments, the extended structure includes a shield and / or a stack.

[0068] Here, considering that some sensitive circuits are located on the motherboard, and their electromagnetic properties affect the performance of the device, the aforementioned extended structure can also be a shield. By covering these critical components, electromagnetic shielding is applied to the critical components, chips, and the sensitive circuits they form, preventing external electromagnetic interference from entering the area, improving the leakage of electromagnetic signals from internal circuits to the outside, and reducing bidirectional electromagnetic interference.

[0069] Furthermore, the extended structure proposed in this embodiment can also be a stacked board, and the stacked board can be set as a PCB board or a multilayer flexible printed circuit (FPC) (forming ribbon cable), so that the surface supports the soldering of other devices and forms a more complex electronic circuit with the motherboard, increasing the functional integration of the circuit and effectively expanding the function of the electronic device.

[0070] Thus, by setting up a shielding cover, the electromagnetic shielding effect of the motherboard can be improved, and by setting up a stacked board, the functions of the motherboard can be effectively expanded.

[0071] In this embodiment of the disclosure, any of the above-described extension structures can be soldered onto the motherboard, forming a first cavity between the extension structure and the motherboard. For example, the first cavity can also be formed between the stacked board and the motherboard, supporting larger functional devices such as CPUs, power interfaces, or large chipsets. Furthermore, the soldering connection can be implemented on the motherboard using surface mount technology (SMT), or it can be fixedly mounted to the motherboard using methods such as manual high-temperature soldering with a solder gun, or pressing the extension structure onto the motherboard using a pressing structure.

[0072] Taking SMT placement as an example, this disclosure also provides at least one first vent hole above the extended structure; the vent hole can achieve air pressure balance: through the vent hole, airflow can be smoothly exchanged between the internal and external spaces during the SMT placement process, improving problems such as SMT placement failure or inaccurate placement displacement caused by air pressure imbalance.

[0073] Here, the shape of the first vent is not limited in this disclosure and can be set according to the needs of the extended structure itself. For example, it can be a regular square or circle, or an irregular shape.

[0074] Without limitation, when the extended structure is a shielding cover, the size of the first vent hole is usually within 1mm. In this way, while ensuring the effective electromagnetic shielding effect of the shielding cover, good ventilation effect can be achieved.

[0075] Considering that the expansion structure has a first vent hole and is connected to the internal first cavity, the first cavity can be sealed and connected to other structures through the vent hole to form a larger chamber. Furthermore, because the present invention addresses the limitations of current electronic device speaker settings, which only emit sound from the top or top of the device, and where the only usable sealed space for the speaker to form a sound cavity, resulting in poor speaker volume and sound quality, the present invention breaks through these limitations by proposing a first speaker and fixing it above the expansion structure of the motherboard, covering at least one vent hole. This allows the rear cavity of the first speaker (the area between the speaker core and the back of the speaker housing) to be tightly connected to the expansion structure and connected to the first cavity through at least one vent hole, forming a sealed rear sound cavity structure. This not only increases the speaker's sound-emitting position but also utilizes the cavity space of the expansion structure, improving device utilization, while simultaneously increasing the rear sound cavity volume and improving the speaker's sound output.

[0076] Understandably, because the embodiments of this disclosure extend the rear acoustic cavity structure, it not only provides a larger vibration space for the diaphragm in the core of the first speaker, which helps the propagation of low-frequency sounds, making the bass fuller and deeper, and improving the low-frequency extension capability of the sound effect; it also reduces sound reflection and interference within the cavity, making sound propagation smoother and improving the clarity and purity of the sound effect. Furthermore, the larger rear acoustic cavity helps to increase the sound pressure level of the first speaker, making the sound louder and enhancing the dynamic range and expressiveness of the sound effect.

[0077] It should be noted that the first speaker disclosed herein can be directly attached to the surface of the expansion structure to achieve a tight connection with the expansion structure; it can also be further fixed to the expansion structure or the motherboard by other fixing structures such as screw structures to increase installation stability.

