LED stretch height color support

Abstract

This utility model discloses an LED RGB bracket with adjustable height, comprising a substrate and six pins connected to the substrate. Each pin has a cup-shaped section with a height ranging from 1.00mm to 1.10mm. A heat dissipation groove is provided on the outer side of the cup-shaped section, and the thickness of the bottom of the cup-shaped section ranges from 0.50mm to 0.55mm. By optimizing the design of the LED RGB bracket and introducing a heat dissipation groove on the outer side with an opening area larger than the bottom area, heat dissipation and optical performance are significantly improved. The increased cup height and heat dissipation groove increase the sidewall surface area, enhancing heat conduction, convection, and radiation efficiency, reducing the chip junction temperature by approximately 10°C to 15°C, and increasing luminous efficacy by 5% to 10%, thereby meeting the requirement for stable high brightness.

Description

Technical Field

[0001] This utility model belongs to the technical field of LED brackets, specifically an LED holographic bracket with adjustable height. Background Technology

[0002] An LED bracket is a structural component used to fix and support LED chips, and is usually a core component in LED packaging. It mainly consists of a housing, a chip bonding base, and related electrical connection structures, designed to provide mechanical support, thermal management, optical optimization, and electrical connection functions to ensure the normal operation and efficient light output of the LED chips.

[0003] Existing LED brackets, such as the "LED bracket" disclosed in patent document "CN112768592A", have technical solutions provided by appendices. Figure 1 and 2 It can be seen that the cup is relatively low, which makes it difficult for heat to be dissipated by transferring it to the cup. Moreover, the heat is high, and the inner wall area of ​​the cup is limited, which easily causes light to diffuse and the brightness to be dim, making it difficult to meet the chip's requirement for stable and continuous high brightness. Utility Model Content

[0004] The purpose of this invention is to provide an LED color-changing bracket with adjustable height to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An LED holographic bracket with adjustable height includes a substrate and six pins connected to the substrate. Each pin has a cup with a height ranging from 1.00mm to 1.10mm. The outer side of the cup has a heat dissipation groove, and the thickness of the bottom of the cup ranges from 0.50mm to 0.55mm.

[0007] In a further technical solution, the heat dissipation grooves provided on the outer side of the cup body are multiple regularly arranged groove structures, the depth of the grooves ranging from 0.12mm to 0.14mm and the width ranging from 0.30mm to 0.40mm.

[0008] In a further technical solution, the bottom of the cup body is provided with a heat-conducting groove and a heat-conducting part, the heat-conducting part is installed in the heat-conducting groove, and the heat-conducting part is used to dissipate heat to the outside.

[0009] A further technical solution is that the inner surface of the cup is coated with a high-reflectivity coating.

[0010] In a further technical solution, the position of the pin corresponding to the cup body is a functional area, and a silver plating layer is provided on the pin located in the functional area, the thickness of the silver plating layer being 0.04mm-0.06mm.

[0011] The beneficial effects of this utility model are:

[0012] This invention optimizes the design of the LED RGB support bracket, setting the cup height to 1.05mm and the bottom thickness to 0.52mm. A heat dissipation groove with an opening area larger than the bottom area is introduced on the outer side, significantly improving heat dissipation and optical performance. The increased cup height and heat dissipation groove increase the sidewall surface area, enhancing heat conduction, convection, and radiation efficiency, reducing the chip junction temperature by approximately 10°C-15°C, and increasing luminous efficacy by 5%-10%, thus meeting the requirements for stable high brightness. Furthermore, the increased inner wall area of ​​the cup improves light reflection, reduces light loss, and increases light output efficiency by 5%-8%, optimizing RGB light mixing uniformity to meet high brightness demands. Simultaneously, the structural design balances mechanical strength and manufacturing cost, making it suitable for mass production. It comprehensively solves the limitations of traditional brackets, such as insufficient heat dissipation, light diffusion, and low brightness, providing reliable support for high-performance RGB LED applications.

[0013] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0014] Figure 1 : Overall structural diagram of this utility model.

