Heat dissipation system for a plasma source cavity

Abstract

This application provides a heat dissipation system for a plasma source cavity, belonging to the field of heat dissipation technology. It includes a plasma source cavity and a heat dissipation structure. The heat dissipation structure includes a main heat dissipation plate and an auxiliary heat dissipation plate. The main heat dissipation plate is disposed on each of the two opposite sides of the plasma source cavity along a first direction. At least one of the two opposite sides of the plasma source cavity along a second direction is provided with an auxiliary heat dissipation plate. The side surface area of ​​the two opposite sides of the plasma source cavity along the first direction is larger than the side surface area of ​​the two opposite sides of the plasma source cavity along the second direction. Power devices that cooperate with the plasma source cavity are mounted on the auxiliary heat dissipation plate. The heat dissipation system for the plasma source cavity provided by this application not only meets the heat dissipation requirements of the power devices, but also allows the auxiliary heat dissipation plate to assist the main heat dissipation plate in absorbing heat from the plasma source cavity, thereby satisfying the heat dissipation requirements of the plasma source cavity.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology, and in particular relates to a heat dissipation system for a plasma source cavity. Background Technology

[0002] The remote plasma source cavity synthesizes plasma outside the reaction zone using a plasma source, and then introduces the plasma into the reaction zone under the influence of airflow, electric field, and magnetic field. The remote plasma source cavity continuously generates high temperatures during gas ionization, requiring real-time heat dissipation to ensure normal operation. Currently, some existing heat dissipation structures are insufficient when simultaneously cooling the remote plasma source cavity and the surrounding power devices, easily leading to localized overheating and affecting the lifespan and stability of the cavity and power devices. Utility Model Content

[0003] The purpose of this application is to provide a heat dissipation system for a plasma source cavity, so as to solve the technical problem that some existing heat dissipation structures are insufficient when simultaneously handling the heat dissipation of a remote plasma source cavity and the power devices around the cavity.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: This application provides a heat dissipation system for a plasma source cavity, including a plasma source cavity and a heat dissipation structure. The heat dissipation structure includes a main heat dissipation plate and an auxiliary heat dissipation plate. The main heat dissipation plate is provided on both sides of the plasma source cavity opposite to each other along a first direction. At least one side of the plasma source cavity opposite to each other along a second direction is provided with an auxiliary heat dissipation plate. The side surface area of ​​the plasma source cavity opposite to each other along the first direction is larger than the side surface area of ​​the plasma source cavity opposite to each other along the second direction. Power devices that cooperate with the plasma source cavity are mounted on the auxiliary heat dissipation plate.

[0005] In this application, by providing main heat dissipation plates on both sides of the plasma source cavity along the first direction and auxiliary heat dissipation plates on at least one side of the plasma source cavity along the second direction, the heat dissipation of the plasma source cavity can be improved. Since the side surface area of ​​the plasma source cavity on both sides along the first direction is larger than that on both sides along the second direction, the heat absorbed by the main heat dissipation plates is greater than the heat absorbed by the auxiliary heat dissipation plates. In addition, power devices that cooperate with the plasma source cavity are installed on the auxiliary heat dissipation plates. Thus, not only can the heat dissipation requirements of the power devices be met, but the auxiliary heat dissipation plates can also assist the main heat dissipation plates in absorbing the heat of the plasma source cavity, thereby simultaneously meeting the heat dissipation requirements of the plasma source cavity and preventing local overheating from affecting the lifespan and stability of the cavity and power devices.

[0006] In one implementation, a flow guiding groove is provided on the side of the main heat sink plate facing the plasma source cavity, and the flow guiding groove cooperates with the outer side of the plasma source cavity to form a main heat dissipation channel. A main liquid inlet and a main liquid outlet connected to the main heat dissipation channel are formed on the main heat sink plate.

[0007] In this implementation, by setting the main heat dissipation plate to cooperate with the outer side of the plasma source cavity to form the main heat dissipation channel, the cooling water can fully absorb the heat emitted by the plasma source cavity, so as to meet the heat dissipation requirements of the plasma source cavity.

[0008] In one implementation, the main heat sink includes a first cooling plate, a second cooling plate, and an intermediate cooling plate. The first cooling plate and the second cooling plate are arranged at intervals relative to each other, and there is one or more intermediate cooling plates disposed between the first cooling plate and the second cooling plate. The first cooling plate, the second cooling plate, and the intermediate cooling plate are all connected to the plasma source cavity, and the flow guiding groove is disposed on the first cooling plate, the second cooling plate, and the intermediate cooling plate.

[0009] In this implementation, the main heat dissipation plate includes a first cooling plate, a second cooling plate, and an intermediate cooling plate, so that the shape of the main heat dissipation plate can be matched with that of the plasma source cavity. While the main heat dissipation plate can be matched with the outer side of the plasma source cavity to form the main heat dissipation channel, the size of the main heat dissipation plate is increased as much as possible to meet the heat dissipation requirements of the plasma source cavity.

[0010] In one implementation, the flow guiding groove includes a first flow guiding groove section, a second flow guiding groove section, and an intermediate flow guiding groove section. The first flow guiding groove section, the second flow guiding groove section, and the intermediate flow guiding groove section are respectively disposed on a first cooling plate, a second cooling plate, and an intermediate cooling plate. One end of the intermediate flow guiding groove section is connected to the first flow guiding groove section by a first sealing element, which is in sealing cooperation with the intermediate cooling plate, the first cooling plate, and the plasma source cavity. The other end of the intermediate flow guiding groove section is connected to the second flow guiding groove section by a second sealing element, which is in sealing cooperation with the intermediate cooling plate, the second cooling plate, and the plasma source cavity.

[0011] In this implementation, by setting a first seal and a second seal, coolant is prevented from overflowing through the part where the first guide channel section connects to the middle guide channel section and the part where the second guide channel section connects to the middle guide channel section.

