A photovoltaic module encapsulation structure, a photovoltaic module, and a power generation system.
By using a thin sealing layer and side sealing layer structure, the problem of high-temperature damage to perovskite solar cells caused by glass encapsulation is solved, maintaining photoelectric conversion efficiency and stability. This makes the cells suitable for electronic products and mobile photovoltaic charging products, while reducing costs.
Patent Information
- Application Number
- CN202521076747.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-29
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2035-05-29
AI Technical Summary
Existing glass encapsulation methods cause irreversible damage to perovskite solar cells during high-temperature processing, affecting photoelectric conversion efficiency and stability. At the same time, the encapsulation material releases substances that cause chemical reactions, and the overall weight increases after encapsulation.
It employs a thin sealing layer and side sealing layer structure, including adhesive film, butyl rubber film, laminated encapsulating film, polymer film, etc., to form a sealed structure through lamination and bonding, avoiding high-temperature treatment and maintaining the high efficiency and stability of perovskite.
It achieves a better sealing performance, a lighter and thinner encapsulation structure, maintains the high efficiency and stability of perovskite, and reduces the cost of photovoltaic modules, making it suitable for electronic products and mobile photovoltaic charging products.
Smart Images

Figure CN224947960U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photovoltaic module technology, and in particular to a photovoltaic module packaging structure, a photovoltaic module, and a power generation system. Background Technology
[0002] To prevent damage to the perovskite structure or other functional layers in photovoltaic modules from the external environment, encapsulation is one of the effective solutions. Glass encapsulation is the most widely used encapsulation method—using two 3 mm thick glass sheets to cover the cell, with vinyl acetate (EVA) as the bottom and top encapsulant and butyl rubber as the edge sealing material. The edge sealing material is softened and the encapsulant is cured by applying pressure of 1000 mbar at 140°C for 20 minutes. Glass encapsulation is a simple and low-cost process that can effectively improve the stability of the cell.
[0003] However, to achieve high-performance encapsulation, most backplane glass needs to be combined with polymer materials for encapsulation. However, the high-temperature processing during encapsulation can cause irreversible damage to the perovskite film, functional materials, and additives, and the substances released from the encapsulation materials can cause chemical reactions, thus affecting the photoelectric conversion efficiency and stability of perovskite solar cells. Furthermore, the glass itself has a certain thickness and weight, increasing the overall weight of the perovskite solar cell and reducing its photoelectric conversion efficiency.
[0004] Therefore, there is an urgent need to develop a packaging structure that does not reduce the photoelectric conversion efficiency and stability of perovskite solar cells, so as to meet the industrialization requirements of high-efficiency, large-area, and low-cost perovskite photovoltaic modules. Utility Model Content
[0005] Therefore, it is necessary to provide a photovoltaic module encapsulation structure, photovoltaic module, and power generation system to address issues such as high-temperature encapsulation exceeding the tolerance temperature of perovskite, high-cost encapsulation, and excessive overall thickness after glass encapsulation.
[0006] A photovoltaic module encapsulation structure includes a substrate and a seal and / or a backsheet, and a photovoltaic cell encapsulated between the substrate and the seal; the seal includes at least one sealing layer and at least one side sealing layer and / or a bottom sealing layer.
[0007] Compared to traditional photovoltaic modules, the aforementioned encapsulation structure offers superior sealing performance, is lightweight and thin, and possesses excellent waterproofing, making it more suitable for applications in electronic products and mobile photovoltaic charging devices. This structure can effectively maintain the high efficiency and stability of perovskite while reducing the cost of photovoltaic modules.
[0008] In one embodiment, the photovoltaic module's encapsulation structure includes the substrate, the photovoltaic cell, and the sealing layer stacked sequentially; the backplate is disposed on the upper surface of the sealing layer, and the bottom sealing layer is disposed on the lower surface of the substrate; the side sealing layers are disposed on the four sides of the photovoltaic module, forming at least one sealing structure together with the substrate, the sealing layer, and / or the backplate.
