Digital anti-reflux device shell with heat dissipation structure

Abstract

This utility model discloses a housing for a digital anti-backflow device with a heat dissipation structure, including an outer shell and a heat dissipation assembly. The heat dissipation assembly is disposed on the side wall of the outer shell and includes a heat dissipation mesh, a clip, and heat dissipation fins. The heat dissipation mesh is disposed on the side wall of the outer shell, and the heat dissipation fins are disposed on the upper and lower sides of the outer shell for dissipating heat from the digital anti-backflow device. The clip is engaged with the side wall of the outer shell to fix the heat dissipation mesh. This utility model enhances the heat dissipation capacity of the outer shell by setting the heat dissipation assembly on the side wall of the outer shell and by mounting the heat dissipation mesh and heat dissipation fins on the assembly onto the outer shell, effectively improving the overall heat conduction efficiency and quickly alleviating the problem of internal heat accumulation.

Description

Technical Field

[0001] This utility model relates to the field of digital anti-backflow equipment technology, and in particular to a housing of a digital anti-backflow device with a heat dissipation structure. Background Technology

[0002] The housing of a digital anti-backflow device is an outer shell structure used to encapsulate the internal electronic components and circuit systems of a digital anti-backflow device. It has applications in various fields such as photovoltaic power generation and medical care.

[0003] The existing digital anti-backflow device housing with heat dissipation structure has the following shortcomings in use: Currently, the housing of digital anti-backflow devices generally adopts a passive natural heat dissipation design. During long-term operation, the heat generated inside the device is difficult to dissipate efficiently to the outside through the housing. Especially in the closed environment of a sealed distribution cabinet, heat is more likely to accumulate continuously inside the housing. This not only leads to a significant increase in the surface temperature of the housing, but also further conducts to the internal components, which can easily cause some components to be damaged due to overheating, affecting the overall operational stability and service life of the device.

[0004] Therefore, a digital anti-backflow device housing with a heat dissipation structure is needed to solve the above problems. Utility Model Content

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0006] In view of the problems of the aforementioned housing of a digital anti-backflow device with a heat dissipation structure, this utility model is proposed.

[0007] Therefore, the purpose of this utility model is to provide a housing for a digital anti-backflow device with a heat dissipation structure, which solves the problem that the heat generated inside the current device is difficult to dissipate efficiently to the outside through the housing, which not only causes the surface temperature of the housing to rise significantly, but also conducts to the internal components and causes damage.

[0008] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a housing for a digital anti-backflow device with a heat dissipation structure, comprising an outer shell, including:

[0009] A heat dissipation assembly is disposed on the side wall of the housing, and the heat dissipation assembly includes a heat dissipation mesh, a card, and heat dissipation fins;

[0010] The heat dissipation mesh is disposed on the side wall of the outer casing, and the heat dissipation fins are disposed on the upper and lower sides of the outer casing for dissipating heat from the digital anti-backflow device. The clips are fastened to the side wall of the outer casing for fixing the heat dissipation mesh.

[0011] As a preferred embodiment of the housing of the digital anti-backflow device with heat dissipation structure of this utility model, the side wall of the housing is provided with a heat dissipation vent, and the heat dissipation mesh is inserted into the heat dissipation vent.

[0012] As a preferred embodiment of the housing of the digital anti-backflow device with heat dissipation structure described in this utility model, multiple sets of the clips are fixedly connected to the side wall of the heat dissipation mesh, and multiple sets of slots are opened on the inner wall of the heat dissipation port, with the clips engaging inside the slots.

[0013] In a preferred embodiment of the housing of the digital anti-backflow device with heat dissipation structure described in this utility model, a connecting rod is fixedly connected to the side wall of the heat dissipation mesh, and a dustproof mesh is sleeved on the side wall of the connecting rod.

[0014] As a preferred embodiment of the housing of the digital anti-backflow device with heat dissipation structure described in this utility model, wherein: the heat dissipation mesh and the dustproof mesh are fixedly connected to each other on their corresponding sides with Velcro, and the dustproof mesh is fixed to the side wall of the heat dissipation mesh by Velcro.

[0015] As a preferred embodiment of the housing of the digital anti-backflow device with heat dissipation structure of this utility model, wherein: the side wall of the heat dissipation port is provided with a connection hole, and the connecting rod is inserted into the inside of the connection hole.

