LED filaments, integrated board, float assembly, and luminous fishing float

Abstract

This application provides an LED filament, an integrated board, a float assembly, and a luminous fishing float. The LED filament includes a substrate, a first metal pattern, multiple first chip pads, and a first light-emitting module. The substrate has a circuit portion extending along a first direction and has opposing first and second circuit surfaces. The first metal pattern is disposed on the first circuit surface and includes a positive line and a negative line extending along the first direction. At least one first chip pad is electrically connected to the positive line or the negative line of the first metal pattern. The first light-emitting module includes multiple first light-emitting chips, each of which is soldered to at least one first chip pad. Through a special circuit pattern design, the spacing between adjacent chip pads and light-emitting chips is reduced, which not only allows the light-emitting chips to be safely connected in parallel but also makes the light effect softer and more consistent, avoiding glare for anglers using luminous fishing floats at night.

Description

Technical Field

[0001] This application relates to the field of fishing tool technology, and in particular to an LED filament, integrated board, float tip assembly and luminous fishing float. Background Technology

[0002] Night fishing, with its cool air, quiet environment, and abundance of large fish, has attracted many professional anglers. The fishing float is a crucial tool, often referred to as the angler's eyes and locator, used to accurately transmit underwater fish activity and bite signals. In night fishing, professionals have higher requirements for the float's light efficiency, reliability, and sensitivity. However, for those with poor eyesight or astigmatism, mainstream luminous floats based on luminous paint have limited visual appeal, while niche LED-based floats, limited by current technology in manufacturing processes, circuitry, structure, and materials, actually produce a discrete point light source. This results in a narrow spectrum, sharp brightness, and concentrated energy, easily leading to problems like cross-referencing, blurring, and ghosting, causing blurred vision and making it easy to misjudge fish activity and bite signals. This makes it difficult for those with poor eyesight to enjoy the charm of night fishing. Utility Model Content

[0003] This application provides an LED filament, an integrated board, a float assembly, and a luminous fishing float. The LED filament has the advantages of soft light and clear visibility in terms of luminous efficacy, and the advantages of being thin, lightweight, flexible, and reliable in terms of structure, and the advantages of controllable cost and high yield in terms of process, and the advantages of stable function and good battery life in terms of circuit.

[0004] In a first aspect, this application provides an LED filament, the LED filament comprising: The substrate has a circuit portion extending along a first direction, and the substrate has opposing first circuit surfaces and second circuit surfaces. A first metal pattern is disposed on a first line surface, and the first metal pattern includes a positive line and a negative line extending along a first direction. Multiple first chip pads are arranged along a first direction between the positive and negative lines of the first metal pattern, and the multiple first chip pads are electrically connected to the positive line or the negative line of the first metal pattern. The first light-emitting module includes multiple first light-emitting chips, each of which is soldered to at least one first chip pad.

[0005] In some embodiments, at least a portion of the positive electrode line of the first metal pattern extends to a first side of the first line surface, and at least a portion of the negative electrode line of the first metal pattern extends to a second side of the first line surface; wherein, the first side and the second side of the first line surface are two sides extending along a first direction on the first line surface, and the first side and the second side of the first line surface are two opposite sides on the first line surface.

[0006] In some embodiments, the plurality of first chip pads include a plurality of first positive chip pads, wherein the plurality of first positive chip pads are formed by the branching extension of the positive electrode line of the first metal pattern towards the negative electrode line, and each first positive chip pad is soldered to the positive electrode of at least one first light-emitting chip; or, the plurality of chip pads include a plurality of first negative chip pads, wherein the plurality of first negative chip pads are formed by the branching extension of the negative electrode line of the first metal pattern towards the positive electrode line, and each first negative chip pad is soldered to the negative electrode of at least one first light-emitting chip.

[0007] In some embodiments, the plurality of first chip pads include a plurality of first positive chip pads and a plurality of first negative chip pads, which are arranged alternately along a first direction; the positive and negative electrodes of at least one first light-emitting chip are respectively soldered to adjacent first positive chip pads and first negative chip pads.

[0008] In some embodiments, the plurality of first chip pads include a plurality of first positive chip pads and a plurality of first negative chip pads, which are arranged alternately along a first direction; the positive electrodes of at least two adjacent first light-emitting chips are connected to the same first positive chip pad, or the negative electrodes of at least two adjacent first light-emitting chips are connected to the same first negative chip pad. In some embodiments, the substrate is a light-transmitting substrate, and the LED filament further includes: a first light-transmitting colloid, which is disposed on a first circuit surface and covers the first light-emitting module; and a second light-transmitting colloid, which is disposed on a second circuit surface, wherein at least a portion of the projection of the second light-transmitting colloid onto the light-transmitting substrate coincides with at least a portion of the projection of the first light-transmitting colloid onto the light-transmitting substrate; wherein the diffusing agent content of the first light-transmitting colloid is higher than that of the second light-transmitting colloid, or the phosphor content of the second light-transmitting colloid is lower than that of the first light-transmitting colloid.

