Heat dissipation devices and communication equipment

Abstract

This disclosure provides a heat dissipation device and a communication device, relating to the field of communication technology. The heat dissipation device is applied to a communication device, which includes a motherboard and chip components and optical module components disposed on the motherboard. The heat dissipation device includes: a chip heat dissipation module disposed on the surface of the chip component away from the motherboard; an optical module heat dissipation module, at least partially disposed on the surface of the optical module component away from the motherboard; and a flow guiding module, including a wind guide shroud disposed on the motherboard, wherein a hollow cavity inside the wind guide shroud forms a flow guiding channel along a first direction, wherein the air outlet of the flow guiding channel faces the optical module heat dissipation module. The heat dissipation device provided by the embodiments of this disclosure can comprehensively balance the heat dissipation requirements of the chip components and optical module components of the communication device, achieving efficient heat dissipation and energy saving and noise reduction.

Description

Technical Field

[0001] This disclosure relates to the field of communication technology, and in particular to a heat dissipation device and communication equipment. Background Technology

[0002] With the continuous development of communication technology, the power density of various electronic components in communication equipment has significantly increased, and the heat generated during operation has also been increasing. However, as communication equipment gradually becomes more integrated and miniaturized, heat dissipation within a limited space has become a key bottleneck restricting its performance stability, service life, and reliability. Utility Model Content

[0003] This disclosure provides a heat dissipation device and a communication device.

[0004] In a first aspect, embodiments of this disclosure provide a heat dissipation device applied to a communication device, the communication device including a motherboard and a chip assembly and an optical module assembly disposed on the motherboard, wherein the heat dissipation device includes: a chip heat dissipation module disposed on the surface of the chip assembly away from the motherboard; an optical module heat dissipation module disposed at least partially on the surface of the optical module assembly away from the motherboard; and a flow guiding module including an air guide shroud disposed on the motherboard, wherein a hollow cavity inside the air guide shroud forms a flow guiding channel along a first direction, wherein the air outlet end of the flow guiding channel faces the optical module heat dissipation module.

[0005] Secondly, embodiments of this disclosure also provide a communication device, including a motherboard and a chip assembly and an optical module assembly disposed on the motherboard, and further including a heat dissipation device as described in any implementation of the first aspect of this disclosure.

[0006] The heat dissipation device and communication equipment provided in this disclosure embodiment, by setting a flow guiding module with a flow guiding channel and directing the air outlet of the flow guiding channel toward the optical module heat dissipation module, effectively dissipates heat from the optical module component by enhancing ventilation and reducing the impact of hot air from the chip component on the optical module component, ensuring that the operating temperature of the optical module component is within a safe range, thereby effectively balancing the heat dissipation requirements of the chip component and the optical module component of the communication equipment, and achieving efficient heat dissipation and energy saving and noise reduction.

[0007] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0008] Other features, objects, and advantages of this disclosure will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1AThis is a schematic diagram of the structure of a communication device in which the heat dissipation device of this disclosure can be applied, according to an embodiment of the present disclosure. Figure 1B This is a schematic diagram of the structure of the heat dissipation device and communication equipment provided in the embodiments of this disclosure; Figure 2 This is a schematic diagram of the structure of a heat dissipation device and a communication device provided in another embodiment of the present disclosure; Figure 3 This is a schematic diagram of a heat dissipation device based on relevant technologies; Figure 4 This is a schematic diagram of the structure of the chip heat dissipation module provided in the embodiments of this disclosure; Figure 5 This is a schematic diagram of the structure of the optical module heat dissipation module provided in the embodiments of this disclosure; Figure 6 This is a schematic diagram of the flow guiding module provided in an embodiment of this disclosure. Detailed Implementation

[0009] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding; these should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description. It should be noted that, unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0010] See Figure 1A and Figure 1B As shown, an embodiment of this disclosure provides a heat dissipation device that can be applied to a communication device 100.

