A magnetic vehicle wireless charging heat dissipation structure based on TEC cooling

Abstract

This utility model relates to the field of wireless charging technology and discloses a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling. It includes a shell, a heat sink, a fan, a TEC plate, a cooling plate, a permanent magnet, a coil, a top cover, and a mobile phone. The hot side of the TEC plate is attached to the heat sink, and the cold side contacts the cooling plate. A portion of the cooling plate is recessed and located on the surface of the shell. The permanent magnet is embedded within the cooling plate, and the coil is also embedded within the permanent magnet. The fan is fixedly connected to the bottom of the heat sink, with the airflow directed towards the heat sink. The system also includes a temperature sensor and a motherboard for intelligent temperature control. This utility model solves the problem of low charging efficiency in vehicle wireless charging caused by shaking and high temperatures. By combining active cooling with magnetic positioning using the TEC plate, it achieves the technical effects of separating hot and cold paths, efficient heat dissipation, accurate positioning, and intelligent temperature control.

Description

Technical Field

[0001] This utility model relates to the field of wireless charging technology, and in particular to a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling. Background Technology

[0002] With the widespread adoption of smartphones, wireless charging technology has been widely used due to its convenience. Especially in in-vehicle environments, in-car wireless chargers (and holders) have become a common feature, allowing drivers to place their phones on the holder for navigation and charging without frequently plugging and unplugging charging cables, thus improving driving convenience and safety.

[0003] However, existing in-vehicle wireless chargers have a serious problem that urgently needs to be solved. The wireless charging process itself generates heat, including heat from the coil and the phone battery. Even more serious is the unique environment of a car; when a vehicle is exposed to the summer sun, the interior temperature can reach very high levels, further exacerbating the heat generated during charging.

[0004] When the temperature gets too high, the protection mechanisms of the phone and wireless charger will activate, automatically reducing the charging power or even stopping charging, resulting in low charging efficiency. This significantly impacts the user experience when the driver urgently needs navigation and battery power, and may even pose a safety hazard.

[0005] Most existing in-vehicle wireless chargers rely on passive cooling or simple fan cooling. Under the dual heat loads of high temperatures inside the vehicle and high-power charging, these methods are far from sufficient to effectively control the temperature. Therefore, how to provide a cooling structure that can actively and efficiently cool magnetic wireless chargers in this high-temperature, enclosed in-vehicle environment has become a core technical problem that urgently needs to be solved in this field.

[0006] Therefore, this utility model proposes a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling to address the shortcomings of existing technologies. Utility Model Content

[0007] In view of the problems existing in the vehicle wireless charging heat dissipation structure, such as unstable positioning due to vehicle shaking, low charging efficiency, and severe heat accumulation and low heat dissipation efficiency of wireless charging and mobile phones in high-temperature environments, this utility model aims to provide a vehicle wireless charging heat dissipation structure with improved structure that can effectively solve the above problems.

[0008] Part Two: Core Technology Solutions

[0009] This utility model provides a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling, including: a shell, a heat sink, a fan, a TEC plate, a cooling plate, a permanent magnet, a coil, a top cover, and a mobile phone.

[0010] The TEC sheet has a hot side and a cold side.

[0011] Furthermore, the heat sink is fixedly connected to the bottom of the housing, the fan is fixedly connected to the bottom of the heat sink, and the airflow of the fan is directed towards the heat sink. The hot side of the TEC plate is attached to the top of the heat sink. The cooling plate is installed on the top of the housing, and a portion of the cooling plate is recessed and contacts the cold side of the TEC plate inside the housing. A portion of the cooling plate is located on the surface of the housing. The permanent magnet is embedded inside the cooling plate. The coil is embedded inside the permanent magnet. The top cover is fixedly connected to the top of the housing and covers the top of the coil. The mobile phone is magnetically attached to the top of the top cover.

[0012] Part Three: Preferred Technical Solutions

[0013] Preferably, thermal grease is disposed between the cold side of the TEC chip and the cooling chip; and thermal grease is disposed between the hot side of the TEC chip and the heat sink. This arrangement is used to fill the tiny gaps between the TEC chip and the heat sink and cooling chip, ensuring efficient heat and cold conduction.

[0014] Preferably, a magnetic shielding sheet is also provided at the bottom of the coil. This magnetic shielding sheet is used to concentrate magnetic lines of force and prevent electromagnetic energy from leaking to the heat dissipation component, thereby improving the efficiency of wireless charging.