[0016] In a preferred embodiment of the housing of the digital anti-backflow device with heat dissipation structure described in this utility model, magnetic pads are fixedly connected to the inner wall of the connecting hole and the end of the connecting rod, and the connecting rod is magnetically fixed inside the connecting hole by the magnetic pads.

[0017] As a preferred embodiment of the housing of the digital anti-backflow device with heat dissipation structure described in this utility model, wherein: multiple sets of screws penetrate the top of the heat dissipation fins, and the screws are threadedly connected to the inside of the housing.

[0018] The beneficial effects of this utility model are as follows: by setting a heat dissipation component on the side wall of the outer shell, and by installing the heat dissipation mesh and heat dissipation fins on the component on the outer shell, the heat dissipation capacity of the outer shell is enhanced, the overall heat conduction efficiency is effectively improved, and the problem of internal heat accumulation is quickly alleviated. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0020] Figure 1 This is a schematic diagram of the overall structure of the housing of a digital anti-backflow device with a heat dissipation structure according to the present invention.

[0021] Figure 2 This is a schematic diagram of the heat dissipation component on the housing of a digital anti-backflow device with a heat dissipation structure according to the present invention.

[0022] Figure 3 This is a schematic diagram of the unfolded structure of the heat dissipation mesh on the housing of a digital anti-backflow device with a heat dissipation structure according to this utility model.

[0023] Figure 4 This is a schematic diagram of the unfolded structure of the dustproof net on the housing of a digital anti-backflow device with a heat dissipation structure according to this utility model.

[0024] Figure 5 This is a schematic diagram of the connecting rod on the housing of a digital anti-backflow device with a heat dissipation structure according to this utility model.

[0025] Figure descriptions: 100, outer casing; 200, heat dissipation assembly; 201, heat dissipation vent; 202, heat dissipation mesh; 203, clip; 203a, slot; 204, dustproof mesh; 204a, Velcro; 205, connecting rod; 205a, connecting hole; 206, magnetic pad; 207, heat dissipation fins; 208, screw. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.

[0029] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0030] Example 1

[0031] Reference Figure 1 and Figure 2 This is the first embodiment of the present invention. This embodiment provides a digital anti-backflow device housing with a heat dissipation structure, which can achieve the effect of rapid heat dissipation from the outer housing 100. It includes an outer housing 100, comprising:

[0032] Heat dissipation component 200 is disposed on the side wall of housing 100. Heat dissipation component 200 includes heat dissipation mesh 202, card 203 and heat dissipation fins 207.

[0033] The heat dissipation mesh 202 is disposed on the side wall of the outer casing 100, and the heat dissipation fins 207 are disposed on the upper and lower sides of the outer casing 100 for dissipating heat from the digital anti-backflow device. The clip 203 is clipped onto the side wall of the outer casing 100 for fixing the heat dissipation mesh 202.

[0034] In use, heat dissipation mesh 202 and heat dissipation fins 207 are provided on the side wall of the outer shell 100, and the outer shell 100 is fixed by the clip 203, which can dissipate heat from the outer shell 100. This avoids the situation where the shell relies solely on natural heat dissipation, which has limited effect and results in low heat conduction efficiency, and improves its heat dissipation efficiency.

[0035] Example 2

[0036] Reference Figures 1 to 5This is the second embodiment of the present invention. Unlike the previous embodiment, the outer shell 100 has a heat dissipation vent 201 on its side wall. The heat dissipation mesh 202 is inserted into the heat dissipation vent 201. Multiple sets of clips 203 are fixedly connected to the side wall of the heat dissipation mesh 202. Multiple sets of slots 203a are opened on the inner wall of the heat dissipation vent 201. The clips 203 are engaged in the slots 203a. By forcefully engaging the clips 203 on the side wall of the heat dissipation mesh 202 into the slots 203a on the outer shell 100, the heat dissipation mesh 202 can be fixed to the side wall of the heat dissipation vent 201. At the same time, by forcefully pulling the heat dissipation mesh 202 outward, it can be disassembled and cleaned.

[0037] The heat dissipation mesh 202 is fixedly connected to a connecting rod 205, and a dustproof mesh 204 is sleeved on the side wall of the connecting rod 205. Velcro fasteners 204a are fixedly connected to the corresponding sides of the heat dissipation mesh 202 and the dustproof mesh 204. The dustproof mesh 204 is attached to the side wall of the heat dissipation mesh 202 by Velcro fasteners 204a. This can protect the heat dissipation port 201 and prevent external dust from easily entering the housing 100 through the heat dissipation port 201, which could cause damage to the components.

