A miniature infrared detector package

Abstract

This utility model discloses a miniature infrared detector packaging device, relating to the field of miniature infrared detector packaging technology. It includes a packaging base component and a packaging cover component. The top of the packaging base component is joined with the packaging cover component, and an infrared window component is installed in the middle of the top of the packaging cover component. The connection between the packaging base component and the packaging cover component is filled with a first sealing material. This miniature infrared detector packaging device, through the structural design of the packaging base component and the packaging cover component, effectively improves the efficiency and accuracy of assembly, avoiding problems such as poor sealing caused by inaccurate alignment. Through the combined use of the lower sealing ring, the upper sealing ring, and the first and second sealing materials, multiple seals are achieved between the packaging base component and the packaging cover component, and between the packaging cover component and the infrared window component. The zinc sulfide protective film on the outer surface of the window lens has good anti-reflection and wear resistance properties.

Description

Technical Field

[0001] This utility model relates to the field of miniature infrared detector packaging technology, specifically a miniature infrared detector packaging device. Background Technology

[0002] Miniature infrared detectors are security devices that detect intrusions by capturing infrared radiation emitted by the human body or objects. They are widely used in homes, commercial spaces, and other settings.

[0003] Conventional miniature infrared detector packaging devices often suffer from unstable detector performance, susceptibility to external environmental interference, and limited protection due to improper structural design and sealing during the packaging process. Utility Model Content

[0004] The purpose of this invention is to provide a miniature infrared detector packaging device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a miniature infrared detector packaging device, comprising a packaging base component and a packaging cover component. The top of the packaging base component is joined with the packaging cover component, and an infrared window component is installed in the middle of the top of the packaging cover component. The connection between the packaging base component and the packaging cover component is filled with a first sealant, and the connection between the packaging cover component and the infrared window component is filled with a second sealant. The packaging base component includes a base, a docking hole, a packaging base body, a lower sealing ring, and a limiting groove. The four opposite corners of the top surface of the base are vertically provided with docking holes, and the packaging base body is provided in the middle of the top surface of the base. Two sets of lower sealing rings are sleeved on the outer surface of the packaging base body, and a limiting groove is provided on the edge of the top inner diameter surface of the packaging base body.

[0006] Furthermore, the base and the main body of the encapsulation seat are integrated into one structure, and both the base and the main body of the encapsulation seat are made of silicon carbide reinforced aluminum matrix composite material.

[0007] Furthermore, the docking holes are arranged in a circular array with the base as the center and there are four groups of them. The lower sealing ring is fastened to the outer surface of the main body of the encapsulation base using a nested structure.

[0008] Furthermore, the encapsulation cover component includes a stabilizing seat, a docking post, a protective ring seat, a first sealing groove, and a second sealing groove. The bottom of the stabilizing seat is vertically provided with a docking post, and the top of the stabilizing seat is provided with a protective ring seat. The inner wall surface of the stabilizing seat is provided with a first sealing groove, and the inner wall surface of the protective ring seat is provided with a second sealing groove.

[0009] Furthermore, the four diagonal corners of the connection between the stabilizing seat and the base are provided with holes for bolt installation, and the connecting piles are arranged in a circular array with the stabilizing seat as the center and distributed in four groups. Moreover, the inner surface structure of the connecting hole matches the outer surface structure of the connecting pile, and the inner surface structure of the first sealing groove matches the outer surface structure of the encapsulation seat body with the lower sealing ring on its surface. The stabilizing seat, connecting pile, and protective ring seat are all integrated into one structure, and the stabilizing seat, connecting pile, and protective ring seat are all made of nano-zirconia ceramic material.

[0010] Furthermore, the infrared window component includes a window lens, a buffer ring frame, an upper sealing ring, a limiting buckle, and a protective film. The bottom surface of the window lens is fixedly connected to the buffer ring frame, and the outer wall surface of the buffer ring frame is fitted with an upper sealing ring. Moreover, the bottom of the buffer ring frame is provided with a limiting buckle, and the outer surface of the window lens is provided with a protective film.

