An electronic device

Abstract

This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to an electronic device comprising an insulating shell, a heat sink, and a potting compound layer. The heat sink is connected and fixed to the insulating shell to form a receiving chamber. A circuit board is disposed within the receiving chamber and is connected and fixed to the heat sink. The heat sink dissipates heat. The potting compound layer is disposed within the receiving chamber and covers the circuit board, conducting heat to the heat sink. This utility model utilizes potting compound to fill and seal the circuit board disposed within the receiving chamber to cover the circuit board and form a potting compound layer. Utilizing the excellent thermal conductivity, moisture resistance, and corrosion resistance properties of the potting compound layer, heat can be quickly conducted to the heat sink, thereby rapidly dissipating heat through the heat sink, improving heat dissipation efficiency, and effectively protecting the electronic device, reducing contamination from airborne impurities, extending its service life, and ensuring the performance of the electronic device.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to an electronic device. Background Technology

[0002] Power supply products include various electronic components. As the usage scenarios for power supply products become increasingly harsh, cooling air can bring salt spray, dust, warm air, corrosive gases, metallic foreign objects, etc. from the environment, which can cover the electronic components and cause them to fail.

[0003] In related technologies, the entire housing is sealed to isolate the electronic components inside from the outside air, preventing airborne impurities from contaminating them. However, this approach does not allow cooling air to directly reach the electronic components; instead, it requires a heat sink for heat dissipation. Compared to direct fan cooling, this method is less efficient. When the product has higher power, insufficient heat dissipation can restrict the performance of the electronic components and may even damage them. Utility Model Content

[0004] In view of this, one objective of the present invention is to provide an electronic device that improves the poor heat dissipation efficiency in the related art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solutions: In a first aspect, embodiments of the present invention provide an electronic device, comprising: Insulating housing; A radiator is connected and fixed to an insulating shell to form a receiving chamber. A circuit board is installed in the receiving chamber and is connected and fixed to the radiator. The radiator is used to dissipate heat. A potting compound layer is placed within the receiving cavity and covers the circuit board to conduct heat to the heat sink.

[0006] In some embodiments, the electronic device further includes a MOSFET electrically connected to the circuit board, the MOSFET being fixed to a heat sink and located within a receiving cavity.

[0007] In some embodiments, the electronic device further includes a fixing plate and a first fixing screw. The heat sink has a fixing screw hole, the fixing plate and the MOSFET have a first opening, and the first fixing screw passes through the first opening of the fixing plate and the MOSFET and is connected and fixed to the fixing screw hole, so that the MOSFET is fixed to the heat sink.

[0008] In some embodiments, the insulating housing includes a first insulating plate and a second insulating plate, the heat sink has a first side and a second side, the first insulating plate is embedded and fixed to the first side and the second side, and the second insulating plate is embedded and fixed to the outer side of the lower end of the first insulating plate.

[0009] In some embodiments, the second insulating plate has a third side with a first notch, and the pins of the MOS transistor extend out of the first notch.

[0010] In some embodiments, a second notch is further provided on the third side, and the circuit board includes a protrusion extending out of the second notch.

[0011] In some embodiments, the electronic device further includes a second fixing screw, a support stud on the heat sink, a second opening on the circuit board, and the second fixing screw passes through the second opening and is connected and fixed to the support stud.

[0012] In some embodiments, the first insulating plate is provided with a third notch, and the second fixing screw is disposed in the third notch in a way that avoids the notch.

[0013] In some embodiments, the second insulating plate further has a fourth side, which is connected and fixed to the third side. The fourth side is provided with a third opening, and the second fixing screw is disposed in the third opening.

[0014] In some embodiments, the radiator is provided with a fourth notch for pouring potting compound into the receiving chamber, such that the potting compound forms a potting compound layer after curing in the receiving chamber.

