An optocoupler

Abstract

This utility model relates to the field of optocoupler technology and discloses an optocoupler. The optocoupler includes: a package housing; a transmitting component and a receiving component, the transmitting component including a transmitting bracket and a transmitting chip fixedly mounted on the transmitting bracket, the receiving component including a receiving bracket and a receiving chip fixedly mounted on the receiving bracket, the transmitting chip and the receiving chip being arranged facing each other inside the package housing so that the light emitted by the transmitting chip is directed onto the receiving chip; and a light-guiding colloid channel connecting the transmitting chip and the receiving chip for guiding and transmitting the light emitted by the transmitting chip to the receiving chip. The optocoupler provided by this utility model has a simpler and easier-to-construct internal optical channel route, and the light signal is transmitted in a straight line without complex reflections, while reducing light escape, improving photoelectric conversion efficiency, and reducing the cost of the optocoupler.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler technology, and in particular to an optocoupler. Background Technology

[0002] An optocoupler is an electro-optical-electrical conversion device that uses light as a medium to transmit electrical signals. Typically, the light-emitting device and the receiving device are encapsulated in the same housing. When an electrical signal is applied to the input terminal, the light-emitting device emits light, and the receiving device receives the light and generates a photocurrent, which flows out from the output terminal, thus realizing the "electrical-optical-electrical" conversion. It is widely used in electrical appliances, digital circuits and other fields.

[0003] As products on the market become increasingly miniaturized, such as fast chargers, the miniaturization of products leads to a demand for miniaturized components. Therefore, in order to adapt to the demand for miniaturized products, the optocoupler market has introduced thin SOP packaging, such as LSOP4. However, the problem brought about by miniaturization is low photoelectric conversion efficiency. In order to improve photoelectric conversion efficiency, the transmitting device is generally upgraded to a chip with higher luminous efficiency, and the receiving device uses a chip with higher sensitivity and faster response speed, which leads to increased costs.

[0004] Therefore, the market demands for optocouplers are increasing. The traditional method of simply adjusting chip specifications to improve photoelectric conversion efficiency is costly and can no longer meet the growing market demand. Summary of the Invention

[0005] To address the aforementioned problems, the present invention aims to provide an optocoupler that can solve the issues of low photoelectric conversion efficiency and high cost of optocouplers.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: An optocoupler, comprising: Encapsulation housing; A transmitting assembly and a receiving assembly, the transmitting assembly including a transmitting bracket and a transmitting chip fixedly disposed on the transmitting bracket, the receiving assembly including a receiving bracket and a receiving chip fixedly disposed on the receiving bracket, the receiving bracket and the transmitting bracket being respectively fixedly disposed inside the package housing and at least partially extending out of the package housing to form pins, the transmitting chip and the receiving chip being disposed opposite each other inside the package housing so that the light emitted by the transmitting chip is directed onto the receiving chip; and A light-guiding colloidal channel is connected between the emitting wafer and the receiving wafer, and is used to guide and transmit the light emitted by the emitting wafer to the receiving wafer.

[0007] In one feasible embodiment, the emitter bracket includes a first die-bonding region, a first wire bonding region, and a first wire bonding. The emitter chip is fixedly disposed in the first die-bonding region and connected to the first wire bonding region through the first wire bonding. The first die-bonding region and the first wire bonding region extend independently out of the package housing to form pins. The receiving bracket includes a second die-bonding area, a second wire bonding area, and a second wire bonding. The receiving wafer is fixedly disposed in the second die-bonding area and connected to the second wire bonding area through the second wire bonding. The second die-bonding area and the second wire bonding area extend independently out of the package housing to form pins.

[0008] In one feasible embodiment, the first bonding wire region and the second bonding wire region, and the first die bonding region and the second die bonding region are respectively located diagonally.

[0009] In one feasible embodiment, the light-guiding colloid channel covers the first die-bonding region, the second die-bonding region, the first bonding wire, and the second bonding wire.

[0010] In one feasible embodiment, the transmitting component and the receiving component are disposed opposite each other along the long side of the encapsulation housing, and the minimum insulation distance between the transmitting component and the receiving component is 0.4mm-1.9mm.