[0078] In this embodiment of the disclosure, to achieve effective sound output from the first speaker, the first speaker is further provided with an electrical connection structure. This electrical connection structure is electrically connected to a drive circuit on the motherboard. The drive circuit on the motherboard, under the control of the processor, electrically drives and controls the core of the first speaker. For example, this electrical connection structure can be a lead wire or an FPC. The drive circuit receives digital audio signals from the processor, converts them into analog signals, amplifies the analog signals, and transmits them to the speaker core through the aforementioned lead wire or FPC, driving the speaker core to vibrate and produce sound.

[0079] It is understood that the embodiments of this disclosure include a first speaker in the electronic device, which is mounted on an expansion structure above the motherboard and covers the vent holes on the expansion structure. This allows the vent holes to connect to the first cavity of the expansion structure, creating a sealed rear acoustic cavity structure. This increases the speaker's position compared to placing speakers only at the top or bottom of the device, improving the sound output. Furthermore, it significantly increases the volume of the rear acoustic cavity, effectively improving low-frequency performance and sound propagation quality, resulting in richer and more three-dimensional sound. Additionally, by utilizing the available space above the expansion structure and its internal cavity, the device's component utilization is improved without significantly increasing its thickness, ensuring a slim and lightweight design.

[0080] In some alternative embodiments, combined with Figure 1 As shown, the electronic device also includes:

[0081] A sealing ring 4 is disposed between the first speaker 3 and the expansion structure 2, and surrounds at least one first vent hole 22, for sealing the installation gap between the first speaker 3 and the expansion structure 2;

[0082] The sealing space formed by the sealing ring 4 is connected to the rear cavity of the first speaker 3 and is connected to the first cavity 21 through the first vent hole 22.

[0083] Here, taking the shielding cover as an example of an extended structure (the same applies to other structures such as stacked plates, which will not be elaborated here). Considering that welding or other fixing methods between the first speaker and the shielding cover may result in significant poor fit, leading to obvious sound leakage in the rear acoustic cavity structure, this embodiment of the present disclosure provides a sealing ring between the bottom of the first speaker housing and the shielding cover to effectively fill and seal the installation gap between the shielding cover and the first speaker.

[0084] Optionally, the sealing ring is an annular structure, which can be a circular annular structure, or a square or other irregular shape, and this disclosure does not impose any restrictions; however, the annular structure surrounds all the first vent holes provided on the shielding cover, thereby ensuring good sealing of the rear sound cavity structure.

[0085] Because the sealing ring structure has a certain thickness, it forms an annular sealing space. One side of this sealing space is connected to the rear cavity of the first speaker, and the other side is connected to the first cavity through the first vent hole, together forming the rear sound cavity structure. While ensuring good sealing, the volume of the sound cavity is further increased.

[0086] In some optional examples of this disclosure, the sealing ring may be a rubber structure or an adhesive.

[0087] For example, the adhesive can be applied in liquid form to the bottom surface of the first speaker facing the shield, or to the upper surface of the shield. After the first speaker is placed above the shield, the adhesive is cured by means of ultraviolet light, high temperature or natural cooling, and the cured adhesive forms the sealing layer.

[0088] Understandably, this sealing ring can effectively prevent external impurities such as dust and moisture from entering the first speaker, protecting the sound quality and lifespan of the first speaker, while further improving the problem of sound leakage from the first speaker through the rear cavity structure.

[0089] In some alternative embodiments, the sealing ring is a sealing foam.

[0090] Optionally, the sealing foam is polyurethane foam. Polyurethane foam has excellent resistance to compression deformation and stress relaxation, and can maintain its elasticity and sealing performance well even after long-term use, thereby further ensuring the long-term stability of the sealing and shock absorption effect of the first speaker.

[0091] Understandably, this disclosure sets the sealing ring as a foam structure, which gives the sealing ring a certain degree of elasticity and compressibility. When the speaker is mounted on the motherboard, it can accommodate the dimensional mismatch between the first speaker, the expansion structure and the motherboard caused by manufacturing tolerances. By filling the tiny gaps, the installation between the first speaker and the expansion structure is made tighter, which has a good effect of absorbing tolerances and improving the installation reliability and stability of the first speaker.

