A heating structure and a heating device capable of leading out electric charges or electric leakage

Abstract

This utility model relates to the technical field of electric heating devices, specifically a heating structure and device capable of discharging or removing electrical charge or leakage current. It includes a substrate, a heating layer, and a protective layer. Both the heating layer and the protective layer have a planar structure. When the heating layer and the protective layer are located on the same independent surface of the substrate, an insulating layer is provided between them, forming a stacked structure. Alternatively, when the heating layer and the protective layer are located on different independent surfaces of the substrate, a layered structure is formed between them. This utility model uses a planar protective layer to allow the leakage current generated on the substrate surface after the heating layer is energized to be discharged or conducted away by connecting to an external electrical control device. This simplifies the substrate surface structure and allows for stacked or layered structures to be used according to different application scenarios or product needs, improving the adaptability and safety of electric heating products and facilitating user operation.

Description

Technical Field

[0001] This utility model relates to the field of electric heating device technology, specifically a heating structure and heating device that can discharge charge or leakage current. Background Technology

[0002] In daily life, electric stoves, tea stoves, heat-insulating mats, grill pans, health pots, formula makers, rice cookers, electric cooking pots, electric stew pots, electric medicine pots, electric kettles, etc. are all common electric heating appliances with various functions and uses. Electric heating devices are usually used when heating. There are also many electric heating devices on the market. Common electric heating devices generally have a heating source for heating (such as a kettle heating base) and a heated object for heating (such as a kettle containing water). They are also very convenient for instant heating.

[0003] However, in actual use, the heating source usually directly contacts the heated object to conduct heat and achieve the heating effect. Some existing electric heating appliances use microcrystalline glass as the base material and set the heating source in microcrystalline glass. At room temperature, microcrystalline glass can act as an insulator, but at high temperature, the voltage resistance of microcrystalline glass will decrease and the conductivity will decrease. When microcrystalline glass is heated to a certain temperature, static electricity and other charges may be generated and accumulated on its surface. After it changes from an insulator to a conductor or semiconductor, there is a risk of leakage. If leakage is transferred to the heated object through microcrystalline glass, there will be certain electrical and thermal safety hazards if the product is used.

[0004] The prior patent application with application number 202521968330X discloses a heating structure that can export surface charge. Specifically, it uses a linear conductive protective layer to export the surface charge of the substrate to the outside. However, the laying and coverage of this linear lead-out structure has certain limitations, and the conductive protective layer shown is not directly connected to the conductive heating layer. The surface leakage generated within the range of the conductive heating layer may still pose certain electrothermal safety hazards if it is conducted to the conductive protective layer by the substrate material. Utility Model Content

[0005] Regarding the aforementioned problems with existing electric heating appliances, such as the potential accumulation of surface charges or weakened insulation of the substrate at high temperatures leading to current leakage and safety hazards, the technical solution adopted by this utility model is as follows: A heating structure capable of discharging charge or leakage current includes a substrate, a heating layer, and a protective layer for connecting external electrical control equipment. Both the heating layer and the protective layer have a planar structure. When the heating layer and the protective layer are located on the same independent surface of the substrate, an insulating layer for insulation and isolation is provided between the heating layer and the protective layer to form an upper and lower stacked structure. Alternatively, when the heating layer and the protective layer are located on different independent surfaces of the substrate, an upper and lower layered structure for leakage current conduction is formed between the heating layer and the protective layer.

[0006] As described above, in a heating structure capable of discharging charge or leakage current, the independent surfaces of the substrate include a first surface a and a second surface b, with the first surface a and the second surface b located at the top and bottom of the substrate, respectively. When the heating layer and the protective layer are located on the first surface a and the second surface b, respectively, the protective layer extends a protective wire toward the heating layer, and there is a gap between the protective wire and the heating layer.

[0007] As described above, in a heating structure capable of discharging charge or leakage current, the protective wire includes a wire pin extending toward the heating layer, and the gap includes a first gap located between the protruding end of the wire pin and the heating layer.

[0008] As described above, in a heating structure capable of discharging charge or leakage current, the protective wire includes a spiral wire structure that surrounds the heating layer and is not connected end to end. The gap includes a second gap located between the starting end of the spiral wire structure and the heating layer. The extended end of the spiral wire structure surrounds the heating layer and passes through the second gap.

