Electronic components and electronic devices

Abstract

This application discloses an electronic component assembly and an electronic device. The electronic component assembly includes an electronic component, a circuit board, a first solder section, and a second solder section. The first end face of the electronic component has a first connection section and a second connection section. Both the first and second connection sections include pins, and the number of pins in the first connection section is less than the number of pins in the second connection section. The circuit board has a first mating section and a second mating section on the side facing the first end face. Both the first and second mating sections include first pads. The number of first pads in the first mating section is equal to the number of pins in the first connection section, and they are positioned opposite each other. The number of first pads in the second mating section is equal to the number of pins in the second connection section, and they are positioned opposite each other. The first and second pads of the first mating section are located on the same side of the second mating section. Each first pad is connected to a pin through the first solder section, and each second pad is connected to the first end face through the second solder section.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to an electronic component assembly and an electronic device. Background Technology

[0002] The electronic component assembly includes electronic components and circuit boards. The electronic components have multiple rows of pins, and the circuit boards have multiple rows of pads. Each row of pins includes at least one pin, and each row of pads includes at least one pad. Each pad is connected to a pin by solder.

[0003] In electronic components, multi-row pins include a first row and a second row, arranged adjacent to each other, with the first row having fewer pins than the second row. When soldering circuit boards and electronic components, the asymmetrical arrangement of the first and second rows can cause instability during reflow soldering, resulting in unbalanced soldering forces and localized pin lifting. This can lead to cold solder joints, poor contact, and ultimately, a reduced yield rate for electronic components. Utility Model Content

[0004] This application aims to provide an electronic component assembly and an electronic device that at least solves one of the problems of cold solder joints caused by the asymmetrical arrangement of the pins of electronic components, which reduces the yield of electronic component assemblies.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application propose an electronic component assembly, comprising: an electronic component, wherein a first end face of the electronic component is provided with a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion are arranged at intervals in a first direction, both the first connecting portion and the second connecting portion include pins, and the number of pins in the first connecting portion is less than the number of pins in the second connecting portion; a circuit board, stacked on one side of the first end face of the electronic component, the circuit board having traces, a first mating portion and a second mating portion being provided on the side of the circuit board facing the first end face, both the first mating portion and the second mating portion including first pads, the number of first pads in the first mating portion being equal to the number of pins in the first connecting portion and being positioned opposite each other, the number of first pads in the second mating portion and the number of pins in the second connecting portion being equal to the number of pins in the second mating portion and being positioned opposite each other, the first pads being electrically connected to the traces; the first mating portion further including second pads, the first pads and the second pads of the first mating portion being located on the same side of the second mating portion; a first solder portion, each first pad being connected to a pin through the first solder portion; a second solder portion, the second pads being connected to the first end face through the second solder portion, and the second solder portion being staggered from the pins of the first connecting portion.

[0007] In a second aspect, embodiments of this application provide an electronic device, including: electronic component assemblies as described in the first aspect.

[0008] In embodiments of this application, the electronic component assembly includes electronic components, a circuit board, a first solder section, and a second solder section. The circuit board is stacked on one side of the electronic components, and the circuit board is disposed opposite to the first end face of the electronic components.

[0009] The first end face of the electronic component is provided with a first connecting part and a second connecting part, and the circuit board is provided with a first mating part and a second mating part. The first connecting part and the first mating part are mated to each other, and the second connecting part and the second mating part are mated to each other.

[0010] Both the first connecting part and the second connecting part include pins, and the number of pins in the first connecting part is less than the number of pins in the second connecting part. For example, the first connecting part includes n1 pins and the second connecting part includes n2 pins, where n1 is less than n2, n1 and n2 are both positive integers, and n1 is greater than or equal to 1.

[0011] Both the first mating part and the second mating part include first pads. The number of first pads in the first mating part is equal to the number of pins in the first connecting part, and their positions are opposite. That is, the first mating part includes n1 first pads, and the n1 first pads and n1 pins are arranged in a one-to-one correspondence. Each first pad is connected to a pin through a first solder part. The number of first pads in the second mating part is equal to the number of pins in the second connecting part, and their positions are opposite. That is, the second mating part includes n2 first pads, and the n2 first pads and n2 pins are arranged in a one-to-one correspondence. Each first pad is connected to a pin through a first solder part.