[0092] Furthermore, the foam structure used in this disclosure has better elasticity than the rubber structure, which can better adapt to installation pressure and tolerance. Rubber materials may undergo permanent deformation due to stress, while foam can restore its original shape to a certain extent and better meet the sealing performance requirements. Compared with glue, it has better disassembly and causes less damage to the board and speaker, making the disassembly and maintenance of the first speaker more convenient and safer.

[0093] In some alternative embodiments, there are at least two first vent holes, which are of the same size and are evenly distributed within the area surrounded by the sealing ring.

[0094] here, Figure 1 The first vent 22 shown is two in number.

[0095] In other examples, more vents can be set for better breathability. When multiple vents are set, each vent is made smaller; for example, the size of each vent can be between 0.2mm and 0.5mm.

[0096] Optionally, the shape of the first vent can be set to circular.

[0097] In the case where at least two first vent holes are provided in this disclosure, in order to make the air permeability of the shield mounted on the motherboard more uniform and reduce installation errors, these first vent holes can be set to be all the same size and evenly distributed.

[0098] Furthermore, considering that a first speaker and a sealing ring need to be installed above the shielding cover, and that the first vent hole is needed to connect the rear cavity with the speaker to form a rear sound cavity, this disclosure sets the first vent holes of the same size to be evenly distributed within the area enclosed by the sealing ring. In this way, when the gas in the rear sound cavity vibrates synchronously under the action of the speaker core, the airflow distribution is more uniform, reducing resonance noise and optimizing the final sound output effect.

[0099] In some alternative embodiments, the sealing ring is disposed at the outer edge of the surface of the first speaker facing the extension structure.

[0100] Here, the shape of the sealing ring is adapted to the outer contour of the first speaker. For example, when the first speaker has a square structure, the sealing ring is located at the outer edge of the bottom surface of the speaker (i.e., the surface of the first speaker facing the shield), forming a square sealing ring, which is bonded to the bottom surface of the first speaker and the upper surface of the extension structure respectively, to achieve a gap seal between the two.

[0101] It is understandable that, since the sealed space formed by the sealing ring will communicate with the rear cavity of the first speaker, the first vent hole and the first cavity to form the rear sound cavity structure, the volume of this sealed space can be maximized by setting the sealing ring at the outer edge of the surface of the first speaker facing the expansion structure, thereby increasing the volume of the rear sound cavity structure and further optimizing the sound output effect of the first speaker.

[0102] In some optional embodiments of this disclosure, the first speaker can be disposed above the stacked plate, which is disposed above the motherboard, forming a first cavity between the stacked plate and the motherboard; the first speaker utilizes the first cavity and a first vent hole on the stacked plate to form a sealed rear acoustic cavity structure. In other optional embodiments, the first speaker can be disposed above a shielding cover, which is disposed above the motherboard, forming a first cavity between the shielding cover and the motherboard; the first speaker utilizes the first cavity and a first vent hole on the shielding cover to form a sealed rear acoustic cavity structure. Of course, in other embodiments, two first speakers can be provided, one disposed above the stacked plate and the other above the shielding cover.

[0103] In some other alternative embodiments, see Figure 2 , Figure 2 This is an internal structure of an electronic device according to an exemplary embodiment. Figure 2 ; combination Figure 1 and Figure 2 As shown, the stacked plate 5 is welded to the main plate 1 and forms a second cavity 51 with the main plate 1. At least one second vent hole 52 is provided on the stacked plate 5.

[0104] The shielding cover 6 is welded to the stacked plate 5, and a third cavity 61 is formed between the shielding cover 6 and the stacked plate 5; the first vent hole 22 is provided in the shielding cover 6.

[0105] The second cavity 51, at least one second vent 52, and the third cavity 61 together form the first cavity 21.

[0106] It should be noted that, Figure 2 The ripple direction in the example is the sound output direction of the first speaker.

