A low-stress circuit board for smart electronic products

Abstract

This utility model discloses a low-stress circuit board for intelligent electronic products, belonging to the field of circuit boards. It includes a main board body, a stress isolation groove, a component assembly area, and an elastic element. By providing an elliptical stress isolation groove, the smooth curve helps to evenly distribute stress to both ends of the groove. The arc-shaped design at the ends can avoid stress concentration and tearing caused by sharp corners. By assembling components in different areas, heating elements and heat-sensitive elements can be separated, reducing the heat conduction path. Combined with the elastic element filled in the groove, the stress transmission is further blocked by absorbing and dispersing mechanical impacts. The elastic element can also adapt to deformation, avoiding excessive stress concentration at the end of the groove and the risk of the circuit board tearing at the groove opening. This greatly reduces the damage caused by external impacts affecting component assembly and stress generated by component thermal expansion. Moreover, the groove is in a sealed state after filling, which can also prevent the groove from being damp and corroded by dust.

Description

Technical Field

[0001] This utility model belongs to the field of circuit boards, and specifically relates to a circuit board for low-stress intelligent electronic products. Background Technology

[0002] Circuit boards make circuits miniaturized and more intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. They are classified into three main categories according to the number of layers: single-sided boards, double-sided boards, and multi-layer circuit boards.

[0003] First, there is the single-sided board. On the most basic PCB, the components are concentrated on one side, and the wires are concentrated on the other side. Because the wires only appear on one side, this type of PCB is called a single-sided circuit board. Single-sided boards are usually simple to manufacture and inexpensive, but the disadvantage is that they cannot be applied to very complex products.

[0004] Double-sided boards are an extension of single-sided boards. When single-layer wiring cannot meet the needs of electronic products, double-sided boards are used. Both sides have copper cladding and traces, and vias can be used to connect the lines between the two layers to form the required network connection.

[0005] Multilayer boards are printed circuit boards with three or more conductive pattern layers and insulating materials laminated between them, and the conductive patterns are interconnected as required. Multilayer circuit boards are a product of the development of electronic information technology towards high speed, multi-functionality, large capacity, small size, thinness and light weight.

[0006] However, in the use of existing technology, circuit boards used in electronic products are equipped with many electronic components. After these electronic components are assembled on the circuit board, since the circuit board is a simple whole board, it is easily damaged by external impact or stress transmission from bending. At the same time, different components on the circuit board may have different thermal expansion. This can easily cause stress due to thermal expansion mismatch between components, resulting in damage to the components or the board body. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] To overcome the shortcomings of existing technologies, a low-stress circuit board for intelligent electronic products is proposed. This addresses the problem that in existing technologies, circuit boards for electronic products are equipped with many electronic components. After these components are assembled on the circuit board, the circuit board, being a simple, solid board, is easily damaged by external impacts or stress transmission from bending. At the same time, different components on the circuit board may have different thermal expansion rates, which can easily lead to stress caused by thermal expansion mismatch between components due to heat transfer, resulting in damage to the components or the board itself.

[0009] (II) Technical Solution

[0010] This utility model is achieved through the following technical solution: This utility model proposes a circuit board for low-stress intelligent electronic products, the structure of which includes a main board body, and the corners of the main board body are provided with rounded chamfers.

[0011] It also includes stress isolation grooves, which symmetrically divide the component assembly area on the motherboard body. The sides of the component assembly area are symmetrical stress isolation grooves. The stress isolation grooves are symmetrically arranged on the motherboard body. The stress isolation grooves are elliptical in shape and are filled with elastic elements.

[0012] Furthermore, the width of the stress isolation groove is greater than 0.5 mm.

[0013] Furthermore, the elastic element is made of an elastic and insulating material, such as silicone, preferably RTV silicone.

[0014] Furthermore, it also includes a heat dissipation support plate and a pad rod. The heat dissipation support plate is fixedly connected to the pad rod, and the pad rod is assembled on an elastic element. The heat dissipation support plate has the same number as the component assembly area and is arranged above the component assembly area one by one.

[0015] Furthermore, the heat dissipation support plate is made of an insulating and thermally conductive material, such as alumina, aluminum nitride, or silicon carbide ceramics, with silicon carbide sheets being preferred.

[0016] Furthermore, the heat dissipation support plate is provided with foot holes and heat dissipation holes. The foot holes are located on the side of the heat dissipation holes. The foot holes are used for the passage of component feet, and the heat dissipation holes are used for bottom ventilation and heat dissipation of components.

[0017] Furthermore, it also includes an assembly tube, which is a tube body with a threaded groove at the inner ring. The assembly tube passes through the elastic element and is fixedly connected to the elastic element. The bottom of the pad rod is fixed with a screw that matches the threaded groove at the inner ring of the assembly tube. The pad rod is locked to the assembly tube by the screw.

[0018] Furthermore, it also includes an adhesive layer, which is used for reinforcing the connection between the elastic element and the main body and the assembly tube.

[0019] Furthermore, the adhesive layer is an adhesive, preferably an RTV silicone adhesive or a two-component silicone adhesive.

[0020] Furthermore, the assembly tube is made of insulating material, such as polypropylene or polyethylene.

