A circuit board land structure

Abstract

This utility model discloses a circuit board pad structure, including a board body, pads, and mounting opening structure. When installing components, the component pins are placed on the upper end of the recess and aligned with it. Then, the component is moved down, pressing the pins into the recess. At this time, the pressure head presses down on the component pins, thus fixing the pins in the recess. This prevents the component from becoming misaligned after installation. Since the pins are located in the recess, they accumulate in the recess during soldering, preventing them from remaining on the board body and damaging it. This achieves the beneficial effects of stable component pin installation, preventing misalignment, and ensuring that solder does not leak out during soldering.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a solder pad structure for a circuit board. Background Technology

[0002] Circuit boards are named as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Pads are the basic building blocks of surface mount assembly, used to form the pad pattern of the circuit board, that is, various combinations of pads designed for special component types.

[0003] The existing pad structure has the following problems: The existing pad structure is simple, but during component mounting, there may be problems with the components being installed at an angle or misaligned. Utility Model Content

[0004] The purpose of this invention is to provide a solder pad structure for a circuit board to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a circuit board pad structure, including a board body, on which pads are provided, and on which mounting opening structure is provided, the mounting opening structure including a notch, on which a notch is provided, a pressure head is provided at the edge of the notch, and a bend is provided at the edge of the pressure head.

[0006] Preferably, the pressure head is elastic.

[0007] Preferably, a pressure opening is formed between the pressure head and the notch.

[0008] Preferably, the lower end of the pressure head is rounded.

[0009] Compared with the prior art, the beneficial effects of this utility model are: During component installation, place the component pins on the upper end of the recess and align them with the recess. Then, move the component down and press the pins into the recess. At this time, the pressure head presses on the component pins, thus fixing the pins in place. This prevents the component from becoming misaligned after installation. Since the pins are located in the recess, they will accumulate in the recess during soldering, preventing them from remaining on the board and damaging it. This achieves the beneficial effects of stable component pin installation, preventing misalignment, and ensuring that solder does not leak out during soldering. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a front view structural diagram of the present utility model; Figure 3 This is a side view of the mounting port structure of this utility model.

[0011] In the diagram: board body-1, solder pad-2, mounting port structure-3, notch-31, pressure head-32, bend-33, pressure port-34. Detailed Implementation

[0012] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0013] Please see Figure 1 and Figure 2 This utility model provides a circuit board pad structure, including a board body 1, a pad 2 on the board body 1, and a mounting port structure 3 on the pad 2.

[0014] Please see Figure 3 This utility model provides a circuit board pad structure. The mounting port structure 3 includes a notch 31. The notch 31 is provided on the surface of the pad 2. A pressure head 32 is provided on the side of the notch 31. The pressure head 32 is integrally formed with the pad 2. The pressure head 32 is elastic. A bend 33 is provided on the side of the pressure head 32. A pressure opening 34 is formed between the pressure head 32 and the notch 31. The lower end of the pressure head 32 is rounded.

[0015] Specifically, during component installation, the component pins are placed on the upper end of the recess 31 and aligned with the recess 31. Then, the component is moved down, and the pins are pressed into the recess 31. At this time, the pressure head 32 is pressed on the component pins, thereby pressing the pins into the pressure opening 34, thus fixing the component pins and fixing the pins in the recess 31. This prevents the component from becoming misaligned after installation. The pins are located in the recess 31 and will accumulate in the recess 31 during soldering, preventing them from remaining on the board 1 and damaging the board 1. This achieves the beneficial effects of stable component pin installation, preventing misalignment during installation, and ensuring that the solder does not leak out during soldering.

[0016] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A solder pad structure for a circuit board, comprising a board body (1), wherein solder pads (2) are disposed on the board body (1), characterized in that: It also includes a mounting port structure (3), on which the pad (2) is provided a mounting port structure (3), the mounting port structure (3) includes a notch (31), on which the pad (2) is provided a notch (31), a pressure head (32) is provided on the side of the notch (31), and a bend (33) is provided on the side of the pressure head (32).

2. The pad structure of a circuit board according to claim 1, characterized in that: The pressure head (32) is elastic.

3. The pad structure of a circuit board according to claim 1, characterized in that: A pressure opening (34) is formed between the pressure head (32) and the notch (31).

4. The pad structure of a circuit board according to claim 3, characterized in that: The lower end of the pressure head (32) is rounded.

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