LED beads and LED strips

Abstract

This application provides an LED lamp bead and an LED light strip. The LED lamp bead includes an insulating base, a driver chip, and a circuit protection module. The insulating base has multiple conductive pins embedded therein, and a reflector is formed within the recessed part of the insulating base. The conductive pins form a die-bonding portion within the reflector. Each conductive pin includes a power supply pin, a signal input pin, and a signal output pin. The driver chip is disposed on and electrically connected to the die-bonding portion. The driver chip includes a power interface, a signal input interface, and a signal output interface. The power interface is electrically connected to the power supply pin, the signal input interface is electrically connected to the signal input pin and connected to the signal output pin of another LED lamp bead through the signal input pin, and the signal output interface is electrically connected to the signal output pin and connected to the signal input pin of another LED lamp bead through the signal output pin. The circuit protection module is disposed on the die-bonding portion and electrically connected to at least one of the power interface, the signal input interface, and the signal output interface.

Description

Technical Field

[0001] This application relates to the field of LED technology, and more particularly to an LED lamp bead and an LED light strip. Background Technology

[0002] In applications such as building contour wall washer LED light strips, seamless light strips spanning hundreds of meters often need to be extended to the end with the support of a single power supply. Any cutting or rewiring would damage the integrity of the building facade, placing higher demands on the cascade length of the light strips. However, in LED light strip manufacturing, due to the shrinking of LED chip package sizes to the millimeter level, traditional SMT assembly still heavily relies on manual visual inspection and manual tray placement. For hundreds-meter-long cascaded light strips, thousands of LED chips must be continuously mounted. If the polarity of a single device is reversed, the reverse current will instantly impact the entire circuit, causing the entire row of chips to fail. Subsequent repairs require desoldering on micro-pads, which limits the operating space, resulting in extremely low rework yields, and often rendering the entire light strip unusable. The small size and high-density integration amplify the probability of human error, becoming a key bottleneck restricting the reliability of ultra-long light strips and improving manufacturing yield. How to improve the electronic circuit system of LED chips to meet the market's higher requirements for the cascade length, reliability, and other technical indicators of LED light strips has become an urgent technical problem to be solved. Utility Model Content

[0003] This application provides an LED lamp bead and an LED light strip. The LED lamp bead has the characteristics of reliable control and good luminous efficiency, while the LED light strip has the characteristics of high manufacturing yield and good reliability.

[0004] In a first aspect, this application provides an LED light bead, the LED light bead comprising: An insulating base, on which multiple conductive pins are fitted, and a reflector cup is formed in the recess of the insulating base. The multiple conductive pins form a die-bonding part in the reflector cup. The conductive pins include a power supply pin, a ground pin, a signal input pin, and a signal output pin. A driver chip is disposed on the die-bonding part and electrically connected to the die-bonding part. The driver chip includes a power interface, a signal input interface, and a signal output interface. The signal input interface is electrically connected to the signal input pin and is connected to the signal output pin of another LED through the signal input pin. The signal output interface is electrically connected to the signal output pin and is connected to the signal input pin of another LED through the signal output pin. A circuit protection module is disposed on the die bond unit and electrically connected to at least one of the power interface, the signal input interface, and the signal output interface.

[0005] Secondly, this application provides an LED light strip, which includes LED beads according to any embodiment of this application.

[0006] The LED chips and LED strips of this application, on the one hand, effectively avoid the problem of voltage fluctuations that can easily cause burnout of LED driver chips in long-cascaded, high-drive-voltage, and long-term-use LED strips, due to the circuit protection module between the power supply pins and the power interface. On the other hand, the circuit protection module between the signal interfaces alleviates the process yield problem of one LED chip being reversed and multiple LED chips failing in the long-cascaded LED strip process. After the aforementioned voltage increase, it can protect the driver chips of a large number of LED chips, improving the overall reliability and safety of the LED strip. Furthermore, since the circuit protection module is located on the die bond section rather than in the circuit, it can reduce the number of component bonding operations and the types of materials and equipment required for the process in the LED strip manufacturing, greatly reducing process and material costs.

[0007] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0008] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a schematic diagram of the structure of an LED lamp bead provided in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of an LED lamp bead provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of an LED lamp bead provided in one embodiment of this application; Figure 4 This is a schematic diagram of the structure of an LED lamp bead with a rated voltage of 12V provided in one embodiment of this application; Figure 5 yes Figure 4 A schematic diagram of a driver chip with the structure shown. Figure 6 This is a schematic diagram of the structure of an LED lamp bead provided in one embodiment of this application; Figure 7 This is a schematic diagram of the structure of an LED lamp bead with a rated voltage of 24V provided in one embodiment of this application; Figure 8 yes Figure 7A schematic diagram of a driver chip with the structure shown. Figure 9 This is a schematic diagram of the structure of an LED lamp bead provided in one embodiment of this application; Figure 10 This is a schematic diagram of the structure of an LED lamp bead provided in one embodiment of this application.

