Integrated circuit board and enclosure

Abstract

This application provides an integrated circuit board and its housing, relating to the field of circuit board technology. The integrated circuit board includes: a circuit board body, the surface of which is divided into multiple surface partitions, and an internal partition corresponding to each surface partition, with each surface partition and its corresponding internal partition vertically aligned along the thickness direction of the circuit board body; adjacent surface partitions and adjacent internal partitions maintain a preset interval; each surface partition and its corresponding internal partition share an independent dedicated grounding loop, and each surface partition contains an electronic component electrically connected to its corresponding dedicated grounding loop; the electronic components corresponding to each surface partition are electrically connected through traces within the circuit board body. Thus, through the design of single-board partition integration, physical isolation, independent grounding, and internal traces, both space utilization optimization and anti-interference requirements are considered, effectively ensuring stable signal transmission and vehicle control accuracy.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more particularly to an integrated circuit board and its enclosure. Background Technology

[0002] With the development of the new energy vehicle industry, spatial integration and signal transmission reliability have become core factors affecting vehicle performance. Therefore, it is necessary to optimize the spatial layout of internal circuit boards, make efficient use of space, and ensure signal transmission stability to meet the high-performance requirements of the entire vehicle.

[0003] In related technologies, various modules often adopt a distributed layout with independent circuit boards. Each circuit board is equipped with a corresponding enclosure for support and protection. The increase in the number of circuit boards directly leads to an increase in the number of enclosures, which occupies a large amount of vehicle space and results in extremely low space utilization. At the same time, the distributed layout of multiple circuit boards and long-distance wiring harness connections can easily cause electromagnetic interference, signal crosstalk and other problems, affecting the stability and accuracy of signal transmission, and thus reducing the overall vehicle performance.

[0004] Given the aforementioned shortcomings, the existing distributed module layout cannot simultaneously meet the requirements of space utilization and signal anti-interference, resulting in wasted vehicle space and affecting control accuracy and reliability due to signal crosstalk, making it difficult to meet the high-performance application requirements of new energy vehicles. Utility Model Content

[0005] This application provides an integrated circuit board and enclosure to solve the problem that the existing distributed module layout cannot simultaneously meet the requirements of space utilization and signal anti-interference, resulting in wasted vehicle space and affecting control accuracy and reliability due to signal crosstalk, making it difficult to meet the high-performance application requirements of new energy vehicles.

[0006] In a first aspect, embodiments of this application provide an integrated circuit board, including: a circuit board body, the surface of the circuit board body is divided into multiple surface partitions, the interior of the circuit board body is provided with an internal partition corresponding to each surface partition, and each surface partition and the corresponding internal partition are vertically aligned in the thickness direction of the circuit board body. A preset interval is maintained between adjacent surface partitions, and the preset interval is also maintained between adjacent internal partitions; Each surface partition and its corresponding internal partition share an independent dedicated grounding loop. Each surface partition contains electronic components that are electrically connected to the corresponding dedicated grounding loop. The electronic components corresponding to each surface partition are electrically connected through traces inside the circuit board body.

[0007] Based on the above technical content, the embodiments of this application integrate dispersed electronic components into corresponding partitions of a single circuit board, replace long-distance wiring harnesses with in-board traces, reduce component and space redundancy, and solve the problem of low space utilization in traditional dispersed layouts. At the same time, the preset interval between adjacent partitions forms physical isolation, and each partition has an independent dedicated grounding circuit to avoid signal interference. Combined with in-board short-path transmission, signal coupling and crosstalk are blocked, overcoming the defects of electromagnetic interference in traditional layouts. Ultimately, it takes into account both space utilization optimization and anti-interference requirements, ensuring stable signal transmission and vehicle control accuracy.

[0008] In one possible implementation, the plurality of surface partitions include at least a high-voltage grounding partition, an analog grounding partition, and a digital grounding partition, and the dedicated grounding loops corresponding to each surface partition are a high-voltage grounding loop, an analog grounding loop, and a digital grounding loop, respectively. The electronic components in the high-voltage grounding zone are high-voltage components, the electronic components in the analog grounding zone are analog components, and the electronic components in the digital grounding zone are digital components.

[0009] In this embodiment, by specifically dividing the core grounding zones into high-voltage, analog, and digital categories, and configuring dedicated grounding circuits for each zone and setting up corresponding electronic components, physical isolation and independent grounding paths for signal components with different characteristics are achieved. From the layout design, interference transmission between high-voltage signals and analog and digital signals is blocked, ensuring the purity and integrity of the transmission of signals with different characteristics, thereby significantly improving the anti-interference performance of the circuit board. At the same time, the component layout is more logical and standardized, so as to improve wiring efficiency and ease of later maintenance.

[0010] In one possible implementation, the high-voltage component includes a high-voltage side component of a discharge circuit and a drive circuit; the analog component includes an analog component of a resolver circuit, a current detection circuit, and a microcontroller unit; the digital component includes a low-voltage side component of a vehicle controller, a digital component of the microcontroller unit, a communication module, a protection circuit, and a drive circuit. The vehicle controller, the communication module, the resolver circuit, and the current detection circuit are respectively connected to the microcontroller unit. The drive circuit is connected between the discharge circuit and the microcontroller unit, and the protection circuit is connected between the microcontroller unit and the drive circuit.

[0011] In this embodiment, by clearly defining the specific composition of the high-voltage component, analog component, and digital component, and constructing a circuit topology with the microcontroller unit as the core and the components interconnected in an orderly manner, the high-voltage signal, analog signal, and digital signal each have their own dedicated transmission path. This structurally avoids interference caused by the mixed transmission of signals with different characteristics, ensures the purity and accuracy of signal transmission, and thus enhances the stability and reliability of the circuit board operation.

[0012] In one possible implementation, the plurality of surface partitions further include a power grounding partition, a power grounding partition, and a filter grounding partition, and the dedicated grounding loops corresponding to each surface partition are a power grounding loop, a power grounding loop, and a filter grounding loop, respectively. The electronic components in the power grounding zone are power components, the electronic components in the power grounding zone are power components, and the electronic components in the filter grounding zone are filter components.