[0009] In one embodiment, the sealing layer comprises at least one of an adhesive film, a butyl rubber film, a laminated encapsulating film, and a polymer film; the side sealing layer comprises at least one of the adhesive film and the butyl rubber film; the bottom sealing layer comprises at least one of the adhesive film and the butyl rubber film; the substrate comprises at least one of glass, an ETFE film, a PET film, a PVDF film, a PMMA film, and a composite polymer encapsulating film; and the backplate comprises at least one of glass, an ETFE film, a PET film, a PVDF film, a PMMA film, and a composite polymer encapsulating film.
[0010] In one embodiment, the adhesive film has waterproof, insulating, and adhesive properties. The adhesive film is formed by applying a suitable adhesive, which then solidifies.
[0011] In one embodiment, the adhesive film includes a conformal adhesive curing film, a conformal coating curing film, an insulating adhesive curing film, a silicone-modified polyurethane film, an epoxy resin film, and a silicone gel film; the laminated encapsulation film includes a silicone-modified polyurethane film, an epoxy resin film, and a silicone gel film; the polymer film includes at least one of PI (polyimide) film, PTFE (polytetrafluoroethylene) film, PE (polyethylene) film, PVDF (polyvinylidene fluoride) film, and FEP (perfluoroethylene propylene) film.
[0012] In one embodiment, the photovoltaic cell includes a perovskite photovoltaic cell, which includes a transparent conductive layer, a first charge transport layer, a perovskite light-absorbing layer, a second charge transport layer, and an electrode layer stacked sequentially from bottom to top.
[0013] The sealing layer in this invention does not release substances that chemically react with the perovskite light-absorbing layer or other functional layers of the perovskite photovoltaic cell during or after the curing process, thus effectively maintaining the high efficiency and stability of the perovskite.
[0014] In one embodiment, the perovskite photovoltaic cell is divided into multiple sub-cells by a laser grooving group; the laser grooving group includes P1 laser grooving, P2 laser grooving, and P3 laser grooving; the P1 laser grooving penetrates the transparent conductive layer and is filled with the material of the first charge transport layer; the P2 laser grooving sequentially penetrates the second charge transport layer, the perovskite light-absorbing layer, and the first charge transport layer, and is filled with the material of the electrode layer to make the electrode layer electrically connected to the transparent conductive layer; the P3 laser grooving sequentially penetrates the electrode layer, the second electron transport layer, the perovskite light-absorbing layer, and the first electron transport layer, and is filled with the material of the sealing layer.
[0015] In one embodiment, the system includes the substrate and the sealant, and the photovoltaic cell encased between the substrate and the sealant; the sealant includes at least one sealing layer and at least one side sealing layer.
[0016] In one embodiment, the system includes the substrate and the sealant, and the photovoltaic cell encased between the substrate and the sealant; the sealant includes at least one sealing layer, at least one side sealing layer, and the bottom sealing layer.
[0017] This utility model also provides a photovoltaic module, including the encapsulation structure described in any of the preceding claims.
[0018] This utility model also provides a power generation system, including the photovoltaic module described above.
[0019] Compared with the prior art, the present invention has the following beneficial effects:
[0020] This invention discloses a photovoltaic module encapsulation structure, a photovoltaic module, and a power generation system. Compared with photovoltaic modules with traditional encapsulation structures, this structure offers better sealing performance, is lightweight and thin, and has excellent waterproof performance, making it more suitable for applications in electronic products and mobile photovoltaic charging products. This structure can effectively maintain the high efficiency and stability of perovskite while reducing the cost of photovoltaic modules. During and after curing, the sealing layer does not release substances that chemically react with the perovskite light-absorbing layer or other functional layers of the perovskite photovoltaic cell, effectively preserving the high efficiency and stability of the perovskite. Attached Figure Description
[0021] Figure 1 These are cross-sectional schematic diagrams of the packaging structures in Examples 1 and 2;
[0022] Figure 2 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 2;
[0023] Figure 3 These are schematic cross-sectional views of the packaging structures in Examples 1 and 3.
