A motherboard component and an FTTR device

Abstract

This utility model relates to the field of FTTR equipment technology, and more particularly to a motherboard assembly and FTTR equipment, including a circuit board, a first heat sink, a second heat sink, and a chip unit. The chip unit includes a chip, a first thermal conductive element, and a second thermal conductive element. The circuit board has a first surface and a second surface opposite to each other along its thickness direction. The circuit board is located between the first heat sink and the second heat sink, with the first surface facing the first heat sink and the second surface facing the second heat sink. A first shielding layer is provided on the side of the first heat sink facing away from the circuit board, and a second shielding layer is provided on the side of the second heat sink facing away from the circuit board. The first thermal conductive element is disposed between the first heat sink and the chip disposed on the first surface to transfer heat from the chip to the first heat sink. The second thermal conductive element is disposed between the chips on the second surface to transfer heat from the chip to the second heat sink. This design simplifies the structure, reduces the overall size, and facilitates installation.

Description

Technical Field

[0001] This utility model relates to the field of FTTR equipment technology, and in particular to a motherboard component and FTTR equipment. Background Technology

[0002] FTTR equipment refers to fiber-to-the-room equipment, a network networking technology solution used in homes or small businesses.

[0003] An existing FTTR device includes a housing, a circuit board, a chip, a heat sink, and a metal shield. The housing has a mounting cavity, within which the circuit board is mounted. The chip is soldered onto the circuit board, and the metal shield covers the chip to prevent interference from other electrical components inside the mounting cavity. The heat sink is also located in the mounting cavity, and the metal shield has openings. Chips on the circuit board that generate significant heat contact the heat sink through these openings, transferring heat to the heat sink for dissipation.

[0004] However, existing FTTR equipment, which includes both heat sinks and shielding covers, involves more assembly steps and occupies a larger internal space. Summary of the Invention

[0005] This utility model provides a motherboard assembly and an FTTR device, aiming to solve the problem that existing FTTR devices, which require multiple assembly steps and occupy a large internal space, have multiple heat sinks and shields.

[0006] To address the aforementioned issues, this utility model provides a motherboard assembly, including a circuit board, a first heat sink, a second heat sink, and a chip unit. The chip unit includes a chip, a first thermal conductive element, and a second thermal conductive element. The circuit board has a first surface and a second surface opposite to each other along its thickness direction. The circuit board is located between the first heat sink and the second heat sink, with the first surface facing the first heat sink and the second surface facing the second heat sink. The first heat sink has a first shielding layer on one side facing away from the circuit board, and the second heat sink has a second shielding layer on one side facing away from the circuit board. The first thermal conductive element is disposed between the first heat sink and the chip disposed on the first surface to transfer the heat of the chip to the first heat sink, and the second thermal conductive element is disposed between the chips on the second surface to transfer the heat of the chip to the second heat sink.

[0007] Optionally, the first shielding layer is a nickel-plated layer.

[0008] Optionally, the second shielding layer is a nickel-plated layer.

[0009] Optionally, the first heat sink has a first protrusion facing the chip, and the first protrusion contacts the first heat-conducting element on one side facing the circuit board.

[0010] Optionally, the first thermal conductive element is a first thermal conductive pad, and the first thermal conductive pad is bonded to the first boss.

[0011] Optionally, the first thermal pad is a first phase change sheet.

[0012] Optionally, the second heat sink has a second protrusion facing the chip, and the side of the second protrusion facing the circuit board contacts the second heat conductor.

[0013] Optionally, the second heat-conducting element is a second phase change plate.

[0014] Optionally, the motherboard assembly further includes a grounding element, which is electrically connected to the circuit board.

[0015] According to the motherboard assembly provided in this embodiment of the present invention, the circuit board is disposed between the first heat sink and the second heat sink. The first heat-conducting component can transfer the heat generated by the chip on the first surface of the circuit board to the first heat sink, and the second heat-conducting component can transfer the heat generated by the chip on the second surface of the circuit board to the second heat sink. In addition, through the first shielding layer on the first heat sink and the second shielding layer on the second heat sink, external electromagnetic interference can be shielded, simplifying the structure, reducing the overall size, and facilitating installation.

