LED brackets, light-emitting devices, and light-emitting apparatus

Abstract

This application relates to an LED bracket, a light-emitting device, and a light-emitting apparatus. The LED bracket has at least three grooves on its front side, with any two grooves spaced apart. Each groove accommodates one LED chip, and the depth of each groove is H, where 0 < H ≤ 0.4 mm. By providing at least three independent grooves on the front side of the LED bracket, each accommodating only one LED chip, the volume of a single groove is significantly reduced, resulting in a noticeably larger gap between the grooves. Furthermore, the groove depth H ≤ 0.4 mm significantly reduces the overall groove depth, thereby significantly improving the structural strength and airtightness of the LED bracket and extending the lifespan of the light-emitting device. Moreover, the groove depth facilitates wide-angle light emission from the LED chip within, preventing lateral obstruction. When LED chips of different colors are placed in different grooves, it further promotes the mixing of different colors of light, resulting in a better light mixing effect.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to an LED bracket, a light-emitting device, and a light-emitting apparatus. Background Technology

[0002] Traditional LED brackets have a large opening and a depth greater than the thickness of the LED chip to accommodate red, green, and blue LED chips within the cup. The greater depth also facilitates the reflection and mixing of the three colors. However, the resin cup walls of traditional LED brackets are relatively thin, and the resin surface area relative to the cup opening on the front of the LED bracket is small. This results in poor structural strength and airtightness of the LED bracket, consequently affecting the lifespan of the light-emitting devices. Summary of the Invention

[0003] Therefore, it is necessary to provide an LED bracket, light-emitting device, and light-emitting apparatus to address the problem that the poor structural strength and airtightness of traditional LED brackets affect the lifespan of light-emitting devices.

[0004] An LED bracket has at least three grooves on its front side, any two grooves are spaced apart from each other, each groove is used to accommodate an LED chip, and the depth of each groove is H, where 0 < H ≤ 0.4 mm.

[0005] In one embodiment, the front of the LED bracket has three grooves arranged in an isosceles triangle, with the base length L1 and the height L2, where 0 < L2 / L1 ≤ 2.

[0006] In one embodiment, 0 < L2 / L1 ≤ √3 / 2.

[0007] In one embodiment, the at least three grooves are arranged side by side at equal intervals, or the front of the LED bracket is provided with three grooves arranged in an equilateral triangle; the distance between two adjacent grooves is D, wherein 1.5mm≤D≤3mm.

[0008] In one embodiment, the front side of the LED bracket is further provided with multiple recesses; the front side of the LED bracket is further provided with a concave-convex structure; or the front side of the LED bracket is roughened.

[0009] In one embodiment, the LED bracket includes a substrate and an enclosure member, the enclosure member having at least three through holes, the enclosure member being disposed on the substrate and enclosing the substrate to form the at least three grooves.

[0010] In one embodiment, the enclosure is integrally formed with the substrate.

[0011] In one embodiment, the enclosure is made of a reflective material.

[0012] In one embodiment, each of the vias is gradually increased in size in the direction away from the substrate.

[0013] A light-emitting device, comprising:

[0014] LED bracket, wherein the LED bracket is the LED bracket described in any of the above embodiments;

[0015] At least three LED chips, each corresponding to one of the at least three recesses in the LED bracket; and

[0016] A light-transmitting structure is disposed on the LED bracket, is sealed to the LED bracket, and is disposed corresponding to the at least three LED chips.

[0017] In one embodiment, the light-emitting device further includes a color conversion layer disposed on or above at least one of the LED chips, the color conversion layer being used to change the wavelength of light emitted by the LED chip.

[0018] A light-emitting device, comprising:

[0019] Circuit board; and

[0020] A light-emitting device, wherein the light-emitting device is disposed on the circuit board and is the light-emitting device as described in the above embodiment.

[0021] The aforementioned LED bracket, light-emitting device, and light-emitting apparatus significantly reduce the volume of a single groove by providing at least three grooves on the front side of the LED bracket, with each groove spaced apart from the others and each groove housing only one LED chip. This results in a noticeably larger gap between the grooves, and the groove depth is less than or equal to 0.4 mm, significantly reducing the groove depth. The proportion of the resin surface area relative to all groove openings on the front side of the LED bracket is greatly increased, significantly improving the structural strength and airtightness of the LED bracket, thereby extending the lifespan of the light-emitting device. Furthermore, the depth of the grooves facilitates wide-angle light emission from the LED chips within, preventing lateral obstruction. When LED chips of different colors are placed in different grooves, it further promotes the mixing of different colors of light, resulting in a better light mixing effect.