[0015] Preferably, the surface of the outer casing is further provided with a recessed step, the bottom of which corresponds to a protrusion on the phone. This design takes into account the protruding structure on the back of the phone (such as the camera module), allowing the phone to fit more tightly against the casing surface, enhancing magnetic stability and cooling performance.

[0016] Preferably, the TEC chip is also equipped with a temperature sensor, which is used to monitor the hot and cold surface temperatures of the TEC chip in real time, providing a data basis for intelligent temperature control.

[0017] Preferably, the magnetic vehicle wireless charging heat dissipation structure based on TEC plate cooling also includes a motherboard, which is installed between the heat sink and the outer casing, serving as the control core of the entire system.

[0018] Preferably, the motherboard serves as a control module electrically connected to the temperature sensor. Furthermore, the motherboard is also electrically connected to the TEC chip and the fan. Through this connection, the motherboard can automatically adjust the output power of the TEC chip and the fan based on the real-time temperature feedback from the temperature sensor, achieving on-demand heat dissipation and energy saving / noise reduction.

[0019] This utility model has the following beneficial effects:

[0020] 1. This utility model solves the problems of unstable positioning and low charging efficiency of existing vehicle wireless chargers when the vehicle shakes, as well as the serious heat accumulation of wireless charging and mobile phones in high-temperature environments. It achieves the technical effects of accurate magnetic positioning, stable charging, active cooling and high heat dissipation efficiency. The magnetic positioning component consists of a permanent magnet, a coil and a top cover, and the heat dissipation component consists of a TEC plate, a cooling plate, a heat sink and a fan.

[0021] 2. This utility model solves the problems of traditional heat dissipation structures being unable to actively cool in high-temperature environments and the heat of the TEC chip being easily conducted to the cold surface of the shell by contacting the cold side of the TEC chip with the cooling chip, while the hot side of the TEC chip is in contact with the heat sink and the heat sink is forced to be cooled by a fan. This achieves the technical effects of separating the hot and cold paths, rapid transfer of cold energy, and efficient heat dissipation.

[0022] 3. This utility model solves the problems of high power consumption and noise caused by continuous high power operation of heat dissipation components, or overheating caused by untimely heat dissipation, by setting a temperature sensor and a motherboard. The temperature sensor monitors the temperature of the TEC chip in real time, and the motherboard controls the output power of the TEC chip and the fan according to the temperature data. It achieves the technical effects of intelligent temperature control, on-demand heat dissipation, energy saving and noise reduction.

[0023] 4. This utility model solves the problem of poor adhesion between the phone and the charger surface due to unevenness of the phone's rear camera module and other structures by setting a recessed step on the surface of the outer shell to correspond to the phone's protrusion. This achieves the technical effect of enhancing the stability of magnetic adhesion and improving charging and cooling efficiency. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling proposed in this utility model;

[0025] Figure 2 This is a schematic diagram of the permanent magnet of a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling proposed in this utility model.

[0026] Figure 3 This is a schematic diagram of the TEC plate of a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling proposed in this utility model;

[0027] Figure 4 This is a schematic diagram of the heat sink of a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling proposed in this utility model.

[0028] Legend:

[0029] 1. Top cover; 2. Coil; 3. Permanent magnet; 4. Cooling chip; 5. Outer shell; 6. Motherboard; 7. Thermal grease; 8. TEC plate; 9. Heat sink; 10. Fan; 11. Mobile phone. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0031] Example:

[0032] Please refer to Figures 1 to 4 This utility model provides a magnetic vehicle wireless charging heat dissipation structure based on TEC cooling, which aims to solve the problems of inaccurate positioning and low charging efficiency caused by vehicle shaking in the existing vehicle wireless charging technology, and the difficulty in dissipating the heat generated by wireless charging in the high temperature environment inside the vehicle.