[0016] This utility model embodiment also provides an FTTR device, including a housing and the aforementioned motherboard assembly. The housing has a mounting cavity, the motherboard assembly is located in the mounting cavity, the circuit board is connected to the housing, and the first heat sink and the second heat sink are both connected to the housing. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of an FTTR device provided in an embodiment of this utility model; Figure 2 for Figure 1 Schematic diagram of the structure of the front shell; Figure 3 for Figure 1Schematic diagram of the middle and rear cover structure; Figure 4 This is a schematic diagram of the structure of a motherboard assembly provided in an embodiment of the present invention; Figure 5 for Figure 4 Assembly diagram of the first heat sink and the first heat conduction component; Figure 6 for Figure 4 A schematic diagram of the assembly of the second heat sink and the second heat-conducting component.

[0019] Reference numerals in the accompanying drawings: 1. Housing; 2. Front housing; 3. Rear cover; 4. Mounting cavity; 5. Third connecting hole; 6. Positioning hole; 7. Locking block; 8. Seventh connecting hole; 9. Locking hole; 10. Fifth connecting hole; 11. Eighth connecting hole; 12. First heat sink; 13. Chip; 14. Circuit board; 15. Second heat sink; 16. First boss; 17. First phase change plate; 18. Fourth connecting hole; 19. First notch; 20. First connecting hole; 21. Second connecting hole; 22. Second boss; 23. Second phase change plate; 24. Sixth connecting hole. Detailed Implementation

[0020] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] like Figures 1 to 6 As shown, an embodiment of the present invention provides an FTTR device, including a housing 1 and a motherboard assembly. The housing 1 has a mounting cavity 4, and the motherboard assembly is located in the mounting cavity 4.

[0023] like Figures 3 to 6As shown, the motherboard assembly includes a circuit board 14, a first heat sink 12, a second heat sink 15, and a chip 13 unit. The circuit board 14 is connected to the housing 1. The first heat sink 12 and the second heat sink 15 are both connected to the housing 1. The chip 13 unit includes a chip 13, a first heat conductor, and a second heat conductor. The circuit board 14 has a first surface and a second surface that are opposite to each other along its thickness direction. The circuit board 14 is located between the first heat sink 12 and the second heat sink 15. The first surface faces the first heat sink 12, and the second surface faces the second heat sink 15.

[0024] The first heat sink 12 has a first shielding layer on one side facing away from the circuit board 14, and the second heat sink 15 has a second shielding layer on one side facing away from the circuit board 14.

[0025] A first heat-conducting element is disposed between the first heat sink 12 and the chip 13 disposed on the first surface to transfer heat from the chip 13 to the first heat sink 12. A second heat-conducting element is disposed between the chips 13 on the second surface to transfer heat from the chip 13 to the second heat sink 15.

[0026] In this embodiment, the circuit board 14 is disposed between the first heat sink 12 and the second heat sink 15. The first heat conductor can transfer the heat generated by the chip 13 on the first surface of the circuit board 14 to the first heat sink 12, and the second heat conductor can transfer the heat generated by the chip 13 on the second surface of the circuit board 14 to the second heat sink 15. In addition, through the first shielding layer on the first heat sink 12 and the second shielding layer on the second heat sink 15, external electromagnetic interference can be shielded, simplifying the structure, reducing the overall size, and facilitating installation.

[0027] In this embodiment, the housing 1 includes a front housing 2 and a rear cover 3. The front housing 2 and the rear cover 3 are connected to form an installation cavity 4.

[0028] In this embodiment, the first heat sink 12 is located between the front cover 2 and the circuit board 14, and the second heat sink 15 is located between the rear cover 3 and the circuit board 14.