[0012] In one implementation, the first guide channel section is in the form of a continuous S-shape or a continuous U-shape; and / or, the second guide channel section is in the form of a continuous S-shape or a continuous U-shape; and / or, the intermediate guide channel section is in the form of a continuous S-shape or a continuous U-shape.

[0013] In this implementation, by setting the first guide channel section, the second guide channel section, and the intermediate guide channel section to be in a continuous S-shape or a continuous U-shape, the heat exchange area is increased, the uniform flow of the cooling medium is ensured, and the temperature gradient in the plasma source cavity is prevented.

[0014] In one implementation, the main liquid inlet and the main liquid outlet are respectively disposed on the first cooling plate and the second cooling plate, and are disposed far apart from each other along the length of the first cooling plate and the second cooling plate.

[0015] In this implementation, the main liquid inlet and main liquid outlet are positioned far apart along the length of the first and second cooling plates to ensure uniform flow of the cooling medium.

[0016] In one implementation, the first cooling plate, the second cooling plate, and the intermediate cooling plate are connected as a whole through a plasma source cavity.

[0017] In this implementation, the first cooling plate, the second cooling plate, and the intermediate cooling plate are connected as one unit through the plasma source cavity, which facilitates the separate processing of the first cooling plate, the second cooling plate, and the intermediate cooling plate, and ensures that the first cooling plate, the second cooling plate, and the intermediate cooling plate do not affect the assembly of the plasma source cavity.

[0018] In one implementation, a heat-conducting layer is provided between the surface of the main heat sink that is in contact with the plasma source cavity and the plasma source cavity.

[0019] In this implementation, by providing a heat-conducting layer between the main heat sink and the plasma source cavity, the gap between the main heat sink and the plasma source cavity can be eliminated, reducing thermal resistance and improving heat dissipation efficiency.

[0020] In one implementation, an auxiliary heat dissipation channel is formed on the auxiliary heat dissipation plate, and an auxiliary liquid inlet and an auxiliary liquid outlet are formed on the auxiliary heat dissipation plate that communicate with the auxiliary heat dissipation channel.

[0021] In this implementation, since an auxiliary heat dissipation channel is formed on the auxiliary heat dissipation plate, the auxiliary heat dissipation plate can be installed on the plasma source cavity after the main heat dissipation plate is assembled with the plasma source cavity.

[0022] In one implementation, the auxiliary heat dissipation plate includes an auxiliary heat dissipation plate and a tube body. The tube body is mounted on the auxiliary heat dissipation plate, the auxiliary heat dissipation plate is connected to the plasma source cavity, an auxiliary heat dissipation flow channel is formed inside the tube body, and the two ends of the tube body are an auxiliary liquid inlet and an auxiliary liquid outlet, respectively.

[0023] In this implementation, by setting an auxiliary heat sink and a tube body, the processing and manufacturing of the auxiliary heat sink can be facilitated.

[0024] In one implementation, a heat-conducting layer is provided between the auxiliary heat sink and the plasma source cavity.

[0025] In this implementation, in this embodiment of the application, by providing a heat-conducting layer between the auxiliary heat dissipation plate and the plasma source cavity, the gap between the auxiliary heat dissipation plate and the plasma source cavity can be eliminated, the thermal resistance can be reduced, and the heat dissipation efficiency can be improved.

[0026] In one implementation, the heat dissipation system includes a first water supply pipe and a second water supply pipe; two main heat dissipation plates are connected in series via water pipes, and one of the main heat dissipation plates is connected to the first water supply pipe, or the two main heat dissipation plates are connected in parallel via water pipes, and both of the main heat dissipation plates are connected to the first water supply pipe; and / or, auxiliary heat dissipation plates are respectively provided on opposite sides of the plasma source cavity along a second direction, the two auxiliary heat dissipation plates are connected in series via water pipes, and one of the auxiliary heat dissipation plates is connected to the second water supply pipe, or the two auxiliary heat dissipation plates are connected in parallel via water pipes, and both of the auxiliary heat dissipation plates are connected to the second water supply pipe.

[0027] In this implementation, the heat dissipation system includes a first water supply pipe and a second water supply pipe, with the first water supply pipe connected to the main heat dissipation plate and the second water supply pipe connected to the auxiliary heat dissipation plate. This allows the cooling water flowing through the main heat dissipation plate and the auxiliary heat dissipation plate to flow independently without interference, which also helps to improve heat dissipation efficiency. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the heat dissipation system of the plasma source cavity provided in some embodiments of this application; Figure 2 Exploded view of the heat dissipation system of the plasma source cavity provided in some embodiments of this application; Figure 3 Schematic diagram of the structure of the main heat sink mounted on the plasma source cavity provided in some embodiments of this application; Figure 4 This is a schematic diagram of the main heat sink portion provided in some embodiments of this application; Figure 5 This is a schematic diagram of the main heat sink portion provided in some embodiments of this application; Figure 6A simplified structural diagram showing the connection between the first water supply pipe and the second water supply pipe and the main heat dissipation plate and the auxiliary heat dissipation plate, provided in some embodiments of this application; Figure 7 A simplified structural diagram showing the connection between the first and second water supply pipes and the main heat sink and the auxiliary heat sink, as provided in some embodiments of this application.

[0030] The following are the labeling elements in the figure: 100 - Heat dissipation system; 10 - Heat dissipation structure; 20 - Plasma source cavity; 11-Main heat dissipation plate; 12-Auxiliary heat dissipation plate; 13-First water supply pipe; 14-Second water supply pipe; 15-Fixing component; 111-First cooling plate; 112-Second cooling plate; 113-Intermediate cooling plate; 114-Guide groove; 115-Water inlet connector; 116-Water outlet connector; 117-First seal; 118-Second seal; 119-Protruding structure; 1141 - First guide channel section; 1142 - Second guide channel section; 1143 - Intermediate guide channel section; 1151 - Main inlet; 1161 - Main outlet; 121-Auxiliary heat sink; 122-Tube body; 123-Auxiliary liquid inlet; 124-Auxiliary liquid outlet; 21-Front side; 22-Rear side; 23-Left side; 24-Right side; 25-First vertical part; 26-Second vertical part; 27-Horizontal part. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings. The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0032] In the description of this application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0034] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0036] It should be noted that, in this application, the words "in one embodiment," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in one embodiment," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner.

