A thin-film low-DCR power inductor circuit board based on laser optical alignment
By employing technologies such as laser optical alignment and multilayer copper foil conductive films, the problems of high positioning accuracy and large DCR in traditional circuit boards have been solved, resulting in a high-precision positioning and low-resistance thin-film type low-DCR power inductor circuit board, which improves electrical performance and reliability.
Patent Information
- Application Number
- CN202522565981.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-03
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-12-03
AI Technical Summary
Traditional power inductor circuit boards use mechanical alignment, which results in limited positioning accuracy, wiring misalignment, and a large DCR (Displacement Curve Count), making them unsuitable for applications requiring high precision and low DCR.
The thin-film low-DCR power inductor circuit board adopts laser optical alignment. Through laser alignment marks and components such as multi-layer copper foil conductive film, flat copper wires, and I-shaped ferrite cores, it achieves precise positioning and low-resistance wiring. Combined with the insulation protection layer and laser welding, it improves the stability of electrical connection.
It achieves high-precision positioning, reduces line resistance, minimizes inter-component interference, improves electrical performance and reliability, and is suitable for high-precision, low-DCR application requirements.
Smart Images
Figure CN224947763U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component technology, specifically to a thin-film low-DCR power inductor circuit board based on laser optical alignment. Background Technology
[0002] Traditional power inductor circuit boards mostly use mechanical alignment to complete circuit wiring and component installation. This method has limited positioning accuracy, which can easily lead to circuit wiring misalignment and power inductor component installation deviation, thus affecting the stability of electrical connections. At the same time, the circuit structure of ordinary circuit boards has high resistance, large DCR (DC resistance), and insufficient current carrying capacity. Thin-film circuit boards are more difficult to align due to their thinner substrate, and improper component layout can easily lead to mutual interference. All of the above problems reduce the performance and reliability of power inductor circuit boards, making them unsuitable for high-precision, low-DCR application scenarios. Utility Model Content
[0003] The purpose of this invention is to provide a thin-film low-DCR power inductor circuit board based on laser optical alignment, so as to solve the technical problem that existing circuit boards are difficult to adapt to high precision and low DCR requirements.
[0004] To achieve the above objectives, this utility model provides the following technical solution:
[0005] A thin-film low-DCR power inductor circuit board based on laser optical alignment includes a substrate, a thin-film circuit layer, multiple power inductor components, and at least one set of laser alignment marks.
[0006] A thin-film circuit layer is disposed on at least one surface of the substrate; each power inductor component is electrically connected to the thin-film circuit layer, and each power inductor component is distributed in an array in the area of the substrate corresponding to the thin-film circuit layer; a laser alignment mark is disposed on the substrate and is disposed corresponding to the wiring area of the thin-film circuit layer and the preset mounting area of each power inductor component, for positioning the wiring area of the thin-film circuit layer and the mounting position of the power inductor components in the laser optical alignment process.
[0007] As a preferred embodiment of this utility model, the laser alignment mark includes at least two positioning marks, each positioning mark being disposed in a diagonal area of the substrate, and each positioning mark corresponding to a reference point of at least one wiring unit of the thin film circuit layer.
[0008] As a preferred embodiment of this utility model, the thin film circuit layer includes at least two conductive thin films, and the conductive thin films are electrically connected to each other through metallized vias; the conductive thin films are made of copper foil and have a thickness of 5μm-20μm.
[0009] As a preferred embodiment of this utility model, the power inductor component includes a magnetic core, a winding, and pins; the winding is wound around the magnetic core, one end of the pin is electrically connected to the winding, and the other end of the pin is welded to the thin film circuit layer; the welding point between the pin and the thin film circuit layer is a solder joint formed by laser welding process, and the contact area between the solder joint and the thin film circuit layer is not less than 0.5 mm².
[0010] As a further embodiment of this utility model, the winding uses flat copper wire with a cross-sectional width of 0.8mm-1.5mm and a thickness of 0.1mm-0.3mm.
[0011] As a preferred embodiment of this utility model, the substrate is made of polyimide film material with a thickness of 25μm-100μm; at least one positioning hole is provided on the substrate, which cooperates with the laser alignment mark for auxiliary positioning in the laser optical alignment process.
[0012] As a preferred embodiment of this utility model, the spacing between the mounting areas of two adjacent power inductor components is 2mm-5mm; the wiring of the thin film circuit layer corresponding to the adjacent power inductor components adopts a differential layout.