[0024] Figure 4 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 3;
[0025] Figure 5 These are schematic cross-sectional views of the packaging structures in Examples 1 and 4.
[0026] Figure 6 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 4;
[0027] Figure 7 These are schematic cross-sectional views of the packaging structures in Examples 1 and 5.
[0028] Figure 8 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 5;
[0029] Figure 9 These are cross-sectional schematic diagrams of the packaging structures in Examples 1 and 6;
[0030] Figure 10 These are schematic cross-sectional views of the packaging structures in Examples 1 and 7.
[0031] Figure 11 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 7;
[0032] Figure 12 These are cross-sectional schematic diagrams of the packaging structures in Examples 1 and 8;
[0033] Figure 13 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 8;
[0034] Figure 14 These are cross-sectional schematic diagrams of the packaging structures in Examples 1 and 9;
[0035] Figure 15 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 9;
[0036] Figure 16 These are cross-sectional schematic diagrams of the packaging structures in Examples 1 and 10;
[0037] Figure 17 This is a three-dimensional assembly structure diagram of the packaging structure in Examples 1 and 10.
[0038] Explanation of reference numerals in the attached drawings: 1. Substrate; 21. Sealing layer; 211. First sealing layer; 212. Second sealing layer; 22. Side sealing layer; 221. First side sealing layer; 222. Second side sealing layer; 223. Third side sealing layer; 23. Bottom sealing layer; 3. Backplate; 4. Photovoltaic cell; 41. Transparent conductive layer; 42. First charge transport layer; 43. Perovskite light-absorbing layer; 44. Second charge transport layer; 45. Electrode layer; 46. P1 laser grooving; 47. P2 laser grooving; 48. P3 laser grooving; 5. Busbar. Detailed Implementation
[0039] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0040] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Furthermore, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this utility model. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0042] Example 1
[0043] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, such as... Figures 1-16As shown, it includes a substrate 1 and a seal and / or a backplate 3, and a photovoltaic cell 4 encased between the substrate 1 and the seal; the seal includes at least one sealing layer 21 and at least one side sealing layer 22 and / or a bottom sealing layer 23.
[0044] Specifically, the encapsulation structure of the photovoltaic module includes a substrate 1, a photovoltaic cell 4, and a sealing layer 21 stacked sequentially from bottom to top; a backplate 3 is disposed on the upper surface of the sealing layer 21, and a bottom sealing layer 23 is disposed on the lower surface of the substrate 1; a side sealing layer 22 is disposed on the four sides of the photovoltaic module, forming at least one sealing structure together with the substrate 1, the sealing layer 21, and / or the backplate 3 and / or the bottom sealing layer 23.
[0045] The sealing layer 21 includes at least one of an adhesive film, a butyl rubber film, a laminated encapsulating film, and a polymer film; the side sealing layer 22 includes at least one of an adhesive film and a butyl rubber film; the bottom sealing layer 23 includes at least one of an adhesive film and a butyl rubber film; the substrate 1 includes at least one of glass (transparent glass, colored glass, patterned glass, glass with an anti-reflective coating), ETFE film, PET film, PVDF film, PMMA film, and a composite polymer encapsulating film; the backplate 3 includes at least one of glass (transparent glass, colored glass, patterned glass, glass with an anti-reflective coating), ETFE film, PET film, PVDF film, PMMA film, and a composite polymer encapsulating film.
[0046] Adhesive films have waterproof, insulating and adhesive functions, including conformal adhesive curing films, conformal paint curing films, insulating adhesive curing films, silicone-modified polyurethane films, epoxy resin films, and silicone gel films; laminated encapsulation films include silicone-modified polyurethane films, epoxy resin films, and silicone gel films; polymer films include at least one of PI (polyimide) films, PTFE (polytetrafluoroethylene) films, PE (polyethylene) films, PVDF (polyvinylidene fluoride) films, and FEP (perfluoroethylene propylene) films.