[0015] The present invention has the following beneficial effects: Unlike related technologies, the electronic device provided in the present invention includes an insulating shell, a heat sink, and a potting compound layer. The heat sink is connected and fixed to the insulating shell to form a receiving cavity. A circuit board is disposed in the receiving cavity and is connected and fixed to the heat sink. The heat sink is used to dissipate heat. The potting compound layer is disposed in the receiving cavity and covers the circuit board, and is used to conduct heat to the heat sink.

[0016] This utility model embodiment utilizes potting compound to fill and seal the circuit board in the receiving cavity to cover the circuit board and form a potting compound layer. Utilizing the excellent thermal conductivity, moisture resistance, and corrosion resistance properties of the potting compound layer, heat can be quickly conducted to the heat sink, thereby quickly dissipating heat through the heat sink, improving heat dissipation efficiency, and effectively protecting electronic components, reducing contamination from air impurities, extending service life, and ensuring the performance of electronic components. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below only show some embodiments of this utility model and should not be considered as limiting the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the disassembly and assembly structure of an electronic device provided in some embodiments of this utility model. Figure 1 ; Figure 2 This is a cross-sectional view of an electronic device provided in some embodiments of the present invention. Figure 1 ; Figure 3 This is a cross-sectional view of an electronic device provided in some embodiments of the present invention. Figure 2 ; Figure 4 This is a schematic diagram of the disassembly and assembly structure of an electronic device provided in some embodiments of this utility model. Figure 2 ; Figure 5 This is a schematic diagram of the disassembly and assembly structure of an electronic device provided in some embodiments of this utility model. Figure 3 ; Figure 6 This is a structural schematic diagram of the electronic device provided in some embodiments of the present invention from a bottom-view perspective; Figure 7 This is a schematic diagram of the assembly structure of an electronic device provided in some embodiments of this utility model.

[0019] Explanation of reference numerals in the attached figures: 100. Electronic devices; 10. Insulating shell; 11. First insulating plate; 11a. Third notch; 12. Second insulating plate; 12a. Third side; 12a1. First notch; 12a2. Second notch; 12b. Fourth side; 12b1. Third opening; 20. Radiator; 21. Fixing screw hole; 22. First side; 23. Second side; 24. Support stud; 25. Fourth notch; 30. Receiving chamber; 31. Circuit board; 31a. Protrusion; 31b. Second opening; 40. MOSFET; 41. Pin; 4a. First opening; 50. Fixing plates; 60. First fixing screw; 70. Second fixing screw. Detailed Implementation

[0020] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. The detailed description of the embodiments of this utility model in the accompanying drawings is not intended to limit the scope of protection claimed by this utility model, but only to represent selected embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it means that it can be directly attached to the other element or that an intervening element may be present. When an element is considered to be "connected to" another element, it can be directly connected to the other element or that an intervening element may be present simultaneously. The terms "vertical," "horizontal," "left," "right," "up," and "down," etc., used in this specification indicate orientation or position based on the orientation or position shown in the accompanying drawings.

[0022] It should be noted that the terms "first," "second," and other similar expressions used in this specification are for illustrative purposes and to distinguish between identical or similar items with substantially the same function and effect, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality of" means two or more items, unless otherwise explicitly defined. It is worth noting that although functional modules are divided in the device or structural diagram, in some cases, a different module division may be used than that shown in the device or structure.

[0023] Unless otherwise defined, the technical and scientific terms used in this specification have the same meanings as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items. It should be understood that the technical features involved in the various embodiments of the invention described below can be combined with each other, provided that no conflict is established.

[0024] Power supply products include various electronic components. As the usage scenarios for power supply products become increasingly harsh, cooling air can bring salt spray, dust, warm air, corrosive gases, metallic foreign objects, etc. from the environment, which can cover the electronic components and cause them to fail.

[0025] The inventors discovered that in related technologies, the entire housing of an electronic device is sealed to isolate the electronic components from the outside air, preventing airborne impurities from contaminating them. However, this approach does not allow cooling air to directly reach the electronic components; instead, heat dissipation is achieved through a heat sink. Compared to direct fan cooling, this method is less efficient. When the electronic device has higher power, insufficient heat dissipation can limit the performance of the electronic components and may even damage them.