[0022] In addition, each recess in the LED bracket houses only one LED chip, enabling independent optical design for multiple chips, improving the light control capability of the light-emitting device, and expanding its application scenarios. At the same time, the individually placed LED chip is easier to dissipate heat, and will not be too close to the sidewall of the recess, thus avoiding light obstruction and preventing accelerated aging of the sidewall resin due to excessive radiation, thereby improving the reliability of the light-emitting device. Attached Figure Description

[0023] Figure 1 This is a top view of the LED bracket in the first embodiment of this application.

[0024] Figure 2 for Figure 1 A cross-sectional view of the LED bracket along line II.

[0025] Figure 3 This is a top view of the LED bracket in the second embodiment of this application.

[0026] Figure 4 for Figure 3 A cross-sectional view of the LED bracket along line II-II.

[0027] Figure 5 This is a top view of the LED bracket in the third embodiment of this application.

[0028] Figure 6 for Figure 5 A cross-sectional view of the LED bracket along line III-III.

[0029] Figure 7 This is a top view of a light-emitting device in one embodiment of this application.

[0030] Figure 8 This is a top view of the light-emitting device in another embodiment of this application.

[0031] Figure 9 This is a partial top view of the light-emitting device in one embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 100-LED bracket; 102-groove; 110-metal conductor; 112-metal lead; 114-first electrode; 116-second electrode; 120-plastic body; 122-recess; 130-substrate; 132-pad; 134-electrode structure; 140-enclosing component; 142-through hole;

[0034] 200 - Light-emitting device; 210 - LED chip; 220 - Light-transmitting structure; 222 - Light-transmitting part; 230 - Color conversion layer;

[0035] 300 - Light-emitting device; 310 - Circuit board. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0042] Please see Figure 1 and Figure 2 , Figure 1 A top view of the LED bracket in the first embodiment of this application is shown. Figure 2 It shows Figure 1 A cross-sectional view of the LED bracket along line II. The first embodiment of this application provides an LED bracket 100 including a metal conductor 110 and a plastic body 120. The plastic body 120 is injection molded onto the metal conductor 110 by a mold and forms at least three independent grooves 102. Each groove 102 is used for die bonding of an LED chip, thus enabling at least three LED chips to be die bonded on the LED bracket 100.

[0043] The metal conductor 110 includes at least three pairs of metal leads 112, each corresponding to one of at least three recesses 102. Each pair of metal leads 112 includes a first electrode 114 and a second electrode 116. One end of the first electrode 114 and one end of the second electrode 116 are spaced apart, and this space is filled by the plastic body 120, together forming the bottom of the recess 102. Therefore, the LED chip in the recess 102 can be electrically connected to the first electrode 114 and the second electrode 116 respectively, realizing individual driving of each LED chip to meet the application scenario of full-color light emission. The other end of the first electrode 114 extends out of the outer side of one side of the plastic body 120, forming a pin. The other end of the second electrode 116 extends out of the outer side of the other side of the plastic body 120, forming another pin.

[0044] It should be noted that when the LED chip is a flip chip, it is only necessary to bond the LED chip to the first electrode 114 and the second electrode 116; when the LED chip is a vertical chip, it is necessary to first bond the LED chip to the first electrode 114, and then wire bond the front electrode and the second electrode 116 of the LED chip.

[0045] Combination Figure 1 From a top view, the front of the LED bracket 100 has at least three grooves 102, with any two grooves 102 spaced apart from each other, meaning that at least three grooves 102 are independent of each other, and each groove 102 is used to accommodate one LED chip, thus allowing at least three LED chips to be disposed on the LED bracket 100. The depth of each groove 102 is H, where 0 < H ≤ 0.4 mm.

[0046] By providing at least three independent grooves 102 on the front side of the LED bracket 100, with each groove 102 housing only one LED chip, the volume of a single groove 102 is significantly reduced. This results in a noticeably larger gap between the grooves 102, and the groove depth is less than or equal to 0.4 mm, thus significantly reducing the groove depth. The proportion of the resin surface relative to the openings of all the grooves 102 on the front side of the LED bracket 100 is greatly increased, significantly improving the structural strength and airtightness of the LED bracket 100, thereby extending the lifespan of the light-emitting device. Furthermore, the depth of the groove 102 facilitates wide-angle light emission from the LED chip within, preventing lateral obstruction. When LED chips of different colors are placed in different grooves 102, it promotes the mixing of different colors of light, resulting in a good light mixing effect.