[0047] The photovoltaic cell 4 includes a perovskite photovoltaic cell, which comprises, from bottom to top, a transparent conductive layer 41, a first charge transport layer 42, a perovskite light-absorbing layer 43, a second charge transport layer 44, and an electrode layer 45, stacked sequentially. The first charge transport layer 42 can be a hole transport layer, and the second charge transport layer 44 can be an electron transport layer.
[0048] The perovskite photovoltaic cell is divided into multiple sub-cells by a laser grooving group, and the multiple sub-cells are electrically connected; the laser grooving group includes P1 laser grooving 46, P2 laser grooving 47 and P3 laser grooving 48.
[0049] The P1 laser grooving 46 penetrates the transparent conductive layer 41 and is filled with the material of the first charge transport layer 42.
[0050] The P2 laser grooving 47 sequentially penetrates the second charge transport layer 44, the perovskite light-absorbing layer 43, and the first charge transport layer 42, and is filled with the material of the electrode layer 45 so that the electrode layer 45 is electrically connected to the transparent conductive layer 41.
[0051] The P3 laser grooving 48 sequentially penetrates the electrode layer 45, the second charge transport layer 44, the perovskite light-absorbing layer 43, and the first charge transport layer 42, and is filled with the material of the sealing layer 21.
[0052] The perovskite photovoltaic cell has a busbar 5 on its busbar electrode; both the sealing layer 21 and the back plate 3 have busbar holes. The busbar 5 passes through the busbar holes on the sealing layer 21 and the back plate 3 in sequence to bring out the electrodes of the perovskite photovoltaic cell. The gap between the busbar 5 and the busbar hole is filled with the material of the sealing layer 21.
[0053] Example 2
[0054] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, with the following differences: Figure 1 and Figure 2 As shown: It includes a substrate 1, a sealant and a backplate 3, and a photovoltaic cell 4 encased between the substrate 1 and the sealant; the sealant includes a sealing layer 21 and a side sealing layer 22.
[0055] The sealing layer 21 and the backsheet 3 are sequentially laminated onto the upper surface of the photovoltaic cell 4. The side sealing layer 22 is adhered to the four sides of the photovoltaic cell 4 and the sealing layer 21 with sealant. The upper surface of the side sealing layer 22 is bonded to the four edges of the lower surface of the backsheet 3, and the lower surface of the side sealing layer 22 is bonded to the four edges of the upper surface of the substrate 1. The side sealing layer 22, the sealing layer 21, the substrate 1, and the backsheet 3 form a sealed structure that seals the photovoltaic cell 4 inside.
[0056] Example 3
[0057] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, with the following differences: Figure 3 and Figure 4 As shown: It includes a substrate 1, a sealant and a backplate 3, and a photovoltaic cell 4 encased between the substrate 1 and the sealant; the sealant includes a sealing layer 21, a first side sealing layer 221 and a second side sealing layer 222.
[0058] The sealing layer 21 and the back sheet 3 are sequentially laminated onto the upper surface of the photovoltaic cell 4. The first side sealing layer 221 and the second side sealing layer 222 are adhered to the four sides of the photovoltaic module with sealant. The first side sealing layer 221 is adhered to the four sides of the photovoltaic cell 4 and the sealing layer, and the upper surface of the first side sealing layer 221 is bonded to the four edges of the lower surface of the back sheet 3, and the lower surface of the first side sealing layer 221 is bonded to the four edges of the upper surface of the substrate 1. The first side sealing layer 221, the substrate 1, and the sealing layer 21 together form a first sealing structure to seal the photovoltaic cell 4 inside. The second side sealing layer 222 is adhered to the outer surface of the first side sealing layer 221, and is also bonded to the four sides of the substrate 1 and the back sheet 3 to form a second sealing structure.
[0059] Example 4
[0060] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, except that... Figure 5 and Figure 6 As shown: It includes a substrate 1, a sealant and a backplate 3, and a photovoltaic cell 4 encased between the substrate 1 and the sealant; the sealant includes a sealing layer 21, a first side sealing layer 221 and a second side sealing layer 222.