[0012] Since the number of pins in the first connection part is less than the number of pins in the second connection part, the first mating part also includes a second pad. The second pad and the first pad of the first mating part are located on the same side of the second mating part. The second pad is connected to the first end face of the electronic component through the second solder part. That is, the part of the first end face located on the periphery of the pin of the first connection part is connected to the second solder part.

[0013] The first and second pads of the first mating part mate, increasing the connection area between the first mating part and the electronic component. This compensates for the structural difference that the number of pins in the first connection part is less than the number of pins in the second connection part. After the second solder part is connected to the first end face of the electronic component, it increases the surface tension of the electronic component, enhances the balance of the device during the soldering process, compensates for the defects of local connection imbalance, and alleviates the soldering defects caused by pin offset and lifting relative to the first pad. When soldering electronic components and circuit boards using the first and second solder parts, the phenomenon of pin cold solder joints caused by force imbalance during surface mount soldering is reduced or even eliminated. This can improve the stability and reliability of electronic component soldering, which is conducive to improving the yield of electronic component assemblies and thus reducing the production cost of electronic component assemblies.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0016] Figure 1 This is a schematic diagram of the structure of an electronic component assembly according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of the electronic components according to the first embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the circuit board structure according to the first embodiment of the present invention;

[0019] Figure 4 This is a schematic diagram of the circuit board, the first solder section, and the second solder section according to the first embodiment of the present invention;

[0020] Figure 5 This is a partial structural schematic diagram of an electronic component assembly according to the first embodiment of the present utility model;

[0021] Figure 6 This is a partial structural schematic diagram of an electronic component assembly according to the second embodiment of the present invention;

[0022] Figure 7 This is a partial structural schematic diagram of an electronic component assembly according to the third embodiment of the present utility model;

[0023] Figure 8 This is a partial structural schematic diagram of an electronic component assembly according to the fourth embodiment of the present utility model.

[0024] Figure label:

[0025] 10 Electronic component assembly, 100 Electronic component, 110 First end face, 120 First connection part, 130 Second connection part, 140 Pin, 200 Circuit board, 210 Trace, 220 First mating part, 222 Second pad, 230 Second mating part, 240 First pad, 250 First area, 252 First side of the first area, 254 Second side of the first area, 300 First solder part, 400 Second solder part, 500 Metal mesh. Detailed Implementation

[0026] The embodiments of this utility model will now be described in detail. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0027] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] The following is combined with Figures 1 to 8 This invention describes an electronic component assembly 10 and an electronic device according to embodiments of the present invention.

[0031] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, an electronic component assembly 10 according to some embodiments of the present invention includes: an electronic component 100, a first connecting portion 120 and a second connecting portion 130 provided on a first end face 110 of the electronic component 100, the first connecting portion 120 and the second connecting portion 130 being arranged at intervals in a first direction, both the first connecting portion 120 and the second connecting portion 130 including pins 140, and the number of pins 140 of the first connecting portion 120 being less than the number of pins 140 of the second connecting portion 130; and a circuit board 200 stacked on one side of the first end face 110 of the electronic component 100, the circuit board 200 having traces 210, a first mating portion 220 and a second mating portion 230 provided on the side of the circuit board 200 facing the first end face 110, both the first mating portion 220 and the second mating portion 230 including a first solder pad 2. 40. The number of first pads 240 of the first mating part 220 is equal to the number of pins 140 of the first connecting part 120 and they are positioned opposite each other. The number of first pads 240 of the second mating part 230 is equal to the number of pins 140 of the second connecting part 130 and they are positioned opposite each other. The first pads 240 are electrically connected to the traces 210. The first mating part 220 also includes a second pad 222. The first pads 240 and the second pads 222 of the first mating part 220 are located on the same side of the second mating part 230. The first solder part 300 is used to connect each first pad 240 to a pin 140. The second solder part 400 is used to connect the second pads 222 to the first end face 110. The second solder part 400 is staggered from the pins 140 of the first connecting part 120.