[0047] Furthermore, each groove 102 of the LED bracket 100 contains only one LED chip, enabling independent optical design under multi-chip configuration. This improves the light control capability of the light-emitting device and expands its application scenarios. At the same time, the individually placed LED chip dissipates heat more easily, avoids being too close to the sidewall of the groove 102, thus preventing light obstruction and accelerating the aging of the sidewall resin due to excessive radiation, thereby improving the reliability of the light-emitting device.

[0048] Furthermore, the depth H of each groove 102 is 0.3mm. At this depth H, the large-angle light emission of the LED chip can be accommodated, reducing lateral light obstruction. At the same time, it can also ensure the structural strength and airtightness of the LED bracket 100. The light emission of LED chips of different colors in different grooves 102 is more easily mixed, resulting in better light mixing effect and achieving a better full-color effect. In other embodiments, the depth H of each groove 102 can be 0.2mm, 0.1mm, or less, depending on the actual needs.

[0049] The number of grooves 102 on the front of the LED bracket 100 can be, but is not limited to, three. The three grooves 102 are arranged in an isosceles triangle with a base length of L1 and a height of L2, where 0 < L2 / L1 ≤ 2, which facilitates independent optical design for LED chips in different grooves 102.

[0050] It should be noted that the "isosceles triangle" is formed by connecting the centers of the openings of the three grooves 102, such as... Figure 1 As shown. In other embodiments, the number of grooves 102 can be four or more. The four or more grooves 102 can be arranged in a quadrilateral or other polygon, or any three of the four or more grooves 102 can be arranged in a triangle. Moreover, the arrangement shape of the three grooves 102 is not limited to an isosceles triangle. The three grooves 102 can also be arranged side by side or in other triangles. When L2 / L1=0, the three grooves 102 are arranged in a row.

[0051] Furthermore, 0 < L2 / L1 ≤ √3 / 2, thus, while maintaining a compact structure, it is more conducive to the independent optical design of LED chips in different grooves 102, without affecting each other.

[0052] In one embodiment, the base length L1 of the isosceles triangle is 2mm, and the height L2 is also 2mm, in which case L2 / L1 = 1; or, L1 can be 2mm, and L2 can be 1.5mm, in which case L2 / L1 = 3 / 4. It is understood that the specific values ​​of the base length L1 and height L2 of the isosceles triangle described above are merely exemplary and not limiting. Furthermore, the three grooves 102 can be the same size or different sizes, depending on the size of the LED chips within them. When the size of the LED chip in one of the grooves 102 is larger, that groove 102 will also be enlarged accordingly.

[0053] To improve the bonding strength of the front surface of the LED bracket 100, the front surface of the LED bracket 100 is roughened, which facilitates the bonding of optical structures, such as lenses, to the front surface of the LED bracket 100, thereby improving the bonding strength and sealing of the connection. This roughening treatment can be achieved through the surface of the mold cavity of the injection mold. In an alternative embodiment, the front surface of the LED bracket 100 can be provided with an uneven structure instead of surface roughening, resulting in even better bonding strength.

[0054] The plastic body 120 is made of a reflective material, which reflects light incident upon it, thus improving the light-emitting efficiency of the LED chip inside. To better reflect light upwards and increase the light emission angle, each groove 102 is inverted conical, specifically a frustum shape. In an alternative embodiment, each groove 102 may be frustum-shaped.

[0055] Furthermore, the plastic body 120 is made of white glue injection molding, such as polyphthalamide (PPA), but is not limited to PPA. It can also be made of materials such as poly(1,4-cyclohexanediol) terephthalate (PCT), epoxy molding compound (EMC), or sheet molding compound (SMC). It can also be made of light-transmitting material so that the large-angle light emitted by the LED chip can pass through the plastic body 120 and be emitted.

[0056] Please see Figure 3 and Figure 4 , Figure 3 A top view of the LED bracket according to the second embodiment of this application is shown. Figure 4 It shows Figure 3 The cross-sectional view of the LED bracket along line II-II shows that, compared to the LED bracket 100 in the first embodiment, the LED bracket 100 in this embodiment includes a substrate 130 and a surrounding member 140. The surrounding member 140 is provided with at least three through holes 142. The surrounding member 140 is disposed on the substrate 130 and surrounds the substrate 130 to form at least three grooves 102.