[0009] As described above, in a heating structure capable of discharging charge or leakage current, the extended end of the spiral wire structure surrounds the heating layer and passes through the first gap and the second gap in sequence. The extended end of the spiral wire structure, the extended end of the wire pin, and the heating layer are all located on the same independent surface of the substrate.

[0010] In the heating structure described above that can discharge charge or lead out leakage current, the distance between the spiral wire structure and the heating layer is not less than 2 mm, or the distance between the wire pin and the heating layer is not less than 2 mm.

[0011] In the heating structure described above, which can discharge charge or leakage current, when the heating layer and the protective layer are located on the same independent surface of the substrate, the heating layer is located between the protective layer and the substrate.

[0012] In the heating structure described above, which can discharge charge or lead out leakage current, the orthogonal projection range of the heating layer on the substrate is located within the orthogonal projection range of the protective layer on the substrate; The orthographic projection range of the heating layer on the substrate is within the orthographic projection range of the insulating layer on the substrate.

[0013] As described above, in a heating structure capable of discharging charge or leakage current, the protective layer is connected to an external electrical control device to form a protective circuit k, wherein the protective circuit k is connected in series with a resistor and / or a capacitor, or the protective circuit k is connected in parallel with a bidirectional ESD transistor.

[0014] A heating device includes a heating structure as described above that can discharge charge or lead out leakage current.

[0015] The beneficial effects of this utility model are as follows: This invention employs a planar protective layer to conduct away leakage current caused by the heating layer heating up the substrate surface through an external electrical control device. This allows the leakage current to be conducted away regardless of whether the protective layer and the heating layer are on the same independent surface. This simplifies the substrate surface structure and allows for the use of stacked or layered structures to meet different application scenarios or product needs. This improves the adaptability and safety of electric heating products and makes them more convenient for users. Attached Figure Description

[0016] Figure 1 This is a perspective view of a heating structure of the present invention that can discharge charge or lead out leakage current.

[0017] Figure 2 This is an internal cross-sectional view of a heating structure of the present invention that can discharge charge or lead out leakage current.

[0018] Figure 3 for Figure 2 A magnified view of A.

[0019] Figure 4 This is a circuit connection diagram of a heating structure according to the present invention.

[0020] Figure 5 This is an exploded perspective view of a heating structure according to the present invention.

[0021] Figure 6 This is another exploded perspective view of a heating structure according to the present invention.

[0022] Figure 7 This is a schematic diagram of the leakage current extraction principle of this utility model. Figure 1 .

[0023] Figure 8This is a schematic diagram of the leakage current extraction principle of this utility model. Figure 2 . Detailed Implementation

[0024] The embodiments of the technical solution of this application will be described in detail below with reference to the accompanying drawings. The described embodiments are only some embodiments of the technical solution of this application, and not all embodiments. Based on the embodiments of the technical solution of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the technical solution of this application.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the technical solution of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0026] Furthermore, the descriptions involving "first," "second," etc., in the technical solutions of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0027] Example 1 Figures 1 to 8 This embodiment provides a heating structure capable of discharging charge or leakage current, including a substrate 1, a heating layer 2, and a protective layer 3 for connecting external electrical control equipment. Both the heating layer 2 and the protective layer 3 have a planar structure. When the heating layer 2 and the protective layer 3 are located on the same independent surface of the substrate 1, an insulating layer 4 for insulation and isolation is provided between the heating layer 2 and the protective layer 3 to form an upper and lower stacked structure. Alternatively, when the heating layer 2 and the protective layer 3 are located on different independent surfaces of the substrate 1, an upper and lower layered structure for leakage current discharging is formed between the heating layer 2 and the protective layer 3.