[0026] To prevent airborne impurities from contaminating electronic components, the inventors also discovered that related technologies employ the following method: after the circuit board is finished, the entire circuit board is sprayed with conformal coating to protect critical parts and components. However, this method has at least the following drawbacks: 1) Because the entire circuit board is coated with conformal coating, the pins of some components on the circuit board cannot be well protected. These pins often need to carry high voltage and high current, and the failure probability of the pins is higher. The conformal coating method cannot protect these pins well. 2) The thickness of the conformal coating is usually only 50 to 70 mm. Because of its thinness, it often fails to provide adequate protection for electronic components used in long-term polluted environments, making these components highly susceptible to contamination, which can lead to damage or failure.

[0027] Therefore, this utility model provides an electronic device. Please refer to [link / reference]. Figures 1 to 3 , Figures 1 to 3 The diagram shows a schematic diagram and a cross-sectional view of an electronic device provided in some embodiments of the present invention.

[0028] See Figures 1 to 3 As shown, the electronic device 100 includes an insulating housing 10, a heat sink 20, and a potting compound layer ( Figures 1 to 3 (Not shown in the image).

[0029] The heat sink 20 is connected and fixed to the insulating housing 10 to form a receiving chamber 30. A circuit board 31 is disposed in the receiving chamber 30, and the circuit board 31 is connected and fixed to the heat sink 20. The heat sink 20 is used to dissipate heat. Specifically, the heat sink 20 dissipates the heat generated by the circuit board 31 and the components disposed on the circuit board 31 through heat exchange with the external environment (relative to the electronic device 100), thereby achieving heat dissipation of the electronic components.

[0030] A potting compound layer is disposed within the receiving chamber 30 and covers the circuit board 31. The potting compound layer is used to conduct heat to the heat sink 20. Specifically, the potting compound layer covers the surface of the circuit board 31 and the surface of the components on the circuit board 31, and is used to conduct the heat generated by the circuit board 31 and the components disposed on the circuit board 31 to the heat sink 20.

[0031] It is understood that there are various ways to connect and fix the radiator 20 to the insulating shell 10, such as by screwing, welding or snapping to form the receiving chamber 30. This embodiment of the utility model does not limit this in any way.

[0032] It should be understood that there are various ways to connect and fix the circuit board 31 to the heat sink 20, such as by screwing, welding or snapping. This embodiment of the utility model does not limit the method in any way.

[0033] In some embodiments, liquid potting compound is poured or injected into the receiving chamber 30 by pouring or injection. After curing within the receiving chamber 30, the liquid potting compound forms a potting compound layer. Potting compound is an adhesive material used to fill, seal, and protect electronic components or assemblies. It possesses excellent thermal conductivity, moisture resistance, corrosion resistance, insulation, and shock resistance properties, providing good protection for the circuit board 31 and the components on it.

[0034] In the electronic device provided by this utility model embodiment, a potting compound is used to fill and seal the circuit board in the receiving cavity to cover the circuit board and form a potting compound layer. Utilizing the good thermal conductivity, moisture resistance and corrosion resistance properties of the potting compound layer, heat can be quickly conducted to the heat sink, thereby quickly dissipating heat through the heat sink, improving heat dissipation efficiency, and effectively protecting the circuit board and electronic components on the circuit board, reducing contamination from impurities in the air, extending service life, and ensuring the performance of electronic components.

[0035] Please continue reading. Figure 1 In some embodiments, the electronic device 100 further includes a MOSFET 40 electrically connected to the circuit board 31. The MOSFET 40 is fixed to the heat sink 20 and located within the receiving chamber 30. The MOSFET 40 is an electronic device that generates a relatively high amount of heat and is used to control the circuits in the circuit board 31 to achieve related circuit functions.

