A cooling device in which the heat source and the refrigerant are in direct contact.

Abstract

This utility model discloses a cooling device in which the heat source and refrigerant are in direct contact. Through an innovative structural design, it achieves direct heat exchange between the heat source and the coolant, completely eliminating the conductive thermal resistance of the metal wall and the interfacial contact thermal resistance present in traditional liquid cooling solutions, resulting in a qualitative leap in heat dissipation efficiency. The carefully designed sealed connection structure ensures reliable sealing of the cooling cavity and provides a convenient and reliable interface for the installation of the heat source. The linear distribution design of multiple openings allows a single cooling device to provide uniform and efficient heat dissipation to multiple heat sources simultaneously, greatly improving space utilization efficiency and simplifying the system structure. This comprehensive improvement in heat dissipation performance, manufacturing cost, reliability, and applicability provides an optimal solution for the thermal management of high-power-density electronic devices.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a cooling device in which the heat source and the refrigerant are in direct contact. Background Technology

[0002] In the current field of electronic technology, with the continuous improvement of chip computing power and power density, the demand for heat dissipation is becoming increasingly severe. Traditional air cooling methods are gradually becoming insufficient to meet the thermal management requirements of high-performance computing devices, and liquid cooling technology has been widely used due to its higher heat dissipation efficiency. Existing liquid cooling devices typically employ liquid cooling plates, whose basic structure involves processing flow channels within a metal substrate. Coolant flows within these channels, while heat-generating components contact the outer surface of the liquid cooling plate through thermally conductive materials. Heat must pass through multiple interfaces and the metal substrate before finally being transferred to the coolant. Significant contact and conduction thermal resistances exist throughout this heat transfer path, limiting further improvements in heat dissipation efficiency. Furthermore, for scenarios requiring simultaneous cooling of multiple heat sources, existing solutions often employ multiple independent liquid cooling plates or complex shunt structures, resulting in complex system structures, high costs, and reliability challenges. Therefore, the industry urgently needs an innovative cooling solution that can overcome traditional heat dissipation bottlenecks and achieve more efficient thermal management. Utility Model Content

[0003] The main purpose of this invention is to propose a cooling device in which the heat source and the refrigerant are in direct contact, aiming to provide an innovative cooling solution that can break through the traditional heat dissipation bottleneck and achieve more efficient thermal management.

[0004] To achieve the above objectives, this utility model proposes a cooling device in which a heat source and a refrigerant are in direct contact, comprising:

[0005] The main body has at least one flow cavity inside, and the flow cavity is provided with a coolant inlet and a coolant outlet;

[0006] At least one opening is formed on the body, and the opening is connected to the flow cavity;

[0007] A sealing connection structure is provided at the opening to seal the external heat source to the opening when the cooling device is operating, allowing the heating surface of the heat source to extend into or be directly exposed to the flow cavity through the opening, so as to directly contact the coolant flowing into the flow cavity.

[0008] Preferably, the number of openings is three, and the three openings are linearly spaced along the length or width direction of the main body.

[0009] Preferably, the main body is rectangular and has several connection holes on its outer wall for connecting and locking with the external installation location or heat source housing.

[0010] Preferably, the sealing connection structure includes a sealing groove disposed on the body and surrounding the opening.

[0011] Preferably, a sealing ring with a matching shape is provided in the sealing groove.

[0012] Preferably, the opening communicates with the top wall of the flow cavity;

[0013] The bottom wall of the flow cavity extends downward and penetrates the bottom of the main body, forming a bottom opening;

[0014] The bottom opening is fixedly connected to a sealing component by welding, so that the flow cavity becomes a closed cavity.

[0015] Preferably, the radial dimension of the bottom opening is larger than the radial dimension of the flow cavity, thereby forming a surrounding stepped portion at the bottom periphery of the flow cavity;

[0016] The closure is embedded in the stepped portion and is fixedly connected to the stepped portion by welding.

[0017] Preferably, both the coolant inlet and the coolant outlet are located on the sealing element;

[0018] A first pipe joint is welded to the coolant inlet, and a second pipe joint is welded to the coolant outlet.