[0011] In one feasible embodiment, the welding structure between the first bonding wire and the transmitting wafer and the first bonding wire region is either forward or reverse bonding; and / or, the welding structure between the second bonding wire and the receiving wafer and the second bonding wire region is either forward or reverse bonding.

[0012] In one feasible embodiment, the emitter bracket further includes a first reflective cup surrounding the outer side of the emitter wafer.

[0013] In one possible embodiment, the receiving bracket further includes a second reflective cup surrounding the outside of the receiving wafer.

[0014] In one feasible embodiment, a light-concentrating structure is provided on the first reflective cup.

[0015] In one feasible embodiment, the portions of the receiving bracket and the transmitting bracket extending outside the encapsulation housing are located on the same side or different sides of the encapsulation housing.

[0016] By adopting the above technical solution, this utility model has at least the following beneficial effects: The optocoupler provided by this utility model forms a through-beam design by arranging the emitting and receiving crystals facing each other, which makes the internal optical channel route simpler and easier to construct. Furthermore, the optical channel route is constructed using a light-guiding colloid, which allows the light signal to be transmitted in a straight line without going through complex reflections, thereby reducing light escape, improving photoelectric conversion efficiency, and increasing response speed. Compared with increasing the crystal size, this method reduces the cost of the optocoupler. Attached Figure Description

[0017] Figure 1 This is a top view schematic diagram of the optocoupler provided in this embodiment of the utility model; Figure 2 This is a schematic diagram of the main structure of the optocoupler provided in this embodiment of the utility model.

[0018] In the attached diagram, 1 is the packaging shell; 2 is the emitting assembly; 21 is the emitting bracket; 211 is the first die-bonding area; 212 is the first wire bonding area; 213 is the first wire bonding; 214 is the first reflector cup; 215 is the light-concentrating structure; 22 is the emitting chip; 3 is the receiving assembly; 31 is the receiving bracket; 311 is the second die-bonding area; 312 is the second wire bonding area; 313 is the second wire bonding; 32 is the receiving chip; and 4 is the light-guiding colloid channel. Detailed Implementation

[0019] The technical solution of this utility model patent will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0020] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] See Figures 1-2 , Figure 1 This is a top view schematic diagram of the optocoupler provided in this embodiment. Figure 2 This is a front view schematic diagram of the optocoupler provided in this embodiment. An optocoupler includes: Encapsulation housing 1; The package includes a transmitting component 2 and a receiving component 3. The transmitting component 2 includes a transmitting bracket 21 and a transmitting chip 22 fixedly disposed on the transmitting bracket 21. The receiving component 3 includes a receiving bracket 31 and a receiving chip 32 fixedly disposed on the receiving bracket 31. The receiving bracket 31 and the transmitting bracket 21 are respectively fixedly disposed inside the package housing 1 and at least partially extend out of the package housing 1 to form pins. The transmitting chip 22 and the receiving chip 32 are disposed facing each other inside the package housing 1 so that the light emitted by the transmitting chip 22 is directed onto the receiving chip 32. A light-guiding colloid channel 4 is connected between the emitting wafer 22 and the receiving wafer 32, and is used to guide and transmit the light emitted by the emitting wafer 22 to the receiving wafer 32.

[0023] It is understandable that, such as Figure 1As shown in the diagram, the direct alignment of the transmitting chip 22 and the receiving chip 32 in this embodiment primarily refers to the alignment of their axes during installation. This ensures that the light emitted by the transmitting chip 22 directly enters the receiving chip 32 without undergoing reflection or refraction. In this embodiment, the transmitting chip 22 and the receiving chip 32 are positioned horizontally on their respective transmitting and receiving supports 21 and 31. In this case, with the transmitting and receiving supports 21 and 31 fixed, the distance between the transmitting chip 22 and the receiving chip 32 is minimized. In other embodiments, the transmitting chip 22 and the receiving chip 32 can be offset vertically by a certain position, effectively making the distance between them minimized. The receiving chip 32 is tilted on the corresponding bracket or the mounting surface of the corresponding bracket is tilted, but the transmitting chip 22 and the receiving chip 32 must be kept in direct or opposite contact with each other, thereby adjusting the distance between the transmitting chip 22 and the receiving chip 32. In addition, under certain special requirements, such as the limitation of the optocoupler length, it is necessary to meet the distance control of the transmitting chip 22 and the receiving chip 32 for easy installation. The transmitting chip 22 and the receiving chip 32 can be staggered vertically, but it is necessary to ensure that the transmitting chip 22 and the receiving chip 32 are facing each other, that is, when the transmitting chip 22 and the receiving chip 32 are installed, their axes coincide. More details will not be described further here.