[0037] Please see Figures 1-2 , Figure 1 This is a schematic diagram of the heat dissipation system 100 for a plasma source cavity provided in some embodiments of this application. Figure 2 This is an exploded view of the heat dissipation system 100 of the plasma source cavity provided in some embodiments of this application. For ease of description, please refer to... Figure 1 In this embodiment, the length direction of the heat dissipation system 100 is defined as the X-axis direction, the width direction as the Y-axis direction, and the height direction as the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are all perpendicular to each other. Furthermore, this embodiment uses directional terms such as "up," "down," "left," "right," "front," and "rear" when describing the heat dissipation system 100. The orientation is primarily based on the location of the heat dissipation system 100 within the surrounding area. Figure 1The orientation of the display is described as follows: the positive direction of the X-axis is "right", the negative direction of the X-axis is "left", the positive direction of the Y-axis is "front", the negative direction of the Y-axis is "back", the positive direction of the Z-axis is "up", and the negative direction of the Z-axis is "down".

[0038] Please see Figure 1 The heat dissipation system 100 of the plasma source cavity provided in this application embodiment includes a plasma source cavity 20 and a heat dissipation structure 10, with the heat dissipation structure 10 connected to the plasma source cavity 20.

[0039] The core function of the plasma source cavity 20 is to ionize / dissociate the gas inside the cavity through energy input (such as electric field, magnetic field, thermal energy) to form a plasma composed of electrons, ions, and neutral particles (free radicals, excited-state atoms). The plasma source cavity 20 can be a remote plasma source cavity, which uses a plasma source to synthesize plasma outside the reaction zone and introduces the plasma into the reaction zone under the influence of airflow, electric field, magnetic field, etc.

[0040] The heat dissipation structure 10 is connected to the plasma source cavity 20. The plasma source cavity 20 will continuously generate high temperature when ionizing gas, and needs to dissipate heat in real time to ensure normal operation. The heat dissipation structure 10 can be used to dissipate heat from the plasma source cavity 20.

[0041] Please see Figure 1 The heat dissipation structure 10 includes a main heat dissipation plate 11 and an auxiliary heat dissipation plate 12, which are connected to the plasma source cavity 20.

[0042] Please see Figure 1 The plasma source cavity 20 is along the first direction (i.e. Figure 1 Main heat dissipation plates 11 are respectively provided on both sides (in the Y-axis direction). This can be understood as... (See also...) Figure 2 The plasma source cavity 20 includes a front side 21 and a rear side 22 along the first direction, and the front side 21 and the rear side 22 are respectively provided with a main heat sink portion 11.

[0043] Please see Figure 1 The plasma source cavity 20 is along the second direction (i.e. Figure 1 At least one of the two opposite sides (in the X-axis direction) is provided with an auxiliary heat dissipation plate 12, which can be understood as, please refer to Figure 2The plasma source cavity 20 includes a left side 23 and a right side 24 along the second direction. At least one of the left side 23 and the right side 24 is provided with an auxiliary heat dissipation plate 12. That is, the auxiliary heat dissipation plate 12 can be provided on the left side 23, or on the right side 24, or both the left side 23 and the right side 24 can be provided with auxiliary heat dissipation plate 12.

[0044] In this embodiment of the application, the side surface area of ​​the plasma source cavity 20 on both sides along the first direction is greater than the side surface area of ​​the plasma source cavity 20 on both sides along the second direction. That is to say, the area of ​​the left side 23 is smaller than the area of ​​the front side 21 and smaller than the area of ​​the rear side 22, and the area of ​​the right side 24 is smaller than the area of ​​the front side 21 and smaller than the area of ​​the rear side 22.

[0045] It should be noted that since the side surface area of ​​the plasma source cavity 20 on both sides along the first direction is larger than the side surface area of ​​the plasma source cavity 20 on both sides along the second direction, the size of the main heat dissipation plate 11 can be set so that the main heat dissipation plate 11 becomes the main heat dissipation component of the plasma source cavity 20.

[0046] In this embodiment of the application, a power device for cooperating with the plasma source cavity 20 can be installed on the auxiliary heat sink 12. For example, an IGBT (Insulated Gate Bipolar Transistor) can be installed on the auxiliary heat sink 12.

[0047] It should be noted that if the power devices used in conjunction with the plasma source cavity 20 are mounted on the main heat sink 11, the heat absorbed by the main heat sink 11 from the plasma source cavity 20 is greater than that absorbed by the auxiliary heat sink 12 because the side areas of the plasma source cavity 20 along the first direction are larger than those along the second direction. This results in insufficient heat dissipation for both the plasma source cavity 20 and the power devices, potentially leading to localized overheating and affecting the lifespan and stability of both the plasma source cavity 20 and the power devices. Therefore, the power devices used in conjunction with the plasma source cavity 20 can be mounted on the auxiliary heat sink 12. This not only satisfies the heat dissipation requirements of the power devices but also allows the auxiliary heat sink 12 to assist the main heat sink 11 in absorbing heat from the plasma source cavity 20, thus meeting its heat dissipation needs.

[0048] Please see Figures 3-5 , Figure 3This is a schematic diagram of the structure of the main heat sink 11 and the plasma source cavity 20 provided in some embodiments of this application. Figure 4 This is a schematic diagram of the structure of the main heat sink portion 11 provided in some embodiments of this application. Figure 5 This is a schematic diagram of the structure of the main heat sink portion 11 provided in some embodiments of this application.