[0011] In this embodiment, Figure 1ATaking the highly integrated network interface card (NIC) as an example, the communication device 100 may include a motherboard 101, on which various devices and electronic components may be installed. The main heat-generating components include a chip assembly 102 and an optical module assembly 103. The chip assembly 102 may include a main chip, such as an FPGA (Field Programmable Gate Array) chip. The chip assembly 102 may also include other chips. The optical module assembly 103 may include one or more optical modules. An optical module is an integrated module used to convert optical signals to electrical signals. For example, an optical module may include optoelectronic devices, functional circuits, and optical interfaces. Simply put, an optical module may include a transmitter and a receiver. The transmitter can convert electrical signals into optical signals and transmit them through optical fibers, while the receiver can convert the optical signals transmitted through optical fibers back into electrical signals.

[0012] refer to Figure 1B As shown, the heat dissipation device provided in this embodiment may include: a chip heat dissipation module 120, an optical module heat dissipation module 130, and a flow guiding module 140.

[0013] A chip heat dissipation module 120 may be disposed on the surface of the chip assembly 102 away from the motherboard 101. The chip assembly 102 is disposed on the motherboard 101 and has a surface facing the motherboard and a surface away from the motherboard. For ease of description, the surface of the chip assembly 102 facing the motherboard is referred to as the bottom surface. The surface of the chip assembly 102 away from the motherboard may include a top surface opposite the bottom surface, and may also include a side surface connecting the bottom surface and the top surface. In some embodiments, the chip heat dissipation module 120 may be disposed on the top surface and / or the side surface of the chip assembly 102. The chip heat dissipation module 120 is used to dissipate heat from the chip assembly 102. The chip heat dissipation module 120 may include an air-cooled heat dissipation component or a liquid-cooled heat dissipation component. Exemplarily, the chip heat dissipation module may include a liquid cooling plate, which absorbs the heat generated by the chip assembly 102 and maintains the temperature of the chip assembly 102 within a safe range through the circulation of coolant in the liquid cooling plate.

[0014] The optical module heat dissipation module 130 can be disposed on the surface of the optical module assembly 103 away from the motherboard 10. As an exemplary embodiment, the optical module assembly 103 is disposed on the motherboard 101, having a bottom surface facing the motherboard and a surface away from the motherboard. The surface of the optical module assembly 103 away from the motherboard may include a top surface opposite the bottom surface and a side surface connecting the bottom and top surfaces. The optical module heat dissipation module 130 is used to dissipate heat from the optical module assembly 103. The optical module heat dissipation module 130 can be configured to completely cover the top surface and / or side surface of the optical module assembly 103; alternatively, it can be configured to partially cover the top surface and / or side surface of the optical module assembly 103. For example, the optical module heat dissipation module 130 may include a heat-conducting component and a heat dissipation component. The heat-conducting component may be a heat-conducting pad. The heat-conducting pad is in partial contact with the surface of the optical module assembly 103 away from the motherboard. The heat generated by the optical module assembly 103 is conducted to the heat dissipation component by the heat-conducting pad. The heat dissipation component radiates heat outward. The heat dissipation component can also exchange heat with the passing cooling gas, thereby achieving the purpose of dissipating heat from the optical module assembly 103.

[0015] The airflow guiding module 140 includes an airflow guide shroud disposed on the motherboard 101. A hollow cavity inside the airflow guide shroud forms an airflow channel along a first direction, with the outlet end of the airflow channel facing the optical module heat dissipation module. The airflow guide shroud can be a metal shell, fixedly connected to the motherboard 101, and its internal hollow cavity can be formed as a square or cylindrical airflow channel. The airflow channel extends along the first direction and has a certain length. The inlet end of the airflow channel can, for example, be connected to cooling gas generated by a cooling fan, and its outlet end faces the optical module heat dissipation module 130 to deliver the cooling gas to the optical module heat dissipation module 130.

[0016] Furthermore, this embodiment also provides a communication device, which may include a motherboard 101 and a chip assembly 102 and an optical module assembly 103 disposed on the motherboard 101, and may also include the heat dissipation device as described above.

[0017] The heat dissipation device and communication equipment provided in the above embodiments of this disclosure, by setting a flow guiding module with a flow guiding channel and directing the air outlet of the flow guiding channel toward the optical module heat dissipation module, effectively dissipates heat from the optical module components by enhancing ventilation and reducing the impact of hot air from the chip components on the optical module components, ensuring that the operating temperature of the optical module components is within a safe range, thereby effectively balancing the heat dissipation requirements of the chip components and optical module components of the communication equipment, and achieving efficient heat dissipation and energy saving and noise reduction.