[0024] It is understood that the light-guiding colloidal channel 4 can be a transparent colloid constructed using colloids such as silicone, silicone resin, epoxy resin, and epoxy adhesive. Its main purpose is to form an optical structure capable of adjusting the intensity of signal transmission. Different materials can be used depending on the specific requirements. If necessary, materials such as silica can be doped to enhance signal intensity control. Further details on material selection are not elaborated here; those skilled in the art can choose the appropriate materials based on actual conditions. The light-guiding colloidal channel 4 can be columnar or block-shaped; specific details can be adjusted by those skilled in the art according to actual needs.

[0025] In this embodiment, as Figure 1 As shown, the emitter bracket 21 includes a first die-bonding area 211, a first wire bonding area 212, and a first wire bonding 213. The emitter chip 22 is fixedly disposed in the first die-bonding area 211 and connected to the first wire bonding area 212 through the first wire bonding 213. The first die-bonding area 211 and the first wire bonding area 212 extend independently out of the package housing 1 to form pins. The receiving support 31 includes a second die-bonding region 311, a second wire bonding region 312, and a second wire bonding 313. The receiving wafer 32 is fixedly disposed in the second die-bonding region 311 and connected to the second wire bonding region 312 via the second wire bonding 313. The second die-bonding region 311 and the second wire bonding region 312 extend independently out of the package housing 1 to form pins. It is understood that, as Figure 1 As shown, the first die-bonding region 211 and the second die-bonding region 311 can be enlarged in area according to actual needs in order to facilitate the mounting and fixing of the corresponding wafer.

[0026] In this embodiment, as Figure 1 As shown, the first bonding area 212 and the second bonding area 312, and the first die bonding area 211 and the second die bonding area 311 are respectively located at diagonal positions.

[0027] It is understandable that, for the purpose of product miniaturization, the first bonding area 212 and the second bonding area 312, as well as the first die-bonding area 211 and the second die-bonding area 311, are respectively positioned diagonally. This allows the first bonding wire 213 and the second bonding wire 313 to be staggered during wire bonding, thereby significantly reducing the space required for bonding, i.e., reducing the distance between the transmitting chip 22 and the receiving chip 32, thus meeting miniaturization requirements. Of course, in other embodiments, the positions of the first bonding area 212, the first die-bonding area 211, the second bonding area 312, and the second die-bonding area 311 can be adjusted according to actual needs, such as by staggering them front and back. Further specific embodiments will not be described in detail here.

[0028] In this embodiment, the light-guiding colloid channel 4 covers the first die-bonding region 211, the second die-bonding region 311, the first bonding wire 213, and the second bonding wire 313.

[0029] It is understandable that the light-guiding colloidal channel 4 can, on the one hand, enhance and transmit the optical signal through the colloidal material, and on the other hand, it can also fix and protect the emitting chip 22, the receiving chip 32, the first bonding wire 213, and the second bonding wire 313, thereby enhancing the reliability of the overall structure. The light-guiding colloidal channel 4 can be formed by casting or molding. Those skilled in the art can make simple adjustments based on the above description and actual needs, and will not be described further here.

[0030] In this embodiment, as Figure 1 As shown, the transmitting component 2 and the receiving component 3 are arranged opposite each other along the long side of the encapsulation housing 1, and the minimum insulation distance w between the transmitting component 2 and the receiving component 3 is 0.4mm-1.9mm.