[0013] As a further preferred embodiment of this utility model, the surface of the thin film circuit layer is covered with an insulating protective layer; the insulating protective layer is a polyimide coating with a thickness of 3μm-10μm; a soldering window is provided in the area of the insulating protective layer corresponding to the pin of the power inductor component.
[0014] As a preferred embodiment of this utility model, the laser alignment mark is cross-shaped, and the line width of the laser alignment mark is 0.1mm-0.3mm; the deviation between the center of the laser alignment mark and the corresponding wiring area or installation position reference point is no greater than 0.05mm.
[0015] As a further preferred embodiment of this utility model, the magnetic core is made of ferrite material and is shaped like an I-beam; the winding is wound around the middle column of the I-beam magnetic core, and the number of turns of the winding is 4-8.
[0016] Compared with existing technologies, the thin-film low-DCR power inductor circuit board based on laser optical alignment provided by this utility model has the following advantages:
[0017] This invention uses a substrate as a carrier and employs laser alignment marks and positioning holes to improve the positioning accuracy of thin-film circuit layer wiring and power inductor component installation, reducing positional deviations. The thin-film circuit layer utilizes multi-layer copper foil conductive film and a low-impedance wiring structure, reducing line resistance and meeting the design requirements of low DCR. Metallized vias further expand wiring space and enhance electrical connectivity. The power inductor component uses flat copper wire windings and an I-shaped ferrite core, which reduces its own resistance and optimizes magnetic performance. An array-distributed differential distribution line reduces interference and signal crosstalk between components. An insulating protective layer protects the thin-film circuit layer, and laser-welded solder joints enhance the connection between the power inductor component and the thin-film circuit layer. Overall, this circuit board combines low DCR, precise positioning, and stable operation, improving electrical performance and application reliability, and meeting the requirements of thin-film structures. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.
[0020] Figure label:
[0021] 1. Substrate; 2. Thin film circuit layer; 3. Power inductor assembly; 4. Laser alignment mark; 5. Positioning hole. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.
[0023] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.
[0024] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present invention should be understood according to the specific circumstances.
[0025] See Figure 1 As shown, this utility model discloses a thin-film low-DCR power inductor circuit board based on laser optical alignment, comprising a substrate 1, a thin-film circuit layer 2, multiple power inductor components 3, and at least one set of laser alignment marks 4. The thin-film circuit layer 2 is disposed on at least one surface of the substrate 1; each power inductor component 3 is electrically connected to the thin-film circuit layer 2, and the power inductor components 3 are arranged in an array in the area of the substrate 1 corresponding to the thin-film circuit layer 2; the laser alignment marks 4 are disposed on the substrate 1 and are corresponding to the wiring area of the thin-film circuit layer 2 and the preset mounting area of each power inductor component 3, for positioning the wiring area of the thin-film circuit layer 2 and the mounting position of the power inductor components 3 in the laser optical alignment process.
[0026] The above technical solution improves the positioning accuracy of the wiring of the thin film circuit layer 2 and the installation area of the power inductor component 3 by setting the laser alignment mark 4 to correspond with the wiring area of the thin film circuit layer 2 and the installation area of the power inductor component 3. The power inductor component 3 is distributed in an array and electrically connected to the thin film circuit layer 2, which optimizes the layout rationality of the components on the circuit board and enhances the stability of the electrical connection.
[0027] The laser alignment mark 4 includes at least two positioning marks, each positioned in a diagonal area of the substrate 1. Each positioning mark corresponds to a reference point of at least one wiring unit of the thin-film circuit layer 2. The positioning marks in the diagonal area of the substrate 1 correspond to the reference points of the wiring units in the thin-film circuit layer 2, further enhancing the positioning accuracy of laser alignment and reducing positional deviations in the wiring area of the thin-film circuit layer 2.
[0028] The thin-film circuit layer 2 comprises at least two conductive films, which are electrically connected to each other via metallized vias. The conductive films are made of copper foil with a thickness of 5μm-20μm. The multilayer conductive films, combined with the metallized vias, expand the wiring space of the thin-film circuit layer 2 and improve the electrical connectivity of the circuit layer. The copper foil conductive films help reduce the resistance of the circuit layer, making it suitable for low DCR design requirements.