[0032] According to an embodiment of the present invention, the electronic component assembly 10 includes an electronic component 100, a circuit board 200, a first solder section 300, and a second solder section 400. The circuit board 200 is stacked on one side of the electronic component 100, and the circuit board 200 is disposed opposite to the first end face 110 of the electronic component 100.

[0033] The first end face 110 of the electronic component 100 is provided with a first connecting part 120 and a second connecting part 130, and the circuit board 200 is provided with a first mating part 220 and a second mating part 230. The first connecting part 120 and the first mating part 220 are mated to each other, and the second connecting part 130 and the second mating part 230 are mated to each other.

[0034] Both the first connecting portion 120 and the second connecting portion 130 include pins 140, and the number of pins 140 in the first connecting portion 120 is less than the number of pins 140 in the second connecting portion 130. For example, the first connecting portion 120 includes n1 pins 140, and the second connecting portion 130 includes n2 pins 140, where n1 is less than n2, n1 and n2 are both positive integers, and n1 is greater than or equal to 1.

[0035] Both the first mating part 220 and the second mating part 230 include first pads 240. The number of first pads 240 in the first mating part 220 is equal to the number of pins 140 in the first connecting part 120, and they are positioned opposite each other. That is, the first mating part 220 includes n1 first pads 240, and the n1 first pads 240 and n1 pins 140 are arranged in a one-to-one correspondence. Each first pad 240 is connected to one pin 140 through a first solder part 300. The number of first pads 240 in the second mating part 230 is equal to the number of pins 140 in the second connecting part 130, and they are positioned opposite each other. That is, the second mating part 230 includes n2 first pads 240, and the n2 first pads 240 and n2 pins 140 are arranged in a one-to-one correspondence. Each first pad 240 is connected to one pin 140 through a first solder part 300.

[0036] Since the number of pins 140 in the first connecting portion 120 is less than the number of pins 140 in the second connecting portion 130, the first mating portion 220 also includes a second pad 222. The second pad 222 and the first pad 240 of the first mating portion 220 are located on the same side of the second mating portion 230. The second pad 222 is connected to the first end face 110 of the electronic component 100 through the second solder portion 400. That is, the portion of the first end face 110 located on the periphery of the pins 140 of the first connecting portion 120 is connected to the second solder portion 400.

[0037] The first pad 240 and the second pad 222 of the first mating part 220 mate with each other, increasing the connection area between the first mating part 220 and the electronic component 100. This compensates for the structural difference that the number of pins 140 in the first connecting part 120 is less than the number of pins 140 in the second connecting part 130. After the second solder part 400 is connected to the first end face 110 of the electronic component 100, it increases the surface tension of the electronic component 100, enhances the device balance during the soldering process, compensates for the defects of local connection imbalance, and alleviates the soldering defects caused by the offset and lifting of the pins 140 relative to the first pad 240. When the first solder part 300 and the second solder part 400 are used to solder the electronic component 100 and the circuit board 200, the phenomenon of false soldering of the pins 140 caused by the imbalance of force during the surface mount soldering process is reduced or even eliminated. This can improve the stability and reliability of the soldering of the electronic component 100, which is conducive to improving the yield of the electronic component assembly 10 and thus helping to reduce the production cost of the electronic component assembly 10.

[0038] The circuit board 200 has a trace 210 inside, and the first pad 240 is electrically connected to the trace 210.

[0039] It is understandable that the first connecting portion 120 has fewer pins 140 than the second connecting portion 130, resulting in uneven stress during soldering of the electronic component 100 and the circuit board 200, making the pins 140 prone to tilting or lifting. In this application, by including a first pad 240 and a second pad 222 in the first mating portion 220, the soldering stress borne by the first connecting portion 120 with fewer pins 140 is reduced. The second pad 222 is connected to the first end face 110 of the electronic component 100 through the second solder portion 400, providing an auxiliary fixing force, thereby reducing the probability of pins 140 lifting and displacement, improving soldering stability, and reducing the probability of cold solder joints.

