Multi-channel enhanced heat dissipation structure and heat sink

Abstract

This disclosure provides a multi-channel enhanced heat dissipation structure and radiator. The multi-channel enhanced heat dissipation structure includes a cover, a plate, and a heat dissipation fin assembly. The heat dissipation fin assembly is 3D printed onto the plate. The cover is placed on the plate and has a liquid inlet channel, a liquid outlet channel, and a liquid outlet channel connected in sequence within the cover. The heat dissipation fin assembly is disposed in the liquid outlet channel and has a protruding partition plate. The heat dissipation fin assembly has an embedding groove, and the partition plate is engaged with the embedding groove and abuts against the plate. The partition plate is parallel to the central axis from the liquid inlet channel to the liquid outlet channel. The heat dissipation fin assembly forms multiple interconnected heat dissipation channels. The 3D printed heat dissipation fins form a complex microchannel structure, increasing the effective contact area of ​​the coolant and improving heat exchange efficiency. The partition plate and heat dissipation channels guide the coolant to form a uniform and controllable flow field. By embedding the partition plate into the embedding groove and tightly abutting against the plate, the rigidity and structural reliability of the multi-channel enhanced heat dissipation structure are improved.

Description

Technical Field

[0001] This disclosure relates to the technical field of heat sinks, and in particular to a multi-channel enhanced heat dissipation structure and heat sink. Background Technology

[0002] With the rapid development of electronic information technology, the power density of integrated circuit chips continues to rise, resulting in a corresponding increase in heat flux density. Heat dissipation solutions for high-power chips have gradually shifted from traditional air cooling to more efficient liquid cooling technology.

[0003] Microchannel liquid-cooled radiators feature a compact structure and high heat exchange efficiency. However, their simple parallel straight channel design results in poor heat exchange efficiency and uneven flow distribution. The coolant tends to concentrate in the central region with the least flow resistance, leading to poor cooling in the peripheral areas. Furthermore, the radiator's assembly process, where the heat dissipation fins are separated from the substrate, results in insufficient overall structural rigidity when subjected to high-pressure coolant, impacting its lifespan and reliability.

[0004] For example, the liquid-cooled radiator structure disclosed in prior art CN202320245081.6 has two water nozzles on the outer side of the radiator shell. The radiator includes a recessed cavity, a heat dissipation cover plate, water nozzles, and heat dissipation fins. A liquid-cooled cavity is vertically integrated through the middle of the recessed cavity. The liquid-cooled cavity has horizontally symmetrical assembly steps, each containing a heat dissipation cover plate. Heat dissipation fins are located inside the liquid-cooled cavity and are connected to the heat dissipation cover plate. The water nozzles are located on the outer side of the liquid-cooled cavity. In this design, the heat dissipation fins on the inner wall are linear, resulting in poor heat dissipation efficiency. Furthermore, the overall structural rigidity of the heat dissipation cover plate and recessed cavity structure is insufficient when subjected to high-pressure coolant. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a multi-channel enhanced heat dissipation structure and radiator that improves heat exchange efficiency and structural reliability.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] A multi-channel enhanced heat dissipation structure includes a cover, a plate, and a heat dissipation fin assembly, wherein the heat dissipation fin assembly is formed on the plate by 3D printing;

[0008] The cover is placed on the plate. The cover has a liquid inlet channel, a liquid passage channel, and a liquid outlet channel that are connected in sequence. The heat dissipation fin assembly is disposed in the liquid passage channel. A partition plate is also provided in the liquid passage channel. The heat dissipation fin assembly has an embedded groove. The partition plate is engaged in the embedded groove and abuts against the plate. The partition plate is parallel to the central axis from the liquid inlet channel to the liquid outlet channel. The heat dissipation fin assembly forms multiple heat dissipation channels. Two adjacent heat dissipation channels are connected.

[0009] In one embodiment, the number of partition plates is at least two, the heat dissipation fin assembly has two corresponding embedded slots, the cover forms a first flow channel between the two partition plates, and the two partition plates each form a second flow channel on the side opposite to the first flow channel.

[0010] In one embodiment, the first flow channel is further provided with a first receiving groove, and a portion of the heat dissipation fin assembly is embedded in the first receiving groove.

[0011] In one embodiment, a first liquid receiving tank is also provided at one end of the first receiving tank adjacent to the liquid inlet channel.