[0057] When fabricating the LED bracket 100, it is only necessary to first fabricate the substrate 130, and then set the enclosure 140 on the substrate 130. Since the substrate 130 has built-in pads 132, there is no need to punch out the metal conductor 110 in the first embodiment, and its fabrication process is relatively simpler. The substrate 130 has at least three pairs of pads 132, and the at least three pairs of pads 132 are arranged in a one-to-one correspondence with at least three recesses 102. The back side of the substrate 130 is provided with electrode structures 134 corresponding to the at least three pairs of pads 132. Through this substrate 130, individual control of LED chips in different recesses 102 can also be achieved.

[0058] Furthermore, the enclosure 140 is integrally formed with the substrate 130, meaning the enclosure 140 can be directly molded onto the substrate 130 to form an integrated structure. This results in better connection stability and sealing between the two, simplifying the production process of the LED bracket 100 and improving its production efficiency. In other embodiments, the enclosure 140 can be pre-formed and then bonded to one side surface of the substrate 130.

[0059] The depth H of each groove 102 is 0.4mm, which takes into account both the large-angle light emission of the LED chip and the structural strength and airtightness of the LED bracket 100. It also facilitates the mixing of light emission from LED chips of different colors and improves the light mixing effect.

[0060] The three grooves 102 of the LED bracket 100 are arranged in an equilateral triangle. The distance between any two grooves 102 is equal, and L2 / L1=√3 / 2. Under the premise of compact structure, independent optical design can be performed on the LED chips in different grooves 102.

[0061] Furthermore, the distance D between two adjacent grooves 102 is 1.5mm. This distance D provides sufficient space for the optical design of the light-emitting chips in different grooves 102, facilitating the design of optical structures on the front side of the LED bracket 100 and preventing interference between adjacent optical structures. In other embodiments, the distance D between two adjacent grooves 102 can be 2mm, 2.5mm, or 3mm, and the specific value can be determined according to actual needs.

[0062] The enclosure 140 is made of a reflective material, which allows the sides of the groove 102 to reflect light, thereby improving the light extraction rate. The enclosure 140 is specifically made of white adhesive material, such as polyphthalamide (PPA), but it is not limited to PPA. It can also be made of materials such as polyethylene terephthalate (PCT), epoxy molding compound (EMC), or sheet molding compound (SMC). It can also be made of a light-transmitting material, so that the large-angle light emitted by the LED chip can pass through the enclosure 140 and be emitted.

[0063] Each through-hole 142 of the enclosure 140 is progressively larger in the direction away from the substrate 130, which allows it to reflect light upwards, thereby increasing the light emission angle. Each through-hole 142 is specifically inverted conical, specifically a frustum-shaped square. In other embodiments, each through-hole 142 may be frustum-shaped.

[0064] It should be noted that in other embodiments, multiple sets of through holes 102 may be provided on the enclosure 140. Each set of through holes 102 may include at least three through holes 120 as described above, thereby forming multiple sets of grooves 102 on the LED bracket 100. Each set of grooves 102 includes at least three grooves 102, and the LED chip in each set of grooves 102 forms a full-color pixel. Thus, the light-emitting device having the LED bracket 100 is similar to a COB device.

[0065] As for the other aspects of the LED bracket 100 in this embodiment, they are basically the same as the other aspects of the LED bracket 100 in the above embodiments. The specific details can be referred to the description of the above embodiments, and will not be repeated here.

[0066] Please see Figure 5 and Figure 6 , Figure 5 A top view of the LED bracket according to the third embodiment of this application is shown. Figure 6 It shows Figure 5The cross-sectional view of the LED bracket along line III-III shows that, compared to the LED bracket 100 in the first embodiment described above, the LED bracket 100 in this embodiment has at least three grooves 102 arranged side by side at equal intervals. The spacing between two adjacent grooves 102 can be set according to actual needs.

[0067] Furthermore, the three grooves 102 of the LED bracket 100 are arranged side by side in a row, at which point L2 / L1=0. In other embodiments, the LED bracket 100 may have four grooves 102 arranged side by side. To overcome the light mixing problem of the LED chips in the first and last grooves 102, a blue LED chip may be placed in each groove 102, and a color conversion layer is used to convert the blue light into white light.

