An LED device structure
By independently setting the first and second metal sheets in the LED device structure, and making one end of them protrude from the plastic material, the chipping and corner breakage problems caused by the coplanar structure of the plastic material and the metal sheet in the prior art are solved, the reliability and heat dissipation performance of the LED device are improved, and the compatibility of electrical testing and spectroscopic testing is enhanced.
Patent Information
- Application Number
- CN202522533847.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-11-28
AI Technical Summary
The existing cut LED brackets, where the plastic material and metal sheet are on the same plane, are prone to structural defects such as chipping and corner breakage, which affect the reliability of subsequent processes and heat dissipation performance.
Design an LED device structure in which a first metal sheet and a second metal sheet are independently disposed within a plastic body, with one end protruding from the exposed area of the plastic body and electrically connected to an LED chip via bonding wires. The package covers the LED chip, and an annular protrusion is provided on the upper surface of the plastic body to enhance connection stability.
It effectively avoids structural defects such as chipped edges and corners, increases the bonding area between solder paste and metal sheets, improves heat dissipation performance and reliability, and facilitates compatibility with electrical testing and spectroscopic testing.
Smart Images
Figure CN224947957U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of LED technology, and specifically relates to an LED device structure. Background Technology
[0002] Existing LED brackets are mostly formed by molding metal sheets and plastic materials, and then cutting them to form a single LED lead frame. The characteristic of this lead frame is that the plastic material and the metal sheet are coplanar around the frame.
[0003] When the plastic material is molded and combined with the etched sheet, its shape is planar. After being dispersed into individual LED brackets through the cutting process, the plastic material and metal sheet around the LED lead frame are on the same plane. This structure is prone to structural defects such as chipping and corner breakage in subsequent processes. This is a similar structure to most cutting types of LEDs. Utility Model Content
[0004] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of this utility model is to provide an LED device structure and manufacturing method.
[0005] The technical solution adopted by this utility model to solve its technical problem is: An LED device structure includes a plastic body, a first metal sheet, a second metal sheet, an LED chip, bonding wires, and a package. The first metal sheet and the second metal sheet are disposed within the plastic material body, and the first metal sheet and the second metal sheet are independently disposed therebetween. The upper and lower end faces of the plastic material body are provided with exposed areas for exposing the upper and lower end faces of the first metal sheet and the second metal sheet. The LED chip is disposed in the exposed area on the upper surface of the plastic material and placed on the first metal sheet or the second metal sheet. The LED chip is electrically connected to the first metal sheet or the second metal sheet in the exposed area through the bonding wire. The package covers the LED chip; One end of the first metal sheet and the second metal sheet protrudes from the exposed area of the plastic material.
[0006] Preferably, the first metal sheet and the second metal sheet are made of the same material.
[0007] Preferably, the upper surface of the plastic material is provided with an annular protrusion, the exposed area of the upper surface of the plastic material is located within the annular protrusion, and one end of the first metal sheet and the second metal sheet protrudes beyond the edge of the annular protrusion of the plastic material.
[0008] Preferably, the annular protrusion is circular or rectangular in shape; The upper surfaces of the first and second metal sheets located in the exposed area on the upper surface of the plastic material are electroplated with a gold plating layer.
[0009] Preferably, the exposed area of the first metal sheet in the exposed area of the upper surface of the plastic material is the same as or different from the exposed area of the second metal sheet. The exposed area of the first metal sheet in the exposed area of the lower end face of the plastic material may be the same as or different from the exposed area of the second metal sheet. The exposed areas of the first and second metal sheets around the exposed areas of the plastic material are of the same or different sizes.
[0010] Preferably, the connection between the exposed area of the plastic material and the protruding end faces of the first and second metal sheets is a planar structure or a curved structure.
[0011] Compared with the prior art, the beneficial effects of this utility model include: In the structure of this application, one end of the first metal sheet and the second metal sheet protrudes from the exposed area of the plastic material, which protects the overall structure of the LED device and can prevent structural defects such as edge chipping and corner chipping in subsequent processes. At the same time, the lower end surface of the plastic material has an exposed area for the first metal sheet and the second metal sheet, which can increase the bonding area between the solder paste and the first metal sheet and the second metal sheet, enhance heat dissipation, and improve reliability. Attached Figure Description
[0012] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a cross-sectional structural diagram of the present invention.