[0036] Please continue reading. Figure 1In some embodiments, the electronic device 100 further includes a fixing plate 50 and a first fixing screw 60. The heat sink 20 has a fixing screw hole 21. The fixing plate 50 and the MOS transistor 40 have a first opening 4a. The first fixing screw 60 passes through the first opening 4a of the fixing plate 50 and the MOS transistor 40 and is connected and fixed to the fixing screw hole 21, so that the MOS transistor 40 is fixed to the heat sink 20.

[0037] Understandably, the number of fixing screw holes 21, the number of MOSFETs 40, the number of fixing plates 50, and the number of first fixing screws 60 are the same. In this way, the MOSFETs 40 can be flexibly fixed to the heat sink 20 by fixing plates 50 and first fixing screws 60. For example, in some embodiments of this utility model, the MOSFETs 40 are fixed to the heat sink 20 in a vertical direction. In other embodiments, the MOSFETs 40 can be fixed to the heat sink 20 in an inclined or horizontal direction. In this way, it can adapt to heat sinks 20 of different heights, improve the installation adaptability of the MOSFETs 40, and enrich the installation methods of the MOSFETs 40.

[0038] Please refer to the following: Figure 1 , Figure 4 as well as Figure 7 In some embodiments, the insulating housing 10 includes a first insulating plate 11 and a second insulating plate 12, and the heat sink 20 has a first side 22 and a second side 23. The first insulating plate 11 is embedded and fixed to the first side 22 and the second side 23 of the heat sink 20, and the second insulating plate 12 is embedded and fixed to the outer side of the lower end of the first insulating plate 11, surrounding the lower end of the first insulating plate 11.

[0039] In this embodiment, by embedding and fixing the first insulating plate 11 and the second insulating plate 12 to the heat sink 20, a receiving chamber 30 is formed, and liquid potting compound can be poured or injected into the receiving chamber 30 to solidify and form a potting compound layer.

[0040] Please refer to the following: Figure 5 , Figure 6 as well as Figure 7 In some embodiments, the circuit board 31 includes a protrusion 31a, the second insulating plate 12 has a third side 12a, the third side 12a is provided with a first notch 12a1 and a second notch 12a2, the pin 41 of the MOS transistor 40 extends out of the first notch 12a1, and the protrusion 31a extends out of the second notch 12a2.

[0041] In this embodiment, by extending the pin 41 of the MOS transistor 40 into the first notch 12a1 and the protrusion 31a into the second notch 12a2, the MOS transistor 40 and the circuit board 31 are conveniently positioned and fixed, so that the positions of the MOS transistor 40 and the circuit board 31 within the receiving chamber 30 are relatively fixed, and external electronic components (relative to the MOS transistor 40) can be electrically connected to the MOS transistor 40.

[0042] Please refer to the following: Figure 1 and Figure 4 In some embodiments, the electronic device 100 further includes a second fixing screw 70. The heat sink 20 is provided with a support stud 24, and the circuit board 31 has a second opening 31b. The second fixing screw 70 passes through the second opening 31b and is connected and fixed to the support stud 24. The number of support studs 24, the number of second openings 31b, and the number of second fixing screws 70 are the same, and the positions of the support studs 24 correspond to the positions of the second openings 31b. Through the cooperation of the second fixing screw 70 and the support stud 24, the circuit board 31 can be quickly and accurately fixed to the heat sink 20.

[0043] Please refer to the following: Figure 1 , Figure 5 as well as Figure 7 In some embodiments, the first insulating plate 11 has a third notch 11a, and the second insulating plate 12 also has a fourth side 12b, which has a third opening 12b1. The fourth side 12b is connected and fixed to the third side 12a. After the second fixing screw 70 passes through the second opening 31b and is connected and fixed to the support stud 24, the second fixing screw 70 is disposed in a recessed manner in the third notch 11a and in a recessed manner in the third opening 12b1.