[0068] To improve the bonding strength on the front side of the LED bracket 100, multiple recesses 122 are provided on the front side of the LED bracket 100. When the optical structure is bonded to this surface, the optical structure can be better bonded to the front side of the LED bracket 100, improving the bonding strength and sealing between the two. Each recess 102 is surrounded by multiple recesses 122.

[0069] As for the other aspects of the LED bracket 100 in this embodiment, they are basically the same as the other aspects of the LED bracket 100 in the first embodiment above. The specific details can be referred to the description of the first embodiment above, and will not be repeated here.

[0070] Please see Figure 7 Combined Figures 1 to 6 , Figure 7 This diagram shows a top view of a light-emitting device according to an embodiment of this application. The light-emitting device 200 provided in this embodiment includes an LED bracket 100, at least three LED chips 210, and a light-transmitting structure 220. The at least three LED chips 210 are disposed on the LED bracket 100, and the light-transmitting structure 220 is disposed on the LED bracket 100, sealed to the LED bracket 100, and corresponding to the at least three LED chips 210. The specific structure of the LED bracket 100 is as described in the above embodiments. Since the light-emitting device 200 in this embodiment adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here. The at least three LED chips 210 are respectively housed in at least three grooves 102 of the LED bracket 100.

[0071] Each recess 102 accommodates only one LED chip 210. When there are three recesses 102, the number of LED chips 210 is also three, which can be red, blue, and green LED chips, or all blue LED chips. A phosphor layer is placed on each LED chip 210 to achieve white light emission. When there are four recesses 102, the number of LED chips 210 is also four, which can be red, blue, green, and white LED chips, or red, blue, green, and infrared LED chips. It should be noted that the type of each LED chip is not limited to a vertical chip; it can also be a flip chip or a horizontal chip.

[0072] The light-transmitting structure 220 includes at least three light-transmitting portions 222, which are disposed corresponding to at least three LED chips 210 in at least three recesses 102. Each light-transmitting portion 222 seals the corresponding recess 102, thereby enclosing the LED chip 210 located therein. By designing the shape of each light-transmitting portion 222, an independent optical design is performed on the corresponding LED chip 210. At the same time, the light-transmitting portion 222 also serves to seal the LED chip 210.

[0073] At least three light-transmitting portions 222 are spaced apart. The light-incident and light-exit surfaces of each light-transmitting portion 222 can be configured according to actual needs, allowing each light-transmitting portion 222 to independently control the light emission of the LED chip 210, thus achieving individual light control of each LED chip 210. In an alternative embodiment, the light-transmitting structure 220 further includes a connecting portion (not shown), which connects the at least three light-transmitting portions 222 respectively; or the at least three light-transmitting portions 222 are interconnected, eliminating the need to install each light-transmitting portion 222 separately, thereby improving the installation efficiency of the light-transmitting structure 220.

[0074] Each light-transmitting portion 222 is bonded to the front surface of the LED bracket 100, sealing the corresponding groove 102 to form a sealed cavity, within which the LED chip 210 is sealed. In other embodiments, light-transmitting adhesive can be used to directly fill the groove 102 and cover the LED chip 210 to form the light-transmitting portion 222.

[0075] Please see Figure 8 , Figure 8A top view of a light-emitting device according to another embodiment of this application is shown. Compared to the light-emitting device 200 in the above embodiment, in this embodiment, one of the recesses 102 of the light-emitting device 200 is larger than the other two recesses 102. The size of the LED chip 210 in the larger recess 102 is also larger than the other two LED chips 210. The light-transmitting portion 222 that closes the larger recess 102 is also larger. The light-transmitting portion 222 is specifically a lens, which is sealed to the front of the LED bracket 100, thereby closing the corresponding recess 102.

[0076] The light-emitting device 200 also includes a color conversion layer 230, which is disposed on or above at least one LED chip. The color conversion layer 230 is used to change the wavelength of light emitted by the LED chip 210.

[0077] The three LED chips 210 are a green LED chip and two blue LED chips, with the larger blue LED chip housed within a larger recess 102. A color conversion layer 230 covers the sides and front of the larger blue LED chip and is a phosphor layer made of red phosphor, converting blue light into red light. It should be noted that the red phosphor can be replaced by quantum dot material; in this case, the color conversion layer 230 is a quantum dot layer, positioned above the blue LED chip.