[0013] In this embodiment, by setting up three types of grounding zones for power supply, power, and filtering, and configuring corresponding dedicated grounding loops and components, the partitioning and grounding isolation design of the circuit board is enriched, making the transmission paths of signals with different characteristics more targeted, improving the independence and stability of the operation of various components, and realizing the intensive management and control of the circuit board as a whole. This not only optimizes the spatial layout of the circuit board and improves the space utilization rate, but also strengthens the overall anti-interference capability of the circuit board, effectively improving the reliability and safety of the vehicle operation.

[0014] In one possible implementation, the power supply component includes a power management module, the power component includes a differential control module, and the filtering component includes a filtering circuit and a connector. The connector is connected to the vehicle controller, the communication module, and the differential disconnect control module via the filtering circuit. The differential disconnect control module is connected to the microcontroller unit. The power management module is connected to the differential disconnect control module, the vehicle controller, the microcontroller unit, and the drive circuit.

[0015] In this embodiment, by clearly defining the specific composition of the power supply component, the filter component, and the power component, and constructing a circuit topology with the microcontroller unit as the core and the components interconnected in an orderly manner, the integrated circuit board as a whole has a hardware connection system with an independent structure and a clear path. At the hardware structure level, the interference transmission path of signals with different characteristics is cut off, the compactness and rationality of the overall layout of the circuit board are optimized, thereby improving space utilization and wiring standardization, and avoiding potential hardware failures caused by messy links.

[0016] In one possible implementation, the high-voltage grounding partition is located in the edge region of the circuit board body, and the digital grounding partition is located in the middle region of the circuit board body.

[0017] In this embodiment, by placing the high-voltage grounding partition in the edge area of ​​the circuit board body and the digital grounding partition in the middle area, the physical space of the two types of core grounding partitions is separated. This increases the transmission distance between high-voltage signals and digital signals from the layout structure, thereby reducing electromagnetic radiation interference of high-voltage signals to digital signals. At the same time, it optimizes the allocation efficiency of circuit board space resources, allowing for more spacious wiring of high-voltage components in the edge area and a more compact layout of core digital components in the middle area, thereby improving the overall electromagnetic interference resistance and layout rationality of the circuit board.

[0018] In one possible implementation, the return paths of adjacent dedicated grounding loops first converge at the same common contact point, and then extend through the common contact point to the corresponding grounding terminal to form an independent return path.

[0019] In this embodiment, by first converging the return paths of adjacent dedicated grounding loops to the same common contact point, and then extending them through the common contact point to the corresponding grounding terminal to form an independent return path, centralized control and independent current distribution of different return paths are achieved. This avoids crosstalk between return currents of different grounding loops, simplifies the overall structure of grounding wiring, reduces wiring intersections and redundancy, improves the space utilization and wiring standardization of the circuit board, enhances the isolation effect of each grounding zone, and ensures the purity and stability of signal transmission with different characteristics, thereby improving the overall anti-interference capability and operational reliability of the circuit board.

[0020] In one possible implementation, the electronic components within each surface partition include a top-level device disposed on the upper surface of the circuit board body and a bottom-level device disposed on the lower surface of the circuit board body; the volume of the top-level device is larger than the volume of the bottom-level device, and / or the weight of the top-level device is greater than the weight of the bottom-level device.

[0021] In this embodiment, electronic components within each surface partition are divided into top-level devices on the upper surface and bottom-level devices on the lower surface of the circuit board body. The volume of the top-level devices is larger than that of the bottom-level devices, and / or the weight is greater than that of the bottom-level devices. This achieves a layered layout of devices based on volume and weight, thereby reducing the risk of installation instability caused by the circuit board's low center of gravity, improving the overall stability of the circuit board structure, and making reasonable use of the space resources on the upper and lower surfaces of the circuit board. This avoids wiring congestion caused by large-volume, heavy devices occupying the bottom space, optimizes the compactness and rationality of the device layout, and reduces physical interference between the top and bottom-level devices. This facilitates subsequent assembly, inspection, and maintenance operations, ultimately improving the space utilization and structural stability of the circuit board to ensure the long-term reliable operation of the entire vehicle.

[0022] In one possible implementation, the circuit board body includes a first signal layer, a first ground layer, a power layer, a second signal layer, a second ground layer, and a third signal layer stacked sequentially along the thickness direction.

[0023] In this embodiment, a board structure consisting of a first signal layer, a first ground layer, a power layer, a second signal layer, a second ground layer, and a third signal layer stacked sequentially along the thickness direction is adopted. This allows the power layer and ground layer to be arranged adjacently, shortening the power return path and effectively reducing interlayer clutter and parasitic capacitance. At the same time, the dual ground layers provide shielding and loops for the upper and lower signal layers respectively, reducing electromagnetic coupling interference between different signal layers and improving the integrity and stability of signal transmission. Ultimately, this achieves a reasonable allocation of the layout of each layer, improves space utilization and layout rationality, and meets the signal and power requirements in multi-device integration scenarios.

[0024] Secondly, embodiments of this application provide a housing that includes the integrated circuit board described in any of the first aspects.

[0025] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of an integrated circuit board according to an embodiment of this application; Figure 2 This is a schematic diagram of another integrated circuit board structure provided in one embodiment of this application; Figure 3 This is a schematic diagram of another integrated circuit board structure provided in another embodiment of this application; Figure 4 This is a schematic diagram of the structure of another integrated circuit board provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a circuit board body provided in one embodiment of this application; Among them, 110, circuit board body; 111, first signal layer; 112, first ground layer; 113, power layer; 114, second signal layer; 115, second ground layer; 116, third signal layer; 120, surface partition; 121, high-voltage ground partition; 122, analog ground partition; 123, digital ground partition; 124, power ground partition; 125, power ground partition; 126, filter ground partition; 130, internal partition; 140, dedicated grounding loop; 150, electronic components; 01, microcontroller unit; 02. Drive circuit; 310. High voltage component; 311. Discharge circuit; 312. High voltage side component; 320. Analog component; 321. Resolver circuit; 322. Current detection circuit; 323. Analog component; 330. Digital component; 331. Vehicle controller; 332. Digital component; 333. Communication module; 334. Protection circuit; 335. Low voltage side component; 340. Power supply component; 350. Power component; 351. Differential control module; 360. Filter component; 361. Filter circuit; 362. Connector. Detailed Implementation

[0029] The present application will be described more clearly below with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the function of the present application, but do not limit the present application in any way. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application. These all fall within the protection scope of the present application.