[0029] The power inductor assembly 3 includes a magnetic core, a winding, and leads. The winding is wound around the magnetic core, one end of the lead is electrically connected to the winding, and the other end of the lead is soldered to the thin-film circuit layer 2. The solder joint between the lead and the thin-film circuit layer 2 is a solder joint formed by laser welding, and the contact area between the solder joint and the thin-film circuit layer 2 is not less than 0.5 mm². The lead connects the winding and the thin-film circuit layer 2, achieving a stable electrical connection between the power inductor assembly 3 and the thin-film circuit layer 2. The solder joint formed by laser welding improves the connection strength between the lead and the thin-film circuit layer 2, reducing the possibility of poor contact.
[0030] The winding uses flat copper wire with a cross-sectional width of 0.8mm-1.5mm and a thickness of 0.1mm-0.3mm. The flat copper wire increases the conductive cross-sectional area, which helps to reduce the winding resistance, meeting the design requirements of low DCR, while also improving the current carrying capacity of the winding.
[0031] The substrate 1 is made of polyimide film with a thickness of 25μm-100μm. At least one positioning hole 5 is formed on the substrate 1, which cooperates with the laser alignment mark 4 for auxiliary positioning in the laser optical alignment process. The polyimide film substrate 1 possesses good flexibility and insulation, adapting to the structural requirements of thin-film circuit boards. The positioning hole 5, in conjunction with the laser alignment mark 4, enhances the positioning reliability of the laser optical alignment process.
[0032] The spacing between the mounting areas of two adjacent power inductor components 3 is 2mm-5mm; the wiring of the thin-film circuit layer 2 corresponding to adjacent power inductor components 3 adopts a differential layout. The spacing between adjacent power inductor components 3 avoids mutual interference between components; the differential layout of the thin-film circuit layer 2 improves the stability of signal transmission and reduces signal crosstalk.
[0033] The surface of the thin-film circuit layer 2 is covered with an insulating protective layer; the insulating protective layer is a polyimide coating with a thickness of 3μm-10μm; a soldering window is provided in the area of the insulating protective layer corresponding to the pins of the power inductor component 3. The insulating protective layer protects the thin-film circuit layer 2, reducing the influence of the circuit layer on the external environment; the setting of the soldering window facilitates the soldering operation between the pins of the power inductor component 3 and the thin-film circuit layer 2, without affecting the insulation protection effect.
[0034] The laser alignment mark 4 is cross-shaped, with a line width of 0.1mm-0.3mm. The deviation between the center of the laser alignment mark 4 and the corresponding wiring area or installation position reference point is no greater than 0.05mm. The cross-shaped laser alignment mark 4 facilitates the identification of the laser optical alignment process; the small deviation between the mark center and the reference point further ensures the positioning accuracy of the wiring area and installation position.
[0035] The magnetic core is made of ferrite material and is H-shaped. The winding is wound around the central column of the H-shaped magnetic core, with 4-8 turns. The ferrite magnetic core improves the magnetic performance of the power inductor component 3; the H-shaped magnetic core, combined with the winding layout of the central column, optimizes the space utilization of the winding and improves the working stability of the inductor.
[0036] The wiring of the thin film circuit layer 2 adopts a low-impedance wiring structure. The line width of the low-impedance wiring is 1mm-3mm and the line spacing is 0.5mm-1.5mm. The low-impedance wiring structure of the thin film circuit layer 2 reduces the resistance of the circuit, which meets the design goal of low DCR. The setting of line width and line spacing improves the current carrying capacity of the circuit and the rationality of the wiring.
[0037] In this embodiment of the invention, a substrate 1 is used as the basic carrier. The laser alignment mark 4 on its surface provides a precise positioning reference for the wiring area of the thin film circuit layer 2 and the mounting area of the power inductor component 3. The thin film circuit layer 2 is composed of multiple layers of copper foil conductive film, and the layers are electrically connected through metallized vias to form a low-impedance circuit path. The winding of the power inductor component 3 is wound on a magnetic core, and the pins electrically connect the winding to the thin film circuit layer 2, realizing the inductance function with the magnetic properties of the magnetic core. An insulating protective layer covers the thin film circuit layer 2, and soldering windows are opened only in the corresponding areas of the pins, which not only protects the circuit layer but also does not affect the electrical connection. The array-distributed power inductor components 3 are matched with differential distribution lines, which can reduce mutual interference between components and ultimately achieve low-resistance, stable electrical signal transmission and inductor operation.