[0019] This invention, through its innovative structural design, achieves direct contact heat exchange between the heat source and the coolant, completely eliminating the conductive thermal resistance of the metal wall and the interfacial contact thermal resistance present in traditional liquid cooling solutions, resulting in a qualitative leap in heat dissipation efficiency. The meticulously designed sealed connection structure ensures reliable sealing of the cooling cavity and provides a convenient and reliable interface for heat source installation. The linear distribution of multiple openings allows a single cooling device to simultaneously provide uniform and efficient heat dissipation to multiple heat sources, greatly improving space utilization efficiency and simplifying the system structure. The flow cavity, through a combination of a bottom open and a closed component, cleverly solves the processing challenges of complex internal cavities, significantly reducing manufacturing costs. Simultaneously, the stepped structure provides precise positioning for the closed component and enhances welding strength and sealing reliability. The integration of the coolant inlet / outlet and pipe joints into the closed component layout makes pipe connections more centralized and convenient. The rectangular shape and standardized connection hole design ensure the ease of installation and structural stability of the cooling device in various application environments. This invention comprehensively improves heat dissipation performance, manufacturing cost, reliability, and applicability, providing an optimal solution for thermal management of high-power-density electronic equipment. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the present invention;

[0021] Figure 2 A schematic diagram of the main body and the closure. Detailed Implementation

[0022] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0023] It should be noted that if any directional indication (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial, etc.) is involved in the embodiments of this utility model, the directional indication is only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0025] This invention proposes a cooling device in which the heat source and the refrigerant are in direct contact.

[0026] In this embodiment of the utility model, such as Figures 1 to 2 As shown, the cooling device package, which is in direct contact with the refrigerant, is mainly used for efficient heat dissipation of high-power heat sources in electronic equipment.

[0027] The cooling device includes a main body 1, and a flow chamber 11 is formed inside the main body 1. The flow chamber 11 is provided with a coolant inlet and a coolant outlet for connecting to an external cooling circulation system, so that the coolant can flow continuously within the flow chamber 11.

[0028] Specifically, an opening 12 is formed on the top wall of the main body 1, and this opening 12 is directly connected to the flow cavity 11. A sealing connection structure is provided around the opening 12. Specifically, the sealing connection structure in this embodiment includes a sealing groove 14 formed around the opening 12. A sealing ring with a shape perfectly adapted to the sealing groove 14 is placed inside the sealing groove 14.

[0029] During operation, the external heat source aligns with the opening 12 through its outer casing or mounting frame and is pressed onto the sealing ring by fasteners to form a reliable seal. At this time, the heating surface of the heat source extends directly into and is exposed to the flow cavity 11 through the opening 12, thereby directly contacting and exchanging heat with the coolant flowing in the flow cavity 11. The heat dissipation efficiency is significantly higher than that of the traditional indirect conduction heat dissipation method.

[0030] Specifically, this embodiment is further optimized based on the above embodiment.

[0031] The main body 1 is designed as a cuboid with a regular structure, facilitating installation and fixation both inside and outside the equipment. Multiple connection holes 13 are machined on its outer wall; these holes 13 are used to lock the entire cooling device to the installation position of the equipment or the heat source housing using screws, ensuring structural stability.

[0032] Specifically, the bottom wall of the flow cavity 11 extends downward and completely penetrates the bottom of the main body 1, forming a bottom opening. This design greatly facilitates the internal processing of the flow cavity 11. After processing, a separately manufactured sealing component 2 is fixedly connected to the bottom opening by welding, sealing the flow cavity 11 into a sealed cavity.

[0033] Preferably, the radial dimension of the bottom opening is larger than the radial dimension of the flow cavity 11, thereby naturally forming a surrounding stepped portion 15 at the bottom periphery of the flow cavity 11. The sealing member 2 can be precisely embedded in this stepped portion 15 and then welded. This structure not only provides precise positioning and stable support for the sealing member 2, but also makes the weld more robust and the sealing performance more reliable.

[0034] Furthermore, to facilitate connection to external piping, both the coolant inlet and outlet are directly mounted on the sealing element 2. A first pipe connector 3 is welded to the coolant inlet, and a second pipe connector 4 is welded to the coolant outlet. External cooling hoses can be directly connected to these two pipe connectors, achieving a quick and reliable piping connection.

[0035] Specifically, this embodiment demonstrates the application of this invention in a scenario of parallel cooling of multiple heat sources:

[0036] Its basic structure is the same as the above embodiment, the main difference being that three openings 12 are linearly spaced along the length of the top wall of the main body 1. Each opening 12 is connected to the same flow cavity 11, and each opening 12 is independently surrounded by a sealing groove 14 and a sealing ring.

[0037] This layout allows three heat sources that need cooling to be installed side by side on the same cooling unit, sharing the same coolant circulation system. This achieves an integrated and highly efficient heat dissipation solution, which is particularly suitable for multi-chip modules such as servers and graphics cards.