[0010] Figure label: VDD, power supply pin; DOUT, signal output pin; DIN, signal input pin; GND, ground pin.

[0011] 100. LED lamp beads; 10. Insulating base; 11. First reflector; 12. Second reflector; 20. Conductive pin; 21. Die-bonding section; 30. Driver chip; 31. First control interface; 32. Second control interface; 33. Third control interface; 34. Fourth control interface; 35. Power interface; 36. Ground interface; 37. Signal input interface; 38. Signal output interface; 41. First light-emitting module; 411. First light-emitting chip; 42. Second light-emitting module; 421. Second light-emitting chip; 43. Third light-emitting module; 431. Third light-emitting chip; 44. Fourth light-emitting module; 441. Fourth light-emitting chip; 45. Integrated light-emitting chip; 50. Circuit protection module; 51. Chip protection device; 52. Line protection device; 53. Power supply protection device; 54. ESD device.

[0012] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Detailed Implementation

[0013] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0014] It should also be understood that the terminology used in this application specification is merely for describing specific realities within the scope of this application. It is important to understand that terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used solely for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0015] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0016] With the widespread application of LED light strips in residential, public, and industrial / commercial settings, users are paying increasing attention to indicators such as cascade length and energy consumption. However, for traditional 5V applications, the extremely limited voltage margin results in insufficient brightness and cascade length for LED light strips. For traditional 12V applications, the series circuitry between the light-emitting module and the driver chip necessitates increased driving current to enhance brightness, leading to higher power consumption, limited reliability, and unsuitability for energy-sensitive applications such as building decoration.

[0017] To resolve the above issues, please refer to [link / reference]. Figures 1 to 3This application provides an LED lamp bead 100, which may include an insulating base 10, conductive leads 20, and multiple light-emitting modules. Multiple conductive leads 20 can be fitted onto the insulating base 10, and a reflector cup is formed recessed within the insulating base 10. Die-bonding portions 21 are formed within the reflector cup of the multiple conductive leads 20. This configuration improves the mechanical strength and compactness of the LED lamp bead 100. Especially for small-sized LED lamp beads 100, the light-emitting modules can be fixedly mounted using the die-bonding portions 21 formed within the reflector cup of the conductive leads 20, and the reflector cup enhances the visual brightness of the LED lamp bead 100, improving the lighting effect. A driver chip 30 can also be mounted using the die-bonding portions 21, thereby effectively fixing the driver chip 30 in a specific position. Those skilled in the art will understand that the die-bonding portion 21 can be understood as a range on a conductive pin 20, which is the part of the conductive pin 20 that can be exposed by the reflector. The die-bonding portion 21 can be used to mount the driver chip 30, the light-emitting module, or both. This configuration facilitates surface mount installation in the manufacturing process. It should be understood that the integrated insulating base 10 and conductive pin 20 design not only reduces the overall size of the LED bead 100 but also simplifies the assembly process and reduces production costs. Due to the adoption of a more reasonable power supply method and structural design, the stability and reliability of the LED bead 100 are significantly improved, extending its service life.

[0018] In some embodiments, please refer to Figures 2 to 4 The LED bead 100 may include an insulating base 10, conductive leads 20, a driver chip 30, a first light-emitting module 41, a second light-emitting module 42, and a third light-emitting module 43. The first light-emitting module 41, the second light-emitting module 42, and the third light-emitting module 43 emit different colors.

[0019] In some embodiments, the driver chip 30 may be disposed on the die-bonding portion 21 and electrically connected to the die-bonding portion 21. It should be understood that the driver chip 30 may be directly soldered to the die-bonding portion 21, or it may be electrically connected to the die-bonding portion 21 via jumpers or other means; no specific limitation is made here. Electrical connection to the die-bonding portion 21 avoids problems such as the driver chip 30 jumpers being cut off or subjected to pressure by the physical structure between the reflectors when passing through multiple reflectors, thus preventing insufficient mechanical strength.

[0020] In some embodiments, the first light-emitting module 41, the second light-emitting module 42, and the third light-emitting module 43 emit different colors. Specifically, they may emit red, green, and blue light respectively, or they may emit three other different colors respectively; no specific limitation is made here.

