A power supply cooling structure

Abstract

This utility model relates to the field of power supply heat dissipation technology, providing a power supply cooling structure including a heat sink and a power cord. The heat sink has cooling grooves, and the power cord passes through these grooves. One end of the power cord is connected to the power input terminal, and the other end is connected to the power supply motherboard. This utility model features a heat sink with water-cooling grooves, which, by filling with coolant, performs liquid cooling of the power supply motherboard. Simultaneously, the heat sink and the power cord body are embedded, spatially isolating the power cord body from the power supply motherboard located on the back of the bottom cover. This effectively provides electromagnetic isolation while dissipating heat from the power cord body, improving the operational stability of the power supply motherboard, and further enabling a compact installation to complement the miniaturization of the device.

Description

Technical Field

[0001] This utility model relates to the field of power supply heat dissipation technology, and in particular to a power supply cooling structure. Background Technology

[0002] With the rapid development of technologies in fields such as communications, data centers, new energy, and industrial drives, the requirements for power density, efficiency, and reliability of core power supply equipment are becoming increasingly stringent. High-power-density power supplies generate a large amount of Joule heat during operation, causing the junction temperature of internal power devices (such as IGBTs, MOSFETs, and diodes) to rise rapidly. Excessive junction temperature can severely limit the power supply's output capacity, shorten component lifespan, reduce system reliability, and even trigger overheat protection or equipment damage. Therefore, efficient heat dissipation has become a key challenge in the design of high-power power supplies.

[0003] Currently, conventional heat dissipation methods for such power supplies mainly include natural air cooling and forced air cooling. Regarding external water cooling: for applications with higher heat flux densities, a separate liquid plate is typically mounted on the heat-generating components, and then connected to a water pump and radiator via external piping to form a circulating cooling system. While this method offers powerful heat dissipation, the power supply casing is a crucial component whose performance directly affects the overall operating status and lifespan of the power supply. However, liquid plates have complex structures and occupy a large amount of space. Separating the liquid plate from the power supply casing increases the system's size and weight, contradicting the trend towards miniaturization and integration in power supply equipment development. Utility Model Content

[0004] This utility model provides a power supply cooling structure that solves the technical problems of existing power supply equipment heat dissipation devices being large in size, having poor heat dissipation efficiency, and low integration.

[0005] To solve the above technical problems, this utility model provides a power supply cooling structure, including: a heat sink and a power cord. The heat sink has a cooling groove, the power cord passes through the cooling groove, and one end of the power cord is used to connect to the power input terminal, and the other end of the power cord is used to connect to the power supply motherboard.

[0006] This basic design features a heatsink with a water-cooling tank, which uses coolant to perform liquid cooling for the power supply motherboard. The heatsink and power cable are also embedded in the design, isolating the power cable from the power supply motherboard located on the back of the bottom cover. This effectively provides electromagnetic isolation while cooling the power cable, improving the stability of the power supply motherboard and further facilitating a compact design that complements the miniaturization of the device.

[0007] In a further embodiment, the heat sink includes a bottom cover, a top cover, and a sealing assembly. The bottom cover and the top cover are sealed together by the sealing assembly. A water-cooling groove is formed by an inward recess in the center of the front of the bottom cover. A power cable is embedded in the water-cooling groove and is sealed and isolated by the sealing assembly. The main body of the power cable is spatially isolated from the power motherboard located on the back of the bottom cover, and its end is electrically connected to the power motherboard.

[0008] In a further embodiment, the front of the bottom cover is also provided with a first through hole and a second through hole penetrating the plate surface. The main body of the power cord is disposed in the water cooling tank. One end of the cord is nested in the sealing component and passes through the first through hole into the water cooling tank. The other end of the cord passes through the second through hole and is nested in the sealing component, and then enters the back of the bottom cover and is electrically connected to the power supply motherboard.