[0011] Furthermore, the inner surface structure of the second sealing groove matches the outer surface structure of the buffer ring frame with the upper sealing ring on its surface, and the limiting buckles are integrally arranged in a ring array structure with the buffer ring frame as the center and distributed in six groups. The protective film is made of zinc sulfide material.

[0012] Furthermore, the first sealant is made of nano-silver conductive material, and the second sealant is made of low-temperature glass solder material.

[0013] This invention provides a miniature infrared detector packaging device, which has the following advantages:

[0014] 1. This utility model, through the structural design of the encapsulation base component and the encapsulation cover component, utilizes the structural insertion between the docking post and the docking hole to achieve rapid and precise positioning and docking between the encapsulation base component and the encapsulation cover component, effectively improving assembly efficiency and accuracy, and avoiding problems such as poor sealing caused by inaccurate docking. At the same time, this structural design also enhances the overall stability of the encapsulation device, better maintaining the integrity of the structure when subjected to external impact or vibration, ensuring the normal operation of the infrared detector. In addition, both the base and the encapsulation base body are made of silicon carbide reinforced aluminum matrix composite material. This material has high strength, high hardness and good thermal stability, which can effectively resist the erosion and damage of the external environment and extend the service life of the encapsulation device. Moreover, the stabilizing seat, docking post and protective ring seat are all made of nano-zirconia ceramic material. Nano-zirconia ceramic material has excellent wear resistance, corrosion resistance and high temperature stability, further improving the performance of the encapsulation cover component, enabling it to maintain a stable structure and working state even in complex environments.

[0015] 2. This utility model achieves multiple seals between the encapsulation base component and the encapsulation cover component, as well as between the encapsulation cover component and the infrared window component, through the combined use of the lower sealing ring, the upper sealing ring, the first sealing material, and the second sealing material. The lower sealing ring and the upper sealing ring are nested on the encapsulation base body and the buffer ring frame, respectively, forming a tight fit with the corresponding sealing groove, effectively preventing external moisture, dust, and other impurities from entering the encapsulation interior, ensuring the sensitivity and stability of the infrared detector. At the same time, the first sealing material uses nano-silver conductive material, which not only has good sealing performance but also plays a certain role in conductivity, reducing electromagnetic interference. The second sealing material uses low-temperature glass solder, which can achieve a firm weld at a low temperature, ensuring the reliability and durability of the seal. This multi-seal design enables the miniature infrared detector encapsulation device to operate stably for a long time in harsh environments, greatly improving its applicability and reliability.

[0016] 3. This utility model utilizes the structure of a buffer ring frame and a limiting buckle at the bottom of the window lens. The buffer ring frame not only provides stable support for the window lens and effectively disperses the impact of external forces on the window lens, but also, through the structural cooperation between the limiting buckle and the inner wall surface of the encapsulation cover component, further ensures the stable installation of the infrared window component in the encapsulation device, preventing performance degradation or damage caused by vibration or displacement. At the same time, the zinc sulfide protective film on the outer surface of the window lens has good anti-reflection and wear resistance, effectively protecting the window lens from scratches and contamination, maintaining the clear field of view and efficient operation of the infrared detector. This comprehensive protection design significantly improves the overall performance and durability of the miniature infrared detector encapsulation device. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main body of a miniature infrared detector packaging device according to the present invention;

[0018] Figure 2 This is a schematic diagram of the disassembled structure of the main body of a miniature infrared detector packaging device according to the present invention;

[0019] Figure 3 This is a cross-sectional view of the main body of a miniature infrared detector packaging device according to the present invention;

[0020] Figure 4 This is a three-dimensional structural diagram of the packaging base component of a miniature infrared detector packaging device according to this utility model;

[0021] Figure 5 This is a three-dimensional structural diagram of the packaging cover component of a miniature infrared detector packaging device according to the present invention;

[0022] Figure 6This is a three-dimensional structural diagram of the infrared window component of a miniature infrared detector packaging device according to the present invention.