[0014] Figure 2 This is a top view of the structure of the present invention, showing the solder paste and PCB board with the solder paste and PCB board hidden.
[0015] Figure 3 This is a schematic diagram of the structure of the present invention with the solder paste and PCB board hidden from view from below.
[0016] Figure 4 This is a schematic diagram of the cutting process using a specially designed blade, as described in this utility model.
[0017] in: 1-Plastic material, 2-First metal sheet, 3-Second metal sheet, 4-LED chip, 5-Packaging body, 6-Bonding wire, 7-Narrow edge of first blade, 8-Wide edge of second blade, 9-Solder paste, 10-PCB board. Detailed Implementation
[0018] To better understand the above-mentioned objectives, features, and advantages of this utility model, it will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this utility model; the described embodiments are merely some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0020] Example: like Figure 1-4 As shown, this embodiment provides an LED device structure, including a PCB board 10, solder paste 9, plastic body 1, first metal sheet 2, second metal sheet 3, LED chip 4, bonding wire 6, and package 5; The first metal sheet 2 and the second metal sheet 3 are disposed inside the plastic body 1. The first metal sheet 2 and the second metal sheet 3 are disposed independently. The upper and lower end faces of the plastic body 1 are provided with exposed areas for the upper and lower end faces of the first metal sheet 2 and the second metal sheet 3 to be exposed. LED chip 4 is disposed in the exposed area on the upper surface of plastic body 1 and placed on the first metal sheet 2 or the second metal sheet 3. LED chip 4 is electrically connected to the first metal sheet 2 or the second metal sheet 3 in the exposed area through bonding wire 6. Package 5 covers LED chip 4; One end of the first metal sheet 2 and the second metal sheet 3 protrudes from the exposed area of the plastic body 1; Solder paste component 9 is located between the lower end face of the plastic material 1 and the PCB board 10.
[0021] In this embodiment, one end of the first metal sheet 2 and the second metal sheet 3 protrudes from the exposed area of the plastic body 1, which protects the overall structure of the LED device. This structure can avoid the dark cracks, chipping, and corner breakage of the plastic material caused by metal extension during traditional EMC bracket cutting, reducing the risk of failure. This can prevent structural defects such as chipping and corner breakage in subsequent processes. At the same time, the lower end surface of the plastic body 1 has an exposed area for the first metal sheet 2 and the second metal sheet 3, which can increase the bonding area between the solder paste 9 and the first metal sheet 2 and the second metal sheet 3, enhance heat dissipation, and improve reliability.
[0022] Furthermore, the structural design of one end of the first metal sheet 2 and the second metal sheet 3 protruding from the exposed area of the plastic body 1 allows for electrical testing through the exposed ends of the first metal sheet 2 and the second metal sheet 3 when the LED chip 4 is mounted on the PCB board 10, facilitating individual inspection of the LED chip 4.
[0023] Furthermore, the structural design of one end of the first metal sheet 2 and the second metal sheet 3 protruding from the exposed area of the plastic body 1 allows for simultaneous adaptation to clamp / bottom testing fixtures when performing spectral testing on LED beads, greatly improving the compatibility of the beads.
[0024] Specifically, the first metal sheet 2 and the second metal sheet 3 are made of the same material.
[0025] Specifically, the upper surface of the plastic body 1 is provided with an annular protrusion, and the exposed area of the upper surface of the plastic body 1 is located within the annular protrusion. One end of the first metal sheet 2 and the second metal sheet 3 protrudes from the edge of the annular protrusion of the plastic body 1.
[0026] Specifically, the annular protrusion is circular or rectangular in shape; The upper surfaces of the first metal sheet 2 and the second metal sheet 3, located in the exposed area on the upper surface of the plastic body 1, are electroplated with a gold plating layer.
[0027] Specifically, the exposed area of the first metal sheet 2 in the exposed area on the upper surface of the plastic body 1 may be the same or different from the exposed area of the second metal sheet 3. The exposed area of the first metal sheet 2 located in the exposed area of the lower end face of the plastic body 1 may be the same as or different from the exposed area of the second metal sheet 3. The exposed areas of the first metal sheet 2 and the second metal sheet 3 around the exposed area of the plastic body 1 may be the same or different.