[0030] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0031] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0032] In the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0034] Furthermore, the term "multiple" mentioned in the embodiments of this application should be interpreted as two or more.

[0035] First, the terms used in the embodiments of this application will be explained: Surface partitioning refers to the division of the outer surface of the circuit board (including the upper and lower surfaces) into several independent areas according to the characteristics of the transmitted signals and grounding requirements.

[0036] Internal partitions refer to areas within the circuit board body that correspond one-to-one with the surface partitions. These internal partitions are perpendicularly aligned with the corresponding surface partitions along the thickness direction of the circuit board body. It's important to note that internal partitions are not isolated structures independent of the surface partitions; rather, they extend along the boundaries of the surface partitions into all layers within the circuit board. For example, taking the high-voltage grounding partition on the surface as an example, internal partitions with identical outlines are defined within the signal layer, ground layer, power layer, and other layers of the circuit board, ensuring that high-voltage related wiring is confined to this three-dimensional partition.

[0037] The applicant has found that, in order to address the problem that the existing distributed module layout cannot simultaneously meet the requirements of space utilization and signal anti-interference, resulting in wasted vehicle space and affecting control accuracy and reliability due to signal crosstalk, making it difficult to meet the high-performance application requirements of new energy vehicles, it is necessary to adopt a new circuit board design to overcome the above-mentioned defects.

[0038] Therefore, in the embodiments of this application, by integrating the dispersed electronic components into the corresponding partitions of a single circuit board, replacing long-distance wiring harnesses with in-board traces, the redundancy of components and space is reduced, solving the problem of low space utilization in traditional dispersed layouts; at the same time, the preset interval between adjacent partitions forms physical isolation, and each partition has an independent dedicated grounding circuit to avoid signal interference. Combined with in-board short-path transmission, signal coupling and crosstalk are blocked, overcoming the defects of electromagnetic interference in traditional layouts. Ultimately, both space utilization optimization and anti-interference requirements are taken into account, ensuring stable signal transmission and vehicle control accuracy.

[0039] refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of an integrated circuit board provided in an embodiment of this application. Figure 1 As shown, the integrated circuit board includes: a circuit board body 110, the surface of which is divided into multiple surface partitions 120, and the interior of the circuit board body 110 is provided with an internal partition 130 corresponding to each surface partition 120, and each surface partition 120 and the corresponding internal partition 130 are vertically aligned in the thickness direction of the circuit board body 110; adjacent surface partitions 120 and adjacent internal partitions 130 maintain a preset interval; each surface partition 120 and its corresponding internal partition 130 share an independent dedicated grounding circuit 140, and each surface partition 120 is provided with an electronic component 150 electrically connected to the corresponding dedicated grounding circuit 140; the electronic component 150 corresponding to each surface partition 120 is electrically connected through the wiring inside the circuit board body 110.

[0040] On the outer surface (such as the upper and lower surfaces) of the circuit board body 110, multiple independent surface partitions 120 are divided according to the functional type of electronic components (such as high voltage, analog, digital, power supply, power, filtering, etc.) and signal characteristics (such as high voltage signals, analog signals, digital signals, etc.). A preset interval is reserved between adjacent surface partitions 120 to form a physical isolation boundary. Inside the circuit board body 110, corresponding to the position of each surface partition 120, an internal partition 130 is synchronously set to ensure that the internal partition 130 corresponds one-to-one with the surface partition 120, and the adjacent internal partitions 130 also maintain a preset interval to avoid cross-interference between signals from different partitions inside.

[0041] Here, surface partition 120 is located on the surface (upper or lower surface) of the circuit board body 110, and internal partition 130 is located in the internal layer of the circuit board body 110 (such as the corresponding area between the signal layer and the ground layer). The two are completely overlapped and aligned in the thickness direction of the circuit board body 110 (i.e., the direction perpendicular to the board surface), forming a top-to-bottom corresponding structure that combines the surface partition and the internal partition, ensuring that the component layout and signal transmission path of the same partition are spatially concentrated and avoiding path intersections across partitions.

[0042] Additionally, each surface partition 120 and its corresponding internal partition 130 have a dedicated grounding loop 140. This loop is primarily constructed based on the ground plane of the circuit board body 110, for example, by dividing an independent copper foil area on its ground plane to form a grounding space matching the corresponding partition. Exemplarily, the copper foil area of ​​the dedicated grounding loop 140 conforms to the outline of the corresponding partition and can be electrically connected to the grounding pins of the electronic components 150 within the surface partition 120 via vias. Simultaneously, the wiring of the internal partition is connected to this grounding loop, forming a complete grounding path from the component grounding pins to the vias, and then to the independent copper foil area of ​​the ground plane. This ensures that the dedicated grounding loop 140 of each partition is independent and does not overlap with the grounding paths of other partitions.

[0043] For example, taking a circuit board body 110 including a ground layer and multiple signal layers as an example, the ground pins of electronic components 150 in each surface partition 120 can pass through the surface layer and the ground layer through vias inside the circuit board body 110 to achieve electrical connection with the independent copper foil area of ​​the dedicated grounding loop 140 of the corresponding partition. In addition, the interconnection of electronic components 150 in different partitions can be achieved through the wiring of the internal signal layer of the circuit board. For example, between the internal signal layer areas corresponding to adjacent partitions, a dedicated signal channel is configured as a dedicated path for interconnection of electronic components in different partitions. Thus, electronic components 150 in two different partitions can be connected to the dedicated signal channel through the connection vias in their respective partitions, without the need for external wiring harnesses. The vias are used to achieve reliable connection between the components and the signal layer, and the dedicated signal channel ensures the independence of the cross-partition transmission path. Combined with the partition independent grounding design, signal crosstalk is effectively avoided, while the transmission path is shortened and the signal transmission efficiency and stability are improved.