[0015] Figure 2 Side view of this utility model.

[0016] Figure 3 : Front view of this utility model.

[0017] Reference numerals: 1. Substrate; 2. Pin; 3. Cup body; 31. Bottom; 4. Heat sink; 5. High reflectivity coating; 6. Marker position; Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0019] Existing LED brackets, as core structural components for fixing and supporting LED chips, play crucial roles in LED packaging, including mechanical support, thermal management, optical optimization, and electrical connection. However, current LED bracket designs have some technical limitations in high-performance applications, such as RGB LEDs. These limitations mainly manifest in low cup height, insufficient heat dissipation, and poor optical performance. These issues restrict the stability and efficiency of LED chips during high-brightness, long-term operation. The relatively small cup height of existing LED brackets typically limits the efficiency of heat transfer from the LED chip to the cup and the external environment. LED chips generate a significant amount of heat during operation, especially in high-power RGB LED applications where heat accumulation is more pronounced. If this heat cannot be dissipated in time, the chip's operating temperature will rise, leading to decreased luminous efficacy, color temperature drift, and even shortened device lifespan. Furthermore, the low sidewall area of ​​the cup limits the contact area with the surrounding air, weakening the heat dissipation effect of natural or forced convection.

[0020] Furthermore, the lower cup body results in a lower inner surface area. In a multi-color LED, the red, green, and blue light emitted by the RGB chip needs to be evenly mixed through multiple reflections within the cup body. The smaller inner surface area restricts the reflection path of the light, reduces the chance of RGB light superimposing, and leads to uneven color of the emitted light, affecting the visual effect.

[0021] Please refer to Figure 1-3 ;

[0022] Example 1:

[0023] An LED holographic bracket with adjustable height includes a substrate 1 and six pins 2 connected to the substrate 1. Each pin 2 has a cup-shaped body 3 with a height ranging from 1.00mm to 1.10mm. Preferably, in this embodiment, the height of the cup-shaped body 3 is 1.05mm. Compared to traditional LED brackets, this significantly increases the surface area of ​​the sidewalls of the cup-shaped body 3. This increased sidewall area directly improves the heat exchange efficiency with the surrounding air, making it easier for heat to dissipate through convection. It forms a trapezoidal or conical channel structure, increasing the contact area with the air. A heat dissipation groove 4 is provided on the outer surface of the cup-shaped body 3. The groove opening area of ​​the heat dissipation groove 4 is larger than the bottom area. The thickness of the bottom 31 of the cup-shaped body 3 ranges from 0.50mm to 0. Preferably, the thickness of the bottom 31 of the cup body 3 is 0.52mm. Compared with traditional brackets, this provides a larger heat conduction cross-sectional area, reduces thermal resistance, and accelerates the transfer of heat from the LED chip to the substrate 1 or external heat dissipation structure. In addition, the 0.52mm thickness of the bottom 31 enhances the connection strength between the cup body 3 and the substrate 1, enabling it to withstand the thermal and mechanical stresses during the operation of high-power LED chips, reducing the risk of structural failure due to thermal expansion or vibration. Furthermore, the 0.52mm thickness improves heat dissipation and mechanical performance while controlling the amount of material used, avoiding increased costs due to excessive thickness, and preventing the distance between the bottom 31 and the cup opening from being too small due to excessive thickness.

[0024] Specifically, by optimizing the LED RGB bracket design, the height of the cup body 3 is set to 1.05mm, the thickness of the bottom 31 is 0.52mm, and a heat dissipation groove 4 with an opening area larger than the bottom area is introduced on the outer side. This significantly improves heat dissipation and optical performance. The increased height of the cup body 3 and the heat dissipation groove 4 increase the side wall surface area, enhance heat conduction, convection and radiation efficiency, reduce the chip junction temperature by about 10°C-15°C, and increase luminous efficacy by 5%-10%, thereby meeting the requirements for stable high brightness. In addition, the increased inner wall area of ​​the cup body 3 improves light reflection, reduces light loss, increases light output efficiency by 5%-8%, and optimizes the uniformity of RGB light mixing to meet high brightness requirements. At the same time, the structural design takes into account both mechanical strength and manufacturing cost, making it suitable for mass production. It comprehensively solves the limitations of traditional brackets such as insufficient heat dissipation, light diffusion and low brightness, providing reliable support for high-performance RGB LED applications.