[0028] Specifically, the connection between the exposed area of the plastic material 1 and the protruding end faces of the first metal sheet 2 and the second metal sheet 3 is a planar structure or a curved structure.
[0029] This embodiment also includes a method for manufacturing an LED device structure, used to fabricate the aforementioned LED device structure. The steps of the manufacturing method are as follows: S1: The first metal sheet 2 and the second metal sheet 3 are placed inside the plastic body 1. At the same time, several exposed areas are provided on the upper and lower end faces of the plastic body 1 to expose the upper and lower end faces of the first metal sheet 2 and the second metal sheet 3. Cutting channels are provided on the plastic body 1 and between adjacent exposed areas. The PCB board 10, solder paste 9, LED chip 4, bonding wire 6 and package 5 are correspondingly installed and connected to the plastic body 1 to form a bracket-type LED. The bracket-type LED is then attached to a UV film with adhesive. S2: Perform the first cutting process. Place the entire bracket-type LED into the cutting machine and perform the first cutting process on the cutting track. The cutting depth of the first cutting process is less than the thickness of the bracket-type LED. S3: Perform the second cutting process, change the cutting blade. The width of the cutting blade in the second cutting process is smaller than that in the first cutting process. The cutting depth of the second cutting process is greater than the thickness of the bracket LED. The second cutting process divides the entire bracket LED into several independent LED devices. S4: After completing the above two cutting processes, irradiate the UV film with ultraviolet light to release the adhesiveness of the UV film, and then peel off the several independent LED devices formed in the second cutting process to form the LED device structure.
[0030] Specifically, the width of the cutting blade in the first cutting process is ≥0.2mm, and the width of the cutting blade in the second cutting process is <0.2mm.
[0031] Specifically, the first and second cutting processes are carried out on the front or back of the bracket-type LED.
[0032] Specifically, special blades are provided for the first and second cutting processes. These special blades include a first blade and a second blade. The narrow edge of the first blade is less than 0.2mm, and the wide edge of the second blade is ≥0.05mm on each side. The cutting depth of the wide edge of the second blade is less than the thickness of the LED bracket, while the cutting depth of the first blade is greater than the thickness of the LED bracket. Based on the structure of these special blades, a one-time cutting process can be achieved.
[0033] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.
Claims
1. An LED device structure, characterized by, It includes a plastic body, a first metal sheet, a second metal sheet, an LED chip, bonding wires, and a package. The first metal sheet and the second metal sheet are disposed within the plastic material body, and the first metal sheet and the second metal sheet are independently disposed therebetween. The upper and lower end faces of the plastic material body are provided with exposed areas for exposing the upper and lower end faces of the first metal sheet and the second metal sheet. The LED chip is disposed in the exposed area on the upper surface of the plastic material and placed on the first metal sheet or the second metal sheet. The LED chip is electrically connected to the first metal sheet or the second metal sheet in the exposed area through the bonding wire. The package covers the LED chip; One end of the first metal sheet and the second metal sheet protrudes from the exposed area of the plastic material.
2. The LED device structure of claim 1, wherein, The first metal sheet and the second metal sheet are made of the same material.
3. The LED device structure of claim 1, wherein, The upper surface of the plastic material is provided with an annular protrusion, and the exposed area of the upper surface of the plastic material is located within the annular protrusion. One end of the first metal sheet and the second metal sheet protrudes beyond the edge of the annular protrusion of the plastic material.
4. The LED device structure of claim 3, wherein, The annular protrusion is circular or rectangular in shape; The upper surfaces of the first and second metal sheets located in the exposed area on the upper surface of the plastic material are electroplated with a gold plating layer.
5. The LED device structure of claim 1, wherein, The exposed area of the first metal sheet in the exposed area of the upper surface of the plastic material may be the same as or different from the exposed area of the second metal sheet. The exposed area of the first metal sheet in the exposed area of the lower end face of the plastic material may be the same as or different from the exposed area of the second metal sheet. The exposed areas of the first and second metal sheets around the exposed areas of the plastic material are either the same or different.
6. The LED device structure of claim 1, wherein, The connection between the exposed area of the plastic material and the protruding end faces of the first and second metal sheets is a planar or curved structure.