A high-temperature-resistant multilayer printed circuit board

Abstract

This utility model relates to the field of multilayer printed circuit board technology, specifically to a high-temperature resistant multilayer printed circuit board, comprising a circuit board body, a copper plate fixedly connected to the side of the circuit board body, a first heat dissipation fin on one side of the circuit board body, and a second heat dissipation fin on the other side of the circuit board body. A connecting mechanism is provided between the first and second heat dissipation fins, the connecting mechanism including a first connecting rod, a through groove, a first snap-fit, a second connecting rod, and a slot. In this utility model, the first and second heat dissipation fins are connected to the copper plate via thermally conductive silicone grease. The thermally conductive silicone grease conducts heat, and the heat is dissipated through the two fins, increasing the contact area with the gas and achieving better heat conduction. During assembly, the first and second heat dissipation fins are pre-fixed through a snap-fit ​​design, making installation more convenient.

Description

Technical Field

[0001] This utility model relates to the field of multilayer printed circuit board technology, specifically a high-temperature resistant multilayer printed circuit board. Background Technology

[0002] Circuit boards make circuits miniaturized and more intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Especially now that the requirements for circuit boards are getting higher and higher, multilayer circuit boards have significantly improved performance compared to single-layer circuit boards, so the demand for multilayer circuit boards is also increasing.

[0003] A search revealed that CN221306180U discloses a high-temperature resistant multilayer printed circuit board, comprising a multilayer circuit board body, a protective component mounted on the top of the multilayer circuit board body, a heat dissipation component installed inside the protective component, and a mounting plate. The mounting plate is mounted on the top of the multilayer circuit board body, and positioning plates are fixedly mounted on both sides of the top of the multilayer circuit board body. Inserts are fixedly mounted on both sides of the bottom of the mounting plate. Rectangular grooves are formed inside the two positioning plates, and two fastening bolts are threaded into the interior of each of the two positioning plates. This high-temperature resistant multilayer printed circuit board utilizes a combination of a heat-absorbing plate, a groove, a dustproof mesh, a bracket, and an electric fan. The heat-absorbing plate absorbs heat from the multilayer circuit board body, and the two electric fans disperse the heat, accelerating the airflow on the outer surface of the multilayer circuit board body. The dustproof mesh in the aforementioned patent requires regular maintenance and disassembly for cleaning. However, the fixed dustproof mesh is cumbersome to install and remove, making it inconvenient.

[0004] Furthermore, existing multilayer printed circuit boards typically rely on blind vias and copper foil for heat dissipation during use. However, using only a single copper foil for heat conduction results in poor thermal conductivity, leading to poor high-temperature resistance when used in high-frequency or high-temperature environments.

[0005] Therefore, a high-temperature resistant multilayer printed circuit board is proposed to solve the problems mentioned above. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a high-temperature resistant multilayer printed circuit board, which solves the problem that multilayer printed circuit boards typically rely on blind vias and copper foil for heat dissipation. However, the heat conduction efficiency is poor due to the reliance on a single copper foil, resulting in poor high-temperature resistance when used in high-frequency or high-temperature environments.

[0007] To achieve the above objectives, this utility model provides the following technical solution: It includes a circuit board body, with a copper plate fixedly connected to the side of the circuit board body. A first heat dissipation fin is provided on one side of the circuit board body, and a second heat dissipation fin is provided on the other side of the circuit board body. A connecting mechanism is provided between the first and second heat dissipation fins. The connecting mechanism includes a first connecting rod, a through groove, a first buckle, a second connecting rod, and a slot. The first connecting rod is fixedly connected to both ends of the first heat dissipation fin. The through groove is opened on the outside of the first connecting rod. The first buckle is fixedly connected to the inside of the through groove. The second connecting rod is fixedly connected to both ends of the second heat dissipation fin. The slot is opened on the outside of the second connecting rod. A top plate is fixedly connected to the top of both the first and second heat dissipation fins. A gas collection box is provided on the top of both the first and second heat dissipation fins.