[0021] (III) Beneficial Effects

[0022] One of the above technical solutions has the following advantages or beneficial effects:

[0023] By incorporating elliptical stress-dissipating grooves, the smooth curves help to evenly distribute stress to both ends of the groove. The arc-shaped design at the ends prevents stress concentration and tearing caused by sharp corners. By assembling components in separate areas, heating elements and heat-sensitive elements can be isolated, reducing heat conduction paths and stress caused by thermal expansion mismatch. Combined with the elastic element filled in the groove, stress transmission is further blocked by absorbing and dispersing mechanical impacts. The elastic element can also adapt to deformation, avoiding excessive stress concentration at the end of the groove and the risk of the circuit board tearing at the groove. This greatly reduces the impact of external impacts on component assembly and damage caused by stress from component thermal expansion. Furthermore, the groove is sealed after filling, preventing moisture and dust corrosion.

[0024] Alternatively, the elastic material of this utility model can be selected as an insulating elastic material, such as silicone, which can significantly increase the creepage distance after the groove is filled, preventing arcing or short circuits caused by dust and moisture between high-voltage components. Attached Figure Description

[0025] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0026] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0027] Figure 2 This utility model Figure 1 A magnified structural diagram of A in the middle;

[0028] Figure 3 This is a schematic diagram of the structure of this utility model;

[0029] In the diagram: Main board body - 1, Stress isolation groove - 2, Component assembly area - 3, Heat dissipation support plate - 4, Elastic component - 5, Assembly tube - 6, Pad rod - 7, Adhesive layer - 8, Foot hole - 402, Heat dissipation hole - 403. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the embodiments, but the implementation of the present invention is not limited thereto.

[0031] Example 1:

[0032] This utility model provides a circuit board for low-stress intelligent electronic products: its structure includes a main board body 1, and the corners of the main board body 1 are provided with rounded chamfers;

[0033] It also includes a stress isolation groove 2, which symmetrically divides the component assembly area 3 on the main board body 1. The side of the component assembly area 3 is a symmetrical stress isolation groove 2. The stress isolation groove 2 is symmetrically arranged on the main board body 1. The stress isolation groove 2 is elliptical and is filled with elastic elements 5.

[0034] The width of the stress isolation groove 2 is greater than 1.5 mm.

[0035] The elastic element 5 is made of silicone, preferably RTV silicone.

[0036] In use, the rounded chamfered corners of the main board 1 reduce tearing at the edges caused by external impacts. The elliptical stress-isolation groove 2, with its smooth curve, helps to evenly distribute stress at both ends of the groove. The rounded ends prevent stress concentration at sharp corners, thus avoiding tearing of the main board 1 at the stress-isolation groove 2. The stress-isolation groove 2 forms the component assembly area 3. This area-based component assembly method separates heating elements from heat-sensitive elements, reduces heat conduction paths, and lowers stress caused by thermal expansion mismatch between components. Combined with the silicone-filled elastic material within the groove... The elastic component 5 absorbs and disperses mechanical impacts through elasticity, further blocking stress transmission. The elastic component 5 can also adapt to deformation, avoiding excessive stress concentration at the end of the slot and the risk of the circuit board tearing at the slot. It greatly reduces the impact of external impacts on component assembly and damage caused by stress generated by component thermal expansion. Moreover, the slot is in a sealed state after filling, which can also prevent the slot from being damp and corroded by dust. The silicone elastic component 5 can also significantly increase the creepage distance after the slot is filled, preventing arcing or short circuits caused by dust and moisture between high-voltage components.

[0037] Example 2:

[0038] Compared to Embodiment 1, this embodiment also includes a heat dissipation support plate 4 and a pad rod 7. The heat dissipation support plate 4 is fixedly connected to the pad rod 7. The pad rod 7 is assembled on the elastic member 5. The heat dissipation support plate 4 has the same number as the component assembly area 3 and is arranged above the component assembly area 3 in a corresponding manner.

[0039] The heat dissipation support plate 4 is made of insulating and thermally conductive materials, such as alumina, aluminum nitride or silicon carbide ceramic materials, with silicon carbide sheets being preferred.

[0040] The heat dissipation support plate 4 is provided with a foot hole 402 and a heat dissipation hole 403. The foot hole 402 is located on the side of the heat dissipation hole 403. The foot hole 402 is used for the passage of the component foot, and the heat dissipation hole 403 is used for bottom ventilation and heat dissipation of the component.

[0041] In order to increase the assembly safety of the component feet, an insulating sleeve or insulating tube or other insulating material is added between the foot hole 402 and the main board body 1 to form a wrapping component (not shown in the figure).