[0018] Please see below. Figure 2 , Figure 2 A heat dissipation device and communication equipment provided in another embodiment of this disclosure are shown.

[0019] The heat dissipation device provided in this embodiment can be applied to communication equipment such as highly integrated network cards. Figure 2 As shown, taking a high-speed smart network card as an example, the heat dissipation device may include a chip heat dissipation module 220, an optical module heat dissipation module 230, and a flow guiding module 240.

[0020] To facilitate a better understanding of this disclosure, the following will first combine... Figure 3 This paper introduces the heat dissipation devices in related technologies.

[0021] like Figure 3 As shown, the heat dissipation device according to related technologies may include a main chip heat sink 302 and an optical module heat sink 303. The main chip heat sink 302 is used to dissipate heat from the main chip, and the optical module heat sink 303 is used to dissipate heat from the optical module. Taking a current 25Gbps / 100Gbps dual-port network card as an example, the transmission rate and power consumption requirements of the optical module are relatively low. To maximize the heat dissipation efficiency of the main chip, the main chip and the optical module are arranged sequentially along the air intake side of the motherboard 301. Figure 3 It can be seen that this layout has two problems. First, the limited installation space for the heat sink of electronic components restricts the heat dissipation efficiency of the heat sink. Second, the position of the optical module on the motherboard is close to the exhaust end of the main chip, which causes the heat generated by the main chip to be directly conducted to the optical module, forming thermal coupling. This results in a higher initial ambient temperature of the optical module, which is not conducive to the heat dissipation of the optical module.

[0022] With the rapid development of technologies such as cloud computing, AI (Artificial Intelligence) large-scale model training, and distributed storage, smart network interface cards (NICs), as core components of data center infrastructure, are facing continuously increasing demands for data transmission rates and processing capabilities. To adapt to the high-speed, high-concurrency data transmission requirements of gigabit networks, the smart chips and optical modules integrated into smart NICs are gradually evolving towards higher power consumption. For example, the power consumption of smart chips such as FPGA chips can reach 100W+, while optical modules can achieve transmission rates of 200Gbps / 400Gbps with power consumption exceeding 8W. Conventional heat dissipation solutions present the following problems: 1) The hot air from the FPGA chip blows downwards onto the optical module, causing the optical module to overheat; 2) To meet the demands of transmission rates and processing capabilities, the power density of core components such as FPGA chips and optical modules has significantly increased, posing a significant challenge to achieving efficient heat dissipation for FPGA chips and optical modules.

[0023] Further integration Figure 2 , Figure 4 , Figure 5 and Figure 6As shown, in this embodiment, the communication device is a high-speed smart network card, which may include a motherboard 210, and various components such as a chip assembly 211 and an optical module assembly 212 disposed on the motherboard 210. Exemplarily, the chip heat dissipation module 220 is disposed on the surface of the chip assembly 211 away from the motherboard 210, for example, on the top surface and / or side surface of the chip assembly 211. The optical module heat dissipation module 230 may be disposed on the surface of the optical module assembly 212 away from the motherboard 210, for example, on the top surface and / or side surface of the optical module assembly 212, and may completely or partially cover these surfaces.

[0024] In order to achieve efficient heat dissipation of the optical module heat dissipation module 230 and avoid it from being affected by the hot air of the chip heat dissipation module 220, the heat dissipation device in this embodiment is designed with a flow guiding module 240 to directionally deliver air to the optical module heat dissipation module 230.

[0025] In this embodiment, the airflow guiding module 240 includes an airflow guide shroud 241 disposed on the motherboard 210. The hollow cavity inside the airflow guide shroud 241 forms an airflow guiding channel along a first direction. The air outlet of the airflow guiding channel faces the optical module heat dissipation module 230. Exemplarily, the airflow guide shroud 241 may be made of stainless steel with a thickness of 1mm-2mm.

[0026] like Figure 2 As shown, the motherboard 210 has a first end and a second end opposite to each other in a first direction, wherein the first end is closer to the air intake direction. For example, the first end may be directly opposite the air outlet of the cooling fan.