[0107] Here, considering that the stacked board and shielding cover may occupy a large amount of XY space on the motherboard and reduce the screen ratio, the embodiments of this disclosure can utilize the larger Z-axis space between the top of the motherboard and the rear shell to stack the stacked board and shielding cover relative to the motherboard.

[0108] The stacked board is formed on the motherboard using surface mount technology (SMT), and the shielding cover is formed on the stacked board using SMT. Therefore, the stacked board has some second vent holes, and the shielding cover has some first vent holes, ensuring smooth airflow during the mounting process. In this disclosure, the size and shape of the first and second vent holes are not limited; they can be the same or different.

[0109] In this embodiment, the second cavity and the third cavity are connected via a second vent hole, together forming the first cavity. Thus, this embodiment allows for a speaker to be configured with a more precise Z-axis spatial stacking of the shielding cover and the motherboard. Simultaneously, the second cavity corresponding to the stacked plate and the third cavity corresponding to the shielding cover can be effectively utilized to form the rear acoustic cavity structure of the speaker. This increases the volume of the rear acoustic cavity structure of the first speaker, further optimizing the low-frequency performance of the first speaker and ensuring sound output quality.

[0110] In the aforementioned embodiment where the shielding cover is stacked with the laminate and motherboard, the projection of the first vent hole toward the second vent hole is located within the range of the second vent hole. This allows for smoother airflow when the shielding cover is attached to the laminate, and also makes the airflow inside the rear acoustic cavity structure smoother, reducing resonance noise problems.

[0111] In some alternative embodiments, the stack includes a cavity composite plate or a sandwich plate.

[0112] The sandwich board, with its multiple layers stacked and a connecting layer in between, enables signal transmission and functional expansion. It can increase the number of functional modules in a device, improve integration, and reduce space requirements. For example, in some high-performance machines, the sandwich board design allows for the integration of more processors, memory modules, and high-speed interfaces, enhancing computing performance and data transmission efficiency.

[0113] For example, a sandwich board includes an adapter board and an RF board.

[0114] Here, the cavity composite board has reserved cavities inside, which not only increase the mounting space for components and enable the assembly of more complex components on the motherboard, but also further realize functions such as electromagnetic shielding and heat dissipation optimization. This solution is widely used in communication equipment, such as 5G base stations, to improve signal transmission quality and equipment stability. Overall, this stacked board solution can effectively improve equipment performance and reliability, meeting the needs of complex application scenarios.

[0115] Thus, this disclosure effectively expands motherboard performance through cavity boards or sandwich boards.

[0116] In some alternative embodiments, see Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of the back of an electronic device according to an exemplary embodiment. Figure 4 This is a partial cross-sectional view of an electronic device according to an exemplary embodiment. (In conjunction with...) Figures 1 to 3 The aforementioned electronic devices also include:

[0117] The rear shell 7, the motherboard 1, and the expansion structure 2 are located within the space of the rear shell 7;

[0118] The first decorative element 71 is disposed in the area near the top of the rear cover 7, including a first mounting area and a second mounting area;

[0119] Camera component 8 is located in the first installation area;

[0120] The second decorative element 72 is disposed in the second installation area;

[0121] The first speaker 3 is disposed between the second decorative element 72 and the extension structure 2;

[0122] The second decorative element 72 is provided with at least one first sound outlet 721, and the first speaker 3 outputs sound to the outside through the front sound cavity structure and at least one first sound outlet 721.

[0123] Here, the back cover is used to protect the internal functional modules of the electronic device, such as the battery module, motherboard, and communication module. The back cover structure can be made of metal or plastic, and this disclosure does not impose any restrictions on it.

[0124] It is understandable that, in order to expand the camera function of electronic devices, a rear camera is usually set for image capture. Therefore, in this embodiment, an opening is made in the rear shell structure and a first decorative piece is provided. The first decorative piece is used to decorate the appearance of the rear shell, improve its aesthetics, and also serves as the mounting structure for the camera assembly, thereby ensuring the reliability of the structural assembly.