[0008] Preferably, one side of the first heat dissipation fin and the second heat dissipation fin are attached to a copper plate, and one side of the copper plate is coated with thermally conductive silicone grease.

[0009] Preferably, the second docking rod is slidably inserted into one end of the first docking rod, and the end of the first buckle is engaged in the inside of the slot.

[0010] Preferably, a connecting block is fixedly connected to the bottom of the air collection box, a fan is fixedly connected inside the air collection box, a filter screen is provided on the top of the air collection box, a first air outlet pipe is fixedly connected to the bottom of the air collection box, and a second air outlet pipe is fixedly connected to the bottom of the air collection box.

[0011] Preferably, there are two second air outlet pipes, with the ends of the two second air outlet pipes respectively placed at one end of the first heat dissipation fin and the second heat dissipation fin, and the first air outlet pipes are equidistantly distributed at the bottom of the air collection box.

[0012] Preferably, an installation mechanism is provided at the connection between the air collection box and the filter screen. The installation mechanism includes a fixing post, a second buckle, a side plate, and a protrusion. The fixing post is fixedly connected to both sides of the air collection box, the second buckle is fixedly connected to the outside of the air collection box, the side plate is fixedly connected to both ends of the filter screen frame, and the protrusion is fixedly connected to the outside of the filter screen.

[0013] Preferably, the outer side of the protrusion has a groove, and the end of the second buckle is engaged inside the groove.

[0014] Preferably, the side plate has a snap-fit ​​groove on its outer side, and the side plate is connected to the fixing post through the snap-fit ​​groove.

[0015] Compared with the prior art, this utility model provides a high-temperature resistant multilayer printed circuit board, which has the following beneficial effects:

[0016] 1. The first and second heat dissipation fins are connected to the copper plate by thermal grease. The thermal grease conducts heat and dissipates heat through the two fins, increasing the contact area with the gas and achieving better heat conduction. During assembly, the first and second heat dissipation fins are pre-fixed by snap-fit, making installation more convenient.

[0017] 2. The filter screen is fixed by a snap-fit ​​installation structure, making it easier to clean and disassemble. The gas blown out by the first air outlet can dissipate heat from the surface of the circuit board, while the second air outlet can assist in heat dissipation for the first and second heat dissipation fins, improving the heat dissipation effect of the two fins and achieving better high-temperature resistance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the second heat dissipation fin structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the filter structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the position and structure of the first air outlet pipe of this utility model.

[0022] In the diagram: 1. Circuit board body; 2. Copper plate; 3. First heat sink fin; 4. Second heat sink fin; 5. First connecting rod; 6. Through slot; 7. First buckle; 8. Second connecting rod; 9. Slot; 10. Top plate; 11. Connecting block; 12. Air collection box; 13. Fixing post; 14. Fan; 15. Second buckle; 16. Filter screen; 17. Side plate; 18. Protrusion; 19. First air outlet pipe; 20. Second air outlet pipe. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example:

[0025] Please see Figure 1 - Figure 4This embodiment of a high-temperature resistant multilayer printed circuit board includes a circuit board body 1, a copper plate 2 fixedly connected to the side of the circuit board body 1, a first heat dissipation fin 3 provided on one side of the circuit board body 1, a second heat dissipation fin 4 provided on the other side of the circuit board body 1, a connecting mechanism provided between the first heat dissipation fin 3 and the second heat dissipation fin 4, the connecting mechanism including a first connecting rod 5, a through groove 6, a first buckle 7, a second connecting rod 8 and a slot 9, the first connecting rod 5 fixedly connected to both ends of the first heat dissipation fin 3, the through groove 6 opened on the outside of the first connecting rod 5, the first buckle 7 fixedly connected to the inside of the through groove 6, the second connecting rod 8 fixedly connected to both ends of the second heat dissipation fin 4, the slot 9 opened on the outside of the second connecting rod 8, a top plate 10 fixedly connected to the top of both the first heat dissipation fin 3 and the second heat dissipation fin 4, and a gas collection box 12 provided on the top of the first heat dissipation fin 3 and the second heat dissipation fin 4. The structural configuration of the circuit board body 1 is well known in the art and will not be described in detail here.