[0078] The color-conversion material in the color conversion layer 230 can be a amine-based phosphor such as CASN-based phosphor (e.g., CaAISiN3:Eu) or SCASN-based phosphor (e.g., (Sr, Ca)AISiN3:Eu), a fluoride-based phosphor such as KSF-based phosphor (e.g., K2SiF6:Mn), KSAF-based phosphor (e.g., K2(SiAI)F6:Mn), or MGF-based phosphor (e.g., 3.5MgO·0.5MgF·GeO2:Mn), a phosphor with a perovskite structure (e.g., CsPb(F, Cl, Br, I)3), or a quantum dot phosphor (e.g., CdSe, InP, AgInS, or AglnSe2), etc.

[0079] In other embodiments, the three LED chips 210 are a red LED chip and two blue LED chips, respectively. One of the blue LED chips has a color conversion layer 230 made of phosphor, which is a green phosphor with a wavelength between 510nm and 545nm, converting blue light into green light. This green phosphor can be a silicate, nitride, or perovskite structure; the perovskite structure can be CsPb(F, Cl, Br, I)3. It should be noted that the green phosphor can be replaced by quantum dot materials. In this case, the color conversion layer 230 is a quantum dot layer, located above the blue LED chip. The quantum dot material can be CdSe, InP, AgInS2, or AgInSe2, etc.

[0080] Please see Figure 9 , Figure 9 A partial top view of a light-emitting device according to an embodiment of this application is shown. The light-emitting device 300 provided in this embodiment includes a circuit board 310 and a light-emitting device 200, which is disposed on the circuit board 310. The specific structure of the light-emitting device 200 is the same as in the above embodiments. Since the light-emitting device 300 in this embodiment adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The number of light-emitting devices 200 is multiple, and they are regularly arranged on the circuit board 310. In other embodiments, only one light-emitting device 200 may be disposed on the circuit board 310.

[0081] Furthermore, the light-emitting device 300 is a backlight module, which also includes optical films (not shown) corresponding to the plurality of light-emitting devices 200. In other embodiments, the light-emitting device 300 may also be a display device, a projection device, a security device, or other lighting device.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An LED holder, characterized by, The front side of the LED bracket (100) is provided with at least three grooves (102), any two grooves (102) are spaced apart from each other, each groove (102) is used to accommodate an LED chip, and the depth of each groove (102) is H, where 0 < H ≤ 0.4 mm.

2. The LED support of claim 1, wherein, The front of the LED bracket (100) is provided with three grooves (102), which are arranged in an isosceles triangle. The base of the isosceles triangle is L1 and the height is L2, where 0 < L2 / L1 ≤ 2.

3. The LED bracket according to claim 2, characterized in that, 0 < L2 / L1 ≤ √3 / 2.

4. The LED bracket according to claim 1, characterized in that, The at least three grooves (102) are arranged side by side at equal intervals, or the front of the LED bracket (100) is provided with three grooves (102), and the three grooves (102) are arranged in an equilateral triangle. The distance between two adjacent grooves (102) is D, where 1.5mm≤D≤3mm.

5. The LED bracket according to any one of claims 1 to 4, characterized in that, The front of the LED bracket (100) is also provided with multiple recesses (122); The front of the LED bracket (100) is also provided with a concave-convex structure; or The front surface of the LED bracket (100) is roughened.

6. The LED bracket according to any one of claims 1 to 4, characterized in that, The LED bracket (100) includes a substrate (130) and a surrounding member (140). The surrounding member (140) has at least three through holes (142). The surrounding member (140) is disposed on the substrate (130) and surrounds the substrate (130) to form the at least three grooves (102).

7. The LED bracket according to claim 6, characterized in that, The enclosure (140) is integrally formed with the substrate (130).

8. A light-emitting device, characterized in that, include: LED bracket (100), wherein the LED bracket (100) is the LED bracket (100) according to any one of claims 1 to 7; At least three LED chips (210) are housed in at least three recesses (102) of the LED bracket (100) in a one-to-one correspondence; as well as A light-transmitting structure (220) is disposed on an LED bracket (100), is sealed to the LED bracket (100), and is disposed corresponding to the at least three LED chips (210).

9. The light-emitting device according to claim 8, characterized in that, Also includes: A color conversion layer (230) is disposed on or above at least one of the LED chips (210), and the color conversion layer (230) is used to change the wavelength of light emitted by the LED chip (210).

10. A light-emitting device, characterized in that, include: Circuit board (310); and A light-emitting device (200) is disposed on the circuit board (310) and is the light-emitting device (200) as described in claim 8 or 9.

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