[0009] This solution, through the embedded installation of sealing components and power cords, effectively improves the sealing performance of the water cooling tank while achieving miniaturized assembly, ensuring water cooling effect and equipment safety.

[0010] In a further embodiment, a wire groove is provided in the middle of the water cooling tank. The wire groove extends radially to form a strip-shaped groove parallel to the flow direction of the water cooling tank. Its two ends are respectively connected to the first through hole and the second through hole. One end of the power cord enters the cavity of the water cooling tank through the first through hole, and its body is embedded in the wire groove. The other end of the power cord passes through the bottom cover through the second through hole and is electrically connected to the power main board. The main body of the power cord is embedded in the sealed water-cooling tank, where it exchanges heat with the coolant in the water-cooling tank and isolates the electromagnetic waves generated by the power cord.

[0011] This design incorporates cable trays within the water-cooling tank, along with first and second through holes, to achieve isolated installation of the power cables. The main body of the power cable is embedded within the cable trays of the sealed water-cooling tank, preventing the power cable from floating and affecting the flow of coolant, while also preventing cable movement from affecting the installation seal. Furthermore, the installation channel provided by the cable trays allows the power cable to directly connect to the power supply components (i.e., the aforementioned heat-generating components, such as circuit boards) from a distance, shortening the power cable's entry path, reducing line loss, and improving the stability of power supply operation.

[0012] In a further embodiment, a plurality of mounting holes are evenly distributed on both sides of the bottom cover, and the mounting holes are blind holes that mate with bolts / screws.

[0013] This design features several mounting holes evenly distributed on both sides of the bottom cover, providing side mounting functionality. This allows the heat sink to be fixed to the side of the power supply housing as a side plate, further adapting to product miniaturization and providing heat dissipation and electromagnetic shielding functions.

[0014] In a further embodiment, the bottom of the water-cooling tank is provided with at least one guide block; the guide block extends radially along the bottom cover and is parallel to the water-cooling tank, and divides the cavity of the water-cooling tank into at least two liquid flow channels; The edge of the water-cooling tank has an L-shaped stepped structure, and the L-shaped stepped structure is sealed and fitted with the face cover by the sealing component.

[0015] This design incorporates an L-shaped stepped structure to assist in the closing of the bottom and top covers, improving the stability of the closing mechanism. Guide blocks are installed to divide the water-cooling tank, forming at least two liquid flow channels. By physically dividing the flow channels, the coolant is forced to flow through all areas of the entire heat dissipation surface, thereby optimizing the flow field distribution and maximizing heat dissipation performance.

[0016] In a further embodiment, a water inlet is installed at one end of the bottom cover and a water outlet is installed at the other end; liquid flow holes are formed through the bottom of both ends of the water cooling tank, which are connected to the water inlet and the water outlet.

[0017] In a further embodiment, the sealing assembly includes a first seal and a second seal, wherein the face cover is closed to the bottom cover via the first seal to seal the water-cooling tank; and the power cord terminal is sealed to the bottom cover via the nested second seal.

[0018] In a further embodiment, a fixing seat corresponding to the first through hole and the second through hole is provided on the back of the bottom cover, and the fixing seat is an annular boss surrounding the first through hole / second through hole; The second sealing element includes a waterproof plug and a waterproof gasket. The waterproof plug has a first mounting hole in the middle and an annular fitting groove around the first mounting hole. The waterproof gasket and waterproof plug are sequentially fitted onto the terminals of the power cord, and the annular fitting groove is fitted into the annular boss. The first sealing element includes a sealing strip.

