A piezoelectric speaker chip, speaker component and headphones
By designing a piezoelectric speaker chip, using surface mount technology (SMT) packaging and a reasonable pin layout, the problem of the large thickness of traditional balanced armature sound units has been solved, resulting in a small-sized and highly consistent speaker chip suitable for various headphones and AR/VR devices.
Patent Information
- Application Number
- CN202522637818.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-12
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-12-12
AI Technical Summary
Traditional balanced armature drivers have a complex structure and many components, resulting in a relatively thick build, which makes it difficult to meet the needs of wired headphones, TWS earphones, and AR/VR glasses.
It adopts a piezoelectric speaker chip, including a PCB base and a cap, and uses surface mount technology (SMT) packaging. The design is simple, with small size and high consistency. The pin layout is reasonable, which facilitates channel design and system integration.
A small, highly consistent speaker chip has been developed, suitable for wired headphones, TWS earphones, and AR/VR glasses, improving integration and design flexibility.
Smart Images

Figure CN224947705U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a piezoelectric speaker chip, a speaker component, and headphones. Background Technology
[0002] Traditional balanced armature drivers have a complex internal structure and use many components in the vibration transmission process, resulting in a relatively thick overall thickness. Therefore, it is necessary to provide a piezoelectric speaker chip that can replace traditional balanced armature drivers and meet the requirements of wired headphones, TWS headphones, and AR / VR glasses. Summary of the Invention
[0003] The main purpose of this invention is to provide a piezoelectric speaker chip that can replace traditional balanced armature drivers and meet the needs of wired headphones, TWS headphones, and AR / VR glasses.
[0004] To achieve the above objectives, the present invention proposes a piezoelectric speaker chip including a PCB base and a cap body disposed on the PCB base, wherein a sound-emitting hole is provided at the center of the PCB base.
[0005] In one embodiment, the PCB base is provided with a first pin and a second pin.
[0006] In one embodiment, the first pin is the positive terminal of the driving voltage.
[0007] In one embodiment, the second pin is either the negative terminal of the drive voltage or the ground terminal.
[0008] In one embodiment, the PCB base is annular.
[0009] In one embodiment, the first pin and the second pin are located on a straight line with the same diameter of the PCB base.
[0010] In one embodiment, the diameter of the sound-emitting hole is 2.5mm-2.7mm.
[0011] In addition, the present invention also provides a speaker component, which includes at least one piezoelectric speaker chip as described above.
[0012] In addition, this utility model also provides an earphone, which includes at least one speaker component as described above.
[0013] In this invention, the piezoelectric speaker chip includes a PCB base and a cap disposed on the PCB base, with a sound-emitting hole formed at the center of the PCB base. The piezoelectric speaker chip provided in this application uses surface-mount (SMT) packaging, which facilitates channel design and system integration, and offers advantages such as small size and high consistency. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the structure of the piezoelectric speaker chip according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the PCB base structure according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the structure of the cap body according to an embodiment of the present utility model.
[0016] The following are the reference numerals: 10, PCB base; 11, sound hole; 12, first pin; 13, second pin; 20, cap.
[0017] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0020] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0021] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0022] This invention provides a piezoelectric speaker chip.
[0023] like Figures 1-3 As shown, the piezoelectric speaker chip provided in this embodiment of the present invention includes a PCB base 10 and a cap 20 disposed on the PCB base 10, and a sound-emitting hole 11 is provided at the axis of the PCB base 10.
[0024] The piezoelectric speaker chip provided in this application adopts surface mount technology (SMT) packaging, which facilitates channel design and system integration, and has the advantages of small size and high consistency.
[0025] Please refer to the following: Figure 2 The PCB base 10 is provided with a first pin 12 and a second pin 13. The first pin 12 is the positive terminal of the driving voltage, and the second pin 13 is the negative terminal of the driving voltage or the ground terminal.
[0026] Optionally, the PCB base 10 is annular, and the first pin 12 and the second pin 13 are located on the same straight line with the same diameter of the PCB base 10, which facilitates wiring. Of course, in other embodiments, the shape of the PCB base 10 and the positions of the first pin 12 and the second pin 13 can be adjusted, which will not be described in detail here.
[0027] In this application, the diameter of the sound-emitting hole 11 is 2.5mm-2.7mm, the height of the cap 20 is 2.4mm, the height of the PCB base 10 is 0.2mm, and the diameter is 5.3mm. The piezoelectric speaker chip provided in this application has the advantages of small size and high consistency.
[0028] Furthermore, this invention also provides a speaker component, which includes at least one piezoelectric speaker chip as described above. Additionally, this invention provides an earphone, which includes at least one speaker component as described above.
[0029] Since the speaker component and the headphones both adopt all the technical solutions of all the above embodiments, they have at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.
[0030] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present utility model.
Claims
1. A piezoelectric speaker chip, characterized by, The piezoelectric speaker chip includes a PCB base (10) and a cap (20) disposed on the PCB base (10). A sound-emitting hole (11) is provided at the center of the PCB base (10).
2. The piezoelectric speaker chip according to claim 1, characterized in that, The PCB base (10) is provided with a first pin (12) and a second pin (13).
3. The piezoelectric speaker chip according to claim 2, characterized in that, The first pin (12) is the positive terminal of the driving voltage.
4. The piezoelectric speaker chip according to claim 2, wherein, The second pin (13) is the negative terminal of the driving voltage or the ground terminal.
5. The piezoelectric speaker chip according to claim 2, wherein, The PCB base (10) is circular.
6. The piezoelectric speaker chip according to claim 5, characterized in that, The first pin (12) and the second pin (13) are located on the same straight line with the same diameter of the PCB base (10).
7. The piezoelectric speaker chip of claim 1, wherein, The diameter of the sound-emitting hole (11) is 2.5mm-2.7mm.
8. A loudspeaker component, characterized by The speaker component includes at least one piezoelectric speaker chip as described in any one of claims 1-7.
9. An earphone, characterized by The headphones include at least one speaker component as described in claim 8.