[0061] The sealing layer 21 and the back sheet 3 are sequentially laminated onto the upper surface of the photovoltaic cell 4. The first side sealing layer 221 and the second side sealing layer 222 are adhered to the four sides of the photovoltaic module with sealant. The first side sealing layer 221 and the second side sealing layer 222 are sequentially adhered to the four sides of the photovoltaic cell 4 and the sealing layer 21. The upper surfaces of the first side sealing layer 221 and the second side sealing layer 222 are bonded to the four edges of the lower surface of the back sheet 3, and the lower surfaces of the first side sealing layer 221 and the second side sealing layer 222 are bonded to the four edges of the upper surface of the substrate 1. The first side sealing layer 221, together with the substrate 1 and the sealing layer 21, forms a first sealing structure to seal the photovoltaic cell 4 inside. The second side sealing layer 222, together with the substrate 1 and the back sheet 3, forms a second sealing structure.
[0062] Example 5
[0063] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, with the following differences: Figure 7 and Figure 8 As shown: It includes a substrate 1, a sealant and a backplate 3, and a photovoltaic cell 4 covering the substrate 1 and the sealant; the sealant includes a first sealing layer 211, a second sealing layer 212, a first side sealing layer 221, a second side sealing layer 222 and a third side sealing layer 223.
[0064] The first sealing layer 211, the second sealing layer 212, and the backplate 3 are sequentially laminated onto the upper surface of the photovoltaic cell 4. The first side sealing layer 221, the second side sealing layer 222, and the third side sealing layer 223 are adhered to the four sides of the photovoltaic module using sealant. The first side sealing layer 221 is adhered to the four sides of the photovoltaic cell 4 and the first sealing layer 211. The upper surface of the first side sealing layer 221 is bonded to the four edges of the lower surface of the second sealing layer 212, and the lower surface of the first side sealing layer 221 is bonded to the four edges of the upper surface of the substrate 1. The first side sealing layer 221, the substrate 1, and the first sealing layer 211 together form a first sealing structure that seals the photovoltaic cell 4 inside. Side sealing layer 222 is adhered to the outer surface of the first side sealing layer 221 and the surrounding side surfaces of the second sealing layer 212. The lower surface of the second side sealing layer 222 is bonded to the surrounding edges of the upper surface of the substrate 1, and the upper surface of the second side sealing layer 222 is bonded to the surrounding edges of the lower surface of the back plate 3. The second side sealing layer 222, together with the substrate 1 and the second sealing layer 212, forms a second sealing structure. Third side sealing layer 223 is adhered to the outer surface of the second side sealing layer 222. The upper surface of the third side sealing layer 223 is bonded to the surrounding edges of the lower surface of the back plate 3, and the lower surface of the third side sealing layer 223 is bonded to the surrounding edges of the upper surface of the substrate 1. The third side sealing layer 223, together with the back plate 3 and the substrate 1, forms a third sealing structure. The P3 laser-grooved groove 48 is filled with the material of the first sealing layer 211.
[0065] Example 6
[0066] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, with the following differences: Figure 9 As shown: It includes a substrate 1, a sealant and a backplate 3, and a photovoltaic cell 4 encased between the substrate 1 and the sealant; the sealant includes a first sealing layer 211, a second sealing layer 212, a first side sealing layer 221 and a second side sealing layer 222.