[0040] For example, the first pad 240 includes, but is not limited to, rectangular pads and circular pads.

[0041] For example, the second pad 222 includes, but is not limited to, rectangular pads and circular pads.

[0042] According to some embodiments of the present invention, the second pad 222 is disconnected from the trace 210; or the second pad 222 is a ground pad.

[0043] Specifically, the type of the second pad 222 is not limited.

[0044] For example, the second pad 222 is disconnected from the trace 210, that is, the second pad 222 is an empty network pad. The second pad 222 is not connected to any functional circuit of the circuit board 200 through the trace 210. While meeting the usage requirement of connecting the second pad 222 to the non-pin area of ​​the electronic component 100 through the second solder section 400, it does not introduce additional electrical interference and does not affect signal transmission.

[0045] For example, the second pad 222 is a ground pad, that is, the second pad 222 is connected to the ground network on the circuit board 200 through the trace 210 of the circuit board 200. The second pad 222 is formed as a ground pad and is connected to the non-pin area of ​​the electronic component 100 through the second solder section 400, which can provide an additional grounding path, which is beneficial to improving the stability of electrical connections and improving anti-interference capability.

[0046] The disconnection of the second pad 222 from the trace 210 can be understood as the second pad 222 being an empty pad without electrical connection.

[0047] The second pad 222 is a ground pad, which can be understood as a pad that connects to the ground network.

[0048] According to some embodiments of the present invention, such as Figure 8 As shown, the plurality of first pads 240 of the second mating part 230 are arranged at intervals along the second direction; the sum of the number of first pads 240 and second pads 222 of the first mating part 220 is equal to the number of first pads 240 of the second mating part 230; the first pads 240 and second pads 222 of the first mating part 220 are staggered in the second direction, each first pad 240 of the first mating part 220 is opposite to one first pad 240 of the second mating part 230, and each second pad 222 of the first mating part 220 is opposite to one first pad 240 of the second mating part 230.

[0049] Specifically, the mating structure of the first mating part 220 and the second mating part 230 is refined.

[0050] The number of first pads 240 in the first mating part 220 is k1, the number of second pads 222 in the first mating part 220 is k2, and the number of first pads 240 in the second mating part 230 is k3, where k1+k2=k3.

[0051] Each first pad 240 of the first mating part 220 is positioned opposite to one first pad 240 of the second mating part 230, and each second pad 222 of the first mating part 220 is positioned opposite to one first pad 240 of the second mating part 230. That is, k1 first pads 240, k2 second pads 222, and k3 first pads 240 form a multi-row, multi-column array structure. The positions of the first pads 240 missing in the first mating part 220 compared to the second mating part 230 are filled by the second pads 222 of the first mating part 220. The total number of pads in the first mating part 220 matches the total number of pads in the second mating part 230, achieving standardization of the pad layout. The spacing between adjacent pads is controllable, which is beneficial for optimizing the surface mount soldering process, further improving the yield of the electronic component assembly 10, and improving the accuracy of electrical connections.

[0052] For example, the first mating part 220 has two first pads 240 and one second pad 222, while the second mating part 230 has three first pads 240. The arrangement of the first pads 240 and the second pads 222 of the first mating part 220 can be adapted to actual usage requirements. For example, the second pad 222 may be located between the two first pads 240, or the two first pads 240 may be located on the same side of the second pad 222.

[0053] For example, the first mating part 220 has two first pads 240 and two second pads 222, while the second mating part 230 has four first pads 240. The arrangement of the first pads 240 and the second pads 222 of the first mating part 220 can be adapted to actual usage requirements. For example, the two first pads 240 and the two second pads 222 can be arranged sequentially in the second direction in the order of first pad 240, second pad 222, second pad 222, and first pad 240. Alternatively, the two first pads 240 and the two second pads 222 can be arranged sequentially in the second direction in the order of second pad 222, first pad 240, second pad 222, and first pad 240. Or, the two first pads 240 and the two second pads 222 can be arranged sequentially in the second direction in the order of first pad 240, first pad 240, second pad 222, and second pad 222.