[0021] In some embodiments, when the light-emitting module includes multiple light-emitting chips, these chips can be connected in series to increase the voltage and improve the light-emitting effect. When the light-emitting module includes multiple light-emitting chips, these series-connected chips can be die-bonded separately, or they can be integrated and packaged into at least one integrated light-emitting chip 45, which includes multiple series-connected light-emitting chips. By packaging multiple light-emitting chips into a smaller number of integrated light-emitting chips 45, it is beneficial to reduce subsequent assembly process steps, improve assembly precision and accuracy, and save related costs. For example, when the supply voltage is 9V, multiple light-emitting chips with rated voltages of 2V or 3V can be packaged into an integrated light-emitting chip 45 with a rated voltage of 8-9V, and then the integrated light-emitting chip 45 can be connected in parallel to the driver chip 30. Alternatively, multiple series-connected light-emitting chips can be directly disposed on the die-bonding section 21, and then these multiple series-connected light-emitting chips can be connected in parallel to the driver chip 30. For example, when the power supply voltage is 24V, two integrated light-emitting chips 45 with a rated voltage of 8-9V can be connected in series or integrated into a packaged integrated light-emitting chip 45 with a rated voltage of 18V, and then the integrated light-emitting chip 45 can be connected in parallel to the driver chip 30.

[0022] For example, a first light-emitting module 41 can be disposed on the die-bonding section 21 and electrically connected to the driver chip 30. The first light-emitting module 41 includes a plurality of first light-emitting chips 411, which are connected in series and emit the same color. Similarly, a second light-emitting module 42 can be disposed on the die-bonding section 21 and electrically connected to the driver chip 30. The second light-emitting module 42 includes a plurality of second light-emitting chips 421, which are connected in series and emit the same color. Furthermore, a third light-emitting module 43 can be disposed on the die-bonding section 21 and electrically connected to the driver chip 30. The third light-emitting module 43 includes a plurality of third light-emitting chips 431, which are connected in series and emit the same color.

[0023] It should be understood that a light-emitting module may include multiple light-emitting chips, or each may include a single light-emitting chip. The light-emitting chips in different light-emitting modules emit different colors. For example, the first light-emitting chip 411, the second light-emitting chip 421, and the third light-emitting chip 431 emit different colors.

[0024] In addition, the inventors also discovered that if the first light-emitting module 41, the second light-emitting module 42 and / or the third light-emitting module 43 are connected in series with the driver chip 30, the LED bead 100 will need to maintain a constant current regardless of whether it is on or off, resulting in high system power consumption.

[0025] In some embodiments, the first light-emitting module 41, the second light-emitting module 42, and / or the third light-emitting module 43 are connected in parallel with the driver chip 30. Those skilled in the art will understand that, since the electrical characteristics of the light-emitting chip of the LED bead 100 are similar to those of a diode, a shunt switch connected in parallel to the controlled chip can be used inside the driver chip 30 to achieve switching control of the light-emitting chip. This achieves the technical effect that the driver chip 30 appears to be connected in series with the light-emitting module, but is actually connected in parallel. This configuration saves production line adjustment costs associated with modification and redesign by changing the selection of the driver chip 30 rather than reconstructing the circuit topology, reduces process adaptation problems such as poor soldering and misalignment caused by modifying the circuit topology, and reduces production line yield fluctuations. Furthermore, since the pin correspondence is not modified, the reconstruction of the control algorithm in the driver chip 30 is avoided, preventing the design and debugging costs of firmware updates for the driver chip 30. Moreover, due to the significantly improved control and power supply of the light-emitting chip of the LED bead 100, it technically becomes possible to produce LED light strips with a length of up to 30 meters and excellent luminous effect.

[0026] In some embodiments, the conductive pin 20 may include a power supply pin, which may be electrically connected to the first light-emitting module 41, the second light-emitting module 42, the third light-emitting module 43, and the driver chip 30, respectively. Alternatively, the conductive pin 20 may include a ground pin, which may be electrically connected to the first light-emitting module 41, the second light-emitting module 42, the third light-emitting module 43, and the driver chip 30, respectively. This configuration allows the driver chip 30 and multiple light-emitting modules to be connected in parallel between the power supply pins and the ground pins, enabling the driver chip 30 and the light-emitting modules to share the same power supply voltage, reducing the number of power supply pins, improving luminous efficiency, and reducing voltage cascading losses in long LED strips.

[0027] In some embodiments, the driver chip 30 further includes a signal input interface 37 and a signal output interface 38. The conductive pin 20 also includes a signal input pin and a signal output pin. The signal input interface 37 is electrically connected to the signal input pin and is connected to the signal output pin of another LED bead 100 through the signal input pin. The signal output interface 38 is electrically connected to the signal output pin and is connected to the signal input pin of another LED bead 100 through the signal output pin. This configuration cleverly utilizes the robust power supply of the driver chip 30 to achieve a "relay-style" transmission of control signals between the series-connected LED beads, preventing the control signal from attenuating with the cascade length and ensuring a clear and stable control signal.