[0038] How to use this utility model embodiment:
[0039] 1. Positioning process: Place the substrate 1 in the laser alignment equipment, and use the equipment to identify the laser alignment mark 4 and positioning hole 5 on the substrate 1 to complete the precise positioning of the substrate 1;
[0040] 2. Circuit fabrication: Using the laser alignment mark 4 as a reference, a thin film circuit layer 2 is fabricated on the surface of the substrate 1. The electrical connection of the multilayer conductive thin film is achieved through metallized vias. Then, an insulating protective layer is covered on the surface of the thin film circuit layer 2, and a soldering window is opened in the area corresponding to the pin of the power inductor component 3.
[0041] 3. Component installation: The winding is wound around the magnetic core of the power inductor component 3, one end of the pin is connected to the winding, and the other end is passed through the welding window and fixed to the thin film circuit layer 2 by laser welding process;
[0042] 4. Batch assembly: Following the array layout, repeat the installation of all power inductor components 3 to connect the circuit board to the target circuit for use.
[0043] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.
Claims
1. A thin film type low DCR power inductor circuit board based on laser optical alignment, characterized by: It includes a substrate (1), a thin film circuit layer (2), multiple power inductor components (3) and at least one set of laser alignment marks (4); The thin-film circuit layer (2) is disposed on at least one surface of the substrate (1); each of the power inductors (3) is electrically connected to the thin-film circuit layer (2), and each of the power inductors (3) is distributed in an array in the area of the substrate (1) corresponding to the thin-film circuit layer (2); the laser alignment mark (4) is disposed on the substrate (1) and is disposed in correspondence with the wiring area of the thin-film circuit layer (2) and the preset installation area of each of the power inductors (3), and is used to locate the wiring area of the thin-film circuit layer (2) and the installation position of the power inductors (3) in the laser optical alignment process.
2. The thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 1, characterized in that: The laser alignment mark (4) includes at least two positioning marks, each of which is disposed in a diagonal area of the substrate (1), and each positioning mark corresponds to a reference point of at least one wiring unit of the thin film circuit layer (2).
3. The thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 1, characterized in that: The thin film circuit layer (2) includes at least two conductive films, and the conductive films are electrically connected to each other through metallized vias; the conductive films are made of copper foil and have a thickness of 5μm-20μm.
4. The thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 1, characterized in that: The power inductor assembly (3) includes a magnetic core, a winding, and a pin; the winding is wound around the magnetic core, one end of the pin is electrically connected to the winding, and the other end of the pin is welded to the thin film circuit layer (2); the welding point between the pin and the thin film circuit layer (2) is a solder joint formed by laser welding process, and the contact area between the solder joint and the thin film circuit layer (2) is not less than 0.5 mm².
5. A thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 4, characterized in that: The winding uses flat copper wire with a cross-sectional width of 0.8mm-1.5mm and a thickness of 0.1mm-0.3mm.
6. A thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 1, characterized in that: The substrate (1) is made of polyimide film with a thickness of 25μm-100μm; at least one positioning hole (5) is provided on the substrate (1), and the positioning hole (5) cooperates with the laser alignment mark (4) for auxiliary positioning in the laser optical alignment process.
7. A thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 1, characterized in that: The spacing between the mounting areas of two adjacent power inductor components (3) is 2mm-5mm; the wiring of the thin film circuit layer (2) corresponding to the adjacent power inductor components (3) adopts a differential layout.
8. A thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 3, characterized in that: The surface of the thin film circuit layer (2) is covered with an insulating protective layer; the insulating protective layer is a polyimide coating with a thickness of 3μm-10μm; the insulating protective layer has a soldering window in the area corresponding to the pin of the power inductor component (3).
9. A thin-film low-DCR power inductor circuit board based on laser optical alignment according to any one of claims 1-8, characterized in that: The laser alignment mark (4) is cross-shaped, and the line width of the laser alignment mark (4) is 0.1mm-0.3mm; the deviation between the center of the laser alignment mark (4) and the corresponding wiring area or installation position reference point is no greater than 0.05mm.
10. A thin-film low-DCR power inductor circuit board based on laser optical alignment according to claim 4, characterized in that: The magnetic core is made of ferrite material and is shaped like an I-beam; the winding is wound around the middle column of the I-beam magnetic core and has 4-8 turns.