[0044] For example, in this embodiment of the present disclosure, the preset interval between adjacent surface partitions (or between adjacent internal partitions) can be set to 4.5mm to 5.3mm. In other embodiments, other sizes can also be set according to isolation requirements, which are not limited here. Here, by appropriately widening the distance between different partitions through spatial separation, the mutual coupling of electric and magnetic fields is reduced, while unnecessary physical interference between components and wiring in different partitions is avoided.

[0045] This embodiment integrates dispersed electronic components 150 into corresponding partitions of a single circuit board, replacing long-distance wiring harnesses with in-board traces, reducing component and space redundancy, and solving the problem of low space utilization in traditional dispersed layouts. At the same time, the preset interval between adjacent partitions forms physical isolation, and each partition has an independent dedicated grounding circuit 140 to avoid signal interference. Combined with short-path transmission within the board, signal coupling and crosstalk are blocked, overcoming the electromagnetic interference defects of traditional layouts. Ultimately, it balances space utilization optimization and anti-interference requirements, ensuring stable signal transmission and vehicle control accuracy.

[0046] In some embodiments, Figure 2 This is a schematic diagram of another integrated circuit board structure provided in an embodiment of this application. Figure 1 Based on, refer to Figure 2 The multiple surface partitions 120 include at least a high-voltage grounding partition 121, an analog grounding partition 122, and a digital grounding partition 123. The dedicated grounding loops 140 corresponding to each surface partition 120 are high-voltage grounding loops, analog grounding loops, and digital grounding loops, respectively. The electronic components in the high-voltage grounding partition 121 are high-voltage components 310, the electronic components in the analog grounding partition 122 are analog components 320, and the electronic components in the digital grounding partition 123 are digital components 330.

[0047] For example, the digital component 330 can serve as the control core. The analog signal collected by the analog component 320 is fed back to the digital component 330. The control commands generated by the digital component 330 drive the high-voltage component 310 to work. The composition and operation of each component can be seen in the following description, and will not be repeated here.

[0048] Among them, the high-voltage component 310 handles high-current, high-voltage signals and is prone to generating strong electromagnetic radiation; the analog component 320 transmits weak analog signals and has weak anti-interference capabilities; the digital component 330 transmits high-frequency digital pulse signals, which itself generates electromagnetic interference and is sensitive to interference. In view of the above differences in signal characteristics and anti-interference requirements, this embodiment divides the high-voltage grounding partition 121, the analog grounding partition 122, and the digital grounding partition 123, as well as corresponding dedicated grounding circuits and components. Through physical partitioning and independent grounding, cross-interference is avoided, ensuring the purity of signal transmission. If the three are mixed or share a grounding circuit, the electromagnetic radiation of the high-voltage signal will interfere with the purity of the analog signal, resulting in a decrease in detection accuracy; the high-frequency noise of the digital signal will couple to the analog signal, affecting the control accuracy; at the same time, the weak fluctuations of the analog signal may also affect the logic stability of the digital component, ultimately leading to the failure of the vehicle control.

[0049] Thus, based on the above structural division, physical isolation and independent grounding paths of signal components with different characteristics are achieved. From the layout design, interference transmission between high-voltage signals and analog and digital signals is blocked, ensuring the purity and integrity of the transmission of signals with different characteristics. This significantly improves the anti-interference performance of the circuit board, while making the component layout more logical and standardized, so as to improve wiring efficiency and ease of later maintenance.

[0050] In some embodiments, Figure 3 This is a schematic diagram of another integrated circuit board structure provided in an embodiment of this application. Figure 1 and Figure 2 Based on, refer to Figure 3The high-voltage component 310 includes a discharge circuit 311 and a high-voltage side component 312 of the drive circuit 02; the analog component 320 includes a resolver circuit 321, a current detection circuit 322 and an analog component 323 of the microcontroller 01; the digital component 330 includes a vehicle controller 331, a digital component 332 of the microcontroller 01, a communication module 333, a protection circuit 334 and a low-voltage side component 335 of the drive circuit 02; the vehicle controller 331, the communication module 333, the resolver circuit 321 and the current detection circuit 322 are respectively connected to the microcontroller 01, the drive circuit 02 is connected between the discharge circuit 311 and the microcontroller 01, and the protection circuit 334 is connected between the microcontroller 01 and the drive circuit 02.

[0051] The integrated circuit board may also include a DC bus capacitor (not shown in the figure), which is integrated within the high-voltage grounding zone and electrically connected to the discharge circuit 311 and the high-voltage side component 312 of the drive circuit 02. It is typically an inherent component of the high-voltage power conversion link on the circuit board. The discharge circuit 311 provides a safe discharge circuit for the DC bus capacitor, preventing residual high voltage from causing safety hazards after the high-voltage power supply between the external battery pack and the circuit board stops. For example, the discharge circuit 311 may include components such as resistors and switches; its specific circuit configuration is not limited, as long as it achieves the corresponding function.

[0052] The integrated circuit board may also be equipped with a motor (not shown in the figure). The high-voltage side component 312 of the drive circuit 02 is the core power part of the drive circuit 02. It carries high voltage and large current and can convert the DC power input from the external battery pack into the AC power required for motor drive. It is a key component for realizing the conversion of electrical energy into motor power.

[0053] The resolver circuit 321 is connected to the rotor of the motor. After converting the mechanical rotation angle of the motor rotor into an analog electrical signal, it transmits the signal to the microcontroller unit 01 so that the microcontroller unit 01 can control the motor. For example, the resolver circuit 321 may include a resolver, a signal excitation module, and a signal demodulation module, etc. The specific circuit connection relationship and configuration are not limited, as long as the corresponding functions are implemented.

[0054] The current detection circuit 322 monitors minute changes in the motor current in real time, converts the motor current signal into a recognizable analog signal, and transmits it to the microcontroller unit 01. The microcontroller unit 01 then provides overload protection and adjusts the power output for the motor. For example, the current detection circuit 322 may include a sampling resistor, an operational amplifier, etc. Its specific circuit connections and configuration are not limited; only the corresponding functions need to be implemented.

[0055] The analog component 323 of the microcontroller 01 is integrated inside the microcontroller 01. It receives the weak analog signals related to the motor transmitted by the resolver circuit 321 and the current detection circuit 322, and can perform preprocessing such as signal amplification and filtering in order to prepare for subsequent digital processing.