[0028] Specifically, in this embodiment, the substrate 1 is used to support and contact the heated object in the heating structure. The substrate 1 can be made of a hard and brittle material, preferably microcrystalline glass, which has good structural stability and is not easily deformed or bent, allowing the user to stably place the heated object for subsequent heating. The independent surfaces of the substrate 1 include a first surface a and a second surface b, which are located at the top and bottom of the substrate 1, respectively. In this embodiment, the first surface a can be a supporting surface located near the top of the substrate 1 for supporting and contacting the heated object, and the second surface b can be the bottom back surface located near the bottom of the substrate 1. Both the heating layer 2 and the protective layer 3 adopt a planar structure, which can be a plane or a curved surface. The heating material of the heating layer 2 preferably uses nano-semiconductor metal oxides, graphene, carbon-based electronic pastes, nano-metal oxides, etc., as conductive heating materials. The electrode materials preferably include silver paste, copper paste, conductive coatings, electronic pastes, etc. The protective layer material includes silver... Materials used include copper, iron, nano-metal oxides, electronic conductive pastes, graphene, electronic pastes, conductive coatings, etc. Among them, nano-metal oxides and nano-semiconductor metal oxides can be made of one or more materials such as tin, antimony, nickel, ammonium, zinc, titanium, and indium as nanoparticles. During fabrication, nano-metal oxides and nano-semiconductor metal oxides can be attached to the surface of substrate 1 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc. The thickness of the heating layer 2 is less than 1 mm. The electrode 21 of the heating layer 2 is connected to an external power source to form a first power-conducting circuit. The figure shows the heating circuit j. After being energized, the heating layer 2 can generate heat and conduct or radiate the heat through the substrate 1 to the heated object, thereby raising the temperature of the heated object. In addition, the conductive material of the protective layer 3 can be attached to the surface of the substrate by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc.

[0029] like Figure 6 As shown, when the heating layer 2 and the protective layer 3 are located on the same independent surface (surface a or surface b) of the substrate 1, an insulating layer 4 for insulation and isolation is provided between the heating layer 2 and the protective layer 3 to form an upper and lower stacked structure. The protective layer 3 is located between the heating layer 2 and the substrate 1. After the heating layer 2 causes leakage on the surface of the substrate 1, the leakage is discharged through the surface layer 3 to the external electrical control device h. like Figure 5 As shown, when the heating layer 2 and the protective layer 3 are located on different independent surfaces of the substrate 1, that is, when the heating layer 2 and the protective layer 3 are located on the first surface a and the second surface b respectively, the heating layer 2 and the protective layer 3 form an upper and lower layered structure. After the heating layer 2 located on one independent surface causes leakage on the surface of the substrate 1, the leakage is guided to the external electrical control equipment through the protective layer 3 located on the other independent surface. In this embodiment, a planar protective layer 3 is used to conduct away leakage current caused by the heating layer 2 on the surface of the substrate 1 after it is powered on and heated. This is done by connecting to an external electrical control device. This allows the leakage current to be conducted away regardless of whether the protective layer 3 is on the same independent surface as the heating layer 2. No additional electrical connection wires or accessories are required to connect to the heating layer. This simplifies the surface structure of the substrate 1 and allows for the use of stacked or layered structures according to different usage scenarios or product needs. This improves the adaptability and safety of electric heating products and makes them more convenient for users.

[0030] Furthermore, in some embodiments, when the heating layer 2 and the protective layer 3 are located on the first surface a and the second surface b respectively, the protective layer 3 can extend toward the heating layer 2 to provide a protective wire 31 for easy leakage current outflow. The protective wire 31 extends from the protective layer 3 along the outer edge of the substrate 1 between the first surface a and the second surface b. There is a gap 32 between the protective wire 31 and the heating layer 2. The protective wire 31 serves as a power-off protection measure in the event of damage and breakage when the substrate 1 is made of a hard and brittle material.

[0031] Furthermore, in some embodiments, the protective wire 31 includes a wire pin 311 extending toward the heating layer 2, and the gap 32 includes a first gap 321 located between the protruding end of the wire pin 311 and the heating layer 2. The protruding end of the wire pin 311 can serve as the first endpoint for the protective layer 3 to connect to the external electrical control device h.