[0125] The first decorative element is formed in the area at the top of the rear shell and extends horizontally (XY direction) to the two sides of the rear shell to support the formation of more structures in the first decorative element.

[0126] In this embodiment, the first decorative component has a first mounting area and a second mounting area, each supporting the installation of different functional components. For example, the first mounting area is used to mount a camera component, and the second mounting area is used to mount a flash, a back screen, etc.

[0127] Since there is a certain Z-axis space between the second mounting area and the motherboard of the rear shell, the second speaker is placed in such a Z-axis space in this embodiment of the present disclosure. This not only achieves effective space utilization without increasing the thickness of the device, but also adds a new sound-emitting position to achieve a more three-dimensional audio effect.

[0128] Here, in order to protect the first speaker and improve the appearance, the present embodiment also provides a second decorative piece, which is placed in the second mounting area. The second decorative piece has a first sound outlet hole. The speaker is placed between the second decorative piece and the motherboard. After the core of the speaker vibrates, it emits sound outward through the front sound cavity structure and the first sound outlet hole of the speaker.

[0129] In some examples of this disclosure, both the first decorative element and the second decorative element can be set as metal decorative elements, with the second decorative element fixedly installed in the mounting opening of the first decorative element and fixedly connected to the first decorative element; or the second decorative element and the first decorative element can be integrally formed.

[0130] Understandably, using metal for the decorative parts results in higher surface hardness, better corrosion resistance, and better compressive strength, which can improve the stability of the camera assembly and the first speaker during installation and use.

[0131] Of course, in actual implementation, since the first speaker structure is relatively small, the first decorative part with a larger area can also be made of metal, while the second decorative part can be made of non-metallic structures such as plastic. This disclosure does not impose any restrictions on this.

[0132] It is understood that by setting a second decorative element in the mounting area of ​​the first decorative element for mounting the rear camera, and setting a first speaker in the Z-direction space of the second decorative element, a new sound output position can be set and the stereo effect of the device can be enhanced without increasing the overall thickness of the device as much as possible.

[0133] In some alternative embodiments, a sound outlet channel is formed between the first speaker and the second decorative element, and the sound outlet channel communicates with the first sound outlet hole;

[0134] The front cavity of the first loudspeaker is connected to the sound outlet channel, and together with the sound outlet channel, they form the front sound cavity structure.

[0135] Here, a plastic support is also provided below the first decorative piece to support the camera assembly and the first speaker, improving installation stability.

[0136] There is also a partial installation gap between the first speaker and the second decorative piece, so a sound outlet channel can be formed. This sound outlet channel is aligned with the first sound outlet hole or connected through other guiding structures. In this way, the front cavity of the first speaker (speaker core and top of housing) can be connected with the sound outlet channel, thereby forming the front sound cavity structure of the first speaker together with the sound outlet channel, and optimizing the sound output effect of the first speaker.

[0137] In some alternative embodiments, the first mounting area and the second mounting area are located on opposite sides of the first decorative element.

[0138] Here, considering that the vibration of the speaker during operation can easily cause minor vibrations in the surrounding structure, placing the first speaker and the camera assembly too close together would affect the camera's shooting stability during sound emission. Therefore, in this embodiment, the first mounting area and the second mounting area are positioned on opposite sides of the first decorative piece; thus, the rear camera assembly and the first speaker can be respectively positioned on the left and right sides (e.g., Figure 3 As shown in the figure, this reduces mutual interference between the two devices and ensures the stability of their respective functions.

[0139] Of course, in actual implementation, considering aesthetics and other factors, the second installation area can also be located within the space surrounded by multiple first installation areas; for example, when the device has a quad-camera rear lens assembly, the first speaker is located in the middle position.

[0140] In some alternative embodiments, the first sound outlet includes a plurality of first sound outlets distributed in the edge region of the second decorative element.

[0141] In this embodiment, multiple first sound outlet holes are provided, and these holes are located on the outer edge region of the second decorative element, surrounding the outer edge to form a ring of small holes. Optionally, these small holes are of the same size and are evenly distributed in the edge region.