[0056] It should be noted that the integrated circuit board of this application can be used as a control circuit board for external actuators (such as fans, differential locks, disengagement mechanisms, etc.). The vehicle controller 331 is the key hub connecting the microcontroller 01 and the external actuators. After receiving the initial instructions from the microcontroller 01, it can convert them into specific control signals adapted to the external actuators, such as the specific operating parameters for controlling the fan. At the same time, it converts the feedback signals from the external actuators into a form that the microcontroller 01 can recognize, thus forming a control closed loop.

[0057] Digital component 332 is the core processing part of microcontroller 01. It can receive motor-related analog signals preprocessed by analog component 323 and feedback from vehicle controller 331, perform logic operations, generate control strategies, and output motor drive control signals and protection commands.

[0058] The communication module 333 is responsible for the communication interaction between the integrated circuit board and the vehicle. For example, the communication module 333 can be a controller local area network communication module, which establishes a connection with the microcontroller unit 01 through the wiring in the board. There is no limitation on its selection here.

[0059] The protection circuit 334 receives protection commands output by the digital component 332. When it detects overcurrent, overvoltage, overload, or abnormality in the motor, it quickly cuts off or adjusts the operating state of the drive circuit 02 to avoid safety accidents such as motor damage. For example, the protection circuit 334 may include devices such as relays, power switches, voltage comparators, and current sampling resistors. Its specific circuit connections and configuration are not limited, as long as the corresponding functions are implemented.

[0060] The low-voltage side component 335 of the drive circuit 02 is the control part of the drive circuit 02. It receives the low-voltage control signal output by the digital component 332 of the microcontroller unit 01, amplifies it, and drives the high-voltage side component 312 to work, realizing the isolation between low-voltage control and high-voltage power, and ensuring the stability of motor drive. For example, the drive circuit 02 may include, but is not limited to, devices such as a drive chip, optocoupler isolator, power transistor, diode, and bus capacitor. The drive chip and optocoupler isolator can be used as low-voltage side components, and the power transistor, diode, and bus capacitor can be used as high-voltage side components. The specific circuit connection relationship and configuration are not limited here, as long as the corresponding functions are implemented.

[0061] Therefore, by clarifying the specific composition of high-voltage components, analog components, and digital components, and constructing a circuit topology with a microcontroller unit as the core and all components interconnected in an orderly manner, high-voltage signals, analog signals, and digital signals each have their own dedicated transmission paths in their respective areas. This structurally avoids interference caused by the mixed transmission of signals with different characteristics in the same area, ensuring the purity and accuracy of signal transmission, and thus enhancing the stability and reliability of the circuit board operation.

[0062] In some embodiments, Figure 1 and Figure 2 Based on this, continue to refer to Figure 3 The multiple surface partitions 120 also include a power grounding partition 124, a power grounding partition 125, and a filter grounding partition 126. Each surface partition 120 has a dedicated grounding loop, which is a power grounding loop, a power grounding loop, and a filter grounding loop, respectively. The electronic components in the power grounding partition 124 are power components 340, the electronic components in the power grounding partition 125 are power components 350, and the electronic components in the filter grounding partition 126 are filter components 360.

[0063] Among them, the power supply component 340 is responsible for providing a stable power supply to the entire integrated circuit board, and it is necessary to avoid the impact of power supply fluctuations on other electronic components; the power component 350 involves high current drive (such as differential lock, disengagement mechanism drive), which is prone to electromagnetic interference and is itself sensitive to interference; the filter component 360 (such as filter circuit) mainly carries the input signal of the whole vehicle side, and it is necessary to filter out external electromagnetic interference and static electricity first to prevent external interference from intruding into the electronic components on the integrated circuit board.

[0064] For example, the power supply component 340 may include a power management module for converting the input voltage of an external battery pack into an operating voltage suitable for each electronic component. Here, the power grounding loop provides a dedicated return path for the output current of the power management module, significantly reducing loop impedance and parasitic inductance. When large current fluctuations occur in power components such as 350, since the power grounding loop and the power grounding loop are physically isolated and do not interfere with each other, such current fluctuations will be confined in the power grounding loop and cannot be conducted to the power supply output terminal of the power management module, thereby avoiding instantaneous drops or fluctuations in the power output voltage and achieving a stable power supply for the entire board.

[0065] The power component 350 receives control commands from the microcontroller unit 01 and can regulate external differential locks, disengagement mechanisms, and other actuators through its built-in high-current drive circuit (including switching devices such as power transistors and relays). For example, it controls the start, stop, and operation of external differential locks and disengagement mechanisms. Here, the power grounding loop provides a dedicated low-impedance return path for the operating current during the high-current drive process, preventing electromagnetic radiation generated by the high current in the loop from entering other areas. It also reduces the interference of current fluctuations on analog signal acquisition and digital logic operations, ensuring the quality of the overall board signal and the reliability of actuator control.

[0066] The 360 ​​filter component is mainly used to receive vehicle-side input signals (such as vehicle control signals) and to perform electromagnetic interference filtering and electrostatic discharge protection on these signals. For example, for vehicle-side input signals, it intercepts interference impurities (including high-frequency electromagnetic interference and electrostatic charge) mixed in the signal, and then quickly discharges these interference impurities through a dedicated filter grounding loop to prevent them from accumulating on the board or coupling to other grounding areas such as power, digital, and analog circuits. This ensures that the signals output to subsequent components are relatively pure, so as to guarantee the stable operation of all components on the board.

[0067] Therefore, by setting up three types of grounding zones for power supply, power, and filtering, and configuring corresponding dedicated grounding circuits and components, the zoning and grounding isolation design of the circuit board is enriched, making the transmission paths of signals with different characteristics more targeted, improving the independence and stability of the operation of various components, and realizing the intensive management and control of the circuit board as a whole. This not only optimizes the spatial layout of the circuit board and improves the space utilization rate, but also strengthens the overall anti-interference capability of the circuit board, effectively improving the reliability and safety of the vehicle operation.

[0068] In some embodiments, Figure 1 and Figure 2 Based on this, continue to refer to Figure 3 The power supply component 340 includes a power management module 341, the power component 350 includes a differential disconnect control module 351, and the filter component 360 includes a filter circuit 361 and a connector 362. The connector 362 is connected to the vehicle controller 331, the communication module 333 and the differential disconnect control module 351 via the filter circuit 361. The differential disconnect control module 351 is connected to the microcontroller unit 01, and the power management module 341 is connected to the differential disconnect control module 351, the vehicle controller 331, the microcontroller unit 01 and the drive circuit 02.