[0009] In some embodiments, the light-transmitting substrate is a transparent FPC substrate, a transparent CPI substrate, or a BT resin substrate; or, the diffusing agent content of the first light-transmitting colloid is higher than that of the second light-transmitting colloid, and the phosphor content of the second light-transmitting colloid is lower than that of the first light-transmitting colloid.

[0010] In some embodiments, the side of the first light-transmitting colloid facing away from the substrate is bent to form an arc surface, or the side of the second light-transmitting colloid facing away from the substrate is bent to form an arc surface.

[0011] In some embodiments, a second metal pattern is formed on the second line surface, and the second metal pattern also includes a positive electrode line and a negative electrode line extending along the first direction; the LED filament further includes: a plurality of second chip pads, the plurality of second chip pads are arranged along the first direction, and the second chip pads are electrically connected to the positive electrode line or the negative electrode line of the second metal pattern; a second light-emitting module, the second light-emitting module including a plurality of second light-emitting chips, each second light-emitting chip being soldered to at least one second chip pad.

[0012] In some embodiments, the second light-emitting module is disposed on the second line surface and is opposite to the first light-emitting module; wherein at least a portion of the projection of the second chip pad on the substrate does not coincide with the projection of the first chip pad on the substrate; at least a portion of the projection of the second light-emitting chip on the substrate does not coincide with the projection of the first light-emitting chip on the substrate.

[0013] In some embodiments, the plurality of second chip pads include a plurality of second positive chip pads and a plurality of second negative chip pads, which are arranged alternately along a second direction; the positive and negative electrodes of at least one second light-emitting chip are respectively soldered to adjacent second positive chip pads and second negative chip pads.

[0014] In some embodiments, at least one fixing through hole is provided at the end of the LED filament along the extension direction of the first direction or the opposite direction, and the fixing through hole is used to straighten the LED filament; at least one guiding through hole is provided at the end of the LED filament along the extension direction of the first direction or the opposite direction, and the guiding through hole is used to cut the LED filament.

[0015] Secondly, this application provides an integrated board, on which multiple LED filaments as described in any embodiment of this application are integrated, and the integrated board is used to cut multiple LED filaments; The integrated board has multiple fixing through holes along the extension direction of the multiple LED filaments in the first direction and in the opposite direction. These fixing through holes are used to straighten the LED filaments; or... The integrated board has at least one guide hole along the extension direction of the first direction or the opposite direction, the guide hole being used to facilitate the cutting of the LED filament.

[0016] Thirdly, this application provides a drifting tail assembly, which includes an LED filament as described in any embodiment of this application.

[0017] Fourthly, this application provides a luminous fishing float, which includes an LED filament as described in any embodiment of this application or a detachable float tail assembly as described in any embodiment of this application.

[0018] This application provides an LED filament that, on the one hand, through a metal pattern design, structurally arranges the positive and negative electrodes to extend along a first direction, and places multiple chip pads between the positive and negative electrodes. In terms of process and structure, it reliably achieves potential management of multiple chip pads without the need for multi-layer etching or jumper vias. Specifically, it can control the potential of at least one end of multiple light-emitting chips to be equal or to achieve parallel connection, avoiding problems such as uneven light effect, difficulty in control, easy conduction of mechanical failure into circuit failure, and poor reliability caused by cascading attenuation of voltage and electrical signals, thus making the light effect of the luminous float clear and controllable. On the other hand, by placing multiple chip pads between the positive and negative electrodes, the light-emitting core... The elimination of the need for metal patterns such as positive and negative lines between the chips allows for a significant increase in the density of the chip pads and the light-emitting chips. This reduces the dispersion of the light source, resulting in a linear or planar overall light effect that is softer and more balanced, avoiding issues such as cross-contamination, blurring, and ghosting. Furthermore, by placing the chip pads between the positive and negative lines extending along the first direction, it not only makes it possible to etch and integrally form the chip pads with the first metal pattern in a single process, but also greatly enhances the mechanical strength of the electrical connection. This allows for thinner filaments and significantly reduces the difficulty of creating vias and accurately soldering them onto the pads, thereby improving process yield and overall reliability.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of an LED filament provided in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of the first circuit surface of an LED filament provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the second circuit surface of an LED filament provided in an embodiment of this application; Figure 4This is a side view schematic diagram of the die-bonding structure of an LED filament provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of an integrated board provided in one embodiment of this application; Figure 6 This is a schematic diagram of the structure of a luminous fishing float provided in an embodiment of this application.