[0033] like Figure 1 , Figure 2 and Figure 3 As shown, the magnetic vehicle wireless charging heat dissipation structure based on TEC plate cooling includes a housing 5, which forms the mounting base of the device. A heat sink 9 is fixedly connected to the bottom of the housing 5, and a fan 10 is fixedly connected to the bottom of the heat sink 9, with the fan 10 directing the airflow towards the heat sink 9. The TEC plate 8 has a hot surface and a cold surface. The hot surface of the TEC plate 8 is attached to the top of the heat sink 9. A cooling plate 4 is mounted on the top of the housing 5, with a portion of the cooling plate 4 sinking down and contacting the cold surface of the TEC plate 8 inside the housing 5. A portion of the cooling plate 4 is located on the surface of the housing 5. A permanent magnet 3 is embedded inside the cooling plate 4, and a coil 2 is embedded in the cooling plate 4. Inside the permanent magnet 3, the top cover 1 is fixedly connected to the top of the outer shell 5. The top cover 1 covers the top of the coil 2. The mobile phone 11 is magnetically attracted to the top cover 1. This structure forms a set of magnetic positioning components and a set of heat dissipation components. The magnetic positioning components are specifically composed of the top cover 1, the coil 2 and the permanent magnet 3. The permanent magnet 3 provides magnetic force to attract and position the mobile phone 11. The coil 2 realizes charging. The heat dissipation components specifically include heat sink 9, fan 10, TEC plate 8 and cooling plate 4. The TEC plate 8 is an active cooling source. Its cold side cools the surface of the outer shell 5 through the cooling plate 4, and its hot side dissipates heat to the outside through the heat sink 9 and fan 10.

[0034] To address the aforementioned technical issues, this magnetic vehicle wireless charging heat dissipation structure based on TEC plate cooling also includes a magnetic shielding sheet, a groove, thermal grease 7, a temperature sensor, and a mainboard 6. Furthermore, these components form a specific structural fit and connection with the aforementioned housing 5, coil 2, TEC plate 8, and heat sink 9. Please refer to [link / reference needed]. Figures 1 to 4 The core structure will be described in detail below:

[0035] Coil 2 is the core component of wireless charging. When it works, it generates an electromagnetic field to achieve energy transfer. To improve charging efficiency, a magnetic shielding sheet is set at the bottom of coil 2. The magnetic shielding sheet can greatly improve charging efficiency. When the phone 11 is magnetically attached to the top cover 1, the surface of the outer shell 5 is also provided with a recessed step corresponding to the protrusion of the phone 11. The bottom of the step makes the phone 11 fit more closely to the surface of the outer shell 5, thereby ensuring the stability of magnetic positioning and charging.

[0036] Regarding the heat dissipation components, to ensure the efficient operation of the TEC chip 8, thermal grease 7 is placed between the cold side of the TEC chip 8 and the cooling chip 4, and between the hot side of the TEC chip 8 and the heat sink 9. The thermal grease 7 can fill the tiny gaps between the contact surfaces, greatly improving the heat (cold) transfer efficiency between the TEC chip 8 and the cooling chip 4, and between the TEC chip 8 and the heat sink 9. The cooling chip 4 quickly transfers the temperature of the cold side of the TEC chip 8 to offset the heat generated by the coil 2 and the mobile phone 11. The fan 10 quickly dissipates the temperature of the hot side of the TEC chip 8, preventing the temperature of the hot side of the TEC chip 8 from being conducted to the cold side of the TEC chip 8, thus affecting the cooling effect. This heat dissipation component greatly improves the overall heat dissipation efficiency and effectively protects the mobile phone 11 device.

[0037] Meanwhile, a temperature sensor is also installed on the TEC chip 8 to monitor the hot and cold surface temperatures of the TEC chip 8 in real time. The motherboard 6 is installed between the heat sink 9 and the outer casing 5. The motherboard 6 acts as a control module, electrically connecting the temperature sensor and the TEC chip 8 to the fan 10. The motherboard 6 provides algorithm and control support, realizing intelligent control of the entire heat dissipation system.

[0038] Based on the above embodiments, the present invention may further include the following preferred technical solutions:

[0039] In a preferred embodiment, in order to improve the heat and cold conduction efficiency, thermal grease 7 is provided between the cold side of the TEC plate 8 and the cooling plate 4, and thermal grease 7 is provided between the hot side of the TEC plate 8 and the heat sink 9.

[0040] As a preferred embodiment, in order to improve charging efficiency and prevent energy leakage, a magnetic shielding sheet is also provided at the bottom of the coil 2.

[0041] In a preferred embodiment, in order to make the phone 11 fit more tightly and stably, the surface of the outer casing 5 is also provided with grooves, which correspond to the protrusions of the phone 11.