[0054] For example, in the first mating part 220, the number of first pads 240 is greater than or equal to 1, and the number of second pads 222 is greater than or equal to 1.

[0055] According to some embodiments of the present invention, such as Figure 5 , Figure 6 and Figure 7As shown, the area where all the first pads 240 of the first mating part 220 are located is the first region 250, and the second pad 222 is located on the periphery of the first region 250.

[0056] Specifically, the mating structure of the first mating part 220 and the second mating part 230 is refined.

[0057] The area containing all the first pads 240 of the first mating part 220 is the first region 250. That is, all the first pads 240 of the first mating part 220 are considered as a whole, and the reference point for the arrangement of the second pad 222 is this whole. Specifically, all the first pads 240 of the first mating part 220 are located in the first region 250, and the second pad 222 is located on the periphery of the first region 250, thus realizing the functional partitioning of the first pads 240 and the second pad 222. In the first mating part 220, the first pads 240 used for electrical connection and the second pads 222 used for auxiliary connection are separated. The first pads 240 need to be electrically connected to the trace 210, requiring high positional accuracy. Concentrating the first pads 240 in the first region 250 facilitates centralized routing, optimizes signal routing, and makes routing smoother. Furthermore, the second pad 222 being located on the periphery of the first region 250 helps reduce electrical coupling and interference.

[0058] It is understandable that the arrangement of all the first pads 240 and all the second pads 222 of the first mating part 220 with all the first pads 240 of the second mating part 230 is not a regular array arrangement.

[0059] According to some embodiments of the present invention, along the second direction, the second pad 222 is located on one side of the first region 250.

[0060] Specifically, the arrangement positions of the first pad 240 and the second pad 222 of the first mating part 220 are refined.

[0061] Along the second direction, the second pad 222 is located on one side of the first region 250, which helps to reduce mutual interference when the solder flows, reduces the soldering defect rate, and improves the rationality of the circuit board 200 layout.

[0062] For example, the number of second pads 222 is one.

[0063] For example, there may be multiple second pads 222, located on the same side of the first region 250. For instance, there may be two second pads 222, located between the first region 250 and the other second pad 222 along the second direction. Alternatively, there may be three second pads 222, with the first region 250 and the three second pads 222 arranged sequentially in the second direction in the order of first region 250, second pad 222, second pad 222, and second pad 222.

[0064] According to some embodiments of the present invention, there are multiple second pads 222; a portion of the multiple second pads 222 are located on the first side 252 of the first region, and another portion of the multiple second pads 222 are located on the second side 254 of the first region; wherein, along the second direction, the first side 252 and the second side 254 of the first region are opposite sides of the first region 250.

[0065] Specifically, the arrangement positions of the first pad 240 and the second pad 222 of the first mating part 220 are refined.

[0066] Along the second direction, the first side 252 and the second side 254 of the first region are opposite sides of the first region 250. A portion of the plurality of second pads 222 are located on the first side 252 of the first region, and another portion of the plurality of second pads 222 are located on the second side 254 of the first region. That is, second pads 222 are arranged on both the first side 252 and the second side 254 of the first region. The plurality of second pads 222 are not concentrated on the same side of the first region 250, but are distributed on opposite sides of the first region 250. This helps ensure balanced force during soldering, prevents pins 140 from lifting or tilting, reduces soldering defects, makes the electronic component 100 less prone to loosening, and improves the yield rate of the electronic component assembly 10.

[0067] A second pad 222 is arranged on the first side 252 of the first region, and a second pad 222 is arranged on the second side 254 of the first region.

[0068] A plurality of second pads 222 are arranged on the first side 252 of the first region, and a plurality of second pads 222 are arranged on the second side 254 of the first region.

[0069] For example, the number of second pads 222 located on the first side 252 of the first region is equal to the number of second pads 222 located on the second side 254 of the first region.

[0070] For example, the number of second pads 222 located on the first side 252 of the first region is not equal to the number of second pads 222 located on the second side 254 of the first region. Device balance can be achieved by adjusting the size of the second pads 222.

[0071] According to some embodiments of the present invention, such as Figure 7 As shown, the second pad 222 is located between the first region 250 and the second mating part 230.