[0029] In this embodiment, the circuit board 14 is provided with a first connection hole 20 and a second connection hole 21. The first connection hole 20 is screwed to the seventh connection hole 8 of the front cover 2, and the second connection hole 21 is screwed to the eighth connection hole 11 of the rear cover 3.

[0030] In this embodiment, the first heat sink 12 is provided with a first notch 19, which is used to avoid the screws between the circuit board 14 and the front shell 2.

[0031] In this embodiment, the front shell 2 is provided with three connecting holes, the first heat sink 12 is provided with a fourth connecting hole 18, and the third connecting hole 5 is connected to the fourth connecting hole 18 by screws.

[0032] In this embodiment, the rear cover 3 is provided with a fifth connecting hole 10, and the second heat sink 15 is provided with a sixth connecting hole 24. The fifth connecting hole 10 and the sixth connecting hole 24 are connected by screws.

[0033] In this embodiment, the front shell 2 is provided with a locking block 7, and the rear cover 3 is provided with a locking hole 9, and the locking block 7 and the locking hole 9 are engaged.

[0034] In one embodiment, the first shielding layer is a nickel-plated layer.

[0035] In this embodiment, the nickel plating layer is applied to the first heat sink 12, and this nickel plating layer can shield electromagnetic interference from the outside of the front shell 2. The nickel plating layer is easy to design and manufacture.

[0036] In one embodiment, the second shielding layer is a nickel-plated layer.

[0037] In this embodiment, the nickel plating layer is applied to the second heat sink 15, and this nickel plating layer can shield electromagnetic interference from the outside of the rear cover 3. This facilitates design and manufacturing.

[0038] In one embodiment, the first heat sink 12 is provided with a first protrusion 16 facing the chip 13, and the side of the first protrusion 16 facing the circuit board 14 is in contact with the first heat conductor.

[0039] In this embodiment, the first boss 16 protrudes from the side of the first heat sink 12 facing the circuit board 14. The first boss 16 can reduce the gap between the first heat sink 12 and the first surface of the circuit board 14, which facilitates the installation of the first heat conduction component.

[0040] In one embodiment, the first thermal conductive element is a first thermal conductive pad, which is bonded to the first boss 16.

[0041] In this embodiment, the first thermal pad is bonded to the side of the first protrusion 16 facing the circuit board 14. The first thermal pad has a planar structure, which can increase the contact area between the first thermal conductive element and the chip 13 and facilitate installation.

[0042] In one embodiment, the first thermal pad is a first phase change sheet 17.

[0043] In this embodiment, the first phase change plate 17 is bonded to the first protrusion 16. One side of the first phase change plate 17 contacts the chip 13, and the other side contacts the side of the first heat sink 12 facing the circuit board 14. When the chip 13 heats up, the first phase change plate 17 softens, filling the microscopic gaps between the contact surfaces of the first phase change plate 17 and the chip 13, and between the first phase change plate 17 and the first protrusion 16, expelling air and forming a heat conduction path with extremely low thermal resistance, allowing heat to be efficiently conducted to the first heat sink 12.

[0044] In one embodiment, the second heat sink 15 is provided with a second protrusion 22 facing the chip 13, and one side of the second protrusion 22 facing the circuit board 14 is in contact with the second heat conductor.

[0045] In this embodiment, the second protrusion 22 protrudes from the side of the second heat sink 15 facing the circuit board 14. The second protrusion 22 can reduce the gap between the second heat sink 15 and the second surface of the circuit board 14, which facilitates the installation of the second heat conduction component.

[0046] In one embodiment, the second heat-conducting element is a second phase change plate 23.

[0047] In this embodiment, the second phase change sheet 23 is bonded to the side of the second protrusion 22 facing the circuit board 14. The second phase change sheet 23 has a planar structure, which can increase the contact area between the second heat-conducting component and the chip 13 and facilitate installation.