[0012] In one embodiment, a second liquid receiving tank is also provided at one end of the two second flow channels adjacent to the liquid inlet channel.

[0013] In one embodiment, the two partition plates are symmetrically arranged on both sides of the central axis from the liquid inlet channel to the liquid outlet channel.

[0014] In one embodiment, the plate body has a limiting groove, and a portion of the partition plate is embedded in the limiting groove.

[0015] In one embodiment, the heat dissipation fin assembly includes a plurality of heat dissipation fins, which are spaced apart in the liquid passage and form a plurality of heat dissipation channels. Each heat dissipation fin has a through hole.

[0016] In one embodiment, the heat sink has a waveform structure.

[0017] A heat sink comprising the multi-channel enhanced heat dissipation structure described in any of the above embodiments.

[0018] Compared with the prior art, this disclosure has at least the following advantages:

[0019] The aforementioned multi-channel enhanced heat dissipation structure utilizes 3D-printed heat dissipation fins to form a complex and dense microchannel structure, increasing the effective contact area between the coolant and the heat dissipation fin assembly and improving the heat exchange efficiency of the multi-channel enhanced heat dissipation structure. The partition plate and heat dissipation channels guide the coolant to form a uniform and controllable flow field, ensuring that the coolant fully covers the heat dissipation area of ​​the plate and improving the cooling effect on the edge of the heat source. By embedding the partition plate into the mounting groove and tightly abutting against the plate, the rigidity of the multi-channel enhanced heat dissipation structure and the structural reliability for long-term use are improved. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a multi-channel enhanced heat dissipation structure according to one embodiment;

[0022] Figure 2 for Figure 1 A partial structural schematic diagram of the multi-channel enhanced heat dissipation structure is shown.

[0023] Figure 3 for Figure 1 A schematic diagram of the cover of the multi-channel enhanced heat dissipation structure shown;

[0024] Figure 4 for Figure 1 The cross-sectional view of the multi-channel enhanced heat dissipation structure shown. Detailed Implementation

[0025] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0029] Please see Figure 1 and Figure 2 As shown, it is a multi-channel enhanced heat dissipation structure 10 according to an embodiment of the present disclosure, including a cover 100, a plate 200 and a heat dissipation fin assembly 300, wherein the heat dissipation fin assembly 300 is formed on the plate 200 by 3D printing.

[0030] Furthermore, the cover 100 covers the plate 200. The cover 100 has a liquid inlet channel 101, a liquid passage channel 102, and a liquid outlet channel 103 connected in sequence. The heat dissipation fin assembly 300 is disposed in the liquid passage channel 102. A partition plate 110 is also protruding in the liquid passage channel 102. The heat dissipation fin assembly 300 has an embedding groove 301. The partition plate 110 is embedded in the embedding groove 301 and abuts against the plate 200. The partition plate 110 is parallel to the central axis from the liquid inlet channel 101 to the liquid outlet channel 103. The heat dissipation fin assembly 300 forms a plurality of heat dissipation channels 302, and two adjacent heat dissipation channels 302 are connected.

[0031] In this embodiment, the plate 200 contacts the heat source to absorb heat, and the heat dissipation fin assembly 300 is integrally formed on the plate 200 using metal 3D printing technology. The cover 100 covers the plate 200 to form a closed flow channel system. The partition plate 110 is arranged in a direction parallel to the center line of the liquid inlet channel 101 and the liquid outlet channel 103. The partition plate 110 separates multiple channels and guides the flow of coolant. The partition plate 110 is embedded in the mounting groove 301 of the heat dissipation fin assembly 300 and closely abuts against the plate 200, so that the partition plate 110 increases the pressure of the coolant fluid and the deformation resistance of the cover 100 and the plate 200.

[0032] The aforementioned multi-channel enhanced heat dissipation structure 10, through the 3D-printed heat dissipation fins forming a complex and dense microchannel structure, increases the effective contact area between the coolant and the heat dissipation fin assembly 300, thereby improving the heat exchange efficiency of the multi-channel enhanced heat dissipation structure 10. The partition plate 110 and the heat dissipation channel 302 guide the coolant to form a uniform and controllable flow field, ensuring that the coolant fully covers the heat dissipation area of ​​the plate 200, and improving the cooling effect on the edge of the heat source. By embedding the partition plate 110 into the mounting groove 301 and tightly abutting against the plate 200, the rigidity of the multi-channel enhanced heat dissipation structure 10 and the structural reliability for long-term use are improved.