[0049] In some embodiments, see Figure 4 A flow-guiding groove 114 is provided on the side of the main heat sink 11 facing the plasma source cavity 20, and the flow-guiding groove 114 cooperates with the outer surface of the plasma source cavity 20 to form the main heat dissipation channel. Please refer to [link to relevant documentation]. Figure 4 The main heat sink 11 has a main liquid inlet 1151 and a main liquid outlet 1161 that are connected to the main heat dissipation channel. Cooling water can enter through the main liquid inlet 1151, carry away the heat of the plasma source cavity 20 when it flows in the main heat dissipation channel, and finally be discharged through the main liquid outlet 1161.

[0050] In this embodiment, by setting the main heat dissipation plate 11 to cooperate with the outer surface of the plasma source cavity 20 to form a main heat dissipation channel, the cooling water can fully absorb the heat emitted by the plasma source cavity 20, so as to meet the heat dissipation requirements of the plasma source cavity 20.

[0051] In some embodiments, see Figure 4 The main heat dissipation plate 11 includes a first cooling plate 111, a second cooling plate 112, and an intermediate cooling plate 113. The first cooling plate 111 and the second cooling plate 112 are arranged at intervals relative to each other. There is one or more intermediate cooling plates 113, and the intermediate cooling plate 113 is arranged between the first cooling plate 111 and the second cooling plate 112. The first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113 are all connected to the plasma source cavity 20. The flow guiding groove 114 is arranged on the first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113.

[0052] Regarding the number of intermediate cooling plates 113, it can be set to one or more; please refer to [link to relevant documentation]. Figure 4 This indicates that there are two intermediate cooling plates 113, which are arranged alternately along the height direction.

[0053] The flow guide groove 114 is disposed on the first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113. This can be understood as follows: (See also...) Figure 4The flow guide groove 114 includes a first flow guide groove section 1141, a second flow guide groove section 1142 and an intermediate flow guide groove section 1143, which are respectively disposed on the first cooling plate 111, the second cooling plate 112 and the intermediate cooling plate 113.

[0054] In this embodiment, the main heat sink 11 is provided to include a first cooling plate 111, a second cooling plate 112 and an intermediate cooling plate 113, so that the main heat sink 11 can match the shape of the plasma source cavity 20. While realizing the main heat sink 11 and the outer surface of the plasma source cavity 20 to form the main heat dissipation channel, the size of the main heat sink 11 can be increased as much as possible to meet the heat dissipation requirements of the plasma source cavity 20.

[0055] In some embodiments, the first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113 are connected as one unit through the plasma source cavity 20.

[0056] This can be understood as, please see Figure 3 The plasma source cavity 20 includes a first vertical portion 25, a second vertical portion 26, and a horizontal portion 27. There are two horizontal portions 27, positioned between the first vertical portion 25 and the second vertical portion 26, and both horizontal portions 27 are connected to both the first vertical portion 25 and the second vertical portion 26. When assembling the heat dissipation system 100 provided in this embodiment, two first cooling plates 111 can be installed on opposite sides of the first vertical portion 25, two second cooling plates 112 can be installed on opposite sides of the second vertical portion 26, and two intermediate cooling plates 113 can be installed on opposite sides of the horizontal portions 27. After assembling the first vertical portion 25, the second vertical portion 26, and the horizontal portion 27, the first... Two main heat dissipation plate portions 11 are formed on both sides of the first vertical portion 25, the second vertical portion 26, and the horizontal portion 27, respectively; or, when assembling the heat dissipation system 100 provided in this application embodiment, a first cooling plate 111 and a second cooling plate 112 can be installed on opposite sides of the first vertical portion 25, a first cooling plate 111 and a second cooling plate 112 can be installed on opposite sides of the second vertical portion 26, and two intermediate cooling plates 113 can be installed on opposite sides of the horizontal portion 27. When the first vertical portion 25, the second vertical portion 26, and the horizontal portion 27 are assembled, two main heat dissipation plate portions 11 can be formed on both sides of the first vertical portion 25, the second vertical portion 26, and the horizontal portion 27, respectively.

[0057] In some examples, the first cooling plate 111 or the second cooling plate 112 may be welded to the first vertical portion 25, or the first cooling plate 111 or the second cooling plate 112 may be mounted on the first vertical portion 25 by means of connectors such as screws or bolts.

[0058] In some examples, the first cooling plate 111 or the second cooling plate 112 may be welded to the second vertical portion 26, or the first cooling plate 111 or the second cooling plate 112 may be mounted on the second vertical portion 26 by means of connectors such as screws or bolts.

[0059] In some examples, the intermediate cooling plate 113 may be welded to the transverse portion 27, or the intermediate cooling plate 113 may be mounted on the transverse portion 27 by means of connectors such as screws or bolts.

[0060] In some examples, the first cooling plate 111 and the second cooling plate 112 may be configured to have the same shape, the first cooling plate 111 may match the shape of the first vertical portion 25 and the second vertical portion 26, and the intermediate cooling plate 113 may match the shape of the horizontal portion 27.

[0061] Regarding the matching shape of the first cooling plate 111 with the first vertical portion 25 and the second vertical portion 26, it can be understood that, please refer to [reference needed]. Figure 3 The height of the first cooling plate 111 and the second cooling plate 112 along the Z-axis is close to the height of the first vertical portion 25 and the second vertical portion 26 along the Z-axis, and the width of the first cooling plate 111 and the second cooling plate 112 along the X-axis is close to the width of the first vertical portion 25 and the second vertical portion 26 along the X-axis.