[0142] For example, the first sound hole is a circular hole with a diameter between 0.3 mm and 0.5 mm.

[0143] Here, the present disclosure may also provide a dustproof structure, such as a dustproof mesh, in the inner rear shell of the edge area of ​​the second decorative piece to effectively waterproof and dustproof the first speaker.

[0144] Understandably, when the first speaker emits sound, the sound diffuses outward through this ring of small holes, which helps to achieve a better stereo effect for the first speaker.

[0145] Of course, in some other alternative embodiments of this disclosure, in order to better improve the sound output effect of the first speaker, these first sound holes can also be provided in the edge area and the center area of ​​the second decorative part; however, considering that adding sound holes may further increase the probability of moisture and dust entering the first speaker through the sound holes, a larger dustproof net needs to be provided in this example to cover each of the first sound holes on the inner side of the second decorative part.

[0146] In some optional embodiments, the above-described electronic device further includes:

[0147] The middle frame (not shown in the figure) is mounted on the rear cover; the first speaker, the expansion structure and the motherboard are stacked between the rear cover and the middle frame; a second sound outlet is provided at the top and / or bottom of the middle frame;

[0148] At least one second speaker (not shown in the figure) is located at the top and / or bottom of the middle frame and outputs sound outward through a second sound outlet.

[0149] Here, the mid-frame is located within the rear shell and is used to support the installation of functional components such as the motherboard, communication module, and battery. The electronic device also includes a display screen, which is mounted on the mid-frame and located on the side of the mid-frame opposite the rear shell, for displaying the device's screen and facilitating UI interaction.

[0150] The aforementioned motherboard is mounted on the mid-frame and faces the rear shell. The first speaker and the expansion structure are stacked on the motherboard and located in the Z-direction space between the second decorative piece and the mid-frame.

[0151] The mid-frame proposed in this disclosure includes a frame, which includes a side frame, a top frame, and a bottom frame. A second sound outlet can be provided on both the top and bottom frames. Therefore, embodiments of this disclosure can provide at least one second speaker located in the bottom or top region of the mid-frame, emitting sound outwards through the second sound outlet provided at the corresponding frame position.

[0152] In some examples, there is one second speaker located at the bottom, with a microphone structure positioned at the top of the mid-frame. In other examples, there are two second speakers, located at the bottom and top respectively, to achieve stereo surround sound. To enhance the sound output, the first speaker proposed in this disclosure is mounted on the decorative element of the rear housing, further increasing the stereo effect.

[0153] Thus, by providing a first speaker and at least one second speaker, this disclosure enhances the sound range and sound effect of the device.

[0154] The following description uses a mobile phone as an example of the electronic device disclosed in this disclosure.

[0155] With the continuous development of mobile communication technology, mobile phones have become an indispensable part of people's daily lives. However, due to the limitations of stacked design, many mobile phones use a single speaker solution, placing the speaker at the bottom of the phone. Some high-end models use a dual-speaker design, with one sound outlet at the top and one at the bottom, but due to the limited internal space of the phone, the overall sound quality is not good.

[0156] In view of this, the present disclosure proposes a design that uses a shield to enlarge the speaker cavity, making full use of the Z-direction space of the mobile phone decorative part area, and further adding a third speaker (i.e. the aforementioned first speaker) on the basis of the bottom and top dual speaker design, so that the sound is emitted through the back of the decorative part; and by utilizing the enclosed space inside the motherboard, cavity board and shield, the cavity volume is maximized and the speaker sound output effect is optimized.

[0157] The structural design of the first loudspeaker in the embodiments of this disclosure will be described below.

[0158] First, a second decorative element is installed in the second mounting area of ​​the first decorative element on the back of the phone. A first speaker is positioned below the second decorative element, projecting sound backwards. In this way, a speaker can be placed within the Z-axis space of the back decorative element area without increasing the overall thickness of the phone.

[0159] Furthermore, conventional mobile phone speakers only have their internal sealed space for sound output, resulting in poor volume and sound quality. This embodiment fully utilizes the shielding cover below the speaker and the cavity space inside the cavity plate, significantly increasing the volume of the rear acoustic chamber.