[0022] Figure label: X: First direction; Y: Second direction; 100. LED filament; 200. Float tip assembly; 300. Illuminated fishing float; 400. Integrated board; 10. Substrate; 12. Circuit section; 13. First circuit surface; 14. Second circuit surface; 21. First metal pattern; 22. Second metal pattern; 23. Positive electrode line; 24. Negative electrode line; 31. First light-emitting module; 311. First light-emitting chip; 32. Second light-emitting module; 321. Second light-emitting chip; 51. First transparent colloid; 52. Second transparent colloid; 53. Curved surface; 61. First chip pad; 611. First positive electrode chip pad; 612. First negative electrode chip pad; 62. Second chip pad; 621. Second positive electrode chip pad; 622. Second negative electrode chip pad; 74. Fixed through hole.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should also be understood that the terminology used in this application specification is merely for describing specific realities within the scope of this application. It is important to understand that terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used solely for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] Large fish are more active in nearshore waters at night, and the waters are cooler and calmer than during the day, attracting many professional anglers. However, night fishing places extremely high demands on floats, and traditional luminous floats are often insufficient to meet the stringent requirements of professional anglers. Specifically, the following problems exist: To save costs, mainstream luminous fishing floats often use luminous technology based on luminescent paint. However, luminescent paint itself is limited by external environmental factors such as temperature. In colder or hotter latitudes or seasons, it is easy to have problems such as low brightness and poor light uniformity. When casting at a distance, it is easy to see problems such as the tail breaking off. Moreover, it has poor impact resistance and salt spray resistance. Once the paint film is worn or the thickness is uneven, a permanent dark area will form in that section, causing cross-seeing and mixed-seeing.

[0028] Furthermore, since larger fish are more active at night, most anglers primarily target larger species like crucian carp, common carp, grass carp, and silver carp when night fishing. However, large fish exert considerable force, easily causing the float tip to bend. This poses a significant challenge to the mechanical strength of the circuitry and electrical connections, as well as the reliability of the luminous float.

[0029] In addition, professional anglers have very high requirements for the light effect of luminous fishing floats when night fishing. Especially for anglers with poor eyesight or astigmatism, due to the limitations of current SMT technology and electronic device technology, luminous fishing floats based on LED light-emitting technology are either too thick and have too low sensitivity, or have poor light effect and often have problems such as glare, which make it difficult to meet their professional needs for night fishing.

[0030] To address the aforementioned problems, this application proposes an LED filament. Please refer to [link / reference]. Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of an LED filament provided in one embodiment of this application. Figure 2 This is a schematic diagram of the structure of the first circuit surface of an LED filament (without die bonding) provided in an embodiment of this application. Figure 3 This is a schematic diagram (without die bonding) of the second circuit surface of an LED filament according to an embodiment of this application. The LED filament 100 may include a substrate 10, a first metal pattern 21, a plurality of first chip pads 61, and a first light-emitting module 31. The substrate 10 has a circuit portion 12 extending along a first direction and has opposing first circuit surfaces 13 and second circuit surfaces 14. It should be understood that the circuit portion 12 may be disposed within the hollow tube of the float tail of the light-emitting float 300.

[0031] In some embodiments, a first metal pattern 21 is disposed on a first line surface 13. The first metal pattern 21 may include a positive electrode line 23 and a negative electrode line 24 disposed along a first direction. A plurality of first chip pads 61 are arranged along the first direction between the positive electrode line 23 and the negative electrode line 24 of the first metal pattern 21. It should be understood that by arranging all chip pads between the positive electrode line 23 and the negative electrode line 24 extending in the first direction, a single etching pass can simultaneously form the pads and the positive electrode line 23 and the negative electrode line 24, eliminating the need for multi-layer wiring, jumpers, or vias, thereby facilitating potential distribution. Based on this, the same-side terminals of multiple light-emitting chips can be made to be at the same potential or directly connected in parallel, avoiding uneven brightness, control instability, and circuit failure induced by mechanical failure caused by cascading voltage drop and signal attenuation, thereby improving the optical consistency and reliability of the light-emitting float 300.

[0032] Specifically, multiple first chip pads 61 are electrically connected to the positive line 23 of the first metal pattern 21, or multiple first chip pads 61 are electrically connected to the negative line 24 of the first metal pattern 21. It should be understood that the electrical connection layout of placing pads between the positive line 23 and the negative line 24 can eliminate the need for additional metal patterns between the chip pads for connecting the positive line 23 and the negative line 24, allowing the light-emitting chips to be closely arranged, reducing the dispersion of the light source, realizing continuous linear or planar light emission, avoiding cross-eye, mixed eye and ghosting, making the light effect softer and more consistent, and avoiding glare for anglers using the luminous float 300 when night fishing. Furthermore, this design makes it possible to form an integral, same-layer metal structure with the solder pads, positive electrode line 23, and negative electrode line 24 in the manufacturing process. This further increases the electrical connection cross-section, improves mechanical strength, reduces the difficulty of subsequent opening and welding while reducing the filament cross-section, improves process yield and overall reliability, and reduces the weight ratio of the luminous float 300, thereby increasing the sensitivity of the luminous float 300.

[0033] In some embodiments, the first light-emitting module 31 includes a plurality of first light-emitting chips 311, each first light-emitting chip 311 being soldered to at least one first chip pad 61. It should be understood that indirectly electrically connecting the light-emitting chips to the positive electrode line 23 or the negative electrode line 24 via the chip pads can form a transition region between the electrode line and the chip, reducing the risk of fatigue cracks caused by thermal expansion and contraction of the metal pattern or solder joint. Furthermore, the pads and electrode lines can be integrated into the same layer, avoiding the introduction of additional interconnect layers, simplifying the process and retaining low-resistance paths. This ensures that the potential at at least one end of the chip is uniformly controlled by the electrode line, achieving parallel or equipotential configuration and suppressing brightness unevenness caused by cascade voltage drops.