[0062] Regarding the matching shape of the intermediate cooling plate 113 and the transverse portion 27, it can be understood that, please refer to [the relevant documentation / reference]. Figure 3 The width of the intermediate cooling plate 113 along the Z-axis is close to the width of the transverse portion 27 along the Z-axis, and the length of the intermediate cooling plate 113 along the X-axis is close to the length of the transverse portion 27 along the X-axis.

[0063] In this embodiment, the first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113 are connected as one unit through the plasma source cavity 20, so as to facilitate the separate processing of the first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113, and to ensure that the first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113 do not affect the assembly of the plasma source cavity 20.

[0064] It should be noted that the above embodiment describes the arrangement of the first cooling plate 111, the second cooling plate 112 and the intermediate cooling plate 113 connected as one unit through the plasma source cavity 20. In other embodiments, the first cooling plate 111, the second cooling plate 112 and the intermediate cooling plate 113 may be assembled first, and then the assembled main heat dissipation plate 11 may be installed on the plasma source cavity 20.

[0065] In some embodiments, see Figure 4 A first sealing element 117 is provided between one end of the intermediate guide channel section 1143 and the first guide channel section 1141. The first sealing element 117 is in a sealing fit with the intermediate cooling plate 113, the first cooling plate 111 and the plasma source cavity 20. A second sealing element 118 is provided between the other end of the intermediate guide channel section 1143 and the second guide channel section 1142. The second sealing element 118 is in a sealing fit with the intermediate cooling plate 113, the second cooling plate 112 and the plasma source cavity 20.

[0066] See some examples. Figure 4 The first sealing element 117 and the second sealing element 118 can be configured with a circular arc or U-shaped cross-section. The two ends of the first sealing element 117 and the second sealing element 118 along the bending direction are respectively sealed and fitted with the plasma source cavity 20. The first sealing element 117 is attached to the intermediate cooling plate 113 and the first cooling plate 111, and the first sealing element 117 is squeezed between the plasma source cavity 20 and the intermediate cooling plate 113 and the first cooling plate 111. The second sealing element 118 is attached to the intermediate cooling plate 113 and the second cooling plate 112, and the second sealing element 118 is squeezed between the plasma source cavity 20 and the intermediate cooling plate 113 and the second cooling plate 112.

[0067] In some examples, the first seal 117 and the second seal 118 may be made of rubber or silicone. For example, the first seal 117 and the second seal 118 may be made of fluororubber.

[0068] See some examples. Figure 5 A first sealing element 117 can be fixed to the intermediate cooling plate 113 and the first cooling plate 111 by multiple fasteners 15, and a second sealing element 118 can be fixed to the intermediate cooling plate 113 and the second cooling plate 112 by multiple fasteners 15.

[0069] In some examples, the fastener 15 can be made of plastic material, for example, it can be made of polytetrafluoroethylene (PTFE).

[0070] In this embodiment of the application, by providing a first sealing element 117 and a second sealing element 118, coolant is prevented from overflowing through the portion where the first guide channel section 1141 communicates with the intermediate guide channel section 1143 and the portion where the second guide channel section 1142 communicates with the intermediate guide channel section 1143.

[0071] In some embodiments, see Figure 4 The first guide channel section 1141 is in the form of a continuous S-shape or a continuous U-shape; and / or, the second guide channel section 1142 is in the form of a continuous S-shape or a continuous U-shape; and / or, the intermediate guide channel section 1143 is in the form of a continuous S-shape or a continuous U-shape.

[0072] In some examples, the first guide channel section 1141, the second guide channel section 1142, and the intermediate guide channel section 1143 may all be in a continuous S-shape or a continuous U-shape; or, one or both of the first guide channel section 1141, the second guide channel section 1142, and the intermediate guide channel section 1143 may be in a continuous S-shape or a continuous U-shape.

[0073] See some examples. Figure 4 The first guide channel section 1141 is oriented along the length direction of the first cooling plate 111 (i.e., Figure 4 (in the Z-axis direction), the direction of the second guide channel section 1142 is along the length direction of the first cooling plate 111 (i.e., Figure 4 (Z-axis direction).

[0074] See some examples. Figure 4 The direction of the intermediate guide channel section 1143 is along the width direction of the intermediate cooling plate 113 (i.e., Figure 4 (in the Z-axis direction); or, in other examples, the direction of the intermediate guide channel section 1143 can also be set along the intermediate cooling plate 113 (i.e., Figure 4 The length direction of the X-axis.

[0075] In this embodiment, by setting the first guide channel section 1141, the second guide channel section 1142, and the intermediate guide channel section 1143 to be in a continuous S-shape or a continuous U-shape, the heat exchange area is increased, the uniform flow of the cooling medium is ensured, and the temperature gradient in the plasma source cavity 20 is prevented.

[0076] In some embodiments, a protruding structure 119 is provided on the flow channel wall of the main heat dissipation channel formed by the flow guide groove 114 and the outer side of the plasma source cavity 20.

[0077] See some examples. Figure 5The protruding structure 119 can be disposed on the groove wall of the flow guiding groove 114; or, the protruding structure 119 can be disposed on the surface of the plasma source cavity 20; or, the protruding structure 119 can be disposed on both the groove wall of the flow guiding groove 114 and the surface of the plasma source cavity 20.

[0078] In some examples, the raised structure 119 can be configured as a PIN or reinforcement.

[0079] In some examples, the protrusion structure 119 may be welded or integrally formed on the groove wall surface of the flow guide groove 114.

[0080] In some examples, the protrusions 119 are distributed sequentially along the length of the guide groove 114.

[0081] In some examples, the first cooling plate 111, the second cooling plate 112, and the intermediate cooling plate 113 may all be provided with protruding structures 119; or, see [link to relevant documentation]. Figure 5 Only the first cooling plate 111 and the second cooling plate 112 are provided with the protruding structure 119, and the protruding structure 119 may not be provided on the intermediate cooling plate 113.

[0082] In this embodiment of the application, a protruding structure 119 is provided on the wall of the main heat dissipation channel to increase the heat dissipation effect.