[0048] In this embodiment, the second phase change plate 23 is bonded to the second protrusion 22. One side of the second phase change plate 23 contacts the chip 13, and the other side contacts the side of the second heat sink 15 facing the circuit board 14. When the chip 13 heats up, the second phase change plate 23 softens, filling the microscopic gaps between the contact surfaces of the second phase change plate 23 and the chip 13 and between the second phase change plate 23 and the second protrusion 22, expelling air and forming a heat conduction path with extremely low thermal resistance, allowing heat to be efficiently conducted to the second heat sink 15.

[0049] In one embodiment, the motherboard assembly further includes a grounding element that is electrically connected to the circuit board 14.

[0050] In this embodiment, the grounding component is a metal conductive component. The grounding component is soldered onto the circuit board 14 and contacts the printed circuit on the circuit board 14. The end of the grounding component away from the circuit board 14 is inserted into the positioning hole 6 provided on the rear cover 3.

[0051] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] According to the motherboard assembly provided in this embodiment of the present invention, the circuit board 14 is disposed between the first heat sink 12 and the second heat sink 15. The first heat conductor can transfer the heat generated by the chip 13 on the first surface of the circuit board 14 to the first heat sink 12, and the second heat conductor can transfer the heat generated by the chip 13 on the second surface of the circuit board 14 to the second heat sink 15. In addition, through the first shielding layer on the first heat sink 12 and the second shielding layer on the second heat sink 15, external electromagnetic interference can be shielded, simplifying the structure, reducing the overall size, and facilitating installation.

[0053] In addition, one embodiment of this utility model also provides the aforementioned motherboard component.

[0054] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A motherboard assembly, comprising: The device includes a circuit board (14), a first heat sink (12), a second heat sink (15), and a chip (13) unit. The chip (13) unit includes a chip (13), a first heat conductor, and a second heat conductor. The circuit board (14) has a first surface and a second surface opposite to each other along its thickness direction. The circuit board (14) is located between the first heat sink (12) and the second heat sink (15). The first surface faces the first heat sink (12), and the second surface faces the second heat sink (15). The first heat sink (12) has a first shielding layer on one side facing away from the circuit board (14), and the second heat sink (15) has a second shielding layer on one side facing away from the circuit board (14). The first heat-conducting component is disposed between the first heat sink (12) and the chip (13) disposed on the first surface to transfer the heat of the chip (13) to the first heat sink (12). The second heat-conducting component is disposed between the chips (13) on the second surface to transfer the heat of the chip (13) to the second heat sink (15).

2. The motherboard assembly of claim 1, wherein, The first shielding layer is a nickel-plated layer.

3. The motherboard assembly of claim 1, wherein, The second shielding layer is a nickel-plated layer.

4. The motherboard assembly of claim 1, wherein, The first heat sink (12) has a first protrusion (16) facing the chip (13), and the side of the first protrusion (16) facing the circuit board (14) is in contact with the first heat conductor.

5. The motherboard assembly of claim 4, wherein, The first thermal conductive component is a first thermal conductive pad, and the first thermal conductive pad is bonded to the first boss (16).

6. The motherboard assembly according to claim 5, characterized in that, The first thermal pad is the first phase change plate (17).

7. The motherboard assembly of claim 1, wherein, The second heat sink (15) is provided with a second protrusion (22) facing the chip (13), and one side of the second protrusion (22) facing the circuit board (14) is in contact with the second heat conductor.

8. The motherboard assembly of claim 7, wherein, The second heat-conducting element is the second phase change plate (23).

9. The motherboard assembly of claim 1, wherein, The motherboard assembly also includes a grounding component, which is electrically connected to the circuit board (14).

10. An FTTR device, characterized by, The device includes a housing (1) and a motherboard assembly as described in any one of claims 1 to 9. The housing (1) has a mounting cavity (4) inside, the motherboard assembly is located in the mounting cavity (4), the circuit board (14) is connected to the housing (1), and the first heat sink (12) and the second heat sink (15) are both connected to the housing (1).

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