[0072] Specifically, the arrangement positions of the first mating part 220 and the second mating part 230 are refined.

[0073] The second pad 222 is located between the first region 250 and the second mating portion 230. The second pad 222 serves to separate the first region 250 and the second mating portion 230, which helps to improve the isolation between input and output signals, enhance anti-interference performance, improve electrical performance, and improve the reliability of the manufacturing process.

[0074] According to some embodiments of the present invention, the second pad 222 is an annular structure or an arc-shaped structure extending circumferentially along the first region 250; or the number of second pads 222 is multiple, and the multiple second pads 222 are arranged at intervals along the circumferential direction of the first region 250.

[0075] Specifically, the types of the second pad 222 are refined. The second pad 222 is a ring structure extending circumferentially along the first region 250, or the second pad 222 is an arc-shaped structure extending circumferentially along the first region 250, or there are multiple second pads 222, which are arranged at intervals along the circumference of the first region 250. This ensures the yield rate of the electronic component assembly 10 while ensuring the effectiveness and feasibility of separating the first region 250 and the second mating part 230.

[0076] According to some embodiments of the present invention, such as Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, a metal mesh 500 is provided on the second solder pad 222, and the second solder part 400 is located on the metal mesh 500.

[0077] Specifically, a metal mesh 500 is provided on the second solder pad 222, and the second solder part 400 is located on the metal mesh 500. This can assist in the distribution of the second solder part 400, allowing it to be distributed more evenly, enhancing the solder joint strength. It can also adjust the amount of the second solder part 400 and control its flow, which is beneficial for enhancing the bonding force between the second solder part 400 and the second solder pad 222 and the electronic component 100, thereby improving the reliability of the soldering.

[0078] For example, the metal mesh 500 includes a steel mesh.

[0079] According to some embodiments of the present invention, the circuit board 200 is at least one of a printed circuit board and a flexible circuit board.

[0080] Specifically, the structure of circuit board 200 is refined.

[0081] The circuit board 200 is at least one of a printed circuit board and a flexible circuit board. That is, the circuit board 200 is a printed circuit board, or the circuit board 200 is a flexible circuit board, or a part of the circuit board 200 is a printed circuit board and the other part of the circuit board 200 is a flexible circuit board.

[0082] According to some embodiments of the present invention, such as Figure 3 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the number of second connecting portions 130 and second mating portions 230 is equal and there are multiple second mating portions 230; the multiple second mating portions 230 are located on the same side of the first mating portion 220, and the multiple second mating portions 230 are arranged at intervals along the first direction.

[0083] Specifically, the number and arrangement of the second connecting part 130 and the second mating part 230 are refined.

[0084] The number of second connecting parts 130 and second mating parts 230 is equal and there are multiple of each. That is, there are multiple second connecting parts 130 and multiple second mating parts 230.

[0085] Multiple second mating portions 230 are located on the same side of the first mating portion 220, and the multiple second mating portions 230 are arranged at intervals along the first direction. It can be understood that multiple second connecting portions 130 are located on the same side of the first connecting portion 120, and the multiple second connecting portions 130 are arranged at intervals along the first direction. In this way, functional partitioning is achieved, which helps to make the space layout of the circuit board 200 more reasonable.

[0086] In some other embodiments, the number of first connecting portions 120 and first mating portions 220 are equal and there are multiple first connecting portions 120 located on the same side of the second connecting portion 130.

[0087] In other embodiments, the number of first connecting portions 120 and first mating portions 220 is equal and there are multiple of each, and the number of second connecting portions 130 and second mating portions 230 is equal and there are multiple of each. The multiple first connecting portions 120 are arranged at intervals along a first direction, and the area where the multiple first connecting portions 120 are located is a second region. A portion of the multiple second connecting portions 130 are located on a first side of the second region, and another portion of the multiple second connecting portions 130 are located on a second side of the second region. Along the first direction, the first side and the second side of the second region are opposite sides of the second region.