[0028] It should be understood that due to the characteristics of the aforementioned "relay-style" control signal transmission, the stable and reliable power supply of the driver chip 30 is particularly important. Therefore, the power supply voltage corresponding to the power supply pin can be determined based on the number of LED chips and the rated voltage of each LED chip, or vice versa. This ensures that the power supply voltage of the driver chip 30 is well guaranteed, ensuring clear and stable control signals and avoiding problems such as poor signal transmission, slow lighting at the tail of the light strip, or no lighting at all. Furthermore, it ensures that the power supply voltage of each light-emitting module stably matches its designed rated voltage, resulting in excellent overall light emission performance for the LED chips and light strip.

[0029] In some embodiments, the rated voltage of the driver chip 30 itself can be determined based on the supply voltage, or the supply voltage can be determined based on the rated voltage of the driver chip 30 and the rated voltage of the light-emitting module. This configuration ensures the stability and efficiency of the overall electronic circuit system of the LED bead 100.

[0030] In some embodiments, please refer to Figures 4 to 6 The first light-emitting chip 411 can be a red light-emitting chip. The second light-emitting chip 421 can be a green light-emitting chip. The third light-emitting chip 431 can be a blue light-emitting chip. The LED bead 100 may also include a fourth light-emitting module 44, which is disposed on the die-bonding part 21 and electrically connected to the driver chip 30. The fourth light-emitting module 44 includes a fourth light-emitting chip 441, which can be a white light-emitting chip or a yellow light-emitting chip. Specifically, the white light-emitting chip can be a composite white light-emitting chip based on blue LED technology and phosphor.

[0031] Typically, but not limitingly, the rated voltage of the red LED chip can be 1.9V, 2.0V, 2.1V, 2.2V, 2.3V, or any combination of two values. The rated voltage of the green LED chip can be 2.6V, 2.7V, 2.8V, 2.9V, 3.0V, 3.1V, 3.2V, or any combination of two values. The rated voltage of the blue LED chip can be 2.8V, 2.9V, 3.0V, 3.1V, 3.2V, or any combination of two values. The rated voltage of the driver chip 30 can be 2V, 3V, 4V, 5V, 6V, 7V, 8V, 9V, or any combination of two values.

[0032] Specifically, when the power supply voltage is 12V, a driver chip 30 with a rated voltage of 3V can be selected, and four red light-emitting chips with a rated voltage of 2V can be connected in series to form a first light-emitting module 41, three green light-emitting chips with a rated voltage of 3V can be connected in series to form a second light-emitting module 42, and three blue light-emitting chips with a rated voltage of 3V can be selected to form a third light-emitting module 43. Furthermore, three white or yellow light-emitting chips with a rated voltage of 3V can be selected to form a fourth light-emitting module 44. The first light-emitting module 41 can also be connected in series with a resistor for current limiting or voltage division. It should be understood that when multiple light-emitting chips are connected in series to form a light-emitting module, the light-emitting module can be multiple light-emitting chips that are separately die-bonded, or multiple light-emitting chips packaged as integrated light-emitting chips; no specific limitations are imposed here.

[0033] In some embodiments, when the supply voltage is 12V, four red LED chips with a rated voltage of 2V can be connected in series to form a first light-emitting module 41, three green LED chips with a rated voltage of 3V can be connected in series to form a second light-emitting module 42, and three blue LED chips with a rated voltage of 3V can be connected in series to form a third light-emitting module 43. Furthermore, three white or yellow LED chips with a rated voltage of 3V can be used to form a fourth light-emitting module 44. The first light-emitting module 41 can also be connected in series with a resistor for current limiting or voltage division. By connecting a resistor in series with the first light-emitting module 41, current limiting and voltage division can be achieved, ensuring stable and reliable voltage for each light-emitting module, while minimizing process complexity and material loss. Additionally, a driver chip 30 with a rated voltage of 3V can be used. It should be understood that when multiple LED chips are connected in series to form a light-emitting module, the light-emitting module can be multiple LED chips that are separately die-bonded, or multiple LED chips packaged as integrated light-emitting chips; no specific limitations are imposed here.