[0026] The copper plate 2 and the copper foil layer inside the circuit board body 1 are integrally formed. The first heat dissipation fin 3 and the second heat dissipation fin 4 are connected to the copper plate 2 through thermal grease. The thermal grease conducts heat and the heat is dissipated through the two fins, increasing the contact area with the gas and achieving better heat conduction. During assembly, the first heat dissipation fin 3 and the second heat dissipation fin 4 are slidably inserted into the second connecting rod 8 and the first connecting rod 5, and are engaged with the first buckle 7 and the slot 9, achieving the effect of pre-fixing the assembly of the first heat dissipation fin 3 and the second heat dissipation fin 4, making installation more convenient.

[0027] Please see Figure 1 - Figure 2 The first heat dissipation fin 3 and the second heat dissipation fin 4 are attached to one side of the copper plate 2. One side of the copper plate 2 is coated with thermal grease. The second docking rod 8 is slidably inserted into one end of the first docking rod 5. The end of the first buckle 7 is engaged in the inside of the slot 9.

[0028] Furthermore, a connecting block 11 is fixedly connected to the bottom of the air collection box 12, a fan 14 is fixedly connected inside the air collection box 12, a filter screen 16 is provided on the top of the air collection box 12, a first air outlet pipe 19 is fixedly connected to the bottom of the air collection box 12, a second air outlet pipe 20 is fixedly connected to the bottom of the air collection box 12, and an installation mechanism is provided at the connection between the air collection box 12 and the filter screen 16. The installation mechanism includes a fixing post 13, a second buckle 15, a side plate 17, and a protrusion 18. The fixing post 13 is fixedly connected to both sides of the air collection box 12, the second buckle 15 is fixedly connected to the outside of the air collection box 12, the side plate 17 is fixedly connected to both ends of the mesh frame of the filter screen 16, and the protrusion 18 is fixedly connected to the outside of the filter screen 16.

[0029] The filter screen 16 is connected to the fixing post 13 on the air collection box 12 via the side plate 17. At the same time, the second buckle 15 is engaged with one side of the protrusion 18, forming a double-locking and fixing effect on the filter screen 16. The locking and fixing structure makes it easier to clean and disassemble the filter screen 16. The fan 14 can blow air out through the first air outlet pipe 19 and the second air outlet pipe 20. The air blown out by the first air outlet pipe 19 can dissipate heat on the surface of the circuit board body 1, while the second air outlet pipe 20 can provide auxiliary heat dissipation for the first heat dissipation fins 3 and the second heat dissipation fins 4, improving the heat dissipation effect of the two fins and achieving better high temperature resistance.

[0030] Please see Figure 3 - Figure 4 There are two second exhaust pipes 20. The ends of the two second exhaust pipes 20 are respectively placed at one end of the first heat dissipation fin 3 and the second heat dissipation fin 4. The first exhaust pipes 19 are evenly distributed at the bottom of the air collection box 12. The outer side of the protrusion 18 is provided with a groove. The end of the second buckle 15 is engaged in the inside of the groove. The outer side of the side plate 17 is provided with a snap-fit ​​groove. The side plate 17 is connected to the fixing post 13 through the snap-fit ​​groove.

[0031] The working principle of the above embodiments is as follows:

[0032] The copper plate 2 and the copper foil layer inside the circuit board body 1 are integrally formed. The first heat dissipation fin 3 and the second heat dissipation fin 4 are connected to the copper plate 2 by thermal grease. The thermal grease conducts heat, and the heat is dissipated through the two fins, increasing the contact area with the gas and achieving better heat conduction. During assembly, the first heat dissipation fin 3 and the second heat dissipation fin 4 are slidably inserted into the second connecting rod 8 and the first connecting rod 5, and are engaged by the first buckle 7 and the slot 9, achieving a pre-fixed assembly effect for the first heat dissipation fin 3 and the second heat dissipation fin 4, making installation more convenient.