[0044] In this embodiment, the number of third notches 11a is the same as the number of second fixing screws 70. By opening the third notches 11a and the third openings 12b1, the second fixing screws 70 are disposed in the third notches 11a and the third openings 12b1 to avoid contact between the second fixing screws 70 and the first insulating plate 11 and the second insulating plate 12, thereby reducing the wear of the first insulating plate 11 and the second insulating plate 12.

[0045] Please see Figure 2 In some embodiments, the radiator 20 is provided with a fourth notch 25 for pouring or injecting potting compound into the receiving chamber 30, so that the potting compound forms a potting compound layer after curing in the receiving chamber 30.

[0046] In this embodiment, engineers can quickly and accurately pour or inject liquid potting compound into the receiving chamber 30 through the fourth notch 25. After the liquid potting compound cures in the receiving chamber 30, it forms a potting compound layer. The potting compound layer has good thermal conductivity, moisture resistance, corrosion resistance, insulation and shock resistance, which can play a good protective role for the circuit board 31 and the components on the circuit board 31.

[0047] In summary, the electronic device provided by this utility model uses potting compound to fill and seal the circuit board in the receiving cavity to form a potting compound layer. The potting compound layer has good thermal conductivity, moisture resistance and corrosion resistance properties, which can quickly conduct heat to the heat sink, thereby quickly dissipating heat through the heat sink, improving heat dissipation efficiency, and can also protect electronic components well, reduce contamination from impurities in the air, extend service life and ensure the performance of electronic components.

[0048] Those skilled in the art will understand that the above-mentioned technical features can be used in any combination without limitation. The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to more clearly understand the technical features, purpose and effects of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, should also be included within the scope of protection of the claims of this utility model.

Claims

1. An electronic device, characterized in that, include: Insulating housing; A radiator is connected and fixed to the insulating shell to form a receiving chamber. A circuit board is disposed in the receiving chamber and the circuit board is connected and fixed to the radiator. The radiator is used to dissipate heat. A potting compound layer is disposed within the receiving cavity and covers the circuit board for conducting heat to the heat sink.

2. The electronic device according to claim 1, characterized in that, The electronic device also includes a MOS transistor electrically connected to the circuit board, the MOS transistor being fixed to the heat sink and located within the receiving cavity.

3. The electronic device according to claim 2, characterized in that, The electronic device also includes a fixing plate and a first fixing screw. The heat sink has a fixing screw hole. The fixing plate and the MOS transistor have a first opening. The first fixing screw passes through the first opening of the fixing plate and the MOS transistor and is connected and fixed to the fixing screw hole, so that the MOS transistor is fixed to the heat sink.

4. The electronic device according to claim 2, characterized in that, The insulating housing includes a first insulating plate and a second insulating plate. The radiator has a first side and a second side. The first insulating plate is embedded and fixed to the first side and the second side, and the second insulating plate is embedded and fixed to the outer side of the lower end of the first insulating plate.

5. The electronic device according to claim 4, characterized in that, The second insulating plate has a third side with a first notch, and the pins of the MOS transistor extend out of the first notch.

6. The electronic device according to claim 5, characterized in that, The third side is also provided with a second notch, and the circuit board includes a protrusion that extends out of the second notch.

7. The electronic device according to claim 5, characterized in that, The electronic device also includes a second fixing screw, the heat sink is provided with a support stud, the circuit board has a second opening, the second fixing screw passes through the second opening and is connected and fixed to the support stud.

8. The electronic device according to claim 7, characterized in that, The first insulating plate has a third notch, and the second fixing screw is disposed in the third notch to avoid obstruction.

9. The electronic device according to claim 7 or 8, characterized in that, The second insulating plate also has a fourth side, which is connected and fixed to the third side. The fourth side is provided with a third opening, and the second fixing screw is disposed in the third opening.

10. The electronic device according to any one of claims 1-8, characterized in that, The radiator is provided with a fourth notch, which is used to pour potting compound into the receiving chamber, so that the potting compound forms the potting compound layer after curing in the receiving chamber.

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