[0034] In some embodiments, please refer to Figures 7 to 9When the power supply voltage is 24V, four red LED chips with a rated voltage of 2V can be connected in series to form a first light-emitting module 41, three green LED chips with a rated voltage of 3V can be connected in series to form a second light-emitting module 42, and three blue LED chips with a rated voltage of 3V can be connected in series to form a third light-emitting module 43. Furthermore, three white or yellow LED chips with a rated voltage of 3V can be used to form a fourth light-emitting module 44. One first light-emitting module 41 can be connected in series and then in parallel to the driver chip 30; two first light-emitting modules 41 can be connected in series and then in parallel to the driver chip 30; two second light-emitting modules 42 can be connected in series and then in parallel to the driver chip 30; two third light-emitting modules 43 can be connected in series and then in parallel to the driver chip 30; and two fourth light-emitting modules 44 can be connected in series and then in parallel to the driver chip 30. This configuration reduces the number of die-bonding operations in the manufacturing process, improves process yield, and effectively increases the number of die-bonded sections 21 of the same area, which is beneficial for further miniaturization of the LED beads 100. It should be understood that multiple light-emitting modules or multiple integrated light-emitting chips can be further packaged to form a new integrated light-emitting chip, and no specific restrictions are imposed here.

[0035] In some embodiments, the reflector may include a first reflector 11 and a second reflector 12. The area of ​​the second reflector 12 may be smaller than that of the first reflector 11, and the fourth light-emitting module 44 may be disposed within the second reflector 12. Specifically, the insulating base 10, as the foundation of the entire LED bead 100, can be recessed from the top to form a first reflector 11 and a second reflector 12, which helps to concentrate and improve the light emission efficiency. The conductive pin 20 is integrally embedded with the insulating base 10, providing a connection point with external circuitry. The first light-emitting module 41, the second light-emitting module 42, and the third light-emitting module 43 are disposed within the first reflector 11 and connected to the die-bonding portion 21 of the conductive pin 20. They are electrically connected to the power supply pins to ensure luminous efficiency. The driver chip 30 may also be located within the first reflector 11 and connected to the die-bonding portion 21 of the conductive pin 20.

[0036] By setting red, green, and blue light-emitting modules in the first reflector 11, a combination of RGB three-color light can be achieved, providing a wide range of color choices. Placing the white light chip in the second reflector 12 allows for independent control of the brightness and stability of the white light, enhancing white light output and making it suitable for applications requiring high-brightness white light. Separating chips of different colors in different reflectors helps achieve a more uniform light distribution, reducing color and light spots. Distributing chips of different colors in different reflectors simplifies the design of the control circuit, allowing for individual control of each color chip and improving the overall efficiency of the system.

[0037] For example, a protective adhesive layer can be formed between the first reflector 11 and the second reflector 12 to prevent the molds corresponding to the first reflector 11 and the second reflector 12 from contacting the conductive foot 20 during processing. It should be understood that the protective adhesive layer effectively prevents physical contact between the mold and the conductive foot 20 during processing, reducing the risk of damage to the conductive foot 20 and improving the product yield. Reducing the possibility of damage to the conductive foot 20 helps improve the stability and reliability of the LED bead 100 and extends its service life. The presence of the protective adhesive layer simplifies the processing technology, avoids complex protective measures, and improves production efficiency. The protective adhesive layer also provides a certain degree of sealing, preventing external contaminants from entering the reflector and maintaining the optical performance of the LED bead 100. Specifically, the material of the protective adhesive layer is any one of green oil, white oil, or black oil.

[0038] Different protective adhesive layers can be selected based on specific application requirements, offering a variety of solutions. Green, white, and black adhesives are all low-cost materials suitable for mass production, offering good economic benefits. Different protective adhesive layers vary in transparency, temperature resistance, and aging resistance; the most suitable material can be selected based on the actual application scenario to optimize performance. Choosing different colored protective adhesive layers can match the color or appearance of the reflector, improving the product's aesthetics and consistency.

[0039] Furthermore, the inventors discovered that in LED strip manufacturing, due to the shrinking of LED chip package sizes to the millimeter level, traditional SMT assembly still heavily relies on manual visual inspection and manual tray placement. For cascaded LED strips hundreds of meters long, thousands of LED chips must be continuously mounted. If the polarity of a single device is reversed, the reverse current will instantly impact the entire circuit, causing the entire row of chips to fail. Subsequent repairs require desoldering on micro-pads, which limits the operating space, resulting in extremely low rework yield and often rendering the entire LED strip unusable. The miniaturization and high-density integration amplify the probability of human error, becoming a key bottleneck restricting the reliability of ultra-long LED strips and improving manufacturing yield.