[0019] This solution sets up corresponding first and second sealing elements based on different sealing areas, and uses sealing strips, waterproof plugs and waterproof gaskets to adapt to different shapes of the faceplate and power cord, thereby improving the sealing performance of the heat sink. Attached Figure Description

[0020] Figure 1 This is an exploded view of a power supply cooling structure provided in an embodiment of this utility model; Figure 2 This is provided by the embodiment of the present utility model. Figure 1 3D structural diagram of the midsole cover 1; Figure 3 This is provided by the embodiment of the present utility model. Figure 1 3D structural diagram of the midsole cover 1; Figure 4 This is provided by the embodiment of the present utility model. Figure 1 Assembly diagram in the image; Figure 5 This is a schematic diagram of the use of a power supply cooling structure provided in an embodiment of this utility model; Wherein: heat sink A, power cord B, power supply housing C; Bottom cover 1, water inlet 11, water outlet 12, liquid flow hole 13, fixing base 14, mounting hole 15; top cover 2; first seal 3, second seal 4, waterproof plug 41, waterproof gasket 42. Water cooling tank a1, first through hole a2, second through hole a3, wire groove a4, guide block a5. Detailed Implementation

[0021] The embodiments of this utility model are described in detail below with reference to the accompanying drawings. The embodiments are given for illustrative purposes only and should not be construed as limiting the utility model. The accompanying drawings are for reference and illustration only and do not constitute a limitation on the scope of patent protection of this utility model, because many changes can be made to this utility model without departing from the spirit and scope of this utility model.

[0022] This utility model provides a power supply cooling structure A, such as... Figures 1-5 As shown, in this embodiment, it includes: a heat sink A and a power cord B. The heat sink A has a cooling groove a1, the power cord B passes through the cooling groove a1, and one end of the power cord B is used to connect to the power input terminal, and the other end of the power cord B is used to connect to the power motherboard.

[0023] In a further embodiment, the heat sink A includes a bottom cover 1, a front cover 2, and a sealing assembly. The bottom cover 1 and the front cover 2 are sealed together by the sealing assembly. The center of the front of the bottom cover 1 is recessed inward to form a water cooling groove a1. A power cord B is embedded in the water cooling groove a1 and is sealed and isolated by the sealing assembly. The main body of the power cord B is spatially isolated from the power motherboard located on the back of the bottom cover 1, and its end is electrically connected to the power motherboard.

[0024] The power line B includes, but is not limited to, the neutral wire and the live wire.

[0025] The bottom cover 1 and the top cover 2 are made of high-strength alloy materials (such as aluminum alloy) or metal materials with good conductivity (such as copper), thereby forming a shielding cavity to isolate the electromagnetic interference generated by the internal power line B, so as to avoid affecting the normal operation of the power supply motherboard.

[0026] In this embodiment, the front of the bottom cover 1 is also provided with a first through hole a2 and a second through hole a3 penetrating the plate surface. The main body of the power cord B is disposed in the water cooling tank a1. One end of its terminal is nested in the sealing component and then passes through the first through hole a2 to enter the water cooling tank a1; the other end of its terminal passes through the second through hole a3 and then is nested in the sealing component, and then enters the back of the bottom cover 1 and is electrically connected to the power supply motherboard.

[0027] This embodiment effectively improves the sealing performance of the water cooling tank a1 by using a sealing component in conjunction with the embedded installation of the power cord B, thereby ensuring water cooling effect and equipment safety while achieving miniaturized assembly.

[0028] In this embodiment, a wire groove a4 is provided in the middle of the water-cooling tank a1. The wire groove a4 extends radially to form a strip-shaped groove parallel to the flow direction of the water-cooling tank a1. Its two ends are respectively connected to the first through hole a2 and the second through hole a3. One end of the power cord B (this end is connected to the power input terminal) enters the cavity of the water-cooling tank a1 through the first through hole a2, and its main body is embedded in the wire groove a4. The other end of the power cord B passes through the bottom cover 1 through the second through hole a3 and is electrically connected to the power main board. The main body of the power line B is embedded in the sealed water-cooling tank a1, where it exchanges heat with the coolant in the water-cooling tank a1 and isolates the electromagnetic waves generated by the power line B.