[0027] In some optional implementations of this embodiment, the air inlet of the airflow channel of the airflow guide module 240 is located on the motherboard 210 near the first end, and is used to guide cooling gas to the optical module heat dissipation module 230. The optical module assembly 212 is located on the motherboard 210 near the second end and opposite to the air outlet of the airflow channel.

[0028] In some optional implementations of this embodiment, the projections of the optical module heat dissipation module 230 and the chip heat dissipation module 220 in the first direction do not completely overlap. By positioning the optical module assembly 212 on the motherboard away from or away from the air outlet of the chip assembly 211, the thermal coupling effect caused by the chip heat dissipation module 220 on the optical module heat dissipation module 230 can be avoided or reduced from the source, thereby effectively improving the heat dissipation efficiency of the optical module heat dissipation module 230.

[0029] In some optional implementations of this embodiment, the flow guiding module 240 further includes one or more removable flow divider baffles 242 disposed inside the flow guiding channel. The flow divider baffles 242 can divide the internal space of the flow guiding channel into multiple independent fluid sub-channels. For example, by providing a flow divider baffle 242 inside the flow guiding channel, the internal space of the flow guiding channel can be divided into two independent fluid sub-channels. In an exemplary embodiment, the flow guiding module 240 may include one or more baffle slots spaced apart along a second direction inside the flow guiding channel, and the flow divider baffles 242 are removably disposed in the baffle slots.

[0030] In some optional implementations of this embodiment, the airflow guiding module 240 further includes an air-guiding structure 2411 disposed on the air-guiding cover 241 and connected to the air inlet end of the airflow guiding channel. The air inlet diameter of the air-guiding structure 2411 is larger than the cross-sectional diameter of the airflow guiding channel. Exemplarily, the air-guiding structure 2411 may have a gradually narrowing flared shape or a smooth inlet angle, which can guide the cold air into the airflow guiding channel to the maximum extent, thereby maximizing the amount of cold air delivered to the optical module heat dissipation module 230 and the flow area, and reducing turbulence when the gas flows in, making the airflow smoother and the resistance lower.

[0031] In some optional implementations of this embodiment, the airflow guiding module 240 further includes an air outlet structure 2412 disposed on the airflow guide cover 241 and connected to the air outlet end of the airflow guiding channel. The air outlet diameter of the air outlet structure 2412 may be greater than or equal to the cross-sectional diameter of the airflow guiding channel.

[0032] In some optional implementations of this embodiment, the projection of the flow guiding module 240 in the first direction can completely or partially cover the projection of the optical module heat dissipation module 230 in the first direction, so as to fully supply cooling gas to the optical module heat dissipation module 230 and ensure the heat dissipation efficiency of the optical module heat dissipation module 230.

[0033] By setting up the aforementioned air guide shroud to form an independent airflow channel, and ensuring that the overall shape, cross-sectional area, and outlet orientation of the airflow channel are compatible with the overall layout of the optical module heat dissipation module, it is ensured that the cooling gas can be accurately delivered to the optical module heat dissipation module with the lowest flow resistance and the lowest bypass loss, thereby achieving effective heat dissipation of the optical module components.

[0034] Figure 4 A schematic diagram of the chip heat dissipation module in this embodiment is shown. Figure 4As shown, in an exemplary embodiment, the chip heat dissipation module 220 includes a vacuum chamber heat dissipation substrate 2201 and a plurality of first heat sinks 2202. The vacuum chamber heat dissipation substrate 2201 can be disposed on the surface of the chip assembly 211 away from the motherboard 210 and can be in direct or indirect contact with it. For example, the vacuum chamber heat dissipation substrate 2201 can be disposed on the top surface of the chip assembly 211 away from the motherboard, and the bottom surface of the vacuum chamber heat dissipation substrate 2201 is in direct contact with the top surface of the chip assembly 211. The plurality of first heat sinks 2202 can be disposed on the surface of the vacuum chamber heat dissipation substrate 2201 away from the chip assembly 211. For example, the plurality of first heat sinks 2202 can be disposed on the top surface and / or side surface of the vacuum chamber heat dissipation substrate 2201.