[0083] In some embodiments, see Figure 4 The main liquid inlet 1151 and the main liquid outlet 1161 are respectively disposed on the first cooling plate 111 and the second cooling plate 112, and the main liquid inlet 1151 and the main liquid outlet 1161 are disposed far apart from each other along the length direction of the first cooling plate 111 and the second cooling plate 112.

[0084] See some examples. Figure 3 The first cooling plate 111 is located on the left side of the second cooling plate 112. A water inlet connector 115 is formed on the first cooling plate 111. The water inlet connector 115 is close to the bottom of the first cooling plate 111 and is connected to the auxiliary liquid inlet 123. A water outlet connector 116 is formed on the second cooling plate 112. The water outlet connector 116 is close to the top of the second cooling plate 112 and is connected to the auxiliary liquid outlet 124.

[0085] In this embodiment, the main liquid inlet 1151 and the main liquid outlet 1161 are arranged far apart along the length of the first cooling plate 111 and the second cooling plate 112 to ensure uniform flow of the cooling medium.

[0086] In some embodiments, see Figure 4There are two intermediate cooling plates 113. For ease of description, the two intermediate cooling plates 113 are referred to as the first intermediate cooling plate and the second intermediate cooling plate, respectively. The first intermediate cooling plate is located above the second intermediate cooling plate.

[0087] Please see Figure 4 The main liquid inlet 1151 is disposed on the first cooling plate 111. For the intermediate guide channel section 1143 on the first intermediate cooling plate (relative to the intermediate cooling plate 113 disposed above), the higher end is connected to the first guide channel section 1141 on the first cooling plate 111, and the lower end is connected to the second guide channel section 1142 on the second cooling plate 112. For the intermediate guide channel section 1143 on the second intermediate cooling plate (relative to the intermediate cooling plate 113 disposed below), the higher end is connected to the first guide channel section 1141 on the first cooling plate 111, and the lower end is connected to the second guide channel section 1142 on the second cooling plate 112.

[0088] See some examples. Figure 4 The intermediate guide channel section 1143 on the first intermediate cooling plate (relative to the intermediate cooling plate 113 above) has its higher end close to the top of the first guide channel section 1141; the intermediate guide channel section 1143 on the second intermediate cooling plate (relative to the intermediate cooling plate 113 below) has its lower end close to the bottom of the second guide channel section 1142, so as to ensure uniform flow of the cooling medium.

[0089] In some embodiments, a heat-conducting layer is provided between the surface of the main heat sink portion 11 that is in contact with the plasma source cavity 20 and the plasma source cavity 20.

[0090] In some examples, the thermally conductive layer can be a thermally conductive pad or a thermally conductive adhesive.

[0091] In this embodiment of the application, by providing a heat-conducting layer between the main heat sink 11 and the plasma source cavity 20, the gap between the main heat sink 11 and the plasma source cavity 20 can be eliminated, the thermal resistance can be reduced, and the heat dissipation efficiency can be improved.

[0092] In some embodiments, an auxiliary heat dissipation channel is formed on the auxiliary heat dissipation plate portion 12, and an auxiliary liquid inlet 123 and an auxiliary liquid outlet 124 communicating with the auxiliary heat dissipation channel are formed on the auxiliary heat dissipation plate portion 12. Please refer to [link to relevant documentation]. Figure 2 The diagram shows the auxiliary liquid inlet 123 and the auxiliary liquid outlet 124. Cooling water can enter through the auxiliary liquid inlet 123, and when it flows in the auxiliary heat dissipation channel, it carries away the heat of the plasma source cavity 20 and the power device, and is finally discharged through the auxiliary liquid outlet 124.

[0093] In this embodiment, since an auxiliary heat dissipation channel is formed on the auxiliary heat dissipation plate 12, the auxiliary heat dissipation plate 12 can be installed on the plasma source cavity 20 after the main heat dissipation plate 11 and the plasma source cavity 20 are assembled.

[0094] In some embodiments, see Figure 2 The auxiliary heat dissipation plate 12 includes an auxiliary heat dissipation plate 121 and a tube body 122. The tube body 122 is mounted on the auxiliary heat dissipation plate 121. The auxiliary heat dissipation plate 121 is connected to the plasma source cavity 20. An auxiliary heat dissipation flow channel is formed inside the tube body 122. The two ends of the tube body 122 are an auxiliary liquid inlet 123 and an auxiliary liquid outlet 124, respectively.

[0095] In some examples, the auxiliary heat sink 121 can be set to an aluminum plate and the tube body 122 to a copper tube.

[0096] In some examples, the auxiliary heat sink 121 may be installed on the plasma source cavity 20; or, the auxiliary heat sink 121 may be installed on the main heat sink 11; or, the auxiliary heat sink 121 may be installed on both the plasma source cavity 20 and the main heat sink 11.

[0097] In some examples, an auxiliary heat sink 121 may be mounted on the plasma source cavity 20 and / or the main heat sink section 11 via connectors such as screws or bolts.

[0098] See some examples. Figure 2 This illustrates that the tube 122 is U-shaped, or in other examples, the tube 122 may be set to be a continuous U-shape or S-shape.

[0099] It should be noted that the shape of the tube body 122 can be reasonably set according to the installation position of the power device on the auxiliary heat sink 121, so as to better dissipate heat from the power device.

[0100] See some examples. Figure 2 The auxiliary heat sink 121 may be configured with a tube 122 embedded on the side opposite to the plasma source cavity 20, and the tube 122 may not protrude from the side of the auxiliary heat sink 121 opposite to the plasma source cavity 20; or, in some examples, the auxiliary heat sink 121 may be configured with a tube 122 embedded on the side of the auxiliary heat sink 121 in contact with the plasma source cavity 20, and the tube 122 may not protrude from the side of the auxiliary heat sink 121 in contact with the plasma source cavity 20; or, in some examples, the tube 122 may be hidden inside the auxiliary heat sink 121.