[0029] In this embodiment, a wire groove a4 is provided in the water-cooling tank a1, which, together with the first through hole a2 and the second through hole a3, enables isolated installation of the power cord B. The main body of the power cord B is embedded in the wire groove a4 of the sealed water-cooling tank a1, preventing the power cord B from floating and affecting the flow of coolant, while also preventing the wire from being pulled and affecting the installation seal. At the same time, due to the installation channel provided by the wire groove a4, the power cord B can be directly connected to the power supply component (i.e., the aforementioned heat-generating component, such as the circuit board) from the far end, shortening the wire entry path of the power cord B, reducing line loss, and improving the stability of the power supply operation.

[0030] In this embodiment, a plurality of mounting holes 15 are evenly distributed on both sides of the bottom cover 1, and the mounting holes 15 are blind holes that cooperate with bolts / screws.

[0031] According to the actual needs of the power supply device, at least one set of heat sink A can be provided on the power supply housing C. The heat sink A is fixed to the power supply housing C through the mounting holes and directly serves as part of the side panel power supply housing C.

[0032] In this embodiment, several mounting holes are evenly distributed on both sides of the bottom cover 1 to provide the function of side mounting, so that the heat sink A can be fixed as a side plate to the side of the power supply housing C, further adapting to the miniaturization of the product and providing heat dissipation and electromagnetic shielding functions.

[0033] In this embodiment, the bottom of the water-cooling tank a1 is provided with at least one guide block a5; the guide block a5 extends radially along the bottom cover 1 and is parallel to the water-cooling tank a1, and divides the cavity of the water-cooling tank a1 into at least two liquid flow channels; The edge of the water-cooled tank a1 has an L-shaped stepped structure, and the L-shaped stepped structure is sealed and fitted with the face cover 2 through the sealing component.

[0034] In this embodiment, the faceplate 2 is fixed to the bottom cover 1 by screws or seals, forming a detachable structure. The power cord B can be installed / inspected by removing the faceplate 2. In other embodiments, it can also be set as a non-detachable potting and sealing structure as needed; this embodiment does not impose any limitations.

[0035] In this embodiment, an L-shaped stepped structure is set to assist the closing of the bottom cover 1 and the top cover 2, thereby improving the stability of the closing. A guide block a5 is set to divide the water cooling tank a1 to form at least two liquid flow channels. By physically dividing the flow channels, the coolant is forced to flow through all areas of the entire heat dissipation surface to optimize the flow field distribution and thus maximize the heat dissipation performance.

[0036] In this embodiment, a water inlet 11 is installed at one end of the bottom cover 1, and a water outlet 12 is installed at the other end; liquid flow holes 13 are formed through the bottom of both ends of the water cooling tank a1, which are connected to the water inlet 11 and the water outlet 12.

[0037] In this embodiment, the sealing assembly includes a first sealing element 3 and a second sealing element 4. The face cover 2 is closed with the bottom cover 1 through the first sealing element 3 to seal the water cooling tank a1. The terminal of the power cord B is sealed to the bottom cover 1 by nesting the second sealing element 4.

[0038] In this embodiment, a fixing seat 14 corresponding to the first through hole a2 and the second through hole a3 is provided on the back of the bottom cover 1. The fixing seat 14 is an annular boss surrounding the first through hole a2 / second through hole a3. The second sealing element 4 includes a waterproof plug 41 and a waterproof gasket 42. The waterproof plug 41 has a first mounting hole in the middle and an annular fitting groove around the first mounting hole. The waterproof gasket 42 and the waterproof plug 41 are sequentially fitted onto the terminals of the power cord B, and the annular fitting groove is fitted into the annular boss. The first sealing element 3 includes a sealing strip.

[0039] In this embodiment, corresponding first sealing element 3 and second sealing element 4 are set according to different sealing areas. The sealing strip, waterproof plug 41 and waterproof gasket 42 are adapted to the different shapes of the face cover 2 and power cord B, thereby improving the sealing performance of the heat sink A.