[0035] In some optional implementations of this embodiment, the vacuum chamber heat dissipation substrate 2201 can be a high-performance VC (Vapor Chamber) metal heat sink, the interior of which is a sealed vacuum chamber containing a working fluid (such as a phase change cooling medium). The vacuum chamber heat dissipation substrate 2201 is provided with multiple first heat sinks 2202, which can be made of copper, which improves heat dissipation efficiency compared to aluminum or aluminum alloy heat sinks. The multiple first heat sinks 2202 can be arranged at intervals along a second direction intersecting the first direction. For example, the second direction is perpendicular to the first direction. Based on the phase change heat transfer principle, the vacuum chamber heat dissipation substrate 2201 can rapidly and uniformly diffuse the heat generated by the chip assembly 211 onto the entire metal heat sink, and dissipate the heat away through the first heat sinks 2202 connected to it. Compared to traditional heat pipe cooling structures and non-vacuum chamber heat sinks, the vacuum chamber heat dissipation substrate can maximize heat dissipation and, combined with multiple external heat sinks, dissipate heat into the air, thereby meeting the heat dissipation requirements of high-speed FPGA chips.

[0036] Regarding the design of the heat dissipation fins of the first heat sink 2202, the high heat flux density of the chip component 211 dictates extremely high heat dissipation efficiency. To maximize the heat dissipation surface area of ​​the fins within a limited space for rapid heat removal, a smaller fin spacing is preferred to provide more heat dissipation surface area for heat exchange with the cooling gas. However, the influence of airflow resistance must also be considered, requiring an appropriate fin spacing to facilitate cooling gas flow, ensuring sufficient cooling gas flow and preventing heat accumulation between the fins. Therefore, the design of the heat dissipation fins needs to achieve an optimal balance between maximizing the heat dissipation surface area and minimizing airflow resistance.

[0037] As an exemplary implementation, the dimensions and spacing of the first heat sink in the second direction can be determined through simulation design based on the preset temperature margin of the chip component 211. First, the temperature constraints of the FPGA chip, which is a high-risk heat dissipation device, can be determined as a design target. For example, if the rated operating condition of the FPGA chip is an inlet air temperature not exceeding 55°C, the chip temperature margin is satisfied under rated operating conditions to ensure no heat dissipation risk. Then, through CFD (Computational Fluid Dynamics) numerical simulation, when the CFD simulation results satisfy the temperature margin of the FPGA chip, the external dimensions of the first heat sink at this point are determined. Furthermore, the maximum external dimensions of the determined first heat sink will also serve as the spatial boundary constraint of the flow guiding module 240.

[0038] In some optional implementations of this embodiment, the spacing between the heat dissipation fins is 1.5 to 2.5 times the width of the heat dissipation fins. In this way, a larger heat dissipation area can be obtained while ensuring a minimum spacing. For example, if the fin width is set to 0.5 mm, the initial spacing between adjacent fins can be set between 0.75 mm and 1.25 mm and optimized through simulation.

[0039] In some optional implementations of this embodiment, the width of the plurality of first heat sinks 2202 in the second direction is in the range of 0.3mm to 1mm, and the spacing between adjacent first heat sinks 2202 in the second direction is in the range of 0.5mm to 2.5mm.

[0040] Figure 5 A schematic diagram of the optical module heat dissipation module in this embodiment is shown. Figure 5 As shown, the optical module heat dissipation module 230 may include a heat dissipation cage 2301 and a plurality of second heat sinks 2302. The heat dissipation cage 2301 may be disposed on the top surface of the optical module assembly 212 away from the motherboard 210, and on the side surface connected to the motherboard 210; that is, the heat dissipation cage 2301 covers the outside of the optical module assembly 212. The plurality of second heat sinks 2302 may be disposed on the top surface and / or side surface of the heat dissipation cage 2301 away from the optical module assembly 212. It should be understood that the terms "top surface," "side surface," "above," "below," "front," "rear," "vertical," etc., used herein to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0041] In some optional implementations of this embodiment, the heat sink 2301 can be made of thermally conductive materials such as metal and can be fixed to the motherboard 210 by means of welding or other methods. The heat sink 2301 can be provided with an assembly interface for the optical module assembly 212, for example, by providing a pluggable connection for the optical module assembly 212 through a structure such as a snap-fit ​​or slot. Furthermore, the heat sink 2301 can also provide electromagnetic interference shielding for the optical module assembly 212, reducing the external radiation of high-speed signals, and can provide a grounding path for the metal casing of the optical module assembly 212.