[0023] In the figure: 1. Encapsulation base component; 101. Base; 102. Connecting hole; 103. Encapsulation base body; 104. Lower sealing ring; 105. Limiting groove; 2. Encapsulation cover component; 201. Stabilizing seat; 202. Connecting post; 203. Protective ring seat; 204. First sealing groove; 205. Second sealing groove; 3. Infrared window component; 301. Window lens; 302. Buffer ring frame; 303. Upper sealing ring; 304. Limiting buckle; 305. Protective film; 4. First sealing material; 5. Second sealing material. Detailed Implementation

[0024] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0025] like Figures 1 to 6 As shown, a miniature infrared detector packaging device includes a packaging base component 1 and a packaging cover component 2. The top of the packaging base component 1 is joined to the packaging cover component 2, and an infrared window component 3 is installed in the middle of the top of the packaging cover component 2. The joint between the packaging base component 1 and the packaging cover component 2 is filled with a first sealant 4, and the joint between the packaging cover component 2 and the infrared window component 3 is filled with a second sealant 5. The packaging base component 1 includes a base 101, a docking hole 102, a packaging base body 103, a lower sealing ring 104, and a limiting groove 105. The four opposite corners of the top surface of the base 101 are vertically provided with docking holes 102, and the packaging base body 103 is located in the middle of the top surface of the base 101. Two sets of lower sealing rings 104 are fitted onto the outer surface of the main body 103, and a limiting groove 105 is opened on the edge of the top inner diameter surface of the main body 103. The base 101 and the main body 103 are integrated into one structure, and both the base 101 and the main body 103 are made of silicon carbide reinforced aluminum matrix composite material. The docking holes 102 are arranged in a ring array with the base 101 as the center and are distributed in four sets. The lower sealing rings 104 are fastened to the outer surface of the main body 103 using a nested structure. The structure between the docking post 202 and the docking hole 102 enables the main body component 1 and the main body component 2 to achieve fast and accurate positioning and docking, which effectively improves the efficiency and accuracy of assembly.

[0026] like Figures 1 to 6As shown, the encapsulation cover component 2 includes a stabilizing base 201, a docking post 202, a protective ring seat 203, a first sealing groove 204, and a second sealing groove 205. The docking post 202 is vertically arranged at the bottom of the stabilizing base 201, and the protective ring seat 203 is arranged at the top of the stabilizing base 201. The first sealing groove 204 is formed on the inner wall surface of the stabilizing base 201, and the second sealing groove 205 is formed on the inner wall surface of the protective ring seat 203. Holes for bolt installation are formed at the four opposite corners of the joint between the stabilizing base 201 and the base 101. The docking posts 202 are arranged in a circular array around the stabilizing base 201, with four groups distributed in this array. The inner surface structure of the docking holes 102 is consistent with the... The outer surface structure of the connecting pile 202 is matched with each other, and the inner surface structure of the first sealing groove 204 is matched with the outer surface structure of the encapsulation seat body 103 on which the lower sealing ring 104 is provided. The stabilizing seat 201, the connecting pile 202, and the protective ring seat 203 are all integrated structures. The stabilizing seat 201, the connecting pile 202, and the protective ring seat 203 are all made of nano-zirconia ceramic material. The first sealing material 4 is made of nano-silver conductive material, and the second sealing material 5 is made of low-temperature glass solder material. The lower sealing ring 104 and the upper sealing ring 303 are respectively nested on the encapsulation seat body 103 and the buffer ring frame 302, forming a tight fit with the corresponding sealing groove.