[0040] This embodiment of the utility model features a heat sink A with a water-cooling tank a1, which performs liquid cooling of the power supply motherboard by filling it with coolant. At the same time, the heat sink A and the main body of the power cord B are embedded in each other, which spatially isolates the main body of the power cord B from the power supply motherboard located on the back of the bottom cover 1. While dissipating heat from the main body of the power cord B, electromagnetic isolation is effectively performed, improving the working stability of the power supply motherboard, and further achieving a compact installation, which is in line with the miniaturization of the device.

[0041] The above embodiments are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. A power supply cooling structure characterized by comprising: include: The heat sink and power cord are provided. The heat sink has a cooling groove, the power cord passes through the cooling groove, and one end of the power cord is used to connect to the power input terminal, while the other end of the power cord is used to connect to the power supply motherboard.

2. The power supply cooling structure as described in claim 1, characterized in that: The heat sink includes a bottom cover, a top cover, and a sealing assembly. The bottom cover and the top cover are sealed together by the sealing assembly. The center of the front of the bottom cover is recessed to form a water cooling groove. A power cable is embedded in the water cooling groove and is sealed and isolated by the sealing assembly. The main body of the power cable is spatially isolated from the power motherboard located on the back of the bottom cover, and its end is electrically connected to the power motherboard.

3. The power supply cooling structure as described in claim 2, characterized in that: The front of the bottom cover is also provided with a first through hole and a second through hole that penetrate the plate surface. The main body of the power cord is set in the water cooling tank. One end of the cord is nested in the sealing component and then passes through the first through hole into the water cooling tank. The other end of the cord passes through the second through hole and is nested in the sealing component, and then enters the back of the bottom cover and is electrically connected to the power supply motherboard.

4. The power supply cooling structure as described in claim 3, characterized in that: The water-cooling tank has a wire groove in the middle, which extends radially to form a strip-shaped groove parallel to the flow direction of the water-cooling tank. Its two ends are respectively connected to the first through hole and the second through hole. One end of the power cord enters the cavity of the water-cooling tank through the first through hole, and its body is embedded in the wire groove. The other end of the power cord passes through the bottom cover through the second through hole and is electrically connected to the power motherboard. The main body of the power cord is embedded in the sealed water-cooling tank, where it exchanges heat with the coolant in the water-cooling tank and isolates the electromagnetic waves generated by the power cord.

5. A power supply cooling structure as described in claim 2, characterized in that: The bottom cover has several mounting holes evenly distributed on both sides, and the mounting holes are blind holes that mate with bolts / screws.

6. A power supply cooling structure as described in claim 2, characterized in that: The bottom of the water-cooling tank is provided with at least one guide block; the guide block extends radially along the bottom cover and is parallel to the water-cooling tank, and divides the cavity of the water-cooling tank into at least two liquid flow channels; The edge of the water-cooling tank has an L-shaped stepped structure, and the L-shaped stepped structure is sealed and fitted with the face cover by the sealing component.

7. A power supply cooling structure as described in claim 5, characterized in that: The bottom cover has an inlet at one end and an outlet at the other end; the bottom of both ends of the water-cooling tank forms liquid flow holes that communicate with the inlet and the outlet.

8. A power supply cooling structure as described in claim 4, characterized in that: The sealing assembly includes a first seal and a second seal. The face cover is sealed to the bottom cover by the first seal to seal the water-cooling tank. The power cord terminal is sealed to the bottom cover by nesting the second seal.

9. A power supply cooling structure as described in claim 8, characterized in that: The bottom cover is provided with a fixing seat corresponding to the first through hole and the second through hole. The fixing seat is an annular boss surrounding the first through hole / second through hole. The second sealing element includes a waterproof plug and a waterproof gasket. The waterproof plug has a first mounting hole in the middle and an annular fitting groove around the first mounting hole. The waterproof gasket and waterproof plug are sequentially fitted onto the terminals of the power cord, and the annular fitting groove is fitted into the annular boss. The first sealing element includes a sealing strip.

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