[0088] In other embodiments, the number of first connecting portions 120 and first mating portions 220 is equal and there are multiple of each, and the number of second connecting portions 130 and second mating portions 230 is equal and there are multiple of each. At least a portion of the multiple first connecting portions 120 have at least one second connecting portion 130 in each of two adjacent first connecting portions 120.

[0089] In other embodiments, the number of first connecting portions 120 and first mating portions 220 is equal and there are multiple of each, and the number of second connecting portions 130 and second mating portions 230 is equal and there are multiple of each. In at least a portion of the multiple second connecting portions 130, at least one first connecting portion 120 is provided in two adjacent second connecting portions 130.

[0090] According to some embodiments of the present invention, the number of the second connecting portion 130 and the second mating portion 230 are equal and there are multiple of each; along the first direction, a portion of the multiple second mating portions 230 are located on the first side of the first mating portion 220, and another portion of the multiple second mating portions 230 are located on the second side of the first mating portion 220.

[0091] Specifically, the number and arrangement of the second connecting part 130 and the second mating part 230 are refined.

[0092] The number of second connecting portions 130 and second mating portions 230 is equal and there are multiple of each; that is, there are multiple second connecting portions 130 and multiple second mating portions 230. Along the first direction, a portion of the multiple second mating portions 230 are located on the first side of the first mating portion 220, and another portion of the multiple second mating portions 230 are located on the second side of the first mating portion 220. It can be understood that the first side and the second side of the first mating portion 220 are opposite sides of the first mating portion 220 in the first direction, and second mating portions 230 are arranged on both opposite sides of the first mating portion 220 in the first direction.

[0093] An electronic device according to some embodiments of this application includes: an electronic component assembly 10 as described in any of the above embodiments.

[0094] The electronic device provided in this application includes the electronic component 10 of any of the above embodiments, and therefore has all the beneficial effects of the electronic component 10, which will not be described one by one here.

[0095] For example, electronic devices can be mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, mobile internet devices (MID), augmented reality (AR) / virtual reality (VR) devices, robots, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), etc. They can also be servers, network attached storage (NAS), personal computers (PCs), televisions (TVs), ATMs, or self-service machines, etc. The embodiments of this application do not impose specific limitations.

[0096] For example, this application sets a dummy pad (virtual pad, i.e., second pad 222) on the circuit board 200 and sets a stencil (i.e., metal mesh 500) on the second pad 222. The stencil is used to adjust the amount of solder (i.e., the amount of the second solder section 400), thereby reducing or even eliminating cold solder joint abnormalities caused by unbalanced force during surface mount soldering reflow, improving the yield rate of electronic component assembly 10 soldering, and improving the soldering stability of electronic component 100. Among them, electronic component 100 includes a surface acoustic wave filter with five pins 140.

[0097] For example, this application adds a second pad 222 to the circuit board 200. During the surface mount soldering process, solder paste (i.e., the second solder part 400) is printed on the second pad 222. After the solder paste comes into contact with the electronic component 100, it can increase the surface tension of the electronic component 100 to achieve the device balance state during the solder melting process. This can alleviate the phenomenon of poor soldering caused by the misalignment of the electronic component 100 during surface mount soldering, improve the soldering yield, and reduce the soldering defect rate of the surface acoustic wave filter.

[0098] For example, the solder paste used in SMT (Surface Mount Technology) soldering has a certain degree of stickiness. Increasing the amount of solder paste can improve the balance of the components on the soldering surface of the circuit board 200, thereby increasing the adhesion of the components to the circuit board 200. The main method is to add two second solder pads 222 to the circuit board 200 to adhere the electronic components 100 to the circuit board 200, maintaining this adhesion until high-temperature reflow soldering, thus compensating for localized stickiness imbalances.

[0099] For example, taking electronic component 100 as an acoustic wave filter and circuit board 200 as a printed circuit board, the acoustic wave filter includes five pins 140. Two empty pads (i.e., second pads 222) are provided on the printed circuit board corresponding to the acoustic wave filter and are attached to the electronic component 100 at the position around the pins 140. Specifically, the second pads 222 correspond to the position of the acoustic wave filter where solder paste is applied (i.e., the second solder part 400), and the acoustic wave filter is attached with the empty pads and solder paste. Utilizing the adhesiveness of the solder paste, the solder paste is adhered to the non-pin parts of the acoustic wave filter (e.g., the plastic package position of the acoustic wave filter), improving the stability of surface mount and printing. The anti-sagging agent in the solder paste itself has a certain degree of adhesiveness, enabling it to adhere to the electronic component 100.