[0040] In some embodiments, the LED bead 100 may include an insulating base 10, a driver chip 30, and a circuit protection module 50. The insulating base 10 has multiple conductive pins 20 fitted onto it, and a reflector cup is formed recessed within the insulating base 10. A die-bonding portion 21 is formed within the reflector cup from the multiple conductive pins 20. Each conductive pin 20 includes a power supply pin, a ground pin, a signal input pin, and a signal output pin. The driver chip 30 may be disposed on and electrically connected to the die-bonding portion 21. The driver chip 30 includes a power interface 35 and a ground interface 36. The signal input interface 37 and the signal output interface 38 are provided. The signal input interface 37 is electrically connected to the signal input pin and is connected to the signal output pin of another LED 100 through the signal input pin. The signal output interface 38 is electrically connected to the signal output pin and is connected to the signal input pin of another LED 100 through the signal output pin. The circuit protection module 50 is disposed on the die bonding part 21 and is electrically connected to at least one of the power interface 35, the ground interface 36, the signal input interface 37 and the signal output interface 38.

[0041] In some embodiments, due to the aforementioned power supply and structural design, the LED chip 100 may face challenges from voltage and current fluctuations under extreme conditions such as transient voltage or temporary power outages. To protect the normal functioning of the light-emitting module and the driver chip 30, the LED chip 100 may also include a circuit protection module 50, which can be disposed on the die-bonding section 21. The circuit protection module 50 may include multiple parts, distributed in different locations within the LED chip 100, or it may be a complete integrated module. Through the circuit protection module 50 between signal interfaces, the process yield problem of one LED chip being reversed and multiple LED chips failing in the long cascade LED strip process is alleviated. After the aforementioned voltage increase, the driver chip 30 of a large number of LED chips can be protected, improving the overall reliability and safety of the LED strip. Furthermore, since the circuit protection module 50 is disposed on the die-bonding section 21 rather than in the circuit, the number of bonding operations and the types of materials and equipment can be reduced, greatly reducing process and material costs.

[0042] It should be further understood that, on the one hand, the circuit protection module 50 between the power supply pin and the power interface 35 effectively avoids the problem of voltage fluctuations that can easily cause the LED driver chip 30 to burn out, which is often caused by the failure of some LEDs in long-cascaded, high-drive-voltage, and long-term-use LED strips. On the other hand, the circuit protection module 50 between the signal interfaces alleviates the process yield problem of one LED being reversed and multiple LEDs failing in the long-cascaded LED strip process. After the aforementioned voltage increase, it can protect the driver chip 30 of a large number of LEDs, improving the overall reliability and safety of the LED strip. Furthermore, since the circuit protection module 50 is located on the die-bonding section 21 rather than in the circuit, it can reduce the number of die-bonding operations and the types of materials and equipment required for the process in the LED strip manufacturing, greatly reducing process and material costs.

[0043] In some embodiments, please refer to Figure 5 and Figure 8 The driver chip 30 may include a first control interface 31, a second control interface 32, a third control interface 33, a power interface 35, and a ground interface 36. The power interface 35 can be used to connect a power supply pin. The ground interface 36 can be used to connect a ground pin. The first control interface 31 can be electrically connected to the first light-emitting module 41. The second control interface 32 can be electrically connected to the second light-emitting module 42. The third control interface 33 can be electrically connected to the third light-emitting module 43. The driver chip 30 may also include a fourth control interface 34, which can be electrically connected to the fourth light-emitting module 44.

[0044] In some embodiments, the driving channels of the driver chip 30 can adopt a parallel structure, thereby connecting the driver chip 30 body in parallel with the first light-emitting module 41, the second light-emitting module 42, and the third light-emitting module 43. Specifically, the first light-emitting module 41 can be electrically connected to the ground pin through the first control interface 31 and the ground interface 36, the second light-emitting module 42 can be electrically connected to the ground pin through the second control interface 32 and the ground interface 36, and the third light-emitting module 43 can be electrically connected to the ground pin through the third control interface 33 and the ground interface 36.

[0045] For example, the power supply pin can be electrically connected to the power interface 35 through the circuit protection module 50. Similarly, the signal input pin can be electrically connected to the signal input interface 37 through the circuit protection module 50. Furthermore, the signal output pin can be electrically connected to the signal output interface 38 through the circuit protection module 50. By setting the circuit protection module 50 on the power supply pin, a voltage divider can be applied to the driver chip 30 and the light-emitting module. By setting the circuit protection module 50 between the signal output interface 38 of the driver chip 30 of one LED bead 100 and the signal input interface 37 of the next LED bead 100, reverse connection protection and stable signal transmission can be achieved.

[0046] Specifically, the circuit protection module 50 may include a chip protection device 51 and a line protection device 52. The chip protection device 51 may include a resistor or an impedance device, and the line protection device 52 may include a resistor or an impedance device. For example, at least one of the first light-emitting module 41, the second light-emitting module 42, the third light-emitting module 43, and the fourth light-emitting module 44 is electrically connected to the chip protection device 51, and is electrically connected to the corresponding first control interface 31, second control interface 32, or third control interface 33 through the chip protection device 51. This arrangement can protect the driver chip 30 and the light-emitting wafer from being directly impacted by power fluctuations in an unstable power environment, preventing serious problems such as device burnout. As another example, the signal input pin is electrically connected to the signal input interface 37 through the line protection device 52, and the signal output pin is electrically connected to the signal output interface 38 through the line protection device 52.