[0033] like Figures 1 to 3 As shown, in one embodiment, the number of partition plates 110 is at least two, and the heat dissipation fin assembly 300 has two corresponding recessed grooves 301. The cover 100 forms a first flow channel 1101 between the two partition plates 110, and a second flow channel 1102 is formed on the side of the two partition plates 110 away from the first flow channel 1101. In this embodiment, the multiple partition plates 110 jointly enhance the compressive and deformation resistance of the multi-channel enhanced heat dissipation structure 10, thereby enhancing the structural rigidity and long-term reliability of the multi-channel enhanced heat dissipation structure 10. By dividing the total flow of coolant into multiple parallel flow channels through the partition plates 110, the coolant re-converges at the end of the flow channels, making the flow distribution of coolant when flowing through the heat dissipation fin assembly 300 more uniform and controllable, avoiding local overheating caused by uneven flow field, and improving the utilization efficiency of heat dissipation area.

[0034] like Figure 3 and Figure 4 As shown, in one embodiment, the first flow channel 1101 is further provided with a first receiving groove 1103, and a portion of the heat dissipation fin assembly 300 is embedded in the first receiving groove 1103. In this embodiment, the upper portion of the heat dissipation fin assembly 300 is embedded in the first receiving groove 1103 of the cover 100, and the heat dissipation fin assembly 300 and the cover 100 form a tight fit, thereby improving the overall structural rigidity and stability of the cover 100, the heat dissipation fin assembly 300 and the plate 200.

[0035] like Figure 4As shown, in one embodiment, a first liquid receiving tank 1104 is also provided at one end of the first receiving tank 1103 adjacent to the liquid inlet channel 101. In this embodiment, the receiving space of the first liquid receiving tank 1104 makes the unstable coolant fluid carrying air bubbles smoother and more uniform. The first liquid receiving tank 1104 reduces the direct impact of the coolant on the internal flow channel and heat dissipation fins when the coolant flows out of the liquid inlet channel 101 at high speed, and avoids the coolant fluid from directly and disorderly impacting the heat dissipation fins, thus ensuring the uniformity of coolant distribution on the cross-section of the heat dissipation fin assembly 300.

[0036] like Figure 4 As shown, in one embodiment, a second liquid receiving tank 1105 is also provided at one end of each of the two second flow channels 1102 adjacent to the liquid inlet channel 101. In this embodiment, the second liquid receiving tank 1105 buffers the coolant fluid, eliminating the direct impact of high-speed fluid on the heat dissipation fin assembly 300, so that the coolant in the first flow channel 1101 and the second flow channel 1102 dissipates heat evenly.

[0037] like Figure 1 As shown, in one embodiment, the two partition plates 110 are symmetrically arranged on both sides of the central axis from the liquid inlet channel 101 to the liquid outlet channel 103. In this embodiment, after the coolant flows out from the liquid inlet channel 101 located on the central axis, the coolant is evenly divided by the two symmetrical partition plates 110, so that the second flow channels 1102 on both sides are symmetrically arranged on both sides of the first flow channel 1101, so that the coolant heat dissipation process of the second flow channels 1102 on both sides is consistent, and the coolant flows smoothly in the rear section of the heat dissipation fin assembly 300, thereby improving the heat dissipation stability of the multi-channel enhanced heat dissipation structure 10.

[0038] like Figure 1 and Figure 2 As shown, in one embodiment, the plate 200 has a limiting groove 201, and a portion of the partition plate 110 is embedded in the limiting groove 201. In this embodiment, the precise embedding of the partition plate 110 into the limiting groove 201 of the plate 200 improves the tightness between the cover plate and the plate 200. During assembly, the limiting groove 201 provides a clear positioning reference for the assembly of the entire component, simplifies the assembly process, ensures the alignment of the flow channels between the partition plate 110, the heat dissipation fins, and the cover 100, and improves the consistency of manufacturing the multi-channel enhanced heat dissipation structure 10 and the product yield.

[0039] like Figure 2As shown, in one embodiment, the heat dissipation fin assembly 300 includes a plurality of heat dissipation fins 310, which are spaced apart in the liquid flow channel 102, forming a plurality of heat dissipation channels 302. Each heat dissipation fin 310 has a through hole 3101. In this embodiment, the coolant flows from the inlet side to the outlet side in the parallel heat dissipation channels 302 formed by the spaced-apart heat dissipation fins 310. The coolant flows laterally from one heat dissipation channel 302 to an adjacent heat dissipation channel 302 through the through hole 3101, making the coolant mix more uniform, effectively eliminating local hot spots, and improving the temperature field uniformity of the multi-channel enhanced heat dissipation structure 10.