[0034] Understandably, for the LED filament 100 provided in this application, on the one hand, through the design of the metal pattern, the positive electrode line 23 and the negative electrode line 24 are structurally arranged to extend along the first direction, and multiple chip pads are set between the positive electrode line 23 and the negative electrode line 24. In terms of process and structure, it is possible to reliably achieve potential management of multiple chip pads without multi-layer etching or jumper vias. In particular, it can control the potential of at least one end of multiple light-emitting chips to be equal or to achieve parallel connection, avoiding problems such as uneven light effect, difficulty in control, easy conduction of mechanical failure into circuit failure, and poor reliability caused by the cascading attenuation of voltage and electrical signal. This makes the light effect of the light-emitting float 300 clear and controllable. On the other hand, by setting multiple chip pads between the positive electrode line 23 and the negative electrode line 24, This arrangement eliminates the need for metal patterns such as positive and negative lines 23 and 24 between the light-emitting chips, significantly increasing the density of the chip pads and the light-emitting chips. This reduces the dispersion of the light source, resulting in a linear or planar overall light effect that is softer and more balanced, avoiding issues such as cross-contamination, blurring, and ghosting. Furthermore, by placing the chip pads between the positive and negative lines 23 and 24 extending along the first direction, it not only makes it possible to etch and integrally form the chip pads with the first metal pattern 21 in one step, but also greatly improves the mechanical strength of the electrical connection. This allows for thinner filaments and significantly reduces the difficulty of creating vias and accurately soldering on the pads, improving process yield and overall reliability.

[0035] In some embodiments, at least a portion of the positive electrode line 23 of the first metal pattern 21 extends along a first side of the first circuit surface 13, and at least a portion of the negative electrode line 24 of the first metal pattern 21 extends along a second side of the first circuit surface 13. The first and second sides of the first circuit surface 13 are two sides extending along a first direction on the first circuit surface 13, and are two opposite sides of the first circuit surface 13. It is understood that the first and second sides may include edge portions on the first circuit surface 13, or side edges of the circuit portion 12 extending along the first direction. It should be understood that by arranging the positive electrode 23 and the negative electrode 24 on the two opposite edges of the first line surface 13 extending along the first direction, a continuous and unobstructed centrally located area can be formed between the electrode lines, allowing the chip pads and the light-emitting chip to connect to the positive and negative electrodes with the shortest path, reducing the additional impedance caused by the circuit detour; the edge positioning also makes the positive and negative electrode lines 24 naturally form a pair of parallel reference surfaces, providing a visible positioning reference for subsequent packaging or coating processes, reducing soldering offset or uneven packaging thickness caused by alignment deviation; at the same time, the outer edge of the electrode line coincides with the physical boundary of the line section 12, eliminating the need for additional reserved spacing, reducing the overall width of the line section 12, improving the radial space utilization of the light-emitting float 300, and reducing the amount of dripping and solidifying adhesive materials, reducing costs, making the filament lighter, reducing the weight ratio of the light-emitting float 300, and improving the sensitivity of night fishing.

[0036] In some embodiments, the chip pads can be divided into positive and negative chip pads. The positive chip pad is formed by the bifurcated extension of the positive electrode line 23 towards the negative electrode line 24. The positive chip pad is used to solder the positive electrode of the light-emitting chip. The negative chip pad is formed by the bifurcated extension of the negative electrode line 24 towards the positive electrode line 23. The negative chip pad is used to solder the negative electrode of the light-emitting chip. It should be understood that the positive and negative chip pads are formed by the corresponding electrode lines extending in opposite directions, and can be formed synchronously with the electrode lines in the same etching process. Direct docking of the chip electrode and the electrode line can be achieved without additional bridges or jumpers, shortening the current path and reducing series impedance. The bifurcated extension keeps the root of the pad and the electrode line body in a continuous metal cross section, improving mechanical support strength. When the chip is thermally expanded or bent, the stress can be dispersed through the bifurcated structure, reducing the risk of pad peeling. The opposing layout also forms a fixed spacing between the positive and negative pads, providing a self-alignment reference for chip mounting and reducing polarity reversal or cold solder joints caused by mounting deviations.

[0037] For example, please refer to Figure 2 and Figure 3The plurality of first chip pads 61 include a plurality of first positive chip pads 611, wherein the plurality of first positive chip pads 611 are formed by the branching extension of the positive line 23 of the first metal pattern 21 to the negative line 24, and each first positive chip pad 611 is soldered to at least the positive electrode of a first light-emitting chip 311.

[0038] For example, the plurality of chip pads include a plurality of first negative electrode chip pads 612, wherein the plurality of first negative electrode chip pads 612 are formed by the branching extension of the negative electrode line 24 of the first metal pattern 21 toward the positive electrode line 23, and each first negative electrode chip pad 612 is soldered to at least one negative electrode of a first light-emitting chip 311.