[0101] See some examples. Figure 2The area of ​​the auxiliary heat sink 121 can be set to be larger than the area of ​​the left side 23 of the plasma source cavity 20 and larger than the area of ​​the right side 24 of the plasma source cavity 20.

[0102] In this embodiment of the application, by providing an auxiliary heat sink 121 and a tube body 122, the processing and manufacturing of the auxiliary heat sink 12 can be facilitated.

[0103] In some embodiments, a heat-conducting layer is provided between the auxiliary heat dissipation plate portion 12 and the plasma source cavity 20.

[0104] In some examples, the thermally conductive layer can be a thermally conductive pad or a thermally conductive adhesive.

[0105] In this embodiment, by providing a heat-conducting layer between the auxiliary heat dissipation plate 12 and the plasma source cavity 20, the gap between the auxiliary heat dissipation plate 12 and the plasma source cavity 20 can be eliminated, reducing thermal resistance and improving heat dissipation efficiency.

[0106] In some embodiments, a thermally conductive layer is provided between the auxiliary heat sink portion 12 and the power device.

[0107] In some examples, the thermally conductive layer can be a thermally conductive pad or a thermally conductive adhesive.

[0108] In this embodiment, by providing a thermally conductive layer between the auxiliary heat sink 12 and the power device, the gap between the auxiliary heat sink 12 and the power device can be eliminated, the thermal resistance can be reduced, and the heat dissipation efficiency can be improved.

[0109] Please see Figures 6-7 , Figure 6 This is a simplified structural diagram showing the connection between the first and second water supply pipes and the main heat dissipation plate 11 and the auxiliary heat dissipation plate 12, as provided in some embodiments of this application. Figure 7 A simplified structural diagram showing the connection between the first water supply pipe and the second water supply pipe and the main heat dissipation plate 11 and the auxiliary heat dissipation plate 12, as provided in some embodiments of this application.

[0110] In some embodiments, the heat dissipation system 100 includes a first water supply pipe 13 and a second water supply pipe 14. The first water supply pipe 13 is used to connect to the main heat dissipation plate portion 11, and the second water supply pipe 14 is used to connect to the auxiliary heat dissipation plate portion 12.

[0111] See some examples. Figure 6Two main heat sink sections 11 are connected in series via water pipes, and the main liquid inlet 1151 of one of the main heat sink sections 11 is connected to the first water supply pipe 13. For ease of description, the two main heat sink sections 11 are referred to as the first main heat sink section and the second main heat sink section, respectively. The main liquid inlet 1151 of the first main heat sink section is connected to the first water supply pipe 13, and the cooling water in the first water supply pipe 13 can flow to the first main heat sink section, and after being discharged from the first main heat sink section, it flows to the second main heat sink section; or, in other examples, please refer to Figure 7 The two main heat dissipation plate sections 11 are connected in parallel through water pipes and both main heat dissipation plate sections 11 are connected to the first water supply pipe 13. That is, the cooling water of the first water supply pipe 13 can be divided into two streams, and the two streams of cooling water can flow to the two main heat dissipation plate sections 11 respectively.

[0112] The plasma source cavity 20 has auxiliary heat dissipation plates 12 on opposite sides along the second direction. In some examples, please refer to... Figure 6 Two auxiliary heat dissipation plates 12 are connected in series via water pipes, and one of the auxiliary heat dissipation plates 12 is connected to a second water supply pipe 14. For ease of description, the two auxiliary heat dissipation plates 12 are referred to as the first auxiliary heat dissipation plate and the second auxiliary heat dissipation plate, respectively. The auxiliary liquid inlet 123 of the first auxiliary heat dissipation plate is connected to the first water supply pipe 13. Cooling water in the first water supply pipe 13 can flow to the first auxiliary heat dissipation plate and, after being discharged from the first auxiliary heat dissipation plate, flow to the second auxiliary heat dissipation plate. Alternatively, in other examples, please refer to [reference needed]. Figure 7 The two auxiliary heat dissipation plate sections 12 are connected in parallel through water pipes and both auxiliary heat dissipation plate sections 12 are connected to the second water supply pipe 14. That is, the cooling water of the second water supply pipe 14 can be divided into two streams, and the two streams of cooling water can flow to the two auxiliary heat dissipation plate sections 12 respectively.

[0113] It should be noted that when the two main heat dissipation plates 11 are connected in series through water pipes, the two auxiliary heat dissipation plates 12 can be connected in series through water pipes, or the two auxiliary heat dissipation plates 12 can be connected in parallel through water pipes; when the two main heat dissipation plates 11 are connected in parallel through water pipes, the two auxiliary heat dissipation plates 12 can be connected in series through water pipes, or the two auxiliary heat dissipation plates 12 can be connected in parallel through water pipes.

[0114] It should be noted that the first water supply pipe 13 and the second water supply pipe 14 can be connected to the same refrigeration unit, or the first water supply pipe 13 and the second water supply pipe 14 can be connected to different refrigeration units respectively.

[0115] In this embodiment, the heat dissipation system 100 includes a first water supply pipe 13 and a second water supply pipe 14, with the first water supply pipe 13 connected to the main heat dissipation plate 11 and the second water supply pipe 14 connected to the auxiliary heat dissipation plate 12. This allows the cooling water flowing through the main heat dissipation plate 11 and the auxiliary heat dissipation plate 12 to flow independently without interference, which also helps to improve heat dissipation efficiency.

[0116] In some embodiments, a plurality of temperature sensors are provided on the plasma source cavity 20 to monitor the temperature of the plasma source cavity 20, thereby facilitating the control of the temperature of the cooling water flowing through the main heat sink 11 and the auxiliary heat sink 12, so as to prevent the temperature range of the plasma source cavity 20 from exceeding the preset range value.