[0100] For example, such as Figure 6 As shown, there are multiple empty solder pads with a small area to further enhance the surface tension of the electronic components 100 during soldering, thereby achieving a balanced state of the components during the solder melting process. Setting multiple spaced empty solder pads can better balance the force on the components. These spaced empty solder pads can be set to any shape according to the force conditions, and the number of empty solder pads can be set according to the force conditions.

[0101] For example, such as Figure 7 As shown, the second pad 222 can be set as a continuous structure (e.g., an arc-shaped structure), which can not only further increase the surface tension of the material body, but also improve the isolation between the input signal and the output signal and optimize the interference problem.

[0102] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0103] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic component assembly, characterized in that, include: An electronic component, wherein a first connecting portion and a second connecting portion are provided on a first end face, the first connecting portion and the second connecting portion are arranged at a distance in a first direction, and both the first connecting portion and the second connecting portion include pins, and the number of pins of the first connecting portion is less than the number of pins of the second connecting portion; A circuit board is stacked on one side of the first end face of the electronic component. The circuit board has traces inside. The side of the circuit board facing the first end face has a first mating part and a second mating part. Both the first mating part and the second mating part include a first pad. The number of first pads of the first mating part is equal to the number of pins of the first connecting part and they are positioned opposite each other. The number of first pads of the second mating part is equal to the number of pins of the second connecting part and they are positioned opposite each other. The first pads are electrically connected to the traces. The first mating part further includes a second pad, and the first pad and the second pad of the first mating part are located on the same side of the second mating part; A first solder section, wherein each of the first solder pads is connected to one of the pins via the first solder section; The second solder section has a second solder pad connected to the first end face via the second solder section, and the pins of the second solder section are staggered from those of the first connection section.

2. The electronic component assembly according to claim 1, characterized in that, The second pad is disconnected from the trace; or The second pad is the ground pad.

3. The electronic component assembly according to claim 1 or 2, characterized in that, The plurality of first pads of the second mating part are arranged at intervals along the second direction; The sum of the number of the first pads and the second pads of the first mating part is equal to the number of the first pads of the second mating part; The first pad and the second pad of the first mating part are staggered in the second direction. Each first pad of the first mating part is opposite to a first pad of the second mating part, and each second pad of the first mating part is opposite to a first pad of the second mating part.

4. The electronic component assembly according to claim 1 or 2, characterized in that, The area where all the first pads of the first mating part are located is the first region, and the second pads are located on the periphery of the first region.

5. The electronic component assembly according to claim 4, characterized in that, The number of the second pad is multiple; A portion of the plurality of second pads is located on a first side of the first region, and another portion of the plurality of second pads is located on a second side of the first region; Along the second direction, the first side of the first region and the second side of the first region are opposite sides of the first region.

6. The electronic component assembly according to claim 4, characterized in that, The second pad is located between the first region and the second mating part.

7. The electronic component assembly according to claim 6, characterized in that, The second pad is a ring-shaped or arc-shaped structure extending circumferentially along the first region; or The number of second pads is multiple, and the multiple second pads are arranged at circumferential intervals along the first region.

8. The electronic component assembly according to claim 1 or 2, characterized in that, The second pad is provided with a metal mesh, and the second solder part is located on the metal mesh.

9. The electronic component assembly according to claim 1 or 2, characterized in that, The number of the second connecting part and the second mating part are equal and there are multiple of each; Multiple second mating parts are located on the same side of the first mating part, and the multiple second mating parts are arranged at intervals along the first direction; or Along the first direction, a portion of the plurality of second mating portions is located on the first side of the first mating portion, and another portion of the plurality of second mating portions is located on the second side of the first mating portion.

10. An electronic device, characterized in that, include: The electronic component assembly as described in any one of claims 1 to 9.

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