[0033] The filter screen 16 is connected to the fixing post 13 on the air collection box 12 via the side plate 17. At the same time, the second buckle 15 is engaged with one side of the protrusion 18, forming a double-locking and fixing effect on the filter screen 16. The locking and fixing structure makes it easier to clean and disassemble the filter screen 16. The fan 14 can blow air out through the first air outlet pipe 19 and the second air outlet pipe 20. The air blown out by the first air outlet pipe 19 can dissipate heat on the surface of the circuit board body 1, while the second air outlet pipe 20 can provide auxiliary heat dissipation for the first heat dissipation fins 3 and the second heat dissipation fins 4, improving the heat dissipation effect of the two fins and achieving better high temperature resistance.

[0034] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature resistant multilayer printed circuit board, characterized in that: The circuit board includes a circuit board body (1), a copper plate (2) is fixedly connected to the side of the circuit board body (1), a first heat dissipation fin (3) is provided on one side of the circuit board body (1), a second heat dissipation fin (4) is provided on the other side of the circuit board body (1), and a connecting mechanism is provided between the first heat dissipation fin (3) and the second heat dissipation fin (4). The connecting mechanism includes a first connecting rod (5), a through groove (6), a first buckle (7), a second connecting rod (8), and a slot (9). The first connecting rod (5) is fixedly connected to the copper plate (2). At both ends of the first heat dissipation fin (3), the through groove (6) is opened on the outside of the first connecting rod (5), the first buckle (7) is fixedly connected to the inside of the through groove (6), the second connecting rod (8) is fixedly connected to both ends of the second heat dissipation fin (4), the slot (9) is opened on the outside of the second connecting rod (8), the top of the first heat dissipation fin (3) and the second heat dissipation fin (4) are both fixedly connected to the top of the top plate (10), and the top of the first heat dissipation fin (3) and the second heat dissipation fin (4) are provided with an air collection box (12).

2. The high-temperature resistant multilayer printed circuit board according to claim 1, characterized in that: One side of the first heat dissipation fin (3) and the second heat dissipation fin (4) are attached to the copper plate (2), and one side of the copper plate (2) is coated with thermally conductive silicone grease.

3. The high-temperature resistant multilayer printed circuit board according to claim 1, characterized in that: The second docking rod (8) is slidably inserted into one end of the first docking rod (5), and the end of the first buckle (7) is engaged in the inside of the slot (9).

4. The high-temperature resistant multilayer printed circuit board according to claim 3, characterized in that: A connecting block (11) is fixedly connected to the bottom of the air collection box (12), a fan (14) is fixedly connected inside the air collection box (12), a filter screen (16) is provided on the top of the air collection box (12), a first air outlet pipe (19) is fixedly connected to the bottom of the air collection box (12), and a second air outlet pipe (20) is fixedly connected to the bottom of the air collection box (12).

5. A high-temperature resistant multilayer printed circuit board according to claim 4, characterized in that: There are two second air outlet pipes (20), and the ends of the two second air outlet pipes (20) are respectively placed at one end of the first heat dissipation fin (3) and the second heat dissipation fin (4). The first air outlet pipes (19) are evenly distributed at the bottom of the air collection box (12).

6. A high-temperature resistant multilayer printed circuit board according to claim 5, characterized in that: An installation mechanism is provided at the connection between the air collection box (12) and the filter screen (16). The installation mechanism includes a fixing post (13), a second buckle (15), a side plate (17), and a protrusion (18). The fixing post (13) is fixedly connected to both sides of the air collection box (12), the second buckle (15) is fixedly connected to the outside of the air collection box (12), the side plate (17) is fixedly connected to both ends of the mesh frame of the filter screen (16), and the protrusion (18) is fixedly connected to the outside of the filter screen (16).

7. A high-temperature resistant multilayer printed circuit board according to claim 6, characterized in that: The outer side of the protrusion (18) is provided with a groove, and the end of the second buckle (15) is engaged inside the groove.

8. A high-temperature resistant multilayer printed circuit board according to claim 6, characterized in that: The side plate (17) has a snap-fit ​​groove on its outer side, and the side plate (17) is connected to the fixing post (13) through the snap-fit ​​groove.

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