[0069] Among them, the power management module 341 is used to receive the input voltage of the external battery pack, convert it into a stable voltage that is compatible with the differential control module 351, the vehicle controller 331, the microcontroller unit 01 and the drive circuit 02, and work with the dedicated power grounding loop to suppress ripple and interference, so as to ensure the stable power supply of each module.

[0070] The differential lock control module 351 is used to receive corresponding instructions from the microcontroller unit 01, control the start, stop and action of the external differential lock and disengagement mechanism, and coordinate with the power grounding circuit to achieve independent return of large current and reduce electromagnetic radiation.

[0071] Connector 362 serves as an external interface, enabling bidirectional signal and power transmission between the vehicle and internal modules. Filtering circuit 361 performs electromagnetic interference filtering and electrostatic discharge protection on the vehicle-side signals received via connector 362, outputting a clean signal after filtering out noise and static electricity. For example, connector 362 can receive control commands from the vehicle side regarding the external differential lock and disengagement mechanism. The filtering circuit 361 filters out interference in these commands before transmitting them to microcontroller unit 01 and differential disengagement control module 351. Microcontroller unit 01 can then generate drive commands for the external differential lock and disengagement mechanism and send them to differential disengagement control module 351. With stable power supply, differential disengagement control module 351 outputs a high-current drive signal, which then controls the external differential lock and / or disengagement mechanism via connector 362. Simultaneously, the result of this action is transmitted back to microcontroller unit 01 via connector 362, forming a control closed loop.

[0072] Therefore, by clarifying the specific composition of the power supply component 340, the filter component 360, and the power component 350, and constructing a circuit topology with the microcontroller unit 01 as the core and the components interconnected in an orderly manner, the integrated circuit board as a whole has a hardware connection system with independent structure and clear path. At the hardware structure level, the interference transmission path of signals with different characteristics is cut off, the compactness and rationality of the overall layout of the circuit board are optimized, thereby improving space utilization and wiring standardization, and avoiding potential hardware failures caused by messy links.

[0073] In some embodiments, Figure 1 and Figure 2 Based on this, continue to refer to Figure 3 High-voltage grounding partition 121 is located in the edge area of ​​the circuit board body 110, and digital grounding partition 123 is located in the middle area of ​​the circuit board body 110.

[0074] Among them, the electronic components in the high-voltage grounding partition 121 are high-voltage components. When operating, high-voltage components need to handle large current and high-voltage signals, which not only easily generates strong electromagnetic radiation, but also has high requirements for the insulation spacing of the wiring. The edge area of ​​the circuit board body 110 has relatively spacious space, which can meet the insulation specifications when wiring high-voltage components, avoid safety hazards caused by insufficient insulation distance, and at the same time allow the electromagnetic radiation generated by the high-voltage components to dissipate to the outside of the circuit board, reducing interference to the core area inside the board.

[0075] The electronic components within the digital grounding partition 123 are digital components, which are the control core of the circuit board and need to be centrally located to shorten the signal transmission paths between them. The central area of ​​the circuit board body 110 enables compact interconnection of the various components within the digital components, reducing signal transmission delay and crosstalk. At the same time, it keeps the digital components away from the high-voltage components at the edge, further mitigating the risk of electromagnetic interference from a physical perspective, improving the quality of digital signals, and thus helping to ensure the overall control accuracy of the integrated circuit board.

[0076] In some embodiments, Figure 4 This is a schematic diagram of another integrated circuit board structure provided in an embodiment of this application. Figures 1-3 Based on this, continue to refer to Figure 4 The return paths of adjacent dedicated grounding loops 140 first converge at the same common contact A, and then extend through the common contact A to the corresponding grounding terminal (not shown in the figure), forming an independent return path.

[0077] Here, when the electronic components on each surface partition of the integrated circuit board operate, they generate various signals such as high voltage, digital, and analog signals. These signals are transmitted to the target module along the dedicated traces on the signal layer within the board to complete command transmission or data interaction. Simultaneously, the operating current corresponding to each signal flows into the dedicated grounding loop 140 of its respective partition. For adjacent dedicated grounding loops 140, their return currents are first converged to the same common contact A, achieving a single-point connection. Then, branching paths are formed from this common contact A, allowing different types of return currents to return to their corresponding grounding terminals through their respective branch paths. This ultimately forms a complete grounding loop where independent transmission occurs within each partition, convergence occurs at the common contact, and then branching out for discharge. It should also be noted that the transmission process of various signals along the dedicated traces on the signal layer within the board to the target module is similar to the single-point connection process described above; see [link to relevant documentation]. Figure 4 This needs to be understood, and will not be elaborated upon here.

[0078] In this way, interference between different electronic components is avoided by using independent grounding in different zones. The grounding structure is also simplified by using the common contact A, ensuring that the return path of each circuit is the shortest. This minimizes circuit inductance and parasitic capacitance, reduces electromagnetic radiation and signal crosstalk, ensures signal transmission quality, reduces signal delay and energy loss, improves control accuracy and response speed, and effectively simplifies wiring structure, reduces fault risk, and enhances circuit stability and anti-interference capability to adapt to the compact layout and high-performance requirements of the vehicle.

[0079] In some embodiments, refer to Figures 1 to 3 The electronic components within each surface partition 120 include top-layer devices disposed on the upper surface of the circuit board body and bottom-layer devices disposed on the lower surface of the circuit board body; the volume of the top-layer device is greater than the volume of the bottom-layer device, and / or the weight of the top-layer device is greater than the weight of the bottom-layer device.