[0032] Furthermore, in some embodiments, the protective wire 31 includes a spiral wire structure 312 that surrounds the heating layer 2 and is not connected end to end. The gap 32 includes a second gap 322 located between the starting end of the spiral wire structure 312 and the heating layer 2. The extended end of the spiral wire structure 312 surrounds the heating layer 2 and passes through the second gap 322. The extended end of the spiral wire structure 312 can serve as the second endpoint for connecting the protective layer 3 to the external electrical control device h. Through the surrounding ring formed by the heating layer 2, it can serve as an explosion-proof wire that cuts off power and stops heating when the substrate 1 explodes and breaks. Specifically, the protective layer 3 is electrically connected to the external electrical control device h used to trigger power-off protection to form a second power-on circuit, also known as the protective circuit k. The electrical control device h controls the on / off of the heating circuit j. When the substrate 1 is damaged, the protective layer 3 is disconnected, causing the protective circuit k to disconnect, thereby triggering the external electrical control device h to disconnect the heating circuit j, so that the heating layer 2 stops heating, thus achieving the function of cutting off power and stopping heating.

[0033] Furthermore, in some embodiments, such as Figure 4 As shown, a resistor 5r and / or a capacitor 5c can be connected in series in the protection circuit k to protect the device or structure from leakage damage.

[0034] Furthermore, in some embodiments, such as Figure 7As shown, a bidirectional ESD transistor can be connected in parallel on the protection circuit k to protect the device or structure from leakage damage.

[0035] Furthermore, in some embodiments, such as Figure 8 As shown, the protruding end of the wire pin 311 serves as the first endpoint connected to the protection circuit k, and the protruding end of the spiral wire structure 312 serves as the second endpoint connected to the protection circuit k. The first endpoint and the second endpoint are grounded via a resistor and a capacitor, respectively.

[0036] Furthermore, in some embodiments, the extended end of the spiral wire structure 312 surrounds the heating layer 2 and then passes through the first gap 321 and the second gap 322 in sequence. The extended end of the spiral wire structure 312, the extended end of the wire pin 311, and the heating layer 2 are all located on the same independent surface of the substrate 1. By adopting a surrounding ring structure around the heating layer 2, the spiral wire structure 312 can form a protective ring structure without obvious gaps to the outside. There are no longer straight or nearly straight through gaps between the outer edge of the substrate 1 and the outer edge of the heating layer 2. This avoids the situation where the path of damage or breakage avoids the protective layer 3 when the substrate 1 is damaged or broken, thus preventing the power-off protection from being triggered. This effectively avoids the problem of the breakage path avoiding the protective layer 3 and ensures that when the substrate 1 is damaged or broken, the protective layer 3 can be disconnected to trigger the protection circuit k to disconnect and achieve power-off protection.

[0037] Furthermore, in some embodiments, the spacing between the spiral wire structure 312 and the heating layer 2 is not less than 2mm, or the spacing between the wire pin 311 and the heating layer 2 is not less than 2mm. This ensures sufficient electrical breakdown strength and prevents the insulating material (such as the substrate 1) around the heating layer 2 from becoming electrically charged under different usage conditions, which could lead to a short circuit between the neutral or live wire and the protective layer 3, causing the fuse to burn out or the appliance to trip. According to the embodiments of this utility model, the creepage distance between the protective layer 3 and the heating layer 2 is greater than 2mm, which can meet the requirements for insulation performance of the heating structure under working voltages above 110V. The specific value of the creepage distance between the protective layer 3 and the heating layer 2 is not particularly limited, as long as the heating structure can be guaranteed to have high safety. Those skilled in the art can design according to the specific application environment of the specific product.

[0038] Example 2 Figure 6This embodiment provides a heating structure that can discharge charge or leakage current. When the heating layer 2 and the protective layer 3 are located on the same independent surface of the substrate 1, an insulating layer 4 for insulation and isolation is provided between the heating layer 2 and the protective layer 3 to form an upper and lower stacked structure. The protective layer 3 is located between the heating layer 2 and the substrate 1. After the heating layer 2 causes leakage current to appear on the surface of the substrate 1, the leakage current is discharged through the surface layer 3 to the external electrical control device h.

[0039] Furthermore, in some embodiments, the orthographic projection range of the heating layer 2 on the substrate 1 is located within the orthographic projection range of the protective layer 3 on the substrate 1, and the heating layer 2 is located within the orthographic projection laying range of the protective layer 3, so that the protective layer 3 can completely cover the orthographic projection laying range of the heating layer 2, avoiding any blind spots.