[0027] like Figures 1 to 6 As shown, the infrared window component 3 includes a window lens 301, a buffer ring frame 302, an upper sealing ring 303, a limiting buckle 304, and a protective film 305. The buffer ring frame 302 is fixedly connected to the bottom surface of the window lens 301, and the upper sealing ring 303 is sleeved on the outer wall surface of the buffer ring frame 302. A limiting buckle 304 is provided at the bottom of the buffer ring frame 302. A protective film 305 is provided on the outer surface of the window lens 301. The inner surface structure of the second sealing groove 205 is consistent with the surface... The outer surface structure of the buffer ring frame 302 with the upper sealing ring 303 is matched with each other, and the limiting buckle 304 is integrally set in a ring array structure with the buffer ring frame 302 as the center and distributed in six groups. The protective film 305 is made of zinc sulfide material. Utilizing the structure of the buffer ring frame 302 and the limiting buckle 304 at the bottom of the window lens 301, the buffer ring frame 302 not only provides stable support for the window lens 301, but also effectively disperses the impact of external impact on the window lens 301.

[0028] In summary, as Figures 1 to 6As shown, when using this miniature infrared detector packaging device, the miniature infrared detector is first installed inside the packaging base body 103. Then, the packaging base component 1 is placed stably on the workbench, ensuring that the bottom of the base 101 is in full contact with the workbench surface to maintain the stability of the device. Next, the packaging cover component 2 is lifted up so that the docking pins 202 at the bottom of the stable base 201 correspond one-to-one with the docking holes 102 at the top of the base 101. The docking pins 202 are slowly and accurately inserted into the docking holes 102. During this process, due to the structural matching of the docking pins 202 and the docking holes 102, fast and accurate positioning and docking can be achieved, which greatly improves the efficiency and accuracy of assembly and avoids problems such as poor sealing caused by inaccurate docking.

[0029] After the docking pin 202 is fully inserted into the docking hole 102, check whether the lower sealing ring 104 on the outside of the encapsulation base body 103 is tightly fitted with the first sealing groove 204 on the inner wall of the stabilizing base 201. If there is a gap, the position of the encapsulation cover component 2 needs to be adjusted appropriately to ensure good sealing. Then, use bolts to firmly fix the encapsulation base component 1 and the encapsulation cover component 2 together through the holes at the four opposite corners of the docking point between the stabilizing base 201 and the base 101. This further enhances the overall stability of the device and can better maintain the integrity of the structure when subjected to external impact or vibration, ensuring the normal operation of the infrared detector.

[0030] Next, install the infrared window component 3. Pick up the infrared window component 3 and align the upper sealing ring 303 on the outer wall of the buffer ring frame 302 with the second sealing groove 205 on the inner wall of the protective ring seat 203. Slowly press down to embed the upper sealing ring 303 into the second sealing groove 205. At the same time, the limiting buckle 304 at the bottom of the buffer ring frame 302 will cooperate with the corresponding structure on the inner wall surface of the encapsulation cover component 2 to further ensure the stable installation of the infrared window component 3 in the encapsulation device and prevent performance degradation or damage caused by vibration or displacement. After installation, check whether the zinc sulfide protective film 305 on the outer surface of the window lens 301 is intact. If scratches or contamination are found, it needs to be cleaned or replaced in time to ensure its good anti-reflection and wear resistance performance, effectively protect the window lens 301, and maintain the clear field of view and efficient operation of the infrared detector.

[0031] During the assembly of the encapsulation base component 1 and the encapsulation cover component 2, the joint between the encapsulation base component 1 and the encapsulation cover component 2 is filled with a first sealant 4. The first sealant 4 is made of nano-silver conductive material, which not only has good sealing performance, but also plays a certain role in conductivity and reduces electromagnetic interference. The joint between the encapsulation cover component 2 and the infrared window component 3 is filled with a second sealant 5. The second sealant 5 is made of low-temperature glass solder, which can achieve a firm weld at a low temperature, ensuring the reliability and durability of the seal. At this point, the miniature infrared detector encapsulation device is installed and can be put into use.