[0040] like Figure 2 As shown, in one embodiment, the heat sink 310 has a wave-shaped structure. In this embodiment, when the coolant flows through the wave-shaped heat sink 310, the coolant flow direction changes continuously with the undulation of the waveform, increasing the mixing of the coolant fluid and extending the effective flow path between the coolant and the heat sink 310, thereby increasing the heat dissipation efficiency of the multi-channel enhanced heat dissipation structure 10.

[0041] This application also provides a heat sink, including the multi-channel enhanced heat dissipation structure 10 described in any of the above embodiments. In this embodiment, the complex heat dissipation fin assembly 300 is 3D printed, which improves the heat exchange efficiency. The partition plate 110 tightly abuts against the plate body 200, which enhances the rigidity of the heat sink and the structural reliability for long-term use.

[0042] Compared with the prior art, this disclosure has at least the following advantages:

[0043] The aforementioned multi-channel enhanced heat dissipation structure 10, through the 3D-printed heat dissipation fins forming a complex and dense microchannel structure, increases the effective contact area between the coolant and the heat dissipation fin assembly 300, thereby improving the heat exchange efficiency of the multi-channel enhanced heat dissipation structure 10. The partition plate 110 and the heat dissipation channel 302 guide the coolant to form a uniform and controllable flow field, ensuring that the coolant fully covers the heat dissipation area of ​​the plate 200, and improving the cooling effect on the edge of the heat source. By embedding the partition plate 110 into the mounting groove 301 and tightly abutting against the plate 200, the rigidity of the multi-channel enhanced heat dissipation structure 10 and the structural reliability for long-term use are improved.

[0044] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A multi-flow enhanced heat dissipation structure, characterized in that, It includes a cover, a plate, and a heat dissipation fin assembly, wherein the heat dissipation fin assembly is formed on the plate by 3D printing; The cover is placed on the plate. The cover has a liquid inlet channel, a liquid passage channel, and a liquid outlet channel that are connected in sequence. The heat dissipation fin assembly is disposed in the liquid passage channel. A partition plate is also provided in the liquid passage channel. The heat dissipation fin assembly has an embedded groove. The partition plate is engaged in the embedded groove and abuts against the plate. The partition plate is parallel to the central axis from the liquid inlet channel to the liquid outlet channel. The heat dissipation fin assembly forms multiple heat dissipation channels. Two adjacent heat dissipation channels are connected.

2. The multi-stream enhanced heat spreading structure of claim 1, wherein, The number of partition plates is at least two, and the heat dissipation fin assembly has two corresponding embedding slots. The cover body forms a first flow channel between the two partition plates, and a second flow channel is formed on the side of each of the two partition plates opposite to the first flow channel.

3. The multi-channel enhanced heat dissipation structure according to claim 2, characterized in that, The first flow channel is also provided with a first receiving groove, and part of the heat dissipation fin assembly is embedded in the first receiving groove.

4. The multi-channel enhanced heat dissipation structure according to claim 3, characterized in that, A first liquid receiving tank is also provided at one end of the first receiving tank adjacent to the liquid inlet channel.

5. The multi-channel enhanced heat dissipation structure according to claim 2, characterized in that, A second liquid receiving tank is also provided at one end of each of the two second flow channels adjacent to the liquid inlet channel.

6. The multi-channel enhanced heat dissipation structure according to claim 2, characterized in that, The two partition plates are symmetrically arranged on both sides of the central axis of the liquid inlet channel and the liquid outlet channel.

7. The multi-channel enhanced heat dissipation structure according to claim 1, characterized in that, The plate body has a limiting groove, and part of the partition plate is embedded in the limiting groove.

8. The multi-channel enhanced heat dissipation structure according to claim 1, characterized in that, The heat dissipation fin assembly includes multiple heat dissipation fins, which are spaced apart in the liquid passage and form multiple heat dissipation channels. Each heat dissipation fin has a through hole.

9. The multi-channel enhanced heat dissipation structure according to claim 8, characterized in that, The heat sink has a wave-shaped structure.

10. A radiator, characterized in that, The multi-channel enhanced heat dissipation structure includes any one of claims 1-9.

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