[0160] To save internal stacking space, this embodiment of the disclosure chooses to add a sandwich board (or more layers of board material) or a cavity board on the motherboard to improve board utilization. The cavity board is placed on the right side of the motherboard and is soldered onto the motherboard using SMT technology. The cavity board has two second vent holes to ensure unobstructed airflow between the internal and external spaces during the SMT process. Similarly, the shielding cover is soldered onto the cavity board via SMT and has two first vent holes to ensure unobstructed airflow between the internal and external spaces during the SMT process.

[0161] Here, a perfectly sealed space can be achieved by adjusting the position of the vents on the cavity and shield, allowing gas exchange only through the two first vents on the shield. The first speaker is then pressed onto the shield using sealing foam, with the foam surrounding the first vents on the shield. At this point, the space inside the shield and the cavity is connected to the rear cavity of the speaker, forming a sealed chamber that serves as the rear acoustic chamber structure for the first speaker.

[0162] In addition, a front sound cavity structure is formed by utilizing the Z-direction space between the second decorative piece and the front cavity of the first speaker. The second decorative piece is a metal decorative piece, on which some exquisite small holes are machined (as the first sound outlet), thus optimizing the sound output effect of the first speaker.

[0163] Understandably, the above-described examples of this disclosure can add a speaker with an extra-large sound cavity volume to a mobile phone without taking up stacking space, ensuring a slim and lightweight design for the device; in addition, by making full use of the space in the decorative parts area and the internal space of the shielding cover / motherboard, an additional sound outlet position is added and the sound cavity volume is increased, resulting in a more stereo sound effect with better low-frequency performance.

[0164] Figure 5 This is a structural block diagram of an electronic device according to an exemplary embodiment. For example, the electronic device 500 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0165] Reference Figure 5 The electronic device 500 may include one or more of the following components: processing component 502, memory 504, power supply component 506, multimedia component 508, audio component 510, input / output interface 512, sensor component 514, and communication component 516.

[0166] Processing component 502 typically controls the overall operation of electronic device 500, such as operations associated with at least one of display, telephone call, data communication, camera operation, and recording operation. Processing component 502 may include one or more processors 520 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 502 may include one or more modules to facilitate interaction between processing component 502 and other components. For example, processing component 502 may include a multimedia module to facilitate interaction between multimedia component 508 and processing component 502.

[0167] Memory 504 is configured to store various types of data to support operation on electronic device 500. Examples of such data include at least one of the following: instructions for any application or method operating on electronic device 500, contact data, phonebook data, messages, pictures, and videos. Memory 504 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0168] Power supply component 506 provides power to various components of electronic device 500. Power supply component 506 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 500.

[0169] Multimedia component 508 includes a screen that provides an output interface between electronic device 500 and user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a Touch Panel, the screen may be implemented as a touchscreen to receive input signals from the user. The Touch Panel includes one or more touch sensors to sense touches, swipes, and gestures on the Touch Panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 508 includes a front-facing camera and / or a rear-facing camera. When electronic device 500 is in an operating mode, such as a shooting mode or video mode, the front-facing camera and / or rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0170] Audio component 510 is configured to output and / or input audio signals. For example, audio component 510 includes a microphone (MIC) configured to receive external audio signals when electronic device 500 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 504 or transmitted via communication component 516. In some embodiments, audio component 510 also includes a speaker for outputting audio signals.

[0171] Input / output interface 512 provides an interface between processing component 502 and peripheral interface modules, such as keyboards, click wheels, and buttons. These buttons may include, but are not limited to, home buttons, volume buttons, start buttons, and lock buttons.

[0172] Sensor assembly 514 includes one or more sensors for providing state assessments of various aspects of electronic device 500. For example, sensor assembly 514 may detect the on / off state of electronic device 500, the relative positioning of components such as the display and keypad of electronic device 500, changes in position of electronic device 500 or one of its components, the presence or absence of user contact with electronic device 500, orientation or acceleration / deceleration of electronic device 500, and temperature changes of electronic device 500. Sensor assembly 514 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 514 may also include an optical sensor, such as a complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, sensor assembly 514 may also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetometer, a pressure sensor, and a temperature sensor.