[0039] In some embodiments, the plurality of first chip pads 61 include a plurality of first positive chip pads 611 and a plurality of first negative chip pads 612, which are alternately arranged along a first direction. It should be understood that the alternating arrangement of the positive and negative chip pads ensures that the positive and negative electrodes of adjacent chips are spatially close, greatly reducing the gap between adjacent pads, thereby reducing the span between light-emitting chips, avoiding additional impedance introduced by long lines, and achieving better anti-glare effect due to the dense light source. Furthermore, similar or consistent alternating pitch ensures that the power supply circuit length of each chip is the same, balancing voltage drop and suppressing brightness gradients. In addition, the alternating gaps form equidistant physical barriers, providing an alignment reference for subsequent cutting or dicing, and blocking the accumulation of thermal expansion of continuous metal layers, reducing warping stress of the electrode lines during high-temperature reflow or mechanical bending, and maintaining stable electrical connections.

[0040] In some embodiments, multiple light-emitting chips can be arranged in the same direction for die bonding to improve process yield and prevent polarity reversal, such as "+-, +-, +-, +-, +-, +-". For example, the positive and negative electrodes of at least one first light-emitting chip 311 can be soldered to adjacent first positive electrode chip pads 611 and first negative electrode chip pads 612, respectively. It should be understood that by ensuring all light-emitting chips maintain the same "+-" orientation and are sequentially soldered across adjacent positive and negative electrode pads, the mounting head only needs to maintain a fixed angle, eliminating the need for additional rotation or visual polarity determination, thus preventing reverse pick-up. The opposing bifurcation of the positive and negative electrode pads provides natural alignment limits for the chip electrodes, and the mounting offset is automatically corrected by the outer edge of the pads, reducing the probability of electrode dangling and bridging. The continuous "+-, +-, +-" arrangement ensures that the chip pitch strictly corresponds to the pad period, guaranteeing that the power supply path of each chip is of equal length, the current is evenly distributed, and the brightness is consistent. At the same time, the unified orientation ensures that the light-emitting surfaces face the same direction, eliminating the need for secondary orientation adjustment in subsequent optical packaging, improving the overlap of the light-emitting axis, and eliminating dark spots or color shifts caused by reversed polarity. Thus, electrical correctness and optical consistency are achieved simultaneously in the die bonding process, improving the overall process yield.

[0041] In some embodiments, multiple light-emitting chips can be die-bonded in alternating opposite directions, such as "+-, -+, +-, -+, +-". For example, the positive electrodes of at least two adjacent first light-emitting chips 311 are connected to the same first positive electrode pad 611, or the negative electrodes of at least two adjacent first light-emitting chips 311 are connected to the same first negative electrode pad 612. It should be understood that when die-bonding is performed in alternating opposite directions, the positive or negative electrodes of adjacent chips share the same positive or negative electrode pad. This pad only needs to carry the current of the two chips according to the design area, and the two chips can be connected in parallel without additional bridging. Furthermore, sharing the pad also reduces the distance between the electrodes of adjacent chips to the width of one pad, further improving the arrangement density.

[0042] In some embodiments, the projected positions of the second light-transmitting colloid 52 and the first light-transmitting colloid 51 may overlap, enabling the LED filament 100 to form a three-dimensional light effect. The substrate 10 may be a light-transmitting substrate 10, and the LED filament 100 may further include the first light-transmitting colloid 51 and the second light-transmitting colloid 52. The first light-transmitting colloid 51 is disposed on the first circuit surface 13 and covers the first light-emitting module 31, the second light-transmitting colloid 52 is disposed on the second circuit surface 14, and at least a portion of the projection of the second light-transmitting colloid 52 onto the light-transmitting substrate 10 overlaps with at least a portion of the projection of the first light-transmitting colloid 51 onto the light-transmitting substrate 10. It should be understood that the light-transmitting substrate 10, together with the double-sided light-transmitting colloid, forms a symmetrical covering structure, so that the light emitted by the first light-emitting module 31 can not only be emitted in the forward direction through the first light-transmitting colloid 51, but also penetrate the substrate 10 and be emitted in the reverse direction through the second light-transmitting colloid 52, thereby expanding the range of light emission angle. Thus, only single-sided die bonding can form three-dimensional light effects such as double-sided light emission, cylindrical lamps, and long strip lamps, which greatly simplifies the process and reduces costs.

[0043] In some embodiments, the scattering can be further optimized by leveraging the optical properties of the light-transmitting colloid itself, such as by creating a frosted surface. This results in clear, soft, and balanced light effects on both sides, providing anglers in any position with a clear and distinct visual experience, thus enabling them to more accurately detect bite signals using the luminous float 300. For example, the diffusing agent content of the first light-transmitting colloid 51 can be higher than that of the second light-transmitting colloid 52. Alternatively, the phosphor content of the second light-transmitting colloid 52 can be lower than that of the first light-transmitting colloid 51. Furthermore, both the diffusing agent and phosphor content of the first light-transmitting colloid 51 can be higher than those of the second light-transmitting colloid 52. It should be understood that the first light-transmitting colloid 51 has a higher diffusing agent content than the second light-transmitting colloid 52, which can immediately form a frosted surface scattering on the light-emitting side of the chip, converting the point light source into a surface light source and eliminating frontal glare. The second light-transmitting colloid 52 has a lower diffusing agent content, maintaining moderate transmission. Although the reverse light is attenuated when passing through the light-transmitting substrate 10, it can still be uniformly diffused in the second light-transmitting colloid 52. Furthermore, since the transmittance of the second light-transmitting colloid 52 is better than that of the first light-transmitting colloid 51, it can prevent a dark area from forming on one side of the luminous fishing float 300. The difference in diffusing agent concentration on both sides makes the light intensity on both sides balanced and soft, meeting the requirement of consistent visual perception from the perspective of night fishing.