[0047] Typically, but not limitingly, the resistor can be 100 ohms, 300 ohms, 500 ohms, 700 ohms, 900 ohms, 1100 ohms, 1300 ohms, 1500 ohms, 1700 ohms, 1900 ohms, 2000 ohms, or any range of two values.

[0048] In some embodiments, the circuit protection module 50 may further include a power supply protection device 53, which includes a resistor and a capacitor, and is electrically connected to the power interface 35. The power interface 35 is connected to the power supply pin through the resistor and grounded through the capacitor. This power supply protection device 53 can ensure the safe and stable power supply of the LED bead 100, which helps to improve the service life of the light-emitting module and the driver chip 30.

[0049] Please see Figure 10 , Figure 10This is a schematic diagram of the structure of an LED lamp bead 100 according to an embodiment of this application. In the LED lamp bead 100, the circuit protection module 50 may further include at least one ESD device 54. The ESD device 54 is connected in parallel to one of the driver chip 30, the first light-emitting module 41, the second light-emitting module 42, the third light-emitting module 43, and the fourth light-emitting module 44. At least one end of the ESD device 54 is grounded. It should be understood that since the ESD device 54 may also be included, one end of the ESD device 54 is grounded, and the other end is electrically connected to one of the power interface 35, signal input interface 37, the first control interface 31, the second control interface 32, the third control interface 33, and the fourth control interface 34 of the driver chip 30, so that one of the driver chip 30, the first light-emitting module 41, the second light-emitting module 42, the third light-emitting module 43, and the fourth light-emitting module 44 can be connected in parallel with the ESD device 54. The ESD device 54 may include a unidirectional Zener diode or a bidirectional Zener diode. It should be understood that since LED light strips are often used in scenarios such as building outline wall washing, they are prone to lightning-induced overvoltage or transient surges in the power grid during extreme weather. This energy can couple into the LED chips through power lines or signal lines, causing the driver chip 30 and the light-emitting chips connected to its control interface to break down, lock up, or be permanently damaged. Therefore, the ESD device 54 provides a low-clamping voltage path between the interface and ground. When the transient voltage exceeds the Zener breakdown voltage, the ESD device 54 can quickly conduct, discharging the peak voltage or surge current to the ground plane, clamping the interface voltage within a safe range, and ensuring that the LED chips 100 maintain functional integrity and luminous consistency in thunderstorms and long-distance wall washing applications.

[0050] In some embodiments, when the ESD device 54 is connected in parallel with one of the driver chip 30, the first light-emitting module 41, the second light-emitting module 42, the third light-emitting module 43, and the fourth light-emitting module 44, its Zener breakdown voltage can be higher than the maximum rated operating voltage of the parallel object and lower than the breakdown voltage of the parallel object, ensuring that the ESD device 54 is in the off state within the normal power supply and signal level range, thereby reducing leakage current and not increasing additional power consumption. For example, the Zener breakdown voltage of the ESD device 54 can be greater than 13V, and the ESD device 54 can be connected in parallel with the fourth light-emitting module 44 and grounded. It should be understood that when lightning induction or grid transients cause the interface voltage to exceed 13V, the ESD device 54 can quickly enter avalanche conduction, providing a low-impedance discharge path, introducing surge current to the ground plane, and clamping the interface voltage to near the Zener voltage, preventing the driver chip 30 and other parallel objects from being subjected to overvoltage. For example, an ESD unit can be set inside the chip. The ESD device 54 and the internal ESD unit of the chip form a two-level protection. The external Zener is responsible for the main energy discharge, while the internal unit only needs to deal with the residual charge, which improves the survivability and lifespan reliability of the LED bead 100 in long-circuit, high-sensitivity environments such as building wall washing.

[0051] This application also provides an LED light strip, which may include the LED beads 100 in any embodiment of this application. This LED light strip has advantages such as long cascade length, good reliability, agile and stable control, good power consumption, and high brightness.