[0040] Furthermore, in some embodiments, the orthographic projection range of the heating layer 2 on the substrate 1 is located within the orthographic projection range of the insulating layer 4 on the substrate 1, and the heating layer 2 is located within the orthographic projection laying range of the insulating layer 4, so that the insulating layer 4 can completely cover the orthographic projection laying range of the heating layer 2, avoiding any blind spots.

[0041] Furthermore, in some embodiments, a heating structure capable of discharging charge or leakage current is applied to the heating device. Preferably, the protective layer 3 is located on the side of the heating device where the heated object is placed, so as to shorten the distance between the protective layer 3 and the location where leakage current occurs, reduce the occurrence of leakage current hazards, and improve the safety of the product.

[0042] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A heating structure capable of discharging charge or leakage current, characterized in that: It includes a substrate (1), a heating layer (2), and a protective layer (3) for connecting external electrical control equipment. Both the heating layer (2) and the protective layer (3) adopt a planar structure. When the heating layer (2) and the protective layer (3) are located on the same independent surface of the substrate (1), an insulating layer (4) for insulation and isolation is provided between the heating layer (2) and the protective layer (3) to form an upper and lower stacked structure. Or when the heating layer (2) and the protective layer (3) are located on different independent surfaces of the substrate (1), an upper and lower layered structure for leakage current is formed between the heating layer (2) and the protective layer (3).

2. The heating structure capable of discharging charge or leakage current as described in claim 1, characterized in that: The independent surfaces of the substrate (1) include a first surface a and a second surface b, the first surface a and the second surface b being located at the top and bottom positions of the substrate (1), respectively. When the heating layer (2) and the protective layer (3) are located on the first surface a and the second surface b, respectively, the protective layer (3) extends a protective wire (31) toward the heating layer (2), and there is a gap (32) between the protective wire (31) and the heating layer (2).

3. The heating structure capable of discharging charge or leakage current as described in claim 2, characterized in that: The protective wire (31) includes a wire pin (311) extending toward the heating layer (2), and the gap (32) includes a first gap (321) located between the protruding end of the wire pin (311) and the heating layer (2).

4. The heating structure capable of discharging charge or leakage current as described in claim 3, characterized in that: The protective wire (31) includes a spiral wire structure (312) that surrounds the heating layer (2) and is not connected end to end. The gap (32) includes a second gap (322) located between the starting end of the spiral wire structure (312) and the heating layer (2). The extended end of the spiral wire structure (312) surrounds the heating layer (2) and passes through the second gap (322).

5. A heating structure capable of discharging charge or leakage current as described in claim 4, characterized in that: The extended end of the spiral wire structure (312) surrounds the heating layer (2) and passes through the first gap (321) and the second gap (322) in sequence. The extended end of the spiral wire structure (312), the extended end of the wire pin (311), and the heating layer (2) are all located on the same independent surface of the substrate (1).

6. A heating structure capable of discharging charge or leakage current as described in claim 5, characterized in that: The distance between the spiral wire structure (312) and the heating layer (2) is not less than 2 mm, or the distance between the wire pin (311) and the heating layer (2) is not less than 2 mm.

7. A heating structure capable of discharging charge or leakage current as described in any one of claims 1-6, characterized in that: When the heating layer (2) and the protective layer (3) are located on the same independent surface of the substrate (1), the protective layer (3) is located between the heating layer (2) and the substrate (1).

8. A heating structure capable of discharging charge or leakage current as described in claim 7, characterized in that: The orthographic projection range of the heating layer (2) on the substrate (1) is within the orthographic projection range of the protective layer (3) on the substrate (1); The orthographic projection range of the heating layer (2) on the substrate (1) is within the orthographic projection range of the insulating layer (4) on the substrate (1).

9. A heating structure capable of discharging charge or leakage current as described in claim 7, characterized in that: The protective layer (3) is connected to an external electrical control device to form a protective circuit k, wherein the protective circuit k is connected in series with a resistor (5r) and / or a capacitor (5c), or the protective circuit k is connected in parallel with a bidirectional ESD transistor.

10. A heating device, characterized in that: Including a heating structure capable of discharging charge or leakage current as described in any one of claims 1-9.

Images