[0044] For further information, please refer to the following: Figure 1 The first light-transmitting colloid 51 is bent towards the substrate 10 on the side facing away from the substrate 10 to form an arc surface 53, or the second light-transmitting colloid 52 is bent towards the substrate 10 on the side facing away from the substrate 10 to form an arc surface 53. It should be understood that the arc surface 53 structure changes the interface between the colloid and air from a planar surface to a convex surface. According to Snell's law, the incident angle of large-angle incident light decreases at the convex surface, the total internal reflection ratio decreases, side light is refracted out, the emission angle increases, the brightness of the float tip from the side is improved, and a more uniform and clearer cylindrical light effect is formed. Furthermore, because the arc-shaped cross-section, thicker at the center and thinner at the edges, increases the contact area between the colloid and air, it improves convection heat dissipation efficiency, reduces chip junction temperature, and delays light decay. In addition, because the arc surface 53 has no sharp edges, stress is dispersed when the rod impacts, reducing the risk of colloid breakage and improving the reliability of night fishing.

[0045] In some embodiments, the light-transmitting substrate 10 includes at least one of a transparent FPC substrate 10, a transparent CPI substrate 10, and a BT resin substrate 10. For example, the light-transmitting substrate 10 can be a transparent CPI substrate 10. It should be understood that the high light transmittance of the transparent CPI substrate 10 can reduce light loss within the substrate 10, ensuring that the luminous float 300 outputs sufficient luminous flux under the same driving current, meeting the requirements for long-distance visibility, and is particularly suitable for products with single-sided die bonding and double-sided light emission. Furthermore, its glass transition temperature is higher than the reflow soldering peak, maintaining a colorless float under the influence of day and night temperature differences, ensuring consistent light color throughout the night, and preventing anglers from misjudging the float signal due to color changes. In addition, its low moisture absorption rate inhibits water vapor penetration, reduces the stress on the metal wires caused by the expansion of the substrate 10, prevents circuit breakage after continuous casting, and ensures reliability for all-night operation. Moreover, its low modulus allows the substrate 10 to deform with the bending of the float body, without creases after storage or collision with fish, maintaining electrical continuity, and is suitable for frequent retrieval and carrying during night fishing.

[0046] In some embodiments, the three-dimensional luminescence effect of the luminescent float 300 can be improved by double-sided die bonding. For example, please refer to... Figure 2 , Figure 3 and Figure 4 , Figure 4 This is a side view schematic diagram of the die-bonding structure of an LED filament according to an embodiment of this application. The LED filament 100 may further include a plurality of second chip pads 62 and a second light-emitting module 32. The second light-emitting module 32 includes a plurality of second light-emitting chips 321, and each second light-emitting chip 321 is soldered to at least one second chip pad 62. A second metal pattern 22 may be formed on the second circuit surface 14. The second metal pattern 22 also includes a positive electrode line 23 and a negative electrode line 24 extending along a first direction. The plurality of second chip pads 62 are arranged along the first direction, and the second chip pads 62 are electrically connected to the positive electrode line 23 or the negative electrode line 24 of the second metal pattern 22. It should be understood that by arranging the second metal pattern 22 on the second circuit surface 14 and die-bonding the second light-emitting module 32 thereon, a back-to-back symmetrical structure can be formed with the first light-emitting module 31 on the first circuit surface 13. Furthermore, the copper foil on both sides of the substrate 10 serves as a current-carrying conductor, doubling the total cross-sectional area, reducing current density, lowering temperature rise, and mitigating light decay in high-temperature and high-humidity nighttime environments. Double-sided die bonding disperses the heat source on both sides of the substrate 10, ensuring symmetrical heat transfer along the thickness direction, reducing warping caused by thermal gradients, preventing fatigue cracking of the metal wires, and ensuring electrical stability during all-night fishing. Moreover, the symmetrical layout allows the filament's center of mass to be located at the geometric midline, preventing additional rotational inertia due to unilateral weight bias after assembly onto the float tip, improving casting accuracy and float stability, and meeting the needs of night fishing for long-distance casting and precise float movement identification.

[0047] Furthermore, a light-transmitting substrate 10 can also be used in the case of double-sided die bonding. With this configuration, light can be radiated in opposite directions through the first light-transmitting colloid 51 and the second light-transmitting colloid 52 respectively, and then transmitted through the light-transmitting substrate 10 to each other, eliminating the directional dark area formed by the substrate 10 blocking during single-sided die bonding, and realizing full-circumference light emission in the horizontal direction.