[0042] In a preferred embodiment, in order to achieve intelligent temperature control, a temperature sensor is also provided on the TEC chip 8 to monitor the hot and cold surface temperatures of the TEC chip 8 in real time, and a motherboard 6 is provided. The motherboard 6 is installed between the heat sink 9 and the outer casing 5. The motherboard 6 acts as a control module and is electrically connected to the temperature sensor. The motherboard 6 is also electrically connected to the TEC chip 8 and the fan 10.

[0043] The working principle of this utility model's magnetic vehicle wireless charging heat dissipation structure based on TEC chip cooling is as follows:

[0044] When the phone 11 approaches the structure, the permanent magnet 3 provides magnetic force, which automatically attracts and positions the phone 11 above the top cover 1. The surface of the outer shell 5 is provided with a recessed step, and the bottom of the step corresponds to the protrusion of the phone 11, which makes the phone 11 fit more tightly and solves the shaking problem during vehicle movement. Then the coil 2 starts wireless charging, and the magnetic shielding sheet at the bottom of the coil 2 improves the charging efficiency.

[0045] During charging, coil 2 and mobile phone 11 begin to heat up. At this time, the heat dissipation component is activated, and TEC chip 8 is powered on. Its cold side generates a low temperature, and the cooling energy is transferred to the cooling chip 4 through thermal grease 7. Part of the cooling chip 4 is located on the surface of the outer casing 5, thereby quickly transferring the cooling energy to the surface of the outer casing 5 to counteract the heat generated by coil 2 and mobile phone 11. At the same time, the heat generated by the hot side of TEC chip 8 is transferred to the heat sink 9 through thermal grease 7. The airflow of fan 10 is directed towards the heat sink 9, and the heat of the heat sink 9 is quickly dissipated through forced air cooling. This heat dissipation path avoids the heat from the hot side of TEC chip 8 being conducted to its cold side, ensuring a continuous and efficient cooling effect.

[0046] Throughout the operation, the temperature sensor on the TEC chip 8 is used to monitor the hot and cold surface temperatures of the TEC chip 8 in real time and transmit the temperature data to the motherboard 6. The motherboard 6, as a control module, is electrically connected to the temperature sensor, the TEC chip 8 and the fan 10. Based on the real-time temperature data, the motherboard 6 automatically adjusts the output power of the TEC chip 8 and the fan 10 to achieve intelligent temperature control and energy saving.

[0047] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A magnetic vehicle-mounted wireless charging heat dissipation structure based on TEC cooling, comprising: Outer shell (5); Heat sink (9) is fixedly connected to the bottom of the outer casing (5); A fan (10) is fixedly connected to the bottom of the heat sink (9), and the airflow of the fan (10) is directed toward the heat sink (9). TEC plate (8), the TEC plate (8) having a hot side and a cold side, the hot side of the TEC plate (8) being attached to the top of the heat sink (9); A cooling chip (4) is installed on the top of the housing (5). A portion of the cooling chip (4) is sunk and contacts the cold surface of the TEC chip (8) inside the housing (5). A portion of the cooling chip (4) is located on the surface of the housing (5). A permanent magnet (3) is embedded inside the cooling chip (4); The coil (2) is embedded inside the permanent magnet (3); The top cover (1) is fixedly connected to the top of the outer shell (5), and the top cover (1) covers the top of the coil (2); and a mobile phone (11), which is magnetically attached to the top cover (1).

2. The structure of claim 1, wherein Thermal grease (7) is provided between the cold side of the TEC plate (8) and the cooling plate (4); and thermal grease (7) is provided between the hot side of the TEC plate (8) and the heat sink (9).

3. The structure of claim 1, wherein A magnetic shielding sheet is also provided at the bottom of the coil (2).

4. The structure of claim 1, wherein The surface of the outer casing (5) is also provided with a recessed step, the bottom of which corresponds to the protrusion of the mobile phone (11).

5. The structure of claim 1, wherein The TEC sheet (8) is also equipped with a temperature sensor to monitor the hot surface temperature and the cold surface temperature of the TEC sheet (8) in real time.

6. The structure according to claim 5, characterized in that, It also includes a motherboard (6), which is mounted between the heat sink (9) and the housing (5).

7. The structure of claim 6, wherein The motherboard (6) is electrically connected to the temperature sensor as a control module.

8. The structure of claim 7, wherein The motherboard (6) is also electrically connected to the TEC chip (8) and the fan (10).

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