[0067] The first sealing layer 211 is a polymer film formed on the upper surface of the photovoltaic cell 4 by magnetron sputtering. It possesses high adhesion, corrosion resistance, high temperature resistance, and the ability to block moisture and air, preventing delamination of the electrode layer 45 during the lamination and heat encapsulation stage. The second sealing layer 212 and the backsheet 3 are sequentially laminated onto the upper surface of the first sealing layer 211. The first side sealing layer 221 and the second side sealing layer 222 are adhered to the four sides of the photovoltaic module using sealant. The first side sealing layer 221 is adhered to the four sides of the photovoltaic cell 4 and the first sealing layer 211. The upper surface of the first side sealing layer 221 is bonded to the four edges of the lower surface of the second sealing layer 212, and the lower surface of the first side sealing layer 221 is bonded to the four edges of the upper surface of the substrate 1. The first side sealing layer 221, together with the substrate 1 and the first sealing layer 211, forms a first sealing structure to seal the photovoltaic cell 4 inside; the second side sealing layer 222 is pasted on the outer surface of the first side sealing layer 221 and the four sides of the second sealing layer 212, the lower surface of the second side sealing layer 222 is bonded to the four edges of the upper surface of the substrate 1, and the upper surface of the second side sealing layer 222 is bonded to the four edges of the lower surface of the back plate 3. The second side sealing layer 222, together with the substrate 1 and the second sealing layer 212, forms a second sealing structure.
[0068] Polymer films include at least one of PI (polyimide) film, PTFE (polytetrafluoroethylene) film, PE (polyethylene) film, PVDF (polyvinylidene fluoride) film, and FEP (perfluoroethylene propylene) film.
[0069] Example 7
[0070] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, with the following differences: Figure 10 and Figure 11 As shown: It includes a substrate 1 and a sealing element, and a photovoltaic cell 4 encapsulated between the substrate 1 and the sealing element; the sealing element includes a sealing layer 21 and a side sealing layer 22.
[0071] The sealing layer 21 is laminated onto the upper surface of the photovoltaic cell 4. The side sealing layer 22 is adhered to the four sides of the photovoltaic cell 4, the sealing layer 21, and the substrate 1 with sealant. The side sealing layer 22, the sealing layer 21, and the substrate 1 form a sealed structure that seals the photovoltaic cell 4 inside. The busbar 5 passes through the busbar hole on the sealing layer 21 to bring out the electrodes of the photovoltaic cell 4. The gap between the busbar 5 and the busbar hole is filled with the material of the sealing layer 21.
[0072] Example 8
[0073] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, with the following differences: Figure 12 and Figure 13 As shown: It includes a substrate 1 and a sealing element, and a photovoltaic cell 4 encapsulated between the substrate 1 and the sealing element; the sealing element includes a sealing layer 21 and a side sealing layer 22.
[0074] The sealing layer 21 is laminated on the upper surface of the photovoltaic cell 4. The side sealing layer 22 is glued to the four sides of the photovoltaic cell 4 and the sealing layer 21 with sealant. The lower surface of the side sealing layer 22 is bonded to the four edges of the upper surface of the substrate 1. The side sealing layer 22, the sealing layer 21 and the substrate 1 form a sealing structure to seal the photovoltaic cell 4 inside.
[0075] Example 9
[0076] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, with the following differences: Figure 14 and Figure 15 As shown: It includes a substrate 1 and a sealing element, and a photovoltaic cell 4 encased between the substrate 1 and the sealing element; the sealing element includes a sealing layer 21, a side sealing layer 22 and four bottom sealing layers 23.
[0077] The sealing layer 21 is laminated onto the upper surface of the photovoltaic cell 4. The bottom sealing layer 23 is adhered to the perimeter of the lower surface of the substrate 1 using sealant. The side sealing layer 22 is adhered to the perimeter of the photovoltaic cell 4, the sealing layer 21, the substrate 1, and the outer perimeter of the bottom sealing layer 23 using sealant. The side sealing layer 22, together with the sealing layer 21 and the substrate 1, forms a sealed structure that seals the photovoltaic cell 4 internally. The busbar 5 passes through the busbar hole on the sealing layer 21 to allow the electrodes of the photovoltaic cell 4 to be led out. The gap between the busbar 5 and the busbar hole is filled with the material of the sealing layer 21.
[0078] Example 10
[0079] A photovoltaic module encapsulation structure, specifically a perovskite photovoltaic module encapsulation structure, is basically the same as that in Example 1, with the following differences: Figure 16 and Figure 17 As shown: It includes a substrate 1 and a sealing element, and a photovoltaic cell 4 encased between the substrate 1 and the sealing element; the sealing element includes a sealing layer 21, a side sealing layer 22 and a bottom sealing layer 23.