[0048] In some embodiments, the plurality of second chip pads 62 may include a plurality of second positive chip pads 621 and a plurality of second negative chip pads 622, which are alternately arranged along a first direction. At least one second light-emitting chip 321 has its positive and negative electrodes soldered to adjacent second positive chip pads 621 and second negative chip pads 622, respectively. This arrangement, through the alternating arrangement of positive and negative chip pads, ensures that the positive and negative electrodes of adjacent chips are spatially close, greatly reducing the gap between adjacent pads and thus reducing the span between light-emitting chips. This avoids the additional impedance introduced by long lines, and due to the dense light source, it significantly reduces the effect of discrete light spots, forming linear and planar light effects, resulting in better anti-glare performance.

[0049] In some embodiments, please refer to Figure 5 , Figure 5 This is a schematic diagram of an integrated board according to an embodiment of this application. It should be understood that at least one fixing through-hole 74 can be provided at the end of the LED filament 100 along the extension direction of the first direction or the opposite direction. This fixing through-hole 74 can be used to straighten the LED filament 100. It should be understood that the fixing through-hole 74 can be provided on the LED filament 100 or on the integrated board 400 integrating multiple LED filaments 100. It should be understood that the fixing through-hole 74 can cooperate with fixture components such as fixing pins to straighten the LED filament 100 during the dispensing process and ensure accurate and reliable subsequent drying and molding. For example, a fixing through-hole 74 penetrating the substrate 10 can be provided at the end of the LED filament 100. Before the dispensing process, a fixing pin is inserted into the through-hole and tension is applied to maintain the straightness of the filament in the first direction. The tension state can suppress the micro-bending of the substrate 10 caused by the flow of the adhesive, ensuring uniform thickness distribution after the light-transmitting adhesive is cured and avoiding local light intensity differences. Furthermore, since the fixing through-hole 74 is located in the blank area of ​​the copper foil on the substrate 10, and since there are no traces on the hole wall of the fixing through-hole 74, tension stress concentration on the metal pattern can be avoided, preventing electrode wire breakage. After the colloid is cured and the fixing pin is removed, the remaining through-hole will not affect the appearance and electrical characteristics of the filament, meeting the requirements of optical consistency and mechanical reliability for the night fishing luminous float 300. Moreover, since it is opened on the integrated board, multiple fixing through-holes 74 can be used to straighten multiple LED filaments 100, so the positional accuracy does not need to be too high, thereby saving process costs.

[0050] This application also proposes an integrated plate 400, on which multiple LED filaments 100 as described in any embodiment of this application are integrated. The integrated plate 400 can be used to cut multiple LED filaments 100. In some embodiments, the integrated plate 400 has multiple fixing through holes 74 along the extension direction of the multiple LED filaments 100 in a first direction and in the opposite direction. The fixing through holes 74 are used to straighten the LED filaments 100. It should be understood that by using the integrated plate 400 for straightening and applying adhesive, the production efficiency of the luminous fishing float 300 and the LED filaments 100 can be greatly improved. Furthermore, multiple models of LED filaments 100 can be formed in one integrated plate 400, thereby meeting the actual delivery needs of professional anglers who purchase sets of different luminous fishing floats 300. Specifically, fixing through holes 74 can be arranged in rows along the filament axis at both ends of the integrated board 400. Fixing pins can be inserted at once while the board is in its entirety, and all filaments can be tensioned simultaneously. Then, double-sided glue application and curing are completed. The whole-board straightening solution eliminates the step of clamping individual filaments one by one, improving the output per unit time. It also ensures the consistency of adhesive thickness, arc contour, and optical axis within the batch by using a shared positioning reference, reducing color difference and light distribution dispersion. Different filament sections can be divided according to pitch within the integrated board 400. Multiple models with different lengths, chip numbers, or luminous colors can be formed in the same process. After cutting, they are packaged in sets, enabling the delivery of a series of luminous fishing floats 300 suitable for different fishing conditions such as long casting, near-shore, and micro-lead fishing with a single order. This meets the diverse configuration needs of professional anglers, while reducing material turnover and repetitive process settings, improving overall manufacturing efficiency and inventory turnover rate.

[0051] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of a luminous fishing float according to an embodiment of this application. This application also proposes a float tip assembly 200, which may include an LED filament 100 as described in any embodiment of this application. It should be understood that the LED filament 100 has the advantages of soft light and clear visibility in terms of luminous efficacy; it is also advantageous in terms of its slim, lightweight, flexible, and reliable structure; it has the advantages of controllable cost and high yield in terms of manufacturing process; and it has the advantages of stable function and good battery life in terms of circuitry. The float tip assembly 200 also has the advantages of being slim, lightweight, flexible, and reliable.

[0052] This application also proposes a luminous fishing float 300, which may include an LED filament 100 as described in any embodiment of this application. The luminous fishing float 300 may also be detachably equipped with a float tip assembly 200 as described in any embodiment of this application. It should be understood that the luminous fishing float 300 can be fitted with the float tip assembly 200 via a standardized plug-in interface, allowing for quick replacement when the float body is damaged or the battery is depleted, eliminating the need to carry the entire float set and meeting the needs of continuous night fishing operations. Multiple specifications of float tip assemblies 200 can be used on the same float body, with the length or luminous color switched as needed to adapt to different water depths, wave conditions, and the visual sensitivity of different fish species, achieving multi-purpose use of a single float and improving the versatility and economy of the equipment.