[0052] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0053] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0054] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. An LED lamp bead, characterized in that, The LED beads include: An insulating base, on which multiple conductive pins are fitted, and a reflector cup is formed in the recess of the insulating base. The multiple conductive pins form a die-bonding part in the reflector cup. The conductive pins include power supply pins, signal input pins, and signal output pins. A driver chip is disposed on the die-bonding part and electrically connected to the die-bonding part. The driver chip includes a power interface, a signal input interface, and a signal output interface. The power interface is electrically connected to the power supply pin. The signal input interface is electrically connected to the signal input pin and is connected to the signal output pin of another LED through the signal input pin. The signal output interface is electrically connected to the signal output pin and is connected to the signal input pin of another LED through the signal output pin. A circuit protection module is disposed on the die bonded portion and electrically connected to at least one of the power interface, the signal input interface, and the signal output interface.

2. The LED lamp bead as described in claim 1, characterized in that, The power supply pin is electrically connected to the power interface through the circuit protection module; and / or, The signal input pin is electrically connected to the signal input interface through the circuit protection module; and / or, The signal output pin is electrically connected to the signal output interface through the circuit protection module.

3. The LED lamp bead as described in claim 2, characterized in that, The circuit protection module includes chip protection devices and line protection devices. The chip protection devices include resistive devices or impedance devices, and the line protection devices include resistive devices or impedance devices. At least one light-emitting module is electrically connected to the chip protection device, and is electrically connected to the driver chip through the chip protection device; and / or, The signal input pin is electrically connected to the signal input interface through the line protection device; and / or, The signal output pin is electrically connected to the signal output interface through the line protection device.

4. The LED lamp bead as described in claim 2, characterized in that, The circuit protection module includes a power supply protection device, which includes an impedance device, a resistor device, and a capacitor device, and is electrically connected to the power interface. The power interface is connected to the power supply pin through the resistor device, and the power interface is grounded through the capacitor device.

5. The LED lamp bead as described in claim 1, characterized in that, The LED beads also include: A first light-emitting module is disposed on the die-bonding portion and electrically connected to the driving chip. The first light-emitting module includes a plurality of first light-emitting chips connected in series and emitting the same color. The second light-emitting module is disposed on the die-bonding part and electrically connected to the driving chip. The second light-emitting module includes a plurality of second light-emitting chips connected in series and emitting the same color. The third light-emitting module is disposed on the die-bonding part and electrically connected to the driving chip. The third light-emitting module includes a plurality of third light-emitting chips connected in series and emitting the same color. The first, second, and third light-emitting chips emit different colors of light.

6. The LED lamp bead as described in claim 5, characterized in that, The first light-emitting module, the second light-emitting module, and / or the third light-emitting module are connected in parallel with the driver chip.

7. The LED lamp bead as described in claim 6, characterized in that, The conductive pin includes a power supply pin, which is electrically connected to the first light-emitting module, the second light-emitting module, the third light-emitting module, and the driver chip, respectively. And / or, The conductive pin includes a ground pin, which is electrically connected to the first light-emitting module, the second light-emitting module, the third light-emitting module, and the driver chip, respectively.

8. The LED lamp bead as described in claim 7, characterized in that, The driver chip further includes a first control interface, a second control interface, a third control interface, and a ground interface, wherein the first control interface, the second control interface, and the third control interface are electrically connected to the ground interface. Wherein, the first light-emitting module is electrically connected to the grounding pin through the first control interface and the grounding interface; and / or, The second light-emitting module is electrically connected to the grounding pin via the second control interface and the grounding interface; and / or, The third light-emitting module is electrically connected to the grounding pin through the third control interface and the grounding interface.

9. The LED lamp bead as described in claim 8, characterized in that, The power supply voltage corresponding to the power supply pin is determined based on the number of LED chips and the rated voltage of each LED chip; and / or, The number of LED chips is determined based on the power supply voltage corresponding to the power supply pin and the rated voltage of each LED chip.

10. The LED lamp bead as described in claim 5, characterized in that, The first light-emitting chip is a red light-emitting chip; and / or, The second light-emitting chip is a green light-emitting chip; and / or, The third light-emitting chip is a blue light-emitting chip; and / or, The LED lamp bead also includes a fourth light-emitting module, which is disposed on the die-bonding part and electrically connected to the driving chip. The fourth light-emitting module includes a fourth light-emitting chip, which is a white light chip or a yellow light chip.

11. The LED lamp bead as described in claim 10, characterized in that, The reflector includes a first reflector and a second reflector, the area of ​​the second reflector is smaller than that of the first reflector, and the fourth light-emitting module is disposed inside the second reflector.

12. The LED lamp bead as described in any one of claims 1 to 11, characterized in that, The LED bead also includes at least one ESD device, which is connected in parallel to one of the driver chip, the first light-emitting module, the second light-emitting module, the third light-emitting module, and the fourth light-emitting module, and at least one end of the ESD device is grounded.

13. An LED light strip, characterized in that, It includes a plurality of LED beads as described in any one of claims 1 to 12.

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