[0031] It is understandable that the minimum insulation distance between the transmitting component 2 and the receiving component 3 refers to the distance between the two closest points between the transmitting component 2 and the receiving component 3, including the first bonding wire 213 and the second bonding wire 313, for example... Figure 1 As shown, the minimum insulation distance refers to the closest position between the first bonding wire 213 and the second bonding wire 313. The minimum insulation distance requires consideration of the balance between insulation and miniaturization. In this embodiment, by setting the emitting chip 22 and the receiving chip 32 face to face to form a through-beam design, the internal optical channel route is simpler and easier to construct. Furthermore, the optical channel route is constructed using light guide colloid, which provides a large operating space for the minimum insulation distance between the emitting component 2 and the receiving component 3. It can be reduced to the minimum insulation requirement distance, while also having enough space to be enlarged, making it more flexible. In this embodiment, the minimum insulation distance can be between 0.4mm and 1.9mm.

[0032] Furthermore, optocouplers are generally elongated, commonly cuboid or cuboid-like structures. In this embodiment, the transmitting component 2 and receiving component 3 are arranged opposite each other along the long side of the encapsulation housing 1, meaning they are positioned along the length of the housing 1. This ensures sufficient space between the transmitting component 2 and receiving component 3 to meet the insulation distance requirements. Of course, if the long side is not significant, it can be placed on the longer side (not the shortest side) according to actual needs. Alternatively, if all sides are of equal length, one side can be chosen based on the actual situation. The key is to preferably arrange the transmitting component 2 and receiving component 3 in a direction that allows for sufficient spacing.

[0033] In this embodiment, the welding structure between the first bonding wire 213 and the transmitting wafer 22 and the first bonding wire area 212 is either forward or reverse bonding; and / or, the welding structure between the second bonding wire 313 and the receiving wafer 32 and the second bonding wire area 312 is either forward or reverse bonding.

[0034] Understandably, the minimum insulation distance of an optocoupler is generally reflected in the shortest distance between the first bonding wire 213 and the second bonding wire 313. Therefore, sufficient space needs to be left between the transmitting bracket 21 and the receiving bracket 31 during the design process to allow for free adjustment of the connecting wires. Due to the short distance of the brackets in existing products, such as the new design of the existing 10XX series LSOP4 package with a chip thickness of about 200um, the distance between two chips facing each other is less than 0.4mm. In order to achieve a minimum insulation distance of not less than 0.4mm, the chips are placed staggered, and the connecting wires can only be soldered in reverse. However, the optocoupler provided in this embodiment sets the transmitting component 2 and the receiving component 3 opposite each other along the long side of the package housing 1, so that the minimum insulation distance can be selected and set between 0.4mm and 1.9mm. Therefore, the internal connection line process can be flexibly designed and the minimum insulation distance can be controlled, improving the flexibility of product manufacturing design.

[0035] In this embodiment, the emitting bracket 21 further includes a first reflective cup 214, which surrounds the outer side of the emitting wafer 22.

[0036] In this embodiment, the receiving bracket 31 further includes a second reflective cup, which surrounds the outer side of the receiving wafer 32. It is understood that the second reflective cup can be understood and configured with reference to the first reflective cup 214, and will not be elaborated further here.

[0037] Understandably, reflectors are typically flared and primarily used to reflect light for adjustment. The first reflector 214 reflects and adjusts the light signal converted and emitted by the emitting chip 22, reducing fiber optic attenuation and divergence, thus improving photoelectric conversion efficiency and intensity. Similarly, the second reflector gathers the light signal emitted by the emitting chip 22, enhancing the receiving chip's signal reception capability and improving photoelectric conversion efficiency.

[0038] In this embodiment, a light-concentrating structure 215 is provided on the first reflector cup 214. It can be understood that the light-concentrating structure 215 is a concave lens structure, which can be formed by casting or molding with silicone, fluorescent glue, etc., so as to further adjust the light signal reflected by the first reflector cup 214, so as to concentrate and adjust the light signal to be directed toward the receiving chip 32, thereby further improving the photoelectric conversion efficiency.

[0039] In this embodiment, the portions of the receiving bracket 31 and the transmitting bracket 21 that extend outside the encapsulation housing 1 are located on the same side or different sides of the encapsulation housing 1.