[0032] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A miniature infrared detector packaging device, comprising a packaging base component (1) and a packaging cover component (2), characterized in that: The top of the encapsulation base component (1) is joined with an encapsulation cover component (2), and an infrared window component (3) is installed in the middle of the top of the encapsulation cover component (2). The connection between the encapsulation base component (1) and the encapsulation cover component (2) is filled with a first sealant (4), and the connection between the encapsulation cover component (2) and the infrared window component (3) is filled with a second sealant (5). The encapsulation base component (1) includes a base (101), a docking hole (102), an encapsulation base body (103), a lower sealing ring (104), and a limiting groove (105). The four opposite corners of the top surface of the base (101) are vertically provided with docking holes (102), and the encapsulation base body (103) is provided in the middle of the top surface of the base (101). The outer surface of the encapsulation base body (103) is fitted with two sets of lower sealing rings (104), and the inner diameter surface edge of the top of the encapsulation base body (103) is provided with a limiting groove (105).

2. The miniature infrared detector packaging device according to claim 1, characterized in that, The base (101) and the encapsulation base body (103) are integrated into one structure, and both the base (101) and the encapsulation base body (103) are made of silicon carbide reinforced aluminum matrix composite material.

3. The miniature infrared detector packaging device according to claim 1, characterized in that, The docking holes (102) are arranged in a ring array structure with the base (101) as the center and there are four groups. The lower sealing ring (104) is fastened to the outer surface of the encapsulation base body (103) in a nested structure.

4. The miniature infrared detector packaging device according to claim 1, characterized in that, The encapsulation cover component (2) includes a stabilizing seat (201), a docking post (202), a protective ring seat (203), a first sealing groove (204), and a second sealing groove (205). The bottom of the stabilizing seat (201) is vertically provided with the docking post (202), and the top of the stabilizing seat (201) is provided with the protective ring seat (203). The inner wall surface of the stabilizing seat (201) is provided with the first sealing groove (204), and the inner wall surface of the protective ring seat (203) is provided with the second sealing groove (205).

5. A miniature infrared detector packaging device according to claim 4, characterized in that, The four diagonal corners of the connection between the stabilizing seat (201) and the base (101) are provided with holes for bolt installation. The connecting piles (202) are arranged in a ring array with the stabilizing seat (201) as the center and are distributed in four groups. The inner surface structure of the connecting hole (102) matches the outer surface structure of the connecting pile (202). The inner surface structure of the first sealing groove (204) matches the outer surface structure of the encapsulation seat body (103) with the lower sealing ring (104) on its surface. The stabilizing seat (201), the connecting pile (202), and the protective ring seat (203) are all integrated. The stabilizing seat (201), the connecting pile (202), and the protective ring seat (203) are all made of nano-zirconia ceramic material.

6. The miniature infrared detector packaging device according to claim 4, characterized in that, The infrared window component (3) includes a window lens (301), a buffer ring frame (302), an upper sealing ring (303), a limiting buckle (304), and a protective film (305). The bottom surface of the window lens (301) is fixedly connected to the buffer ring frame (302), and the outer wall surface of the buffer ring frame (302) is fitted with the upper sealing ring (303). The bottom of the buffer ring frame (302) is provided with a limiting buckle (304), and the outer surface of the window lens (301) is provided with a protective film (305).

7. A miniature infrared detector packaging device according to claim 6, characterized in that, The inner surface structure of the second sealing groove (205) matches the outer surface structure of the buffer ring frame (302) on which the upper sealing ring (303) is provided. The limiting buckle (304) is integrally set in a ring array structure with the buffer ring frame (302) as the center and is distributed in six groups. The protective film (305) is made of zinc sulfide material.

8. The miniature infrared detector packaging device according to claim 1, characterized in that, The first sealant (4) is made of nano-silver conductive material and the second sealant (5) is made of low-temperature glass solder material.

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