[0080] In this design, a heatsink is typically placed beneath the circuit board. Larger, heavier components are positioned as top-level devices on the upper surface of the circuit board. This serves two purposes: firstly, it prevents the circuit board's center of gravity from shifting downwards due to the placement of these large components, reducing the risk of instability under vibration and providing better shock absorption; secondly, the relatively spacious top layer is more suitable for accommodating large components, preventing them from occupying the limited space at the bottom layer and causing wiring congestion, thus improving overall space utilization. Conversely, smaller, lighter components are placed as bottom-level devices on the lower surface. This allows these smaller components to come into closer contact with the heatsink, enabling rapid heat conduction for better heat dissipation. Furthermore, during soldering, the bottom-level smaller components can be assembled in a single wave soldering operation, eliminating the need for the top-level components to undergo multiple high-temperature soldering processes. This effectively protects critical components at the top layer, preventing high temperatures from affecting circuit performance. It also reduces soldering steps, lowers production costs, and improves production efficiency, meeting the high integration and high reliability requirements of automotive applications.

[0081] It's important to understand that small, lightweight bottom-layer components are mostly through-hole devices. These can be batch-soldered in a single wave soldering process because wave soldering is suitable for mass production of through-hole devices. Immersing the bottom of the circuit board in a wave of molten solder allows for rapid soldering of all bottom-layer components, resulting in high efficiency and low cost. Large, heavy top-layer components, on the other hand, are mostly surface-mount or precision devices. They don't need to participate in the bottom-layer wave soldering process and only require individual soldering through processes like reflow soldering. This avoids the circuit board undergoing multiple high-temperature wave soldering cycles, preventing performance degradation and pin detachment issues caused by repeated exposure to high temperatures in precision components. It also reduces damage to internal circuitry and solder joints from high temperatures, ensuring stable circuit performance.

[0082] For example, large and heavy devices may include microcontrollers, power management modules, communication modules, transformers, electrolytic capacitors, safety capacitors, high-power switching transistors, etc., while small and light devices may include resistive, capacitive, and inductive devices (such as resistors, capacitors, inductors, etc.), transistors (such as triodes, metal-oxide-semiconductor field-effect transistors, etc.) and some chips (such as triggers, low-dropout linear regulators, etc.). The types of devices are not limited or elaborated here.

[0083] For example, in actual layout, the top layer of each surface partition can be used to centrally arrange the core components (large in size / heavy in weight) required for the function of that partition, while the bottom layer can only arrange auxiliary small components (small in size / light in weight). There is no need to compare the core components of the top layer with the auxiliary components of the bottom layer one by one. Taking the digital grounding partition as an example, its corresponding top layer can be used to arrange communication modules with a volume of 10mm×8mm and a weight of 4g; its corresponding bottom layer can be used to arrange small auxiliary components such as resistors, capacitors and inductors with a volume of 0.8mm×1.2mm and a weight of 0.01g, and low dropout linear regulators with a volume of 2mm×2mm and a weight of 0.1g. It is simple to arrange them according to the overall distribution pattern of the component types in this partition.

[0084] In some embodiments, Figure 5 This is a schematic diagram of the structure of a circuit board body according to an embodiment of this application, with reference to... Figure 5 The circuit board body includes a first signal layer 111, a first ground layer 112, a power layer 113, a second signal layer 114, a second ground layer 115, and a third signal layer 116 stacked sequentially along the thickness direction.

[0085] The third signal layer 116 serves as the top signal layer, used to house large and heavy devices, while also facilitating close-range interconnection between top-level devices. This layer eliminates the need for long-distance traces, enabling direct signal interaction between adjacent devices, reducing signal attenuation and interference, balancing device assembly convenience with signal transmission efficiency, and adapting to the high-integration layout requirements of the top layer.

[0086] The second ground layer 115 provides a dedicated grounding loop for the devices and traces of the third signal layer 116, quickly dissipating static electricity and interference current, ensuring stable transmission of the top signal layer, and also forming a shielding barrier to block electromagnetic coupling between the third signal layer 116 and the layers below, avoiding mutual interference between signals of different layers, and also providing a stable reference ground for the inner layer signals of the second signal layer 114, enhancing the electromagnetic compatibility performance of the entire board.

[0087] The second signal layer 114 serves as an intermediate signal layer, primarily housing key sensitive signals such as detection signals, pulse width modulation signals, and serial peripheral interface signals. Since these key sensitive signals are the core of the circuit board's precise control and are extremely sensitive to interference and transmission loss, concentrating them on the intermediate signal layer and adjacent to the ground plane can minimize the signal loop area, reduce the coupling of electromagnetic radiation and external interference, and avoid interference from top and bottom layer wiring, thus ensuring the purity and stability of signal transmission.

[0088] Power layer 113 is responsible for providing a stable power input to the entire board. This layer has a separately planned power supply area, which can accurately allocate power according to the power consumption requirements of each module to ensure uniform power supply; at the same time, it is arranged close to the ground layer to shorten the power return path, effectively reduce interlayer clutter and parasitic capacitance, reduce power supply fluctuations, and provide a low-noise and highly stable power supply environment for each module.

[0089] The first ground layer 112 and the second ground layer 115 form a symmetrical layout, undertaking the loop and shielding functions for the underlying devices, traces, and power layers. For example, the first ground layer 112 provides a dedicated grounding loop for the underlying devices and short-path traces of the first signal layer 111, quickly dissipating signal interference at the underlying level; at the same time, it shields the electromagnetic interference between the power layer 113 and the first signal layer 111, preventing power fluctuations from affecting the underlying signals, and its adjacent arrangement with the power layer 113 further optimizes the power return path, reduces power supply noise, and ensures the stable operation of the devices in the underlying signal layer.

[0090] The first signal layer 111, as the bottom signal layer, is used to arrange small and lightweight devices, and also undertakes close-range interconnection between devices at the bottom layer. Moreover, the bottom signal layer usually arranges through-hole devices in a concentrated manner, which facilitates soldering in one wave soldering, reduces the impact of high-temperature reflow on the circuit board, lowers production costs, and improves assembly efficiency.

[0091] Thus, the overall layered design achieves coordinated optimization of power distribution, signal transmission, and electromagnetic shielding through orderly arrangement. Specifically, the ground layer is arranged alternately with the signal layer and power layer to form an all-round shielding structure. The second signal layer 114 serves as the intermediate signal layer, and the top and bottom signal layers achieve close-range interconnection between devices in their respective layers, balancing transmission accuracy and layout flexibility. The power layer is centrally located to shorten the power supply path of the entire board. Ultimately, it achieves the circuit operation requirements of high integration, low interference, and high stability within a limited thickness space to adapt to the high-performance application scenarios of the vehicle.