[0038] The heat dissipation vent 201 has a connecting hole 205a on its side wall. The connecting rod 205 is inserted into the connecting hole 205a. Magnetic pads 206 are fixedly connected to the inner wall of the connecting hole 205a and the end of the connecting rod 205. The connecting rod 205 is magnetically fixed inside the connecting hole 205a by the magnetic pads 206. When the clip 203 is clipped into the slot 203a on the outer shell 100, the connecting rod 205 will be inserted into the connecting hole 205a at the same time. The magnetic pads 206 further improve the stability of the heat dissipation mesh 202 when it is fixed.

[0039] The top of the heat dissipation fins 207 has multiple sets of screws 208 running through it. The screws 208 are threaded into the inside of the outer casing 100, and the heat dissipation fins 207 further improve the heat dissipation efficiency of the outer casing 100.

[0040] In use, first attach the dustproof mesh 204 to the side wall of the heat dissipation mesh 202 using Velcro 204a. Then, forcefully snap the clip 203 on the side wall of the heat dissipation mesh 202 into the slot 203a on the outer shell 100. At the same time, the connecting rod 205 will be inserted into the connecting hole 205a for fixation. Finally, by rotating the screw 208, the heat dissipation fins 207 are threaded and fixed to the upper and lower sides of the outer shell 100, and the outer shell 100 can then be used.

[0041] It is worth noting that the specific functions and appearance of the aforementioned housing 100 can be referenced from the housing of the digital anti-backflow device, model ETP-220B.

[0042] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., variations in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​such as temperature and pressure, installation arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of this utility model. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0043] It should be understood that during the development of any practical implementation, and in any engineering or design project, numerous specific implementation decisions can be made. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, the development effort will be a routine task in design, manufacturing, and production without requiring extensive experimentation.

[0044] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A housing for a digital anti-backflow device with a heat dissipation structure, comprising an outer shell (100), characterized in that, include: A heat dissipation assembly (200) is disposed on the side wall of the outer casing (100), and the heat dissipation assembly (200) includes a heat dissipation mesh (202), a clip (203), and heat dissipation fins (207); The heat dissipation mesh (202) is disposed on the side wall of the outer shell (100), and the heat dissipation fins (207) are disposed on the upper and lower sides of the outer shell (100) for dissipating heat from the digital anti-backflow device. The clip (203) is clipped onto the side wall of the outer shell (100) for fixing the heat dissipation mesh (202).

2. The housing of the digital anti-backflow device with a heat dissipation structure according to claim 1, characterized in that: The outer casing (100) has a heat dissipation vent (201) on its side wall, and the heat dissipation mesh (202) is inserted into the heat dissipation vent (201).

3. The housing of the digital anti-backflow device with a heat dissipation structure according to claim 2, characterized in that: Multiple sets of the aforementioned card pieces (203) are fixedly connected to the side wall of the heat dissipation mesh (202), and multiple sets of card slots (203a) are opened on the inner wall of the heat dissipation port (201), and the card pieces (203) are engaged inside the card slots (203a).

4. The housing of the digital anti-backflow device with a heat dissipation structure according to claim 3, characterized in that: A connecting rod (205) is fixedly connected to the side wall of the heat dissipation mesh (202), and a dustproof mesh (204) is sleeved on the side wall of the connecting rod (205).

5. The housing of the digital anti-backflow device with a heat dissipation structure according to claim 1, characterized in that: The heat dissipation mesh (202) and the dustproof mesh (204) are each fixedly connected to a Velcro strap (204a) on their respective sides. The dustproof mesh (204) is attached to the side wall of the heat dissipation mesh (202) by the Velcro strap (204a).

6. The housing of the digital anti-backflow device with a heat dissipation structure according to claim 4, characterized in that: The heat dissipation port (201) has a connecting hole (205a) on its side wall, and the connecting rod (205) is inserted into the connecting hole (205a).

7. The housing of the digital anti-backflow device with a heat dissipation structure according to claim 6, characterized in that: Magnetic pads (206) are fixedly connected to the inner wall of the connecting hole (205a) and the end of the connecting rod (205). The connecting rod (205) is magnetically fixed inside the connecting hole (205a) by the magnetic pads (206).

8. The housing of the digital anti-backflow device with a heat dissipation structure according to claim 1, characterized in that: The top of the heat dissipation fins (207) has multiple sets of screws (208) running through it, and the screws (208) are threaded into the inside of the outer casing (100).

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