[0025] Furthermore, the heat dissipation grooves 4 provided on the outer side of the cup body 3 are multiple regularly arranged groove structures. In this embodiment, there are four grooves, which are respectively arranged opposite each other on both sides of the outer side of the cup body 3. The depth of the grooves ranges from 0.12mm to 0.14mm, preferably 0.13mm, and the width ranges from 0.30mm to 0.40mm, preferably 0.35mm. Specifically, by providing four regularly arranged groove structures as heat dissipation grooves 4 on the outer side of the LED color bracket cup body 3, the heat dissipation performance and manufacturing feasibility are further optimized. The depth and width design of the grooves effectively increases the heat dissipation surface area on the outer side of the cup body 3, enhances the efficiency of heat convection and heat radiation, and tests have shown that it reduces the chip junction temperature by about 3°C-5°C and improves the luminous efficiency by about 2%-3%. At the same time, the regular arrangement of the groove structure facilitates precision processing, reduces manufacturing costs, and balances efficient heat dissipation with production economy, providing better thermal management support for high-performance color LED applications.

[0026] Furthermore, the inner surface of the cup body 3 is coated with a high reflectivity coating 5 to improve color mixing efficiency and make the color more uniform. In addition, a marking position 6 is provided at one end of the cup body 3, which makes it easier to find the installation position of the cup body 3 during installation.

[0027] Furthermore, the position of pin 2 corresponding to the cup body 3 is a functional area. A silver plating layer is provided on pin 2 in the functional area. The thickness of the silver plating layer is 0.04mm-0.06mm, preferably 0.05mm. By providing a silver plating layer with a thickness of 0.05mm on pin 2 in the functional area of ​​the LED color bracket, the electrical performance and reliability are significantly improved. The high conductivity of the silver plating layer effectively reduces the contact resistance of pin 2, enhances the current transmission efficiency, and reduces power loss.

[0028] Example 2:

[0029] In this embodiment, the bottom 31 of the cup body 3 is provided with a heat-conducting groove (not shown in the figure) and a heat-conducting part (not shown in the figure). The heat-conducting part is installed in the heat-conducting groove and is used to dissipate heat to the outside.

[0030] The other structures are the same as in Embodiment 1, and will not be described again in this embodiment.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0032] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An LED holographic bracket with adjustable height, characterized in that, It includes a substrate (1) and six pins (2) connected to the substrate (1). The pins (2) are provided with cups (3). The height of the cups (3) ranges from 1.00mm to 1.10mm. The outer side of the cups (3) is provided with heat dissipation grooves (4). The thickness of the bottom (31) of the cups (3) ranges from 0.50mm to 0.55mm.

2. The LED holographic bracket with adjustable stretch height according to claim 1, characterized in that, The heat dissipation groove (4) provided on the outer side of the cup body (3) is a plurality of regularly arranged groove structures, the depth of the grooves ranges from 0.12mm to 0.14mm, and the width ranges from 0.30mm to 0.40mm.

3. The LED holographic bracket with adjustable stretch height according to claim 1, characterized in that, The bottom (31) of the cup body (3) is provided with a heat-conducting groove and a heat-conducting part. The heat-conducting part is installed in the heat-conducting groove and is used to dissipate heat to the outside.

4. The LED holographic bracket with adjustable stretch height according to claim 1, characterized in that, The inner surface of the cup body (3) is coated with a high reflectivity coating (5).

5. The LED holographic bracket with adjustable stretch height according to claim 1, characterized in that, The pin (2) is located at the position of the cup body (3) as a functional area. A silver plating layer is provided on the pin (2) located in the functional area. The thickness of the silver plating layer is 0.04mm-0.06mm.

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