[0080] The sealing layer 21 is laminated onto the upper surface of the photovoltaic cell 4. The bottom sealing layer 23 is adhered to the lower surface of the substrate 1 with sealant. The side sealing layer 22 is adhered to the four sides of the photovoltaic cell 4, the sealing layer 21, the substrate 1, and the bottom sealing layer 23 with sealant. The side sealing layer 22, together with the sealing layer 21 and the substrate 1, forms a sealed structure that seals the photovoltaic cell 4 internally. The busbar 5 passes through the busbar hole on the sealing layer to allow the electrodes of the photovoltaic cell 4 to be led out. The gap between the busbar 5 and the busbar hole is filled with the material of the sealing layer.
[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0082] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A photovoltaic module encapsulation structure, characterized in that, The system includes a substrate and a seal and / or a backplate, and a photovoltaic cell sandwiched between the substrate and the seal. The seal includes at least one sealing layer and at least one side sealing layer and / or a bottom sealing layer. The sealing layer includes at least one of a gel film, a butyl rubber film, a laminated encapsulating film, and a polymer film. The side sealing layer includes at least one of the gel film and the butyl rubber film. The bottom sealing layer includes at least one of the gel film and the butyl rubber film. The substrate includes at least one of glass, an ETFE film, a PET film, a PVDF film, a PMMA film, and a composite polymer encapsulating film. The backplate includes at least one of glass, an ETFE film, a PET film, a PVDF film, a PMMA film, and a composite polymer encapsulating film. The photovoltaic cell includes a perovskite photovoltaic cell, which includes a transparent conductive layer, a first charge transport layer, a perovskite light-absorbing layer, a second charge transport layer, and an electrode layer stacked sequentially from bottom to top. The perovskite photovoltaic cell is divided into multiple sub-cells by laser grooving. The laser grooving group includes P1 laser grooving, P2 laser grooving and P3 laser grooving; The P1 laser grooving penetrates the transparent conductive layer and is filled with the material of the first charge transport layer. The P2 laser grooving sequentially penetrates the second charge transport layer, the perovskite light-absorbing layer, and the first charge transport layer, and is filled with the material of the electrode layer to make the electrode layer electrically connected to the transparent conductive layer. The P3 laser grooving sequentially penetrates the electrode layer, the second charge transport layer, the perovskite light-absorbing layer, and the first charge transport layer, and is filled with the material of the sealing layer.
2. The photovoltaic module encapsulation structure according to claim 1, characterized in that, The photovoltaic module includes a substrate, a photovoltaic cell, and a sealing layer stacked sequentially; a back sheet is disposed on the upper surface of the sealing layer, and a bottom sealing layer is disposed on the lower surface of the substrate; the side sealing layers are disposed on the four sides of the photovoltaic module, forming at least one sealing structure together with the substrate, the sealing layer, and / or the back sheet.
3. The photovoltaic module encapsulation structure according to claim 1, characterized in that, The adhesive film includes conformal adhesive curing film, conformal coating curing film, insulating adhesive curing film, silicone-modified polyurethane film, epoxy resin film, and silicone gel film; the laminated encapsulation film includes silicone-modified polyurethane film, epoxy resin film, and silicone gel film; the polymer film includes at least one of PI film, PTFE film, PE film, PVDF film, and FEP film.
4. The photovoltaic module encapsulation structure according to claim 1, characterized in that, It includes the substrate and the sealant, and the photovoltaic cell encased between the substrate and the sealant; the sealant includes at least one sealing layer and at least one side sealing layer.
5. The photovoltaic module encapsulation structure according to claim 1, characterized in that, It includes the substrate and the sealant, and the photovoltaic cell encased between the substrate and the sealant; the sealant includes at least one sealing layer, at least one side sealing layer and the bottom sealing layer.
6. A photovoltaic module, characterized in that, Includes the packaging structure as described in any one of claims 1 to 5.
7. A power generation system, characterized in that, Including the photovoltaic module as described in claim 6.