[0117] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation system for a plasma source cavity, characterized in that, It includes a plasma source cavity (20) and a heat dissipation structure (10), wherein the heat dissipation structure (10) includes a main heat dissipation plate (11) and an auxiliary heat dissipation plate (12), wherein: The plasma source cavity (20) is provided with the main heat sink portion (11) on both sides opposite to each other along the first direction. The plasma source cavity (20) is provided with the auxiliary heat sink portion (12) on at least one side of the two sides opposite to each other along the second direction. The side area of ​​the plasma source cavity (20) on both sides opposite to each other along the first direction is larger than the side area of ​​the plasma source cavity (20) on both sides opposite to each other along the second direction. The auxiliary heat sink portion (12) is used to install power devices that cooperate with the plasma source cavity (20).

2. The heat dissipation system for the plasma source cavity as described in claim 1, characterized in that, The main heat sink plate (11) is provided with a flow guide groove (114) on the side facing the plasma source cavity (20). The flow guide groove (114) cooperates with the outer side of the plasma source cavity (20) to form a main heat dissipation channel. The main heat sink plate (11) is provided with a main liquid inlet (1151) and a main liquid outlet (1161) that are connected to the main heat dissipation channel.

3. The heat dissipation system for the plasma source cavity as described in claim 2, characterized in that, The main heat dissipation plate (11) includes a first cooling plate (111), a second cooling plate (112), and an intermediate cooling plate (113). The first cooling plate (111) and the second cooling plate (112) are arranged at intervals relative to each other. There is one or more intermediate cooling plates (113), and the intermediate cooling plate (113) is arranged between the first cooling plate (111) and the second cooling plate (112). The first cooling plate (111), the second cooling plate (112), and the intermediate cooling plate (113) are all connected to the plasma source cavity (20). The flow guide groove (114) is arranged on the first cooling plate (111), the second cooling plate (112), and the intermediate cooling plate (113).

4. The heat dissipation system for the plasma source cavity as described in claim 3, characterized in that, The flow guide groove (114) includes a first flow guide groove section (1141), a second flow guide groove section (1142), and an intermediate flow guide groove section (1143), which are respectively disposed on the first cooling plate (111), the second cooling plate (112), and the intermediate cooling plate (113). A first sealing element (117) is provided between one end of the intermediate guide channel section (1143) and the first guide channel section (1141), and the first sealing element (117) is sealed in conjunction with the intermediate cooling plate (113), the first cooling plate (111) and the plasma source cavity (20). A second sealing element (118) is provided between the other end of the intermediate guide channel section (1143) and the second guide channel section (1142), and the second sealing element (118) is in sealed cooperation with the intermediate cooling plate (113), the second cooling plate (112) and the plasma source cavity (20).

5. The heat dissipation system for the plasma source cavity as described in claim 4, characterized in that, The first guide channel section (1141) is in the form of a continuous S-shape or a continuous U-shape; and / or, The second guide channel section (1142) is in the form of a continuous S-shape or a continuous U-shape; and / or, The intermediate guide channel section (1143) is in the form of a continuous S-shape or a continuous U-shape; and / or, The main liquid inlet (1151) and the main liquid outlet (1161) are respectively disposed on the first cooling plate (111) and the second cooling plate (112), and the main liquid inlet (1151) and the main liquid outlet (1161) are disposed far apart from each other along the length direction of the first cooling plate (111) and the second cooling plate (112).

6. The heat dissipation system for the plasma source cavity as described in claim 3, characterized in that, The first cooling plate (111), the second cooling plate (112), and the intermediate cooling plate (113) are connected as one unit through the plasma source cavity (20).

7. The heat dissipation system for the plasma source cavity as described in claim 1, characterized in that, A heat-conducting layer is provided between the surface of the main heat sink (11) that is in contact with the plasma source cavity (20) and the plasma source cavity (20).

8. The heat dissipation system for the plasma source cavity as described in claim 1, characterized in that, An auxiliary heat dissipation channel is formed on the auxiliary heat dissipation plate (12), and an auxiliary liquid inlet (123) and an auxiliary liquid outlet (124) connected to the auxiliary heat dissipation channel are formed on the auxiliary heat dissipation plate (12).

9. The heat dissipation system for the plasma source cavity as described in claim 8, characterized in that, The auxiliary heat dissipation plate (12) includes an auxiliary heat dissipation plate (121) and a tube (122). The tube (122) is mounted on the auxiliary heat dissipation plate (121). The auxiliary heat dissipation plate (121) is connected to the plasma source cavity (20). The auxiliary heat dissipation channel is formed inside the tube (122). The two ends of the tube (122) are the auxiliary liquid inlet (123) and the auxiliary liquid outlet (124), respectively.

10. The heat dissipation system for the plasma source cavity as described in claim 1, characterized in that, A heat-conducting layer is provided between the auxiliary heat dissipation plate (12) and the plasma source cavity (20).

11. The heat dissipation system for the plasma source cavity as described in any one of claims 1-10, characterized in that, The heat dissipation system includes a first water supply pipe (13) and a second water supply pipe (14). The two main heat dissipation plates (11) are connected in series via water pipes, and one of the main heat dissipation plates (11) is connected to the first water supply pipe (13); or, the two main heat dissipation plates (11) are connected in parallel via water pipes, and both of the main heat dissipation plates (11) are connected to the first water supply pipe (13); and / or, The plasma source cavity (20) is provided with auxiliary heat dissipation plate parts (12) on opposite sides along the second direction. The two auxiliary heat dissipation plate parts (12) are connected in series through water pipes and one of the auxiliary heat dissipation plate parts (12) is connected to the second water supply pipe (14). Alternatively, the two auxiliary heat dissipation plate parts (12) are connected in parallel through water pipes and both of the auxiliary heat dissipation plate parts (12) are connected to the second water supply pipe (14).

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