[0042] In some optional implementations of this embodiment, the second heat sink 2302 is a heat dissipation fin mounted on the heat dissipation cage 2301. The heat dissipation cage 2301 transfers the heat generated by the optical module assembly 212 to the heat dissipation fin, and the heat is quickly and effectively transferred to the flowing cooling gas through the heat dissipation surface of the heat dissipation fin. As an exemplary embodiment, the second heat sink 2302 can be made of aluminum, aluminum alloy, or copper. The second heat sink 2302 can also be configured as a columnar heat dissipation fin, which can provide a larger heat dissipation area by being taller, thereby further improving heat dissipation efficiency. Furthermore, by simulating and designing parameters such as the height and spacing of the fins, an optimal balance between wind resistance, airflow efficiency, and heat dissipation area can be achieved in a given space, ensuring that the optical module assembly can operate stably and reliably for a long time in high-speed communication equipment.

[0043] refer to Figure 5 and Figure 6 As shown, in some optional implementations of this embodiment, the optical module assembly 212 may include multiple optical modules. The number of fluid sub-channels in the flow guiding module 240 may correspond to the number of optical modules included in the optical module assembly 230. For example, the optical module assembly 212 may include a first optical module 212a and a second optical module 212b. Accordingly, the flow divider 242 disposed inside the flow guiding channel can divide the flow guiding channel into two fluid sub-channels: a first fluid sub-channel 2401 and a second fluid sub-channel 2402. The air outlet of each fluid sub-channel can directionally deliver cooling airflow to the corresponding optical module to achieve independent heat dissipation for each optical module. Furthermore, the cool airflow of the two fluid sub-channels can be flexibly allocated by adjusting the position of the flow divider to ensure balanced heat dissipation for the two optical modules.

[0044] As an exemplary implementation, based on the external dimensions of the first heat sink 2202 described above, the design dimensions of the air guide shroud 241 of the airflow guiding module 240 are determined. Simultaneously, considering the temperature difference control target between multiple optical modules, such as a maximum temperature difference not exceeding 2°C, the dimensional parameters of the air guide shroud 241 and the position parameters of the flow divider 242 within the airflow channel are determined. Then, through simulation design, the dimensions of the air guide shroud 241 and the position of the flow divider 242 are optimized so that the airflow of the first fluid sub-channel 2401 and the second fluid sub-channel 2402 meets a predetermined flow resistance ratio, thereby controlling the temperature difference between the first optical module 212a and the second optical module 212b to ≤2°C. For example, because the first fluid sub-channel 2401 is closer to the chip heat dissipation module 220, its ventilation flow rate should be greater than that of the second fluid sub-channel 2402.

[0045] Furthermore, embodiments of this disclosure also provide a communication device, with reference to... Figure 2 , Figures 4 to 6 As shown, the communication device may include a motherboard 210, and a chip assembly 211 and an optical module assembly 212 disposed on the motherboard 210. The chip assembly 211 may include, for example, one or more FPGA chips, and the optical module assembly 212 may include one or more optical modules. The communication device also includes a heat dissipation device as described in any of the foregoing embodiments. The specific structure of the heat dissipation device has been described in detail above and will not be repeated here.

[0046] According to the heat dissipation device and communication equipment of the above embodiments of this disclosure, an efficient heat dissipation solution is provided: an efficient heat dissipation module is designed according to the temperature requirements of high-power chip components to ensure that the chip components have no heat dissipation risk; simultaneously, an independent air guide shroud is designed for the optical module components, and through reasonable spatial layout and enhanced ventilation, the hot air from the chip components to the optical module components is effectively avoided, ensuring that the optical module components operate at the optimal temperature to obtain better data transmission performance and stability; furthermore, by setting a shunt partition, the temperature difference between optical modules can be controlled within 2°C, ensuring balanced heat dissipation between optical modules and achieving good temperature uniformity. This heat dissipation device can be applied to communication equipment such as high-speed smart network cards, enabling efficient and compact layout within limited installation space, comprehensively balancing the heat dissipation requirements of FPGA chips and optical module components, and achieving efficient heat dissipation and energy-saving noise reduction requirements of communication equipment.