[0092] One embodiment of this application also provides a housing (not shown in the figure) including the integrated circuit board described in any of the above embodiments.

[0093] The enclosure is an integrated protective structure adapted to the size of the integrated circuit board. The interior can be equipped with mounting and positioning structures (such as clips, positioning posts, and thermal pads) corresponding to the integrated circuit board. It can provide physical protection for the integrated circuit board, avoiding the impact of vibration, impact and external environment on the board. It can also assist the circuit board in heat dissipation through the built-in thermal structure, while strengthening the electromagnetic shielding effect and reducing the external radiation of the board signal and the intrusion of external interference.

[0094] For example, the integrated circuit board can be located in the central area inside the enclosure and fixedly connected to the enclosure by positioning posts. The connector interface of the circuit board can be precisely aligned with the cable outlet reserved in the enclosure for easy connection to the vehicle wiring harness. The lower surface of the integrated circuit board can be closely attached to the thermal pad of the enclosure for efficient heat dissipation. At the same time, the interior of the enclosure can be equipped with isolation ribs according to the surface partitions of the circuit board body to further enhance the physical isolation effect of each partition and ensure the stable operation of the integrated circuit board in the complex vehicle environment. The specific layout relationship of the integrated circuit board in the enclosure is not limited here.

[0095] This application embodiment integrates core functional modules into a single circuit board through a highly integrated design. Dedicated in-board wiring replaces the long-distance wiring harnesses connecting traditional modules, significantly improving spatial integration while shortening signal transmission paths and reducing signal delay and loss. Simultaneously, a multi-regional layout is adopted, physically partitioning modules according to signal characteristics and other requirements. Adjacent partitions maintain preset intervals for isolation, and a corresponding dedicated grounding loop design ensures independent return current for each partition. This guarantees convenient interconnection between modules and low signal transmission latency, while effectively avoiding electromagnetic interference and signal crosstalk between different modules, ensuring the shortest signal return path and enhancing circuit stability and anti-interference capabilities. Therefore, this structural design solves the problems of large space occupation, complex wiring, high cost, and inconvenient maintenance associated with traditional distributed layouts, and also compensates for insufficient safety isolation between modules, fully adapting to the high integration, high precision, and high reliability requirements of vehicle applications.

[0096] Furthermore, in this embodiment, a single enclosure replaces multiple separate enclosures, thus solving the problems of connection redundancy, high failure rate, high cost, and low space utilization that exist with multiple separate enclosures.

[0097] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0098] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An integrated circuit board, characterized in that, include: The circuit board body has multiple surface partitions on its surface and internal partitions that correspond one-to-one with each surface partition. Each surface partition and its corresponding internal partition are vertically aligned in the thickness direction of the circuit board body. A preset interval is maintained between adjacent surface partitions, and the preset interval is also maintained between adjacent internal partitions; Each surface partition and its corresponding internal partition share an independent dedicated grounding loop. Each surface partition contains electronic components that are electrically connected to the corresponding dedicated grounding loop. The electronic components corresponding to each surface partition are electrically connected through traces inside the circuit board body.

2. The integrated circuit board according to claim 1, characterized in that, The plurality of surface zones include at least a high-voltage grounding zone, an analog grounding zone, and a digital grounding zone, and the dedicated grounding loops corresponding to each surface zone are a high-voltage grounding loop, an analog grounding loop, and a digital grounding loop, respectively; The electronic components in the high-voltage grounding zone are high-voltage components, the electronic components in the analog grounding zone are analog components, and the electronic components in the digital grounding zone are digital components.

3. The integrated circuit board according to claim 2, characterized in that, The high-voltage component includes a high-voltage side component of a discharge circuit and a drive circuit; the analog component includes an analog component of a resolver circuit, a current detection circuit, and a microcontroller unit; the digital component includes a low-voltage side component of a vehicle controller, a digital component of a microcontroller unit, a communication module, a protection circuit, and a drive circuit. The vehicle controller, the communication module, the resolver circuit, and the current detection circuit are respectively connected to the microcontroller unit. The drive circuit is connected between the discharge circuit and the microcontroller unit, and the protection circuit is connected between the microcontroller unit and the drive circuit.

4. The integrated circuit board according to claim 3, characterized in that, The multiple surface partitions also include a power grounding partition, a power grounding partition, and a filter grounding partition, and the dedicated grounding loops corresponding to each surface partition are a power grounding loop, a power grounding loop, and a filter grounding loop, respectively. The electronic components in the power grounding zone are power components, the electronic components in the power grounding zone are power components, and the electronic components in the filter grounding zone are filter components.

5. The integrated circuit board according to claim 4, characterized in that, The power supply component includes a power management module, the power component includes a differential control module, and the filtering component includes a filtering circuit and a connector; The connector is connected to the vehicle controller, the communication module, and the differential disconnect control module via the filtering circuit. The differential disconnect control module is connected to the microcontroller unit. The power management module is connected to the differential disconnect control module, the vehicle controller, the microcontroller unit, and the drive circuit.

6. The integrated circuit board according to claim 2, characterized in that, The high-voltage grounding zone is located in the edge area of ​​the circuit board body, and the digital grounding zone is located in the middle area of ​​the circuit board body.

7. The integrated circuit board according to any one of claims 1 to 6, characterized in that, The return paths of adjacent dedicated grounding loops first converge at the same common contact point, and then extend through the common contact point to the corresponding grounding terminal to form an independent return path.

8. The integrated circuit board according to any one of claims 1 to 6, characterized in that, The electronic components within each surface partition include a top-level device disposed on the upper surface of the circuit board body and a bottom-level device disposed on the lower surface of the circuit board body; the volume of the top-level device is greater than the volume of the bottom-level device, and / or the weight of the top-level device is greater than the weight of the bottom-level device.

9. The integrated circuit board according to any one of claims 1 to 6, characterized in that, The circuit board body includes a first signal layer, a first ground layer, a power layer, a second signal layer, a second ground layer, and a third signal layer stacked sequentially along the thickness direction.

10. A box, characterized in that, Including the integrated circuit board as described in any one of claims 1 to 9.

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