[0038] Specifically, in a preferred embodiment of this invention, the main body 1 is made of aluminum alloy with excellent thermal conductivity, which ensures good thermal conductivity while achieving lightweight design. The sealing component 2 is also made of the same aluminum alloy as the main body 1. This not only ensures the consistency of their coefficients of thermal expansion, reducing the risk of deformation due to thermal stress, but also provides a good material basis for subsequent welding processes. For the connection between the pipe joint and the sealing component 2, this solution uses laser welding for fixing. This process features high energy density and a small heat-affected zone, enabling high-strength connections while minimizing thermal damage to surrounding areas, ensuring the highest standard of sealing reliability at the connection between the pipe joint and the sealing component 2. For the large-area connection between the sealing component 2 and the main body 1, this solution innovatively uses friction stir welding for sealing. This solid-state joining technology uses the high-speed rotation of the stirring head and frictional heat to plasticize and fully mix the materials in the area to be joined, ultimately forming a dense and defect-free metallurgical weld. Compared to traditional fusion welding, friction stir welding effectively avoids common defects such as porosity and cracks, and is particularly suitable for welding aluminum alloy materials. It can achieve long-term stable sealing of the cooling cavity and fundamentally eliminate the risk of coolant leakage.

[0039] This invention, through its innovative structural design, achieves direct contact heat exchange between the heat source and the coolant, completely eliminating the conductive thermal resistance of the metal wall and the interfacial contact thermal resistance present in traditional liquid cooling solutions, resulting in a qualitative leap in heat dissipation efficiency. The meticulously designed sealed connection structure ensures reliable sealing of the cooling cavity and provides a convenient and reliable interface for heat source installation. The linear distribution of multiple openings allows a single cooling device to simultaneously provide uniform and efficient heat dissipation to multiple heat sources, greatly improving space utilization efficiency and simplifying the system structure. The flow cavity, through a combination of a bottom open and a closed component, cleverly solves the processing challenges of complex internal cavities, significantly reducing manufacturing costs. Simultaneously, the stepped structure provides precise positioning for the closed component and enhances welding strength and sealing reliability. The integration of the coolant inlet / outlet and pipe joints into the closed component layout makes pipe connections more centralized and convenient. The rectangular shape and standardized connection hole design ensure the ease of installation and structural stability of the cooling device in various application environments. This invention comprehensively improves heat dissipation performance, manufacturing cost, reliability, and applicability, providing an optimal solution for thermal management of high-power-density electronic equipment.

[0040] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A cooling device in which a heat source and a refrigerant are in direct contact, characterized in that, include: The main body (1) has at least one flow cavity (11) inside, and the flow cavity (11) is provided with a coolant inlet and a coolant outlet; At least one opening (12) is provided on the main body (1), and the opening (12) is connected to the flow cavity (11); A sealing connection structure is provided at the opening (12) for sealing the external heat source with the opening (12) when the cooling device is working, so that the heating surface of the heat source extends into or is directly exposed in the flow cavity (11) through the opening (12) to directly contact the coolant flowing into the flow cavity (11).

2. The cooling device in which the heat source and the refrigerant are in direct contact as described in claim 1, characterized in that: The number of openings (12) is three, and the three openings (12) are linearly spaced along the length or width direction of the main body (1).

3. The cooling device in which the heat source and the refrigerant are in direct contact as described in claim 1, characterized in that: The main body (1) is rectangular in shape, and several connection holes (13) are provided on the outer wall for connecting and locking with the external installation position or heat source shell.

4. The cooling device in which the heat source and the refrigerant are in direct contact as described in claim 1, characterized in that: The sealing connection structure includes a sealing groove (14) disposed on the body (1) and surrounding the opening (12).

5. The cooling device in which the heat source and the refrigerant are in direct contact as described in claim 4, characterized in that: A sealing ring with a matching shape is provided in the sealing groove (14).

6. The cooling device in which the heat source and the refrigerant are in direct contact as described in claim 1, characterized in that: The opening (12) is connected to the top wall of the flow cavity (11); The bottom wall of the flow cavity (11) extends downward and penetrates the bottom of the main body (1), forming a bottom opening; The bottom opening is fixedly connected to a closure (2) by welding, so that the flow cavity (11) becomes a closed cavity.

7. The cooling device in which the heat source and the refrigerant are in direct contact as described in claim 6, characterized in that: The radial dimension of the bottom opening is larger than the radial dimension of the flow cavity (11), thereby forming a surrounding stepped portion (15) at the bottom periphery of the flow cavity (11). The closure (2) is embedded in the step portion (15) and is fixedly connected to the step portion (15) by welding.

8. The cooling device in which the heat source and the refrigerant are in direct contact as described in claim 6, characterized in that: The coolant inlet and coolant outlet are both located on the closure (2); A first pipe joint (3) is welded at the coolant inlet, and a second pipe joint (4) is welded at the coolant outlet.

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