[0042] In use, the heat dissipation support plate 4 and the main board 1 are separated by a certain distance by the pad rod 7. The heat dissipation support plate 4 is provided with corresponding component pin holes 402 and heat dissipation holes 403. When the components are assembled, the pins pass through the pin holes 402 of the heat dissipation support plate 4 and are soldered to the corresponding positions on the circuit board. The components are supported by the heat dissipation support plate 4 during assembly. When the circuit board is in use, only the pins are disconnected from the main board 1, which can reduce the stress generated inside the main board 1 due to the heat of the components themselves. After the main body of the component comes into contact with the heat dissipation support plate 4, the heat dissipation support plate 4 can quickly dissipate heat through its insulating and thermally conductive properties, reducing the mutual influence of thermal expansion of components in the same area and enabling rapid heat dissipation of the components. The way the pad rod 7 is mounted on the elastic element 5 can also avoid stress warping caused by the different materials of the heat dissipation support plate 4, the pad rod 7 and the main board 1. The rest of the structure and effect remain unchanged.

[0043] Example 3:

[0044] Compared to the previous embodiment, this embodiment also includes an assembly tube 6, which is a tube with a threaded groove at the inner ring. The assembly tube 6 passes through the elastic member 5 and is fixedly connected to the elastic member 5. The bottom of the pad rod 7 is fixed with a screw (not shown in the figure) that matches the threaded groove at the inner ring of the assembly tube 6. The pad rod 7 is locked to the assembly tube 6 by the screw.

[0045] The assembly tube 6 is made of insulating material, such as polypropylene or polyethylene.

[0046] In use, the assembly tube 6 is inserted and fixed through the elastic element 5, so that the main body 1 can be assembled through the assembly tube 6 during use. Auxiliary parts such as heat dissipation support plate 4 can also be assembled on the assembly tube 6. Since the assembly tube 6 is assembled on the elastic element 5, the assembly is elastic, which can reduce the mutual influence caused by the vibration of different parts and increase the stability of use. The rest of the structure and effect remain unchanged.

[0047] Example 4:

[0048] Compared to the previous embodiments, this embodiment also includes an adhesive layer 8, which is used for reinforcing connection between the elastic element 5 and the main body 1 and the assembly tube 6.

[0049] The adhesive layer 8 is an adhesive, preferably an RTV silicone adhesive or a two-component silicone adhesive.

[0050] When in use, adhesive layer 8 can increase the mechanical reliability of the connection, but the adhesive area must be thoroughly cleaned before use to avoid affecting the bonding effect. The rest of the structure and effect remain unchanged.

[0051] In the description of this utility model, it should be noted that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0052] The control method of this utility model is to control the device by manually starting and stopping the switch. The wiring diagram of the power element and the supply of power are common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and wiring layout will not be explained in detail.

[0053] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0054] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A circuit board for low-stress intelligent electronic products, the structure of which includes a main board body (1), wherein the corners of the main board body (1) are provided with rounded chamfers; Its features are: It also includes stress isolation grooves (2), which symmetrically divide the component assembly area (3) on the main board body (1). The side of the component assembly area (3) is a symmetrical stress isolation groove (2). The stress isolation grooves (2) are symmetrically arranged on the main board body (1). The stress isolation grooves (2) are elliptical and are filled with elastic elements (5).

2. The circuit board for low-stress intelligent electronic products according to claim 1, characterized in that: The width of the stress isolation groove (2) is greater than 1.5 mm.

3. The circuit board for low-stress intelligent electronic products according to claim 1, characterized in that: The elastic element (5) is made of an elastic and insulating material.

4. The circuit board for low-stress intelligent electronic products according to claim 1, characterized in that: It also includes a heat dissipation support plate (4) and a pad rod (7). The heat dissipation support plate (4) is fixedly connected to the pad rod (7). The pad rod (7) is mounted on the elastic member (5). The heat dissipation support plate (4) has the same number as the component assembly area (3) and is arranged above the component assembly area (3) one by one.

5. A circuit board for low-stress intelligent electronic products according to claim 4, characterized in that: The heat dissipation support plate (4) is made of an insulating and thermally conductive material.

6. A circuit board for low-stress intelligent electronic products according to claim 4, characterized in that: The heat dissipation support plate (4) is provided with a foot hole (402) and a heat dissipation hole (403). The foot hole (402) is located on the side of the heat dissipation hole (403). The foot hole (402) is used for the passage of the component foot, and the heat dissipation hole (403) is used for bottom ventilation and heat dissipation of the component.

7. A circuit board for low-stress intelligent electronic products according to claim 4, characterized in that: It also includes an assembly tube (6), which is a tube with a threaded groove at the inner ring. The assembly tube (6) passes through the elastic element (5) and is fixedly connected to the elastic element (5). The bottom of the pad rod (7) is fixed with a screw that matches the threaded groove at the inner ring of the assembly tube (6). The pad rod (7) is locked to the assembly tube (6) by the screw.

8. A circuit board for low-stress intelligent electronic products according to claim 7, characterized in that: It also includes an adhesive layer (8) for reinforcing the connection between the elastic element (5) and the main body (1) and the assembly tube (6).

9. A circuit board for low-stress intelligent electronic products according to claim 8, characterized in that: The adhesive layer (8) is glue.

10. A circuit board for low-stress intelligent electronic products according to claim 9, characterized in that: The adhesive layer (8) is made of RTV silicone adhesive or two-component silicone glue, the elastic element (5) is made of RTV silicone, the assembly tube (6) is made of insulating material, and the heat dissipation support plate (4) is made of silicon carbide sheet.

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