[0173] Communication component 516 is configured to facilitate wired or wireless communication between electronic device 500 and other devices. Electronic device 500 can access wireless networks based on communication standards, such as Wi-Fi, 4G, 5G, or combinations thereof. In one exemplary embodiment, communication component 516 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 516 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wide Band (UWB), Bluetooth (BT), and other technologies.

[0174] In an exemplary embodiment, the electronic device 500 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0175] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 504 including executable instructions or a computer program, which can be executed by a processor 520 of an electronic device 500 to perform methods corresponding to specific functions in the electronic device 500. For example, executing the audio output control method for the first and second speakers described above. The non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, or optical data storage device, etc.

[0176] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0177] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, comprising: include: Motherboard; An expansion structure is mounted on the motherboard and forms a first cavity with the motherboard to expand the functionality of the motherboard; wherein, the expansion structure is provided with at least one first vent hole; A first speaker is fixedly installed on the side of the expansion structure opposite to the motherboard and covers the at least one first vent hole; The rear cavity of the first loudspeaker is connected to the first cavity through at least one first vent hole, and together they form the rear acoustic cavity structure of the first loudspeaker.

2. The electronic device of claim 1, wherein, The electronic device also includes: A sealing ring is disposed between the first speaker and the expansion structure, and surrounds the at least one first vent hole, for sealing the mounting gap between the first speaker and the expansion structure; The sealing space formed by the sealing ring is connected to the rear cavity of the first speaker and is also connected to the first cavity through the first vent hole.

3. The electronic device of claim 2, wherein, The sealing ring is made of sealing foam.

4. The electronic device of claim 2, wherein, The sealing ring is disposed at the outer edge of the surface of the first speaker facing the extended structure.

5. The electronic device of claim 1, wherein, The extended structure includes a shield and / or a stack of plates.

6. The electronic device of claim 5, wherein, The stacked plate is welded to the main board and together with the main board form a second cavity. At least one second vent hole is provided on the stacked plate. The shielding cover is welded to the stacked plate, and a third cavity is formed between the shielding cover and the stacked plate; the first vent hole is provided in the shielding cover. The second cavity, the at least one second vent hole, and the third cavity together form the first cavity.

7. The electronic device of claim 5, wherein, The stacked plates include cavity composite plates or sandwich plates.

8. The electronic device of any one of claims 1 to 7, wherein, The electronic device also includes: The motherboard and the expansion structure are located within the space of the rear housing; A first decorative element is disposed in the area near the top of the rear shell, including a first mounting area and a second mounting area; The camera assembly is disposed in the first mounting area; A second decorative element is disposed in the second installation area; The first speaker is disposed between the second decorative element and the extended structure; The second decorative element is provided with at least one first sound outlet hole, and the first speaker outputs sound to the outside through the front sound cavity structure and the at least one first sound outlet hole.

9. The electronic device of claim 8, wherein, A sound outlet channel is formed between the first speaker and the second decorative piece, and the sound outlet channel is connected to the first sound outlet hole; The front cavity of the first loudspeaker is connected to the sound outlet channel, and together with the sound outlet channel, they form the front sound cavity structure.

10. The electronic device of claim 8, wherein, The first mounting area and the second mounting area are located on opposite sides of the first decorative element.

11. The electronic device of claim 8, wherein, The first sound outlet includes multiple holes, which are distributed in the edge area of ​​the second decorative element.

12. The electronic device of claim 8, wherein, The electronic device also includes: A mid-frame is mounted on the rear shell; the first speaker, the expansion structure, and the motherboard are stacked between the rear shell and the mid-frame; a second sound outlet is provided at the top and / or bottom of the mid-frame; At least one second speaker is disposed at the top and / or bottom of the middle frame and outputs sound outward through the second sound outlet.

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