[0047] The specific embodiments described above do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A heat dissipation device applied to a communication device, the communication device comprising a mainboard and a chip assembly and an optical module assembly arranged on the mainboard, characterized in that, The heat dissipation device includes: A chip heat dissipation module is disposed on the surface of the chip assembly away from the motherboard; The optical module heat dissipation module is at least partially disposed on the surface of the optical module assembly away from the motherboard; The airflow guiding module includes an airflow guide cover disposed on the motherboard, wherein a hollow cavity inside the airflow guide cover forms an airflow guiding channel along a first direction, and wherein the air outlet end of the airflow guiding channel faces the optical module heat dissipation module.

2. The heat dissipation device according to claim 1, characterized in that, The chip heat dissipation module includes: A vacuum chamber heat dissipation substrate is disposed on the surface of the chip assembly away from the motherboard; Multiple first heat sinks are disposed on the surface of the vacuum cavity heat dissipation substrate away from the chip assembly.

3. The heat dissipation device according to claim 2, characterized in that, The plurality of first heat sinks are arranged at intervals along a second direction intersecting the first direction, wherein the spacing between adjacent first heat sinks in the second direction is 1.5 to 2.5 times the width of the first heat sink in the second direction.

4. The heat dissipation device according to claim 3, characterized in that, The motherboard has a first end and a second end opposite to each other in the first direction, wherein... The air inlet of the air guide channel is located on the motherboard near the first end; The optical module assembly is located on the motherboard near the second end; Wherein, the projections of the optical module heat dissipation module and the chip heat dissipation module in the first direction do not completely overlap; the projection of the flow guiding module in the first direction covers the projection of the optical module heat dissipation module in the first direction.

5. The heat dissipation device according to claim 4, characterized in that, The air guiding module also includes an air intake structure disposed on the air guide cover and connected to the air inlet end of the air guiding channel, wherein the air inlet diameter of the air intake structure is larger than the cross-sectional diameter of the air guiding channel.

6. The heat dissipation device according to claim 5, characterized in that, The airflow guiding module also includes an air outlet structure disposed on the airflow guide cover and connected to the air outlet end of the airflow guiding channel, wherein the air outlet diameter of the air outlet structure is larger than the cross-sectional diameter of the airflow guiding channel.

7. The heat dissipation device according to claim 4, characterized in that, The flow guiding module also includes at least one removable flow divider disposed inside the flow guiding channel, the flow divider being used to divide the internal space of the flow guiding channel into multiple independent fluid sub-channels.

8. The heat dissipation device according to claim 7, characterized in that, The flow guiding module further includes at least one baffle slot spaced at intervals inside the flow guiding channel along the second direction, wherein the flow dividing baffle is detachably disposed in the baffle slot.

9. The heat dissipation device according to claim 7 or 8, characterized in that, The number of fluid subchannels corresponds to the number of optical modules included in the optical module assembly.

10. The heat dissipation device according to claim 1, characterized in that, The optical module heat dissipation module includes a heat dissipation cage and a plurality of second heat sinks. The heat dissipation cage is disposed on the top surface of the optical module assembly away from the motherboard and on the side surface connected to the motherboard. The plurality of second heat sinks are disposed on the top surface of the heat dissipation cage away from the optical module assembly.

11. The heat dissipation device according to claim 10, characterized in that, The second heat sink is a columnar heat dissipation fin.

12. The heat dissipation device according to claim 2 or 3, characterized in that, The first heat sink is a copper heat sink fin.

13. A communication device, characterized in that, The communication device includes a motherboard and chip components and optical module components disposed on the motherboard, and also includes a heat dissipation device as described in any one of claims 1-12.

14. The communication device according to claim 13, characterized in that, The communication device includes a smart network interface card (NIC), and the chip assembly includes at least one field-programmable gate array (FPGA) chip.

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