[0040] It is understandable that, such as Figure 1As shown, the receiving bracket 31 and the transmitting bracket 21 extend to both sides of the encapsulation housing 1. However, in other embodiments, they can be located on the same side. Specifically, one of the transmitting bracket 21 or the receiving bracket 31 can be designed with a corner bend so that its exposed part is on the same side as the exposed part of the other. The specific adjustment details will not be further described here. Those skilled in the art can simply understand and implement it based on the above description.

[0041] When the optocoupler provided in this embodiment is working, the light signal emitted by the emitting chip 22 is received by the receiving chip 32. The receiving chip 32 converts the received light signal into an electrical signal. The emitted light signal is reflected and collected by the first reflector cup 214 and then guided by the light guide colloid channel 4 to the second reflector cup at one end of the receiving chip 32. After being reflected by the second reflector cup, it is concentrated and received by the receiving chip 32.

[0042] By adopting the above technical solution, this utility model has at least the following beneficial effects: The optocoupler provided by this utility model forms a through-beam design by arranging the emitting chip 22 and the receiving chip 32 facing each other, which makes the internal optical channel route simpler and easier to construct. Furthermore, the optical channel route is constructed using a light-guiding colloid, which allows the light signal to be transmitted in a straight line without going through complex reflections, thereby reducing light escape, improving photoelectric conversion efficiency, and increasing response speed. Compared with increasing the crystal size, this reduces the cost of the optocoupler.

[0043] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. An opto-coupler, characterized by, include: Encapsulation housing; A transmitting assembly and a receiving assembly, the transmitting assembly including a transmitting bracket and a transmitting chip fixedly disposed on the transmitting bracket, the receiving assembly including a receiving bracket and a receiving chip fixedly disposed on the receiving bracket, the receiving bracket and the transmitting bracket being respectively fixedly disposed inside the package housing and at least partially extending out of the package housing to form pins, the transmitting chip and the receiving chip being disposed opposite each other inside the package housing so that the light emitted by the transmitting chip is directed onto the receiving chip; and A light-guiding colloidal channel is connected between the emitting wafer and the receiving wafer, and is used to guide and transmit the light emitted by the emitting wafer to the receiving wafer.

2. The opto-coupler of claim 1, wherein, The emitter bracket includes a first die-bonding area, a first wire bonding area, and a first wire bonding. The emitter chip is fixedly disposed in the first die-bonding area and connected to the first wire bonding area through the first wire bonding. The first die-bonding area and the first wire bonding area extend independently out of the package housing to form pins. The receiving bracket includes a second die-bonding area, a second wire bonding area, and a second wire bonding. The receiving wafer is fixedly disposed in the second die-bonding area and connected to the second wire bonding area through the second wire bonding. The second die-bonding area and the second wire bonding area extend independently out of the package housing to form pins.

3. The optocoupler according to claim 2, characterized in that, The first bonding wire area and the second bonding wire area, as well as the first die bonding area and the second die bonding area, are respectively located at diagonal positions.

4. The optocoupler according to claim 2, characterized in that, The light-guiding colloid channel covers the first die-bonding region, the second die-bonding region, the first bonding wire, and the second bonding wire.

5. The optocoupler according to claim 1, characterized in that, The transmitting component and the receiving component are arranged opposite each other along the long side of the encapsulation housing, and the minimum insulation distance between the transmitting component and the receiving component is 0.4mm-1.9mm.

6. The optocoupler according to claim 2, characterized in that, The welding structure between the first bonding wire and the transmitting wafer and the first bonding wire area is either forward or reverse bonding; and / or, the welding structure between the second bonding wire and the receiving wafer and the second bonding wire area is either forward or reverse bonding.

7. The optocoupler according to claim 1, characterized in that, The transmitter holder also includes a first reflective cup surrounding the outer side of the transmitter wafer.

8. The optocoupler according to claim 7, characterized in that, The receiving bracket also includes a second reflective cup, which surrounds the outside of the receiving wafer.

9. The optocoupler according to claim 7, characterized in that, The first reflector cup is provided with a light-concentrating structure.

10. The optocoupler according to claim 1, characterized in that, The portions of the receiving bracket and the transmitting bracket that extend outside the encapsulation housing are located on the same side or different sides of the encapsulation housing.

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