[0053] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0054] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0055] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. An LED filament, characterized in that, The LED filament includes: A substrate having a circuit portion extending along a first direction, the substrate having opposing first circuit surfaces and second circuit surfaces; A first metal pattern is disposed on the first line surface, and the first metal pattern includes a positive line and a negative line extending along the first direction. A plurality of first chip pads are arranged along the first direction between the positive line and the negative line of the first metal pattern, and the plurality of first chip pads are electrically connected to the positive line or the negative line of the first metal pattern. The first light-emitting module includes a plurality of first light-emitting chips, each of which is soldered to at least one first chip pad.

2. The LED-filament of claim 1, wherein At least a portion of the positive electrode line of the first metal pattern extends to a first side of the first line surface, and at least a portion of the negative electrode line of the first metal pattern extends to a second side of the first line surface. Wherein, the first edge and the second edge of the first line surface are two edges extending along the first direction on the first line surface, and the first edge and the second edge of the first line surface are two opposite edges on the first line surface.

3. The LED-filament of claim 1, wherein The plurality of first chip pads include a plurality of first positive electrode chip pads, wherein the plurality of first positive electrode chip pads are formed by the branching extension of the positive electrode line of the first metal pattern towards the negative electrode line, and each first positive electrode chip pad is soldered to at least one positive electrode of the first light-emitting chip; or... The plurality of chip pads include a plurality of first negative electrode chip pads, wherein the plurality of first negative electrode chip pads are formed by the branching extension of the negative electrode line of the first metal pattern toward the positive electrode line, and each first negative electrode chip pad is soldered to at least one negative electrode of the first light-emitting chip.

4. The LED-filament of claim 3, wherein, The plurality of first chip pads include the plurality of first positive chip pads and the plurality of first negative chip pads, which are arranged alternately along the first direction.

5. The LED-filament of claim 3, wherein, At least one of the positive and negative electrodes of the first light-emitting chip is soldered to adjacent first positive electrode chip pads and first negative electrode chip pads, respectively; or, At least two adjacent first light-emitting chips have their positive electrodes connected to the same first positive electrode pad, or at least two adjacent first light-emitting chips have their negative electrodes connected to the same first negative electrode pad.

6. The LED filament as described in claim 1, characterized in that, The substrate is a light-transmitting substrate, and the LED filament further includes: A first light-transmitting colloid is disposed on the first circuit surface and covers the first light-emitting module; A second light-transmitting colloid is disposed on the second circuit surface, and at least a portion of the projection of the second light-transmitting colloid on the light-transmitting substrate coincides with at least a portion of the projection of the first light-transmitting colloid on the light-transmitting substrate.

7. The LED filament as described in claim 6, characterized in that, The light-transmitting substrate includes at least one of a transparent FPC substrate, a transparent CPI substrate, and a BT resin substrate.

8. The LED filament as described in claim 6, characterized in that, The diffusing agent content of the first light-transmitting colloid is higher than that of the second light-transmitting colloid, or the phosphor content of the second light-transmitting colloid is lower than that of the first light-transmitting colloid.

9. The LED filament as described in claim 6, characterized in that, The first light-transmitting colloid is bent to the substrate on the side facing away from the substrate to form an arc surface, or the second light-transmitting colloid is bent to the substrate on the side facing away from the substrate to form an arc surface.

10. The LED filament as described in claim 1, characterized in that, A second metal pattern is formed on the second circuit surface, and the second metal pattern also includes a positive electrode line and a negative electrode line extending along the first direction; the LED filament further includes: A plurality of second chip pads are arranged along the first direction, and the second chip pads are electrically connected to the positive line or the negative line of the second metal pattern. The second light-emitting module includes a plurality of second light-emitting chips, each of which is soldered to at least one second chip pad.

11. The LED filament as described in claim 10, characterized in that, The plurality of second chip pads include a plurality of second positive chip pads and a plurality of second negative chip pads, and the plurality of second positive chip pads and the plurality of second negative chip pads are alternately arranged along the first direction; At least one of the positive and negative electrodes of the second light-emitting chip is soldered to adjacent second positive electrode chip pads and second negative electrode chip pads, respectively.

12. The LED filament as described in any one of claims 1-11, characterized in that, At least one fixing through hole is provided at the end of the LED filament along the extension direction of the first direction or the opposite direction, and the fixing through hole is used to straighten the LED filament.

13. An integrated board, characterized in that, The integrated board integrates multiple LED filaments as described in any one of claims 1-11, and the integrated board is used to cut the multiple LED filaments; The integrated board has multiple fixing through holes along the extension direction of the first direction of the multiple LED filaments and the opposite direction, and the fixing through holes are used to straighten the LED filaments.

14. A drift tail assembly, characterized in that, The drift tail assembly includes an LED filament as described in any one of claims 1-11.

15. A luminous fishing float, characterized in that, The luminous fishing float includes an LED filament as described in any one of claims 1-11 or a